JPWO2017168745A1 - Conductor forming apparatus and conductor manufacturing method - Google Patents

Abstract

The conveying device 11 includes a base material in a range from the developing device 12 to the pattern plating device 13 at least in the entire conveyance path 20 from the developing device 12 to the etching device 15 via the pattern plating device 13 and the peeling device 14. 1 is continuously conveyed in an upright posture.

Description

  The present invention relates to a conductor forming apparatus such as a printed circuit board and a conductor manufacturing method.

  An additive method is known as a method for forming a circuit on a printed circuit board or the like. In the additive method, as described in Patent Document 1, for example, a plating resist having a pattern opposite to the conductive pattern is formed on the conductive thin film on the surface of the object to be processed (development process), and plating on the conductive thin film is performed. A conductive pattern is formed on the surface region where the resist is not formed (pattern plating step), the plating resist is peeled off from the conductive thin film (peeling step), and the conductive thin film excluding the region under the conductive pattern Removal by chemical etching using an etching solution (etching process) to form a circuit pattern.

  In a conventional general conductor forming apparatus, there are a mixture of horizontal transport for transporting a processing object in a state of lying substantially horizontally and vertical transport for transporting a processing object in an upright position. For example, the processing object is horizontally conveyed in the developing process (developing apparatus), vertically conveyed in the pattern plating process (pattern plating apparatus), and horizontally conveyed in the peeling process (peeling apparatus) and the etching process (etching apparatus).

JP-A-6-164104

  In the conventional general conductor forming apparatus, the processing object is horizontally transported in each step of the developing device, the peeling device, and the etching device. In such horizontal conveyance, the conveyance roller and the object to be processed are in contact with each other, so that the load on the surface (circuit pattern) of the object to be processed is large. As a result, defects such as pattern disconnection and short circuit are likely to occur.

  Further, between the developing device and the pattern plating device, the object to be processed is removed from the horizontal conveying type conveying device of the developing device (received from the conveying roller) and reattached to the vertical conveying type conveying device of the pattern plating device. There is a need. Similarly, between the pattern plating apparatus and the peeling apparatus, the object to be processed is removed from the vertical conveying type conveying apparatus of the pattern plating apparatus and reattached to the horizontal conveying type conveying apparatus of the peeling apparatus (on the conveying roller again). Need to put). For this reason, work efficiency is reduced, man-hours are increased, and the size and complexity of the apparatus are increased due to the division of the transfer apparatus, and defects due to removal and attachment of the processing object are likely to occur.

  Then, an object of this invention is to provide the conductor formation apparatus and conductor manufacturing method which can aim at stabilization of quality and improvement of work efficiency.

  In order to achieve the above object, the conductor forming apparatus of the present invention includes a conveying means, a developing device, a pattern plating device, a peeling device, and an etching device.

  The conveyance means conveys a processing object having a conductive thin film on the surface of an insulating substrate from the upstream side to the downstream side along a predetermined conveyance path. The developing device forms a plating resist having a pattern opposite to the conductor pattern on the conductive thin film of the object to be processed conveyed along the conveyance path. The pattern plating apparatus is disposed on the downstream side of the developing device, and forms a conductor pattern in a surface region where the plating resist in the conductive thin film is not formed. The peeling device is disposed on the downstream side of the pattern plating device and peels the plating resist from the conductive thin film. The etching apparatus is disposed on the downstream side of the peeling apparatus, and removes the conductive thin film excluding the region under the conductor pattern by chemical etching using a predetermined etching solution.

  In the conductor forming apparatus according to the first aspect of the present invention, the conveying means is at least in the range from the developing apparatus to the pattern plating apparatus in the conveying path from the developing apparatus to the etching apparatus via the pattern plating apparatus and the peeling apparatus. Then, the object to be processed is continuously conveyed in an upright posture.

  Moreover, the conductor manufacturing method of this invention is equipped with the image development process, the pattern plating process, the peeling process, and the etching process.

  In the development step, a plating resist having a pattern opposite to the conductor pattern is formed on the conductive thin film of the object to be processed which has a conductive thin film on the surface of the insulating substrate and is transported along a predetermined transport path. In the pattern plating process, a conductor pattern is formed in a region where the plating resist is not formed in the conductive thin film of the object to be processed conveyed along the conveyance path from the development process. In the stripping step, the plating resist is stripped from the conductive thin film of the processing object transported along the transport path from the pattern plating step. In the etching process, the conductive thin film excluding the region under the conductor pattern of the object to be processed that is transported along the transport path from the peeling process is removed by chemical etching using a predetermined etching solution.

  In the conductor manufacturing method according to the first aspect of the present invention, the object to be processed is at least in the range from the development step to the pattern plating step in the transport path from the development step to the etching step via the pattern plating step and the peeling step. Is continuously transported in a vertically standing posture.

  According to the apparatus and method of the first aspect, the object to be processed is continuously in an upright posture in the range from the developing device (developing step) to the pattern plating device (pattern plating step) in the transport path. Is conveyed. For this reason, in the development process and the pattern plating process, it is possible to prevent contact between the object to be processed and the transfer roller, etc., resist crushing and chipping are less likely to occur, and suppress occurrence of defects such as pattern disconnection and short circuit. can do.

  Moreover, since a conveyance path | route continues between a image development process and a pattern plating process, it is not necessary to remove and attach a process target object between processes. For this reason, the work efficiency is not reduced, the number of man-hours is increased, the apparatus is not enlarged or complicated due to the division of the transfer apparatus, and the defect due to the removal and attachment of the processing object does not occur.

  In the conductor forming apparatus according to the second aspect of the present invention, the conveying means is at least in the range from the pattern plating apparatus to the peeling apparatus in the conveyance path from the developing apparatus to the etching apparatus via the pattern plating apparatus and the peeling apparatus. Then, the object to be processed is continuously conveyed in an upright posture.

  In the conductor manufacturing method according to the second aspect of the present invention, the object to be processed is at least in the range from the pattern plating step to the peeling step in the transport path from the development step to the etching step via the pattern plating step and the peeling step. Is continuously transported in a vertically standing posture.

  According to the apparatus and method of the said 2nd aspect, a process target object is continuous with the attitude | position standing substantially vertically in the range from a pattern plating apparatus (pattern plating process) to a peeling apparatus (peeling process) among conveyance paths. Is conveyed. For this reason, in a pattern plating process and a peeling process, a contact with a processing object, a conveyance roller, etc. can be prevented, damage to a pattern is reduced or eliminated, and generation | occurrence | production of defects, such as a pattern disconnection and a short circuit, is suppressed. be able to.

  Moreover, since a conveyance path | route continues between a pattern plating process and a peeling process, it is not necessary to remove and attach a process target object between processes. For this reason, the work efficiency is not reduced, the number of man-hours is increased, the apparatus is not enlarged or complicated due to the division of the transfer apparatus, and the defect due to the removal and attachment of the processing object does not occur.

  In the conductor forming apparatus according to the third aspect of the present invention, the conveying means has a posture in which the object to be processed stands substantially vertically over the entire conveying path from the developing device to the etching device via the pattern plating device and the peeling device. Convey continuously.

  In the conductor manufacturing method according to the third aspect of the present invention, the object to be processed is continuously raised in a vertically standing position throughout the entire conveyance path from the development process to the etching process via the pattern plating process and the peeling process. Transport.

  According to the apparatus and method of the third aspect, the object to be processed is conveyed in a substantially vertically upright position throughout the entire conveyance path from the development process to the etching process via the pattern plating process and the peeling process. Is done. For this reason, it is possible to prevent contact between the object to be processed and the conveying roller, and resist resist crushing, chipping, and the like, and occurrence of defects such as pattern disconnection and short circuit can be suppressed.

  In addition, since the conveyance path is continuous between the processes, it is not necessary to remove or attach the processing object between the processes. For this reason, the work efficiency is not reduced, the number of man-hours is increased, the apparatus is not enlarged or complicated due to the division of the transfer apparatus, and the defect due to the removal and attachment of the processing object does not occur.

  The conductor forming apparatus according to the fourth aspect of the present invention is the conductor forming apparatus according to the first or third aspect, and is disposed between the developing step and the pattern plating apparatus and is transported along the transport path. A first transfer chamber through which the object passes is provided. The first transfer chamber is provided with a first humidifying means for humidifying the first transfer chamber in order to prevent the processing object from drying.

  According to the conductor forming apparatus of the fourth aspect, it is possible to supply the processing object in a state where substantially the entire surface of the substrate is covered with the water film to the pattern plating apparatus. As a result, air oxidation on the surface of the substrate can be minimized, and a powerful oxide film removal process using chemicals in the pre-plating process becomes unnecessary. Moreover, since the water wettability of the surface of the substrate can be kept good, the amount of water required for the water washing treatment can be greatly reduced.

  In addition, since the entire surface of the substrate is continuously covered with a water film from development to pattern plating, plating caused by bubbles taken into the recesses of the resist film circuit formed on the substrate surface Deposition failure can be significantly reduced.

  The conductor forming apparatus according to the fifth aspect of the present invention is the conductor forming apparatus according to the second or third aspect, and is disposed between the pattern plating apparatus and the peeling apparatus and is conveyed along the conveyance path. A second transfer chamber through which an object passes is provided. The second transfer chamber is provided with second humidifying means for humidifying the second transfer chamber in order to prevent the processing object from drying.

  According to the conductor forming apparatus of the fifth aspect, it is possible to supply the non-dry state (wet state) processing object to the peeling step. Thereby, the surface of a board | substrate can always be kept in the state wet with water, and water wettability can be kept favorable.

  In addition, since the object to be processed is sent to the peeling process with a thin water film formed over the entire area of the substrate after pattern plating, the effect of preventing the adhesion of an oil film or foreign matter on the resist film is obtained. Inhibitors that cause the liquid to come into contact with the resist film can be eliminated sufficiently and reliably.

  According to the present invention, quality can be stabilized and work efficiency can be improved.

It is a top view showing typically the whole conductor formation device concerning one embodiment of the present invention. FIG. 2 is a plan view schematically showing the developing device and the first direction changing mechanism of FIG. 1. FIG. 2 is a side view schematically showing the developing device of FIG. 1. It is a top view which shows typically the 2nd direction change mechanism, peeling apparatus, and etching apparatus of FIG. It is a perspective view which shows typically the state which conveys a process target object vertically. It is a schematic diagram for demonstrating the process by an additive method, (a) is a base material, (b) is the state which formed the electroconductive thin film, (c) is the state which formed the plating resist, (d) Indicates a state where a conductive layer is formed, (e) indicates a state where the plating resist is peeled off, and (f) indicates a state where the conductive thin film is removed by chemical etching.

  Hereinafter, the conductor formation apparatus 10 which concerns on one Embodiment of this invention is demonstrated based on drawing.

  First, an outline of a method for manufacturing a printed wiring board by an additive method using the conductor forming apparatus 10 will be described with reference to FIG.

  In the additive method, as shown in FIG. 6A, a base material (substrate) 1 made of an insulating layer is prepared. The substrate 1 is, for example, an insulating thin-walled film or thin plate made of epoxy, polyimide, or other resin. In addition, you may form the base material 1 by apply | coating resin on the board | substrate consisting of a copper clad laminated board or metal foil.

  Next, as shown in FIG. 6B, the conductive thin film 2 is formed on the surface of the substrate 1 with a predetermined film thickness (for example, 10 μm or less) by sputtering, electroless copper plating, or the like. In addition, it is good also considering the copper foil as the electroconductive thin film 2 by using a copper clad laminated board for the base material 1. FIG.

  Next, as shown in FIG. 6C, for example, a dry film or the like is laminated on the conductive thin film 2, and exposure and development are performed, whereby a plating resist having a pattern opposite to that of the conductor pattern 4 formed in a subsequent process is obtained. 3 is formed (developing step).

  Next, as shown in FIG. 6D, a conductive pattern 4 made of copper is formed by electroplating using, for example, a copper sulfate plating solution on the surface region of the conductive thin film 2 where the plating resist 3 is not formed. (Pattern plating process). A metal or alloy other than copper may be used as the material of the conductor pattern 4.

  Next, as shown in FIG. 6E, the plating resist 3 is removed by peeling or the like (peeling process).

  Next, as shown in FIG. 6 (f), the conductive thin film (removed layer) 2 excluding the region under the conductor pattern 4 is chemically treated with a predetermined etching solution (for example, a mixed solution of sulfuric acid and hydrogen peroxide). It is removed by etching (etching process). Thereby, the printed wiring board which has the predetermined conductor pattern 4 on the base material 1 is formed. In addition, although the base material 1 in which the electroconductive thin film 2 was formed turns into a process target object, a process target object may only be called the base material 1 below.

  As shown in FIG. 1, the conductor forming apparatus 10 includes a transport device (transport means) 11, a developing device 12, a pattern plating device 13, a peeling device 14, an etching device 15, and a plurality of cleaning devices 16. Prepare. The cleaning device 16 is attached to each of the developing device 12, the pattern plating device 13, the peeling device 14, and the etching device 15. 6 illustrates the case where the conductor pattern 4 is formed only on one surface of the base material 1, but in this embodiment, the case where the conductor pattern 4 is formed on both surfaces of the base material 1 will be described. That is, the conductive thin film 2 is formed on both surfaces (surfaces on both sides) of the base material 1, and processing from the development process to the etching process is performed. Moreover, the base material 1 of this embodiment is a flat plate material cut into a predetermined size.

  The transport device 11 transports the base material 1 on which the conductive thin film 2 is formed from the upstream side to the downstream side along a predetermined transport path 20. The conveyance path 20 includes a first line 21 that extends linearly, a second line 22 that extends substantially parallel to the first line 21, and one end of the first line 21 and one end of the second line 22. It is a rectangular ring having a third line 23 that connects and a fourth line 24 that connects the other end of the second line 22 and the other end of the first line 21. The peeling device 14, the etching device 15, and the developing device 12 are arranged along the first line 21, and the pattern plating device 13 is arranged so as to extend along the second line 22. Between the etching device 15 and the developing device 12 on the first line 21, a work supply position 25 where the worker M supplies the base material 1 to the transport path 20 on the upstream side of the developing device 12, and downstream of the etching device 15. On the side, a workpiece take-out position 26 is set where the operator M takes out the substrate 1 on which the circuit has been formed from the transport path 20. The conveyance path 20 returns from the workpiece supply position 25 to the developing device 12 through the developing device 12, the pattern plating device 13, the peeling device 14, and the etching device 15 in order.

  The conveyance device 11 includes a workpiece holding member 30 that holds the base material 1, linear rails 31 (see FIG. 5) provided corresponding to the first line 21 and the second line 22, a third line 23, A first direction changing mechanism 32 and a second direction changing mechanism 33 provided corresponding to the fourth line 24, and a drive mechanism 37 (see FIG. 3) are provided.

  As shown in FIG. 5, the work holding member 30 includes a work gripping portion 34 that detachably grips the upper edge of the substrate 1, an arm portion 35 that extends from the work gripping portion 34 in a substantially horizontal direction, and a rail 31. The movable portion 36 is movable along the rail 31 by a drive mechanism 37 (see FIG. 3). That is, in the first line 21 and the second line 22, the work holding member 30 moves along the rail 31. The substrate 1 attached to the workpiece holding member 30 at the workpiece supply position 25 moves to the workpiece removal position 26 while being attached to the workpiece holding member 30, and then is removed from the workpiece holding member 30 at the workpiece removal position 26. Removed.

  As shown in FIG. 2, the first direction changing mechanism 32 moves the work holding member 30 that has reached one end of the first line 21 along the third line 23 in the first transfer chamber 41 to the second line 22. Slide to one end. Further, as shown in FIG. 4, the second direction changing mechanism 33 moves the work holding member 30 that has reached the other end of the second line 22 along the fourth line 24 in the second transfer chamber 42. Slide to the other end of the line 21. Accordingly, the movement direction 38 of the work holding member 30 is reversed between the first line 21 and the second line 22.

  In addition, in the first transfer chamber 41 and the second transfer chamber 42, a plurality of sprays for spraying fine water (mist) to humidify the room for the purpose of preventing drying of the moving base material 1. Nozzles (humidifying means) 43 and 44 are provided. By humidifying the inside of the first transfer chamber 41, the substrate 1 in a state where substantially the entire surface is covered with a water film can be supplied to the pattern plating step. Thereby, the air oxidation of the exposed copper surface of the base material 1 can be suppressed to a minimum, and a powerful oxide film removal process with a chemical in the pre-plating process becomes unnecessary. Moreover, the water wettability of the surface of the base material 1 can be kept good, and the conventional excessive water washing treatment can be largely omitted, which can bring about a great effect in saving water resources. Further, by humidifying the inside of the second transfer chamber 42, the base material 1 in a non-dry state (wet state) can be supplied to the peeling step. Thereby, the surface of the base material 1 can always be kept wet with water, and water wettability can be kept favorable. The means for humidifying the inside of the transfer chambers 41 and 42 is not limited to the spray nozzles 43 and 44 for spraying mist, but may be other means (for example, a humidifier using ultrasonic waves).

  As shown in FIG. 2, the worker M attaches the upper edge of the substrate 1 to the work gripping portion 34 (see FIG. 5) of the work holding member 30 at the work supply position 25, and as shown in FIG. 4, At the workpiece removal position 26, the base material 1 is removed from the workpiece gripping portion 34 (see FIG. 5) of the workpiece holding member 30. The base material 1 mounted on the work holding member 30 is suspended from the work gripping portion 34 in a substantially vertical direction. In the first line 21 and the second line 22, the surface direction of the base material 1 is the lines 21, 22 (base In the third line 23 and the fourth line 24, the surface direction of the base material 1 is the lines 23 and 24 (the movement direction 38 of the base material 1). It moves almost horizontally in a substantially orthogonal posture. In this way, the transport device 11 has a base material in the entire transport path 20 that continues from the work supply position 25 to the work removal position 26 via the developing device 12, the pattern plating device 13, the peeling device 14, and the etching device 15. 1 is conveyed in an upright posture. In addition, although the moving direction 38 of the base material 1 (work holding member 30) of this embodiment is counterclockwise in FIG. 1, the moving direction 38 may be set in the opposite direction (clockwise).

  The developing device 12 forms a plating resist 3 having a pattern opposite to the conductor pattern 4 on the conductive thin film 2 of the base material 1 conveyed along the conveyance path 20 (development process). Specifically, after laminating a dry film resist on the conductive thin film 2 and performing image exposure by irradiating ultraviolet rays through a photomask, a developer (for example, sodium carbonate) is applied from a plurality of spray nozzles 40. Development is performed by spraying on both surfaces of the material 1 to form a plating resist 3 (see FIG. 3).

  The pattern plating apparatus 13 has a plurality of plating chambers 13a arranged on the downstream side of the developing device 12 and arranged linearly along the second line 22, and in each plating chamber 13a, a plating resist in the conductive thin film 2 is provided. Conductive pattern 4 is formed in a surface region where 3 is not formed (pattern plating step). Specifically, the conductor 1 is transported while being immersed in a predetermined plating solution (for example, copper sulfate plating solution) in a plating tank (not shown) while being immersed in an upright state, immersed while being transported, and electroplated. Pattern 4 is formed.

  The pattern plating process performed in the pattern plating apparatus 13 includes pre-plating treatment, plating treatment, and post-plating treatment. The base material 1 immersed a plurality of treatment tanks for pre-plating treatment, a plurality of treatment tanks for plating treatment (plating tank), and a plurality of treatment tanks for post-plating treatment in the treatment liquid in each treatment tank. Move in order in the state. The rail 31 of the second line 22 is set at a height position where the base material 1 is sufficiently immersed in the processing liquid in each processing tank, and before and after each processing tank, the base material 1 is charged with respect to the processing liquid. An elevating device that performs (down) and takes out (up) is provided. The lifting device raises the workpiece holding member 30 to disengage the movable portion 36 from the rail 31, moves the workpiece holding member 30 downstream by a predetermined distance, and lowers the workpiece holding member 30 to place the movable portion 36 on the rail 31 again. . As a result, the base material 1 that has reached the pre-plating treatment descends at the upstream end of the treatment tank, is immersed in the treatment liquid and moves in the treatment liquid, and rises at the downstream end of the treatment tank to the next treatment tank. The operation of moving is repeated from the first (most upstream) treatment tank to the last (most downstream) treatment tank, and then moves to the plating process. The base material 1 that has reached the plating process descends at the upstream end of the plating tank, is immersed in the treatment liquid and moves in the treatment liquid, and moves up to the downstream end of the plating tank and moves to the next plating tank. Is repeated from the first (most upstream) plating tank to the last (most downstream) plating tank, and then the process moves to post-plating treatment. The base material 1 that has reached the post-plating process descends at the upstream end of the treatment tank and is immersed in the treatment liquid and moves in the treatment liquid, and rises at the downstream end of the treatment tank and moves to the next treatment tank. After the operation is repeated from the first (most upstream) processing tank to the last (most downstream) processing tank, the operation moves to the fourth line 24 (second transfer chamber 42).

  The peeling device 14 is disposed on the downstream side of the pattern plating device 13 and peels the plating resist 3 from the conductive thin film 2 (peeling step). Specifically, a predetermined stripping solution (for example, an amine-based stripping solution) is sprayed from a plurality of spray nozzles (not shown) to both surfaces of the base material 1 in the same manner as in the developing device 12 to form a plating resist. 3 is peeled off.

  The etching device 15 is disposed on the downstream side of the peeling device 14 and removes the conductive thin film 2 excluding the region under the conductor pattern 4 by chemical etching using a predetermined etching solution (etching process). Specifically, a predetermined etching solution (processing solution) is sprayed toward both surfaces of the substrate 1 from a plurality of spray nozzles (not shown) in the same manner as in the developing device 12, so The conductive thin film 2 excluding the region is removed.

  The cleaning device 16 is downstream of each processing (each process) of each device 12, 13, 14, 15 (the developing device 12 is downstream of the development processing, the pattern plating device 13 is downstream of the plating pretreatment and the plating processing. Attached to the downstream side and the downstream side of the post-plating treatment, the peeling device 14 on the downstream side of the peeling treatment, and the etching device 15 on the downstream side of the etching treatment, and cleans both surfaces of the substrate 1. Specifically, water or hot water is sprayed toward both surfaces of the substrate 1 from a plurality of spray nozzles (not shown) as in the case of the developing device 12 to clean both surfaces of the substrate 1. The cleaning device 16 attached to the pattern plating device 13 may be a cleaning tank that stores a cleaning liquid. In this case, before and after the cleaning tank, an elevating device for loading and unloading the base material 1 with respect to the cleaning liquid is provided, and the base material 1 is cleaned while being immersed in the cleaning liquid.

  According to the present embodiment, the base material 1 stands substantially vertically in the entire conveyance path 20 from the work supply position 25 to the work removal position 26 via the development process, the pattern plating process, the peeling process, and the etching process. It is conveyed in the posture (vertical conveyance). For this reason, a contact with the base material 1 and a conveyance roller etc. can be prevented, and generation | occurrence | production of defects, such as a disconnection, can be suppressed.

  Moreover, since the conveyance path | route 20 continues between each process, it is not necessary to remove and attach the base material 1 between processes. For this reason, work efficiency is not reduced, man-hours are increased, and the size and complexity of the apparatus are not increased due to the division of the transfer apparatus, and defects due to removal and attachment of the base material 1 do not occur.

  As described above, the present invention has been described based on the above embodiment, but the present invention is not limited to the content of the above embodiment, and can be appropriately changed without departing from the present invention. is there.

  For example, in the above-described embodiment, the base material 1 is continuously vertically conveyed over the entire conveyance path 20 from the developing device 12 to the etching device 15 via the pattern plating device 13 and the peeling device 14. The substrate 1 may be vertically conveyed in the range up to the pattern plating apparatus 13, and the substrate 1 may be horizontally conveyed in other ranges, and the range from the pattern plating apparatus 13 to the peeling apparatus 14 (or the etching apparatus 15). The substrate 1 may be conveyed vertically and the substrate 1 may be conveyed horizontally in other ranges.

  Moreover, the conveyance path 20 may not be annular, but may be linear (for example, linear). Further, the rails may be annular without providing the first direction changing mechanism 32 and the second direction changing mechanism 33. By using a transport device that does not include the direction changing mechanisms 32 and 33 (for example, when the transport path is linear or when the rail is annular), the base material drawn out from the roll material is continuously long. And can be transported.

  The present invention can be widely used as a conductor forming apparatus such as a printed wiring board and a conductor manufacturing method.

1: Base material (substrate, processing object)
2: Conductive thin film 3: Plating resist 4: Conductor pattern 10: Conductor forming device 11: Conveying device (conveying means)
12: Development device 13: Pattern plating device 14: Peeling device 15: Etching device 16: Cleaning device 20: Transfer route 21: First line 22: Second line 23: Third line 24: Fourth line 25: Work supply position 26: Work removal position 30: Work holding member 31: Rail 32: First direction changing mechanism 33: Second direction changing mechanism 41: First transfer chamber 42: Second transfer chamber 43: Spray nozzle (first humidification) means)
44: Spray nozzle (second humidifying means)
M: Worker

The conductor forming apparatus according to the fourth aspect of the present invention is the conductor forming apparatus according to the first or third aspect, and is disposed between the developing device and the pattern plating apparatus and conveyed along the conveying path. A first transfer chamber through which the object passes is provided. The first transfer chamber is provided with a first humidifying means for humidifying the first transfer chamber in order to prevent the processing object from drying.

In the conductor forming apparatus according to the first aspect of the present invention, the conveying means is at least in the range from the developing apparatus to the pattern plating apparatus in the conveying path from the developing apparatus to the etching apparatus via the pattern plating apparatus and the peeling apparatus. A movable part movable along a rail provided in the conveyance path, a grip part for detachably gripping the upper part of the processing object, and an arm part for connecting the movable part and the grip part. The object is continuously conveyed along the rail in an upright posture.

In the conductor manufacturing method of the first aspect of the present invention, among the transport paths from the development process to the etching process via the pattern plating process and the peeling process, at least in the range from the development process to the pattern plating process , An object to be processed is provided by a conveying means having a movable part movable along a provided rail, a grip part for detachably holding an upper part of the object to be processed, and an arm part for connecting the movable part and the grip part . Is continuously transported along the rails in a substantially vertically standing posture.

In the conductor forming apparatus according to the second aspect of the present invention, the conveying means is at least in the range from the pattern plating apparatus to the peeling apparatus in the conveyance path from the developing apparatus to the etching apparatus via the pattern plating apparatus and the peeling apparatus. A movable part movable along a rail provided in the conveyance path, a grip part for detachably gripping the upper part of the processing object, and an arm part for connecting the movable part and the grip part. The object is continuously conveyed along the rail in an upright posture.

In the conductor manufacturing method of the second aspect of the present invention, at least in the range from the pattern plating step to the peeling step, the transfer route from the development step to the etching step via the pattern plating step and the peeling step An object to be processed is provided by a conveying means having a movable part movable along a provided rail, a grip part for detachably holding an upper part of the object to be processed, and an arm part for connecting the movable part and the grip part . Is continuously transported along the rails in a substantially vertically standing posture.

In the conductor forming apparatus according to the third aspect of the present invention, the conveying means includes the movable portion, the gripping portion, and the arm portion in the entire conveying path from the developing device to the etching device via the pattern plating device and the peeling device. The processing object is continuously conveyed along the rail in a posture in which the processing object stands substantially vertically.

Claims (6)

A transport means for transporting a processing object having a conductive thin film on the surface of an insulating substrate from an upstream side to a downstream side along a predetermined transport path;
A developing device that forms a plating resist having a pattern opposite to the conductor pattern on the conductive thin film of the processing object conveyed along the conveyance path;
A pattern plating apparatus that is disposed on the downstream side of the developing device and forms the conductor pattern on a surface region of the conductive thin film where the plating resist is not formed;
A peeling device that is disposed on the downstream side of the pattern plating device and peels a plating resist from the conductive thin film;
An etching apparatus that is disposed on the downstream side of the peeling apparatus and removes the conductive thin film excluding the region under the conductor pattern by chemical etching using a predetermined etching solution,
The conveying means includes the processing object in at least a range from the developing device to the pattern plating device in the conveyance path from the developing device to the etching device via the pattern plating device and the peeling device. A conductor forming apparatus characterized by continuously transporting a wire in an upright posture. The conductor forming apparatus according to claim 1,
A transfer chamber disposed between the development step and the pattern plating apparatus, through which the object to be processed transferred along the transfer path passes;
The conductor forming apparatus, wherein the transfer chamber is provided with humidifying means for humidifying the transfer chamber in order to prevent drying of the processing object. The conductor forming device according to claim 1 or 2,
The transport means continuously transports the processing object in an upright posture in the entire region of the transport path from the developing device to the etching device via the pattern plating device and the peeling device. The conductor formation apparatus characterized by the above-mentioned. A transport means for transporting a processing object having a conductive thin film on the surface of an insulating substrate from an upstream side to a downstream side along a predetermined transport path;
A developing device that forms a plating resist having a pattern opposite to the conductor pattern on the conductive thin film of the processing object conveyed along the conveyance path;
A pattern plating apparatus that is disposed on the downstream side of the developing device and forms the conductor pattern on a surface region of the conductive thin film where the plating resist is not formed;
A peeling device that is disposed on the downstream side of the pattern plating device and peels a plating resist from the conductive thin film;
An etching apparatus that is disposed on the downstream side of the peeling apparatus and removes the conductive thin film excluding the region under the conductor pattern by chemical etching using a predetermined etching solution,
The conveying means is the processing object in a range from the developing device to the etching device through the pattern plating device and the peeling device at least in the range from the pattern plating device to the peeling device. A conductor forming apparatus characterized by continuously transporting a wire in an upright posture. A development step of forming a plating resist having a pattern opposite to the conductor pattern on the conductive thin film of the object to be processed which has a conductive thin film on the surface of the insulating substrate and is transported along a predetermined transport path;
A pattern plating step of forming the conductor pattern on a surface region where the plating resist is not formed in the conductive thin film of the processing object to be transported along the transport path from the development step;
A peeling step of peeling the plating resist from the conductive thin film of the object to be processed conveyed along the conveyance path from the pattern plating step;
An etching step of removing the conductive thin film excluding a region under the conductor pattern of the processing object conveyed along the conveyance path from the peeling step by chemical etching using a predetermined etching solution. ,
The processing object stands up substantially vertically in at least the range from the development step to the pattern plating step in the transport path from the development step to the etching step via the pattern plating step and the peeling step. A conductor manufacturing method characterized by continuously transporting in a fixed posture. A development step of forming a plating resist having a pattern opposite to the conductor pattern on the conductive thin film of the object to be processed which has a conductive thin film on the surface of the insulating substrate and is transported along a predetermined transport path;
A pattern plating step of forming the conductor pattern on a surface region where the plating resist is not formed in the conductive thin film of the processing object to be transported along the transport path from the development step;
A peeling step of peeling the plating resist from the conductive thin film of the object to be processed conveyed along the conveyance path from the pattern plating step;
An etching step of removing the conductive thin film excluding a region under the conductor pattern of the processing object conveyed along the conveyance path from the peeling step by chemical etching using a predetermined etching solution. ,
The processing object stands up substantially vertically in the range from the pattern plating step to the peeling step at least in the transport path from the developing step to the etching step via the pattern plating step and the peeling step. A conductor manufacturing method characterized by continuously transporting in a fixed posture.

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