JP2006118019A - Surface treatment method and surface treatment equipment for flat shaped object - Google Patents

Surface treatment method and surface treatment equipment for flat shaped object Download PDF

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JP2006118019A
JP2006118019A JP2004309095A JP2004309095A JP2006118019A JP 2006118019 A JP2006118019 A JP 2006118019A JP 2004309095 A JP2004309095 A JP 2004309095A JP 2004309095 A JP2004309095 A JP 2004309095A JP 2006118019 A JP2006118019 A JP 2006118019A
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treatment
liquid
downward
flat plate
tank
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JP4677216B2 (en
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Tomohiro Noda
朝裕 野田
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Almex Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a surface treatment method and surface treatment equipment for flat shaped objects where flat shaped objects can be securely and smoothly carried into a treatment solution in a treatment tank in the state of a vertically hanging form. <P>SOLUTION: A pair of overflow tanks are oppositely arranged in such a manner that respective inside rising partitions are confronted with a carrying passage held to form a downward fluidizing solution chamber and an upward fluidizing solution chamber. The downward fluidizing solution chamber is formed in such a manner that a treatment solution Qsp fed from an upper side opening part can be continuously fluidized downward, and also, the upward fluidizing solution chamber is formed in such a manner that the treatment solution Qsp refed from the lower side can be continuously fluidized upward. A rotary tank and a solution recirculation means are provided so as to be formed in such a manner that flat shaped objects can be carried into the continuously fluidizing treatment solution through an opening part for carrying-in, the flat shaped objects after treatment can be carried out from the inside of the continuously fluidizing treatment solution through an opening part for carrying-out, and also, in the process of their carrying into the downward fluidizing solution chamber, surface treatment therefor can be performed using the downward continuous fluidizing treatment solution. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、搬送方向の上流側から縦吊状態で搬送されて来た平板形状物を処理槽に搬入しかつ処理液中で表面処理を施すとともに表面処理後の平板形状物を処理槽から搬出してその下流側に搬送させることで、複数枚の平板形状物を連続的に表面処理する平板形状物の表面処理方法および表面処理装置に関する。   In the present invention, a plate-shaped object conveyed in a vertically suspended state from the upstream side in the conveying direction is carried into a treatment tank and subjected to surface treatment in a treatment liquid, and the plate-shaped article after surface treatment is carried out of the treatment tank. And it is related with the surface treatment method and surface treatment apparatus of the flat plate-shaped thing which surface-treats several flat plate-like goods continuously by making it convey to the downstream.

ワークの表面処理方法には、バッチ処理方式と連続処理方式とがある。バッチ処理方式は、図10に示すように、平板形状物(ワーク200P1)を縦吊状態として、列配された各処理槽10P10,10P20,10P30へ順番に搬送する。すなわち、ワーク200P1を処理槽10P10の処理液中に浸漬して所定時間だけ表面処理を施し、次いでワークを上昇(V1),水平搬送(H1)および下降(V21)させて処理槽10P20の処理液中に浸漬する。以下、同様な手順を繰り返す。   There are a batch processing method and a continuous processing method in the surface treatment method of the workpiece. In the batch processing method, as shown in FIG. 10, a plate-shaped object (work 200P1) is vertically suspended, and is sequentially conveyed to the processing tanks 10P10, 10P20, and 10P30 arranged in a row. That is, the workpiece 200P1 is immersed in the treatment liquid in the treatment tank 10P10 and subjected to surface treatment for a predetermined time, and then the work is lifted (V1), horizontally conveyed (H1), and lowered (V21) to treat the treatment liquid in the treatment tank 10P20. Immerse in. Thereafter, the same procedure is repeated.

連続処理方式は、図11に示す如く、例えば帯状長尺板材(ワーク200P2)を水平状態として保持しつつ各処理槽10P11,10P21,10P31の配列順に従って連続搬送する。すなわち、ワーク200P2が各処理槽の上部に設けられた開口部分10UHを通じて当該各処理液中に浸漬されかつ通過する間に当該各表面処理が施される。   In the continuous processing method, as shown in FIG. 11, for example, the belt-like long plate material (work 200P2) is held in a horizontal state and is continuously conveyed according to the arrangement order of the processing tanks 10P11, 10P21, and 10P31. That is, each surface treatment is performed while the workpiece 200P2 is immersed in and passes through each processing solution through the opening 10UH provided at the top of each processing tank.

ここに、バッチ処理方式は、ワーク形態(平板形状物,立体形状物,棒状短尺物等)に対する適応性が広いが、各処理槽間におけるワークの上昇・水平搬送・下降が必要になるので、生産性向上が難しい。対する連続処理方式は、各処理槽間での中間的かつ断続的な搬送(V1,H1,V21等)が必要ないので、生産性が高い。しかし、最上流のアンコイラーと最下流のコイラーとの間に張設可能な帯状長尺板材や線状材料に限られる。つまり、ワーク形態に対する適応性が極めて狭い。   Here, the batch processing method is widely adaptable to the work form (flat plate, solid, rod-like, etc.), but it is necessary to raise, horizontally convey and lower the workpiece between the treatment tanks. It is difficult to improve productivity. On the other hand, the continuous processing method does not require intermediate and intermittent conveyance (V1, H1, V21, etc.) between the processing tanks, so that the productivity is high. However, it is limited to a strip-like long plate material or a linear material that can be stretched between the most upstream uncoiler and the most downstream coiler. That is, the adaptability to the workpiece form is extremely narrow.

ところで、液組成の均一化の点からすれば、処理時間が長い場合に複数の処理槽に分割するバッチ処理方式の場合に比較して、処理時間に応じた槽長を持たせた1つの処理槽内で処理する連続処理方式の方が、その管理・維持が容易である。つまり、安定した品質の処理ができる。また、連続処理方式の場合は、バッチ処理方式における処理槽間での搬送中に引き起こされる問題(ワーク表面付着液による過剰反応、大気接触による酸化進行およびワーク表面への塵埃付着)の心配がない。この問題は、いずれも品質に悪影響を及ぼす。   By the way, from the point of homogenization of the liquid composition, compared with the case of the batch processing method that divides into a plurality of processing tanks when the processing time is long, one process having a tank length corresponding to the processing time. Management and maintenance of the continuous processing method in which processing is performed in the tank is easier. That is, stable quality processing can be performed. In the case of the continuous processing method, there is no concern about problems caused during transfer between processing tanks in the batch processing method (excessive reaction due to work surface adhesion liquid, oxidation progress due to atmospheric contact, and dust adhesion to the work surface). . All of these problems adversely affect quality.

かくして、ワーク200P1に高品質電解処理(例えば、めっき処理)を行う場合には、図12に示す如く、当該電解処理槽10EP内では槽外に配置されたベルトコンベア等を用いてワークを処理液中で水平搬送(H20)しつつ電解処理を連続して施す連続処理方式が採られている。しかし、他の処理槽との関係では、バッチ処理方式の搬送態様が採用されている。   Thus, when high-quality electrolytic treatment (for example, plating treatment) is performed on the workpiece 200P1, as shown in FIG. 12, the workpiece is treated with a treatment liquid using a belt conveyor or the like disposed outside the tank in the electrolytic treatment tank 10EP. In particular, a continuous processing method is employed in which the electrolytic treatment is continuously performed while being horizontally conveyed (H20). However, in relation to other processing tanks, a batch processing type transport mode is adopted.

すなわち、上流側から水平搬送(H10)されたワーク200P1は、下降(V10)により電解処理槽10EPに投入される。また、処理後のワークは、上昇(V30)および水平搬送(H30)により下流側の処理槽へ搬送される。つまり、この図12は、バッチ処理方式と連続処理方式とを組み合わせた折衷方式を指すものといえる。   That is, the workpiece 200P1 that is horizontally conveyed (H10) from the upstream side is put into the electrolytic treatment tank 10EP by lowering (V10). Moreover, the workpiece | work after a process is conveyed to a downstream processing tank by a raise (V30) and horizontal conveyance (H30). That is, this FIG. 12 can be said to indicate a compromise method combining a batch processing method and a continuous processing method.

しかし、薄板状の例えばプリント回路基板(ワーク200P)の場合は、電解処理槽10EP内での水平搬送速度を高くする程にワーク200Pに揺動や振動が発生する。さらに、ワークに搬送(X)方向と直交する方向の湾曲が生じ、その先端が折れてしまう場合がある。これでは、電解処理槽10EP内での電極間距離が変動してしまうから品質劣悪化を免れない。処理槽内装部材との衝突によるワーク200Pの破損や内装部材自体の変形等を発生させる虞もある。   However, in the case of a thin plate-like printed circuit board (work 200P), for example, the work 200P swings or vibrates as the horizontal conveyance speed in the electrolytic treatment tank 10EP is increased. Further, the workpiece may bend in a direction orthogonal to the conveyance (X) direction, and the tip may be broken. In this case, since the distance between the electrodes in the electrolytic treatment tank 10EP varies, it is inevitable that the quality deteriorates. There is also a possibility that the workpiece 200P may be damaged or the interior member itself may be deformed due to a collision with the treatment tank interior member.

これに関しては、本出願人は、ガイドポストに張設された複数のワイヤー(搬送ガイド)を有する搬送ガイド手段を設けた表面処理装置を提案(特許文献1を参照)している。これによれば、ワイヤー(搬送ガイド)間でワークの自由運動を規制できるから、ワーク200Pの縦吊状態(状態)を維持しつつ安定かつ円滑に搬送することができた。つまりは、高品質処理を行える。   In this regard, the present applicant has proposed a surface treatment apparatus provided with conveyance guide means having a plurality of wires (conveyance guides) stretched around a guide post (see Patent Document 1). According to this, since the free movement of the workpiece can be regulated between the wires (conveyance guides), the workpiece 200P can be stably and smoothly conveyed while maintaining the vertically suspended state (state). That is, high quality processing can be performed.

しかし、上記の折衷方式では、槽外から電解処理槽10EPの処理液中にワーク200Pを投入(浸漬)しかつ連続電解処理終了後に処理液中から槽外へワークを取出さなければならない。しかも、ワークの昇降速度は、電解処理の連続性を担保するために処理槽10EP内での水平搬送(H20)速度に比較して高速(例えば、4倍速)である。したがって、浸漬に際する下降工程では、ワーク200Pの先端部分(縦吊状態での下端部分)が大きな液抵抗を受けるので湾曲,折れ曲りあるいは揺動してしまうことが多々ある。結果として、ワーク200Pが槽内装品(例えば、上記ガイドポスト,図示しない電極等)に衝突し、さらには張り付いてしまう場合がある。   However, in the above eclectic method, the workpiece 200P must be introduced (immersed) into the treatment liquid of the electrolytic treatment tank 10EP from outside the tank, and the work must be taken out of the treatment liquid after completion of the continuous electrolytic treatment. And the raising / lowering speed | rate of a workpiece | work is high speed (for example, 4 times speed) compared with the horizontal conveyance (H20) speed in the processing tank 10EP, in order to ensure the continuity of an electrolytic process. Accordingly, in the descent process during immersion, the tip portion of the workpiece 200P (the lower end portion in the vertically suspended state) receives a large liquid resistance, and thus is often bent, bent or rocked. As a result, the workpiece 200P may collide with a tank interior product (for example, the guide post, an electrode (not shown), etc.) and may stick to it.

また、ワーク200Pをいきなり搬送ガイド間内に下降可能に構築した表面処理装置の場合には、ワークの先端部分(縦吊状態での下端部分)が搬送ガイド間に入らないので、搬送が開始できない。そこで、本出願人は、処理槽10EP内に縦吊(姿態)状態維持手段を組込み、縦吊状態のワーク200Pを槽上から下降させつつ処理液中に浸漬する搬送に先立ち、ワーク200Pの両側から多数の挟持片を接近させかつその強制押え力を利用して縦吊状態(姿態)を保持(維持)可能に形成した表面処理装置を提供(特許文献2を参照)した。これによれば、処理槽10EP内に浸漬する際の先端曲り等を防止しつつワーク200Pを縦吊状態のまま真直ぐに処理液中に下降させることができた。   Further, in the case of a surface treatment apparatus constructed so that the workpiece 200P can be lowered suddenly between the conveyance guides, the leading end portion (lower end portion in the vertically suspended state) of the workpiece does not enter between the conveyance guides, so that conveyance cannot be started. . Accordingly, the present applicant incorporates a vertically suspended (appearance) state maintaining means in the processing tank 10EP, and prior to transporting the vertically suspended work 200P while being lowered from the tank, it is immersed on both sides of the work 200P. Provided a surface treatment apparatus formed such that a large number of clamping pieces were brought close to each other and the vertically suspended state (appearance state) could be maintained (maintained) by utilizing the forced pressing force (see Patent Document 2). According to this, the workpiece 200 </ b> P could be lowered straight into the processing liquid while being vertically suspended while preventing tip bending or the like when immersed in the processing tank 10 </ b> EP.

さらに、搬送方向の上流側に設けた上記の縦吊状態維持手段と搬送ガイド手段との間に引き起こる問題の解決として、両者間に液噴流導入案内手段を設けた表面処理装置を提案(特許文献3を参照)している。この液噴流導入案内手段は、水平搬送中のワーク200Pの両面側から液を強制噴流させて当該ワークの先端部が搬送ガイドに衝突することを回避させるためのものである。   Furthermore, as a solution to the problem caused between the above-described vertically suspended state maintaining means provided on the upstream side in the transport direction and the transport guide means, a surface treatment apparatus provided with a liquid jet introduction guide means between them is proposed (patent) Reference 3). The liquid jet introduction guide means is for forcibly jetting the liquid from both sides of the workpiece 200P during horizontal conveyance so as to prevent the tip of the workpiece from colliding with the conveyance guide.

かくして、プリント回路基板(200P)のような薄板状で可撓性に富んだワーク200Pを連続的に表面処理する場合には、上記の折衷方式を採用しているのが実状である。
特開2001−23440号 特開2002−285398号公報 特開2002−285396号公報
Thus, in the case of continuously surface-treating a thin plate-like workpiece 200P such as a printed circuit board (200P), it is actually the case that the above-described folding method is employed.
Japanese Patent Laid-Open No. 2001-23440 JP 2002-285398 A JP 2002-285396 A

しかしながら、電子部品や電子機器の一層の高品質が進みかつ小型化および低コスト化が一段と強く要求される現今では、上記の折衷方式の妥協的採用も難しくなる傾向にある。つまり、縦吊状態維持手段の一掃による装置小型化,コスト削減化はもとより、生産能率上、処理槽間ごとの上昇・水平搬送・下降工程を一掃できないかとの指摘がある。   However, at the present time when higher quality of electronic parts and electronic devices is advanced and further miniaturization and cost reduction are strongly demanded, it is difficult to compromise the above compromise method. In other words, it is pointed out that in terms of production efficiency, the ascending / horizontal conveyance / lowering process for each treatment tank can be wiped out as well as reducing the size and cost of the apparatus by cleaning up the vertically suspended state maintaining means.

これに関しては、その実現化を目指して試行を繰り返しているが、確認的に記述する以下の技術的事項の解決なくしては、実用的な連続処理方式の具現化は至難とされている。   With regard to this, trials have been repeated with the aim of realizing it, but it is considered difficult to realize a practical continuous processing system without solving the following technical matters described in a definite manner.

すなわち、図13において、上流側(右側)の処理槽10P12からX方向に搬送されて来たワーク200Pは、開口部13Pを通して処理槽10P22に搬入され、槽内連続移行中に表面処理が施されかつ処理後に後方側開口部(図示省略)を通して下流側(左側)の処理槽10P32に搬送される。各開口部から漏れた処理液(Qr)は、回収槽17Pに回収されかつ再循環使用される。   That is, in FIG. 13, the workpiece 200P conveyed in the X direction from the processing tank 10P12 on the upstream side (right side) is carried into the processing tank 10P22 through the opening 13P and subjected to surface treatment during the continuous transition in the tank. And after a process, it is conveyed to the downstream (left side) process tank 10P32 through a back side opening part (illustration omitted). The treatment liquid (Qr) leaked from each opening is collected in the collection tank 17P and is recycled.

ここに、プリント回路基板(ワーク200P)の形態の特殊性から、ワーク搬送手段側の冶具にワークの上端部(上辺側)を挟持させた縦吊状態(両面が垂直になる状態)で水平搬送される。他方、開口部13Pから漏れる液量Qrは非常に多く、しかも上流側に向い勢いよく流れ出る。   Here, because of the peculiarity of the form of the printed circuit board (work 200P), it is horizontally transported in a vertically suspended state (both surfaces are vertical) with the work upper end (upper side) held between jigs on the work transport means side. Is done. On the other hand, the amount of liquid Qr leaking from the opening 13P is very large and flows out toward the upstream side.

かくして、上流側の処理槽10P12から縦吊状態で搬送されて来たワーク200Pを、流出する大量の漏れ液流(Qr)に向いかつ逆らってその先端辺200F側から突入させると、ワーク200Pが湾曲しあるいはその先端が折れてしまう。つまり、平板形状物(200P)を縦吊状態のまま処理槽(10P12)内の処理液中に正確かつ円滑に搬入させることができない。   Thus, when the workpiece 200P conveyed in a vertically suspended state from the upstream processing tank 10P12 faces the large amount of leaked liquid flow (Qr) that flows out and counters from the tip side 200F side, the workpiece 200P is brought into contact with the workpiece 200P. It is bent or its tip is broken. That is, the plate-shaped object (200P) cannot be accurately and smoothly carried into the processing liquid in the processing tank (10P12) in a vertically suspended state.

そこで、液漏れ量Qrを小さくするには、図14(A)に示す1対の搬入ガイドローラ81PL,81PRを設けかつその間隔S1を狭くしなければならない。あるいは、図14(B)に示す弾性材質からなる1対の搬入ガイドブレード82PL,82PRの場合も間隔S2を極めて小さくしなければならない。しかし、液漏れ量Qrを絞れば絞る程に、ワークの先端がガイド(81PL,81PR、82PL,82PR)に直接に衝突してしまうという新たな問題が発生する。したがって、厚さが一段と薄くかつ可撓性に富む傾向が強いワーク200Pでは、連続処理方式は未だに実現できていない。   Therefore, in order to reduce the liquid leakage amount Qr, it is necessary to provide a pair of carry-in guide rollers 81PL and 81PR shown in FIG. 14A and to narrow the interval S1. Alternatively, in the case of a pair of carry-in guide blades 82PL and 82PR made of an elastic material shown in FIG. 14B, the interval S2 must be extremely small. However, as the liquid leakage amount Qr is reduced, a new problem that the tip of the workpiece directly collides with the guides (81PL, 81PR, 82PL, 82PR) occurs. Therefore, the continuous processing method has not yet been realized in the workpiece 200P which is much thinner and has a strong tendency to be flexible.

本発明の目的は、平板形状物を縦吊状態のまま処理槽の処理液中に確実かつ円滑に搬入させることができる平板形状物の表面処理方法および表面処理装置を提供することにある。   The objective of this invention is providing the surface treatment method and surface treatment apparatus of a flat plate-shaped thing which can be reliably and smoothly carried in into the process liquid of a processing tank with a flat plate-shaped object suspended vertically.

上記の試行処理槽10P22では、縦吊状態の平板形状物(200P)を導入させるために縦長でスリット形状の開口部13Pを設けているので、ダムの放水口の場合と同様に、その水頭に応じた勢いでかつ上流側に向かって噴出する処理液流(溢出流)が発生している。しかし、水道の蛇口の場合には、その流量の多少や勢い強弱に関係なく、水は下方に向かって流下するが手前に向かう溢出流は生じない。また、下方に向かう処理液中に搬送方向(横方向)から押し込むようにワーク200Pを搬入させれば、その直後からワークの各側面には等価の水圧が掛かりかつ下方に向けた軽い引張力を発生できるので、ワークが湾曲しあるいは折れることを防止できる筈である。   In the trial treatment tank 10P22, since a vertically long and slit-shaped opening 13P is provided in order to introduce a vertically suspended flat plate-shaped object (200P), as in the case of the dam outlet, A processing liquid flow (overflow) that spouts toward the upstream side with a corresponding momentum is generated. However, in the case of a water faucet, water flows downward but does not cause an overflow flow toward the front, regardless of the flow rate or strength. Further, if the workpiece 200P is carried into the processing liquid directed downward from the conveyance direction (lateral direction), an equivalent water pressure is applied to each side of the workpiece immediately after that, and a light tensile force directed downward is applied. Since it can be generated, it should be possible to prevent the workpiece from being bent or broken.

本発明は、これら経験則と推測事項に着目した試験・研究の結果として創生された新規で有用なものである。すなわち、積極的に処理液の下向きの連続流動を生成することで上流側に向かう噴出液流の発生を消滅しかつ下向連続流動液中にワークを直接搬入させることで、連続処理可能に形成したものである。   The present invention is novel and useful as a result of tests and research focusing on these empirical rules and assumptions. In other words, the continuous flow of the processing liquid is positively generated to eliminate the generation of the jet liquid flow toward the upstream side, and the workpiece can be directly carried into the downward continuous flow liquid to enable continuous processing. It is a thing.

具体的には、請求項1の発明は、処理液を再循環使用しつつ処理槽に処理液を下向連続流動させ、平板形状物を連続流動処理液中に押し込むようにして処理槽に搬入しかつ搬送中に下向連続流動処理液を用いて表面処理を施し、表面処理終了後に平板形状物を連続流動する処理液中から押し出すようにして処理槽から搬出させる、平板形状物の表面処理方法である。   Specifically, according to the first aspect of the present invention, the processing liquid is continuously flowed downward into the processing tank while the processing liquid is recirculated and used, and the flat plate-like product is pushed into the continuous flow processing liquid and is carried into the processing tank. In addition, surface treatment is performed using a downward continuous fluid treatment liquid during transportation, and after the surface treatment is finished, the flat plate material is pushed out from the treatment liquid flowing continuously, and is discharged from the treatment tank. Is the method.

また、請求項2の発明は、電解処理室の下方側で回収した処理液を電極室の下方側から供給しかつ電極室に供給して上向きに連続流動させ、電極室を連続流動した処理液を再循環使用しつつ電解処理室に再供給して処理液を下向きに連続流動させ、平板形状物を連続流動処理液中に押し込むようにして電解処理室に搬入しかつ搬送中に給電しつつ平板形状物に下向連続流動処理液を用いて表面処理を施し、表面処理終了後に平板形状物を連続流動処理液中から押し出すようにして電解処理室から搬出させる、平板形状物の表面処理方法である。   Further, the invention of claim 2 is that the processing liquid collected on the lower side of the electrolytic processing chamber is supplied from the lower side of the electrode chamber and supplied to the electrode chamber to continuously flow upward, and the processing liquid continuously flowing in the electrode chamber. While recirculating and re-feeding the electrolytic treatment chamber, the treatment liquid is continuously flowed downward, and the plate-shaped object is pushed into the continuous flow treatment liquid and carried into the electrolytic treatment chamber, and power is supplied during conveyance. A surface treatment method for a plate-shaped article, wherein the plate-shaped article is subjected to a surface treatment using a downward continuous fluid treatment solution, and after the surface treatment is finished, the plate-like article is pushed out of the continuous fluid treatment solution and taken out of the electrolytic treatment chamber. It is.

また、請求項3の発明は、処理槽を、搬送経路を挟み対向配設された1対の起立隔壁で区画しかつ処理液を下向きに連続流動可能な下向流動液室から形成し、下向流動液室の下方側で回収された処理液を下向流動液室に再供給しつつ再循環使用可能に形成し、平板形状物を上流側搬入用開口部を通しかつ連続流動処理液中に押し込むようにして下向流動液室に搬入可能で、処理済の平板形状物を下流側搬出用開口部を通しかつ連続流動処理液中から押し出すようにして下向流動液室から搬出可能に形成し、下向流動液室内の搬送中に下向連続流動処理液を用いて表面処理可能に形成された、平板形状物の表面処理装置である。   According to a third aspect of the present invention, the processing tank is defined by a pair of upstanding partition walls arranged opposite to each other across the conveyance path, and the processing liquid is formed from a downward flowing liquid chamber capable of continuously flowing downward. The processing liquid collected on the lower side of the counter-flow fluid chamber is formed so that it can be recirculated while being re-supplied to the downward-fluid fluid chamber, and the flat plate is passed through the upstream loading opening and in the continuous fluid processing solution. Can be carried into the downward flow liquid chamber as it is pushed into, and the processed flat plate-shaped object can be carried out from the downward flow liquid chamber through the downstream discharge opening and pushed out from the continuous flow treatment liquid. It is the surface treatment apparatus of the flat plate-shaped object formed and formed so that surface treatment is possible using the downward continuous fluid treatment liquid during conveyance in the downward fluid liquid chamber.

また、請求項4の発明は、1対の溢出槽を搬送経路を挟み対向配設し、下向流動液室が各内側起立隔壁で区画された区画内空間としてかつ上向流動液室が当該各溢出槽の内部空間として形成され、下向流動液室が当該各溢出槽の上端部を越えて溢出しかつ上方側開口部から供給された処理液Qspを下向連続流動可能に形成されるとともに上向流動液室が下方側から再供給された処理液Qspを上向連続流動可能に形成され、下向流動液室の搬送方向の上流側に搬入用開口部を設けかつその下流側に搬出用開口部を設け、下向流動液室の下方側開口部から流下排出された処理液を回収可能な回収槽と、回収された処理液を加圧して各上向流動液室に再供給しつつ処理液を再循環使用可能な液再循環手段とを設け、平板形状物を搬入用開口部を通しかつ連続流動処理液中に押し込むようにして下向流動液室に搬入可能であるとともに処理済の平板形状物を搬出用開口部を通しかつ連続流動処理液中から押し出すようにして下向流動液室から搬出可能に形成し、下向流動液室内の搬送中に下向連続流動処理液を用いて平板形状物に表面処理可能に形成された、平板形状物の表面処理装置である。   In the invention of claim 4, a pair of overflow tanks are arranged opposite to each other across the conveyance path, and the downward fluid chamber is defined as an internal space defined by the inner standing partition walls, and the upward fluid chamber is Formed as an internal space of each overflow tank, the downward flow liquid chamber overflows beyond the upper end of each overflow tank, and is formed so that the processing liquid Qsp supplied from the upper opening can flow downward continuously. In addition, the upward fluid chamber is formed so that the processing liquid Qsp re-supplied from the lower side can continuously flow upward, and a loading opening is provided on the upstream side in the transport direction of the downward fluid chamber and on the downstream side thereof. A recovery opening is provided, a recovery tank that can recover the processing liquid that flows down from the lower side opening of the downward fluid chamber, and the recovered processing fluid is pressurized and re-supplied to each upward fluid chamber And a liquid recirculation means capable of recirculating the treatment liquid while providing a plate-shaped object with an opening for carrying in In addition, it is possible to carry it into the downward flow liquid chamber by pushing it into the continuous flow treatment liquid, and to flow the downward flow by pushing the processed flat plate shape through the opening for unloading and from the continuous flow treatment liquid. A flat plate surface treatment apparatus that is formed so as to be able to be carried out from a liquid chamber, and is formed so as to be capable of being subjected to a surface treatment on a flat plate using a downward continuous fluid treatment liquid during conveyance in a downward flow liquid chamber.

さらに、請求項5の発明は、各上向流動液室内に当該各内側起立隔壁を挟んで平板形状物の各面に対向可能に電極を配設するとともに各内側起立隔壁が電極と平板形状物との間の通電を促進可能かつ上向流動液室から下向流動液室への処理液のバイパス流動を抑制可能に形成されている。請求項6の発明は、内側起立隔壁が多孔板から形成されている。また、請求項7の発明は、起立隔壁が布製シート部材から形成されている。   Furthermore, the invention according to claim 5 is arranged such that an electrode is disposed in each upward flowing liquid chamber so as to be opposed to each surface of the plate-shaped object with each inner standing partition wall interposed therebetween, and each inner standing partition wall is formed with the electrode and the plate-shaped object. And the bypass flow of the processing liquid from the upward fluid chamber to the downward fluid chamber can be suppressed. In the invention of claim 6, the inner standing partition is formed of a perforated plate. According to a seventh aspect of the present invention, the standing partition is formed from a cloth sheet member.

さらに、請求項8の発明は、平板形状物がプリント回路基板とされかつ搬送手段側の複数の冶具でプリント回路基板の上端部を挟持させた縦吊状態で搬送可能に形成されている。   Further, the invention of claim 8 is formed so that the flat plate-like object is a printed circuit board and can be conveyed in a vertically suspended state in which the upper end portion of the printed circuit board is sandwiched by a plurality of jigs on the conveying means side.

請求項1の発明によれば、平板形状物を縦吊状態のまま処理槽内で下向きに流動する処理液中に確実かつ円滑に搬入させることができる。よって、連続搬送と高品質処理とを高能率でかつ安定して行える。   According to invention of Claim 1, a flat plate-shaped thing can be reliably and smoothly carried in in the process liquid which flows downward in a process tank with a vertically suspended state. Therefore, continuous conveyance and high quality processing can be performed efficiently and stably.

また、請求項2の発明によれば、請求項1の発明の場合と同様に平板形状物を縦吊状態のまま処理槽内で下向きに流動する処理液中に確実かつ円滑に搬入させることができるとともに、平板形状物と電極との間の給電を伴う電解処理を高能率でかつ安定して行える。   Further, according to the invention of claim 2, as in the case of the invention of claim 1, the flat plate-like object can be reliably and smoothly carried into the treatment liquid that flows downward in the treatment tank while being vertically suspended. In addition, the electrolytic treatment with power feeding between the flat plate and the electrode can be performed efficiently and stably.

また、請求項3の発明によれば、請求項1の発明の場合と同様に平板形状物を縦吊状態のまま処理槽内で下向きに流動する処理液中に確実かつ円滑に搬入させることができるとともに、具現化が容易である。   Further, according to the invention of claim 3, as in the case of the invention of claim 1, the flat plate-like object can be reliably and smoothly carried into the processing liquid that flows downward in the processing tank while being vertically suspended. It can be easily implemented.

さらに、請求項4の発明によれば、請求項3の発明の場合と同様な効果を奏することができることに加え、さらに1対の溢出槽を用いて下向流動液室および上向流動液室が形成されているので、液流動を一段と安定化できるとともに構造簡単かつ取り扱いが容易である。   Furthermore, according to the invention of claim 4, in addition to the effects similar to those of the invention of claim 3, in addition, a downward fluid chamber and an upward fluid chamber can be obtained using a pair of overflow tanks. Therefore, the liquid flow can be further stabilized and the structure is simple and the handling is easy.

さらに、請求項5の発明によれば、請求項4の発明の場合と同様な効果を奏することができることに加え、請求項2の発明の場合と同様に平板形状物と電極との間の給電を伴う電解処理を高能率でかつ安定して行える。また、請求項6の発明によれば、請求項5の発明の場合と同様な効果を奏することができる他、さらにコスト低減ができる。請求項7の発明によれば、請求項5の発明の場合と同様な効果を奏することができる他、さらに処理液のバイパス流動を抑制する作用を強化することができる。   Furthermore, according to the invention of claim 5, in addition to the effects similar to the case of the invention of claim 4, the power feeding between the flat plate-like object and the electrode as in the case of the invention of claim 2 is achieved. Can be performed efficiently and stably. According to the invention of claim 6, the same effect as that of the invention of claim 5 can be obtained, and the cost can be further reduced. According to the seventh aspect of the invention, the same effect as in the case of the fifth aspect of the invention can be obtained, and further, the action of suppressing the bypass flow of the processing liquid can be enhanced.

さらにまた、請求項8の発明によれば、請求項3から請求項7まで各発明の場合と同様な効果を奏することができることに加え、一段と多様化するプリント回路基板への適応性が広くかつ高品質基板の提供に大きく貢献することができる。   Furthermore, according to the invention of claim 8, in addition to being able to achieve the same effects as in the case of each invention from claim 3 to claim 7, the adaptability to further diversified printed circuit boards is wide and It can greatly contribute to the provision of high quality substrates.

(第1の実施の形態)
本表面処理方法(請求項1の発明)を実施するために最良な表面処理装置は、図1(概略正面図)に示す如く、処理槽10を搬送経路12を挟み対向配設した1対の起立隔壁32AL,32ARで区画されかつ上方側から供給された処理液Qspを下向きに連続流動(Qdp)可能な下向流動液室11(11L,11R)から形成し、この下向流動液室の下方側に流下した処理液Qdpを回収可能かつ回収された処理液を下向流動液室11(11L,11R)の上方側に再供給しつつ再循環使用可能に形成し、平板形状物(200)を搬送方向の上流側に設けられた搬入用開口部15INを通して下向流動液室に搬入可能であるとともに処理済の平板形状物をその下流側に設けられた搬出用開口部15OTを通して下向流動液室から搬出可能に形成し、下向流動液室内の搬送中に下向きに連続流動する処理液Qdnを用いて平板形状物(200)に表面処理を施すことができるように形成されている。
(First embodiment)
As shown in FIG. 1 (schematic front view), the best surface treatment apparatus for carrying out this surface treatment method (invention of claim 1) is a pair of treatment tanks 10 arranged opposite to each other with a conveyance path 12 therebetween. The processing liquid Qsp partitioned by the standing partition walls 32AL and 32AR and supplied from the upper side is formed from the downward flow liquid chamber 11 (11L, 11R) capable of continuous downward flow (Qdp). The processing liquid Qdp that has flowed downward can be recovered, and the recovered processing liquid can be recirculated while being re-supplied to the upper side of the downward flow liquid chamber 11 (11L, 11R). ) Can be carried into the downward fluid chamber through the carrying-in opening 15IN provided on the upstream side in the conveying direction, and the processed flat plate-shaped object is directed downward through the carrying-out opening 15OT provided on the downstream side thereof. Can be removed from the fluid chamber Formed, it is formed so as to be able to perform a surface treatment on a flat plate-like object (200) using the processing solution Qdn continuous flow downwards during transfer of the downward flow liquid chamber.

ここに、平板形状物は、この実施の形態では、プリント回路基板(ワーク200)とされている。このワーク200は、ワーク搬送手段(70)側の複数の冶具80にその上端部を挟持させた縦吊状態で、搬送方向(図1で紙面に直交する方向…搬送経路12)に連続搬送される。複数の冶具80は、搬送方向に一定ピッチで取付けられている。なお、ワーク搬送手段(70)等に関しては、第3の実施形態において説明する。   Here, the flat plate-like object is a printed circuit board (workpiece 200) in this embodiment. The workpiece 200 is continuously conveyed in the conveying direction (the direction perpendicular to the paper surface in FIG. 1 ... the conveying path 12) in a vertically suspended state in which the upper ends of the workpieces are sandwiched by a plurality of jigs 80 on the workpiece conveying means (70) side. The The plurality of jigs 80 are attached at a constant pitch in the transport direction. The work transfer means (70) and the like will be described in the third embodiment.

確認的に、本表面処理方法(装置)の基本的構成・機能は、搬送方向[X方向(図6,図7を参照)]の上流側から縦吊状態で搬送されて来た平板形状物(200)を処理槽10に搬入し、処理槽10の処理液中で平板形状物に表面処理を施し、表面処理後の平板形状物を処理槽から搬出してその下流側に搬送させることで、複数枚の平板形状物を連続的に表面処理するものである。   To be sure, the basic configuration / function of this surface treatment method (apparatus) is that the plate-shaped object is transported in a vertically suspended state from the upstream side in the transport direction [X direction (see FIGS. 6 and 7)]. (200) is carried into the treatment tank 10, surface treatment is performed on the flat plate-shaped article in the treatment liquid of the treatment tank 10, and the flat plate-shaped article after the surface treatment is carried out of the treatment tank and conveyed downstream thereof. A plurality of flat plate-like objects are continuously surface-treated.

処理槽10は、X方向に伸びる搬送経路12を挟み槽幅方向(図1で左右方向)に対向(離隔)配設された1対の起立隔壁32AL,32ARを用いて区画された下向流動液室11から形成されている。この下向流動液室11は、上方側から供給された処理液Qspを利用して下向きに連続して流動(Qdn)させることができる。つまり、下向連続液流動(域)を生成可能である。なお、搬送経路12を中心とした場合、その左側を下向流動液室11Lしかつ右側を下向流動液室11Rとする。   The processing tank 10 has a downward flow defined by a pair of upstanding partition walls 32AL and 32AR disposed opposite (separated) in the tank width direction (left and right direction in FIG. 1) with the conveyance path 12 extending in the X direction interposed therebetween. The liquid chamber 11 is formed. The downward flowing liquid chamber 11 can be continuously flowed downward (Qdn) using the processing liquid Qsp supplied from the upper side. That is, a downward continuous liquid flow (zone) can be generated. When the transport path 12 is the center, the left side is a downward fluid chamber 11L and the right side is a downward fluid chamber 11R.

なお、この下向流動液室11(起立隔壁32AL,32AR)の上方側には処理液を供給するための開口部13が設けられ、下方側には流下した処理液を排出するための開口部19が設けられている。   An opening 13 for supplying the processing liquid is provided above the downward fluid chamber 11 (standing partition walls 32AL and 32AR), and an opening for discharging the flowing processing liquid is provided on the lower side. 19 is provided.

ここに、上部開放かつ四方側壁で有底構造の従来例(例えば、図13の処理槽10P22)の構造に比較して、本処理槽10は槽内での処理液の流動および供給・排出に関する作用(機能)が全く異なる。つまり、ユニークな構造であると理解される。ただし、具現(構築)化は容易である。   Compared with the structure of the conventional example (for example, processing tank 10P22 in FIG. 13) having an open top and a four-sided wall, the present processing tank 10 relates to the flow of the processing liquid in the tank and the supply / discharge. The action (function) is completely different. In other words, it is understood as a unique structure. However, implementation (construction) is easy.

また、処理槽10(下向流動液室11)の搬送方向の上流側(図1で紙面に直交する方向で手前側)にワーク200を縦吊状態のまま搬入させるための搬入用開口部15INが設けられかつ下流側に処理後のワーク200を縦吊状態のまま搬出させるための搬出用開口部15OTが設けられている(図6を参照)。   Further, a loading opening 15IN for carrying the workpiece 200 in a vertically suspended state on the upstream side in the conveying direction of the processing tank 10 (downward flowing liquid chamber 11) (front side in the direction orthogonal to the paper surface in FIG. 1). And an unloading opening 15OT for unloading the processed workpiece 200 in a vertically suspended state (see FIG. 6).

上部開放部13を通して供給された処理液Qspは、下向流動液室11において、下向きに連続して流動する。つまり、処理液Qdnの全量が垂直方向に自然流下(加圧流下としてもよい。)するので、従来例の場合(図13)のように水頭により処理液QrがX方向へ大量にかつ勢いよく漏れるという不都合は生じない。   The processing liquid Qsp supplied through the upper open part 13 continuously flows downward in the downward flowing liquid chamber 11. That is, since the entire amount of the processing liquid Qdn naturally flows down in the vertical direction (may be pressurized flow), as in the case of the conventional example (FIG. 13), the processing liquid Qr becomes large and vigorous in the X direction by the water head. There is no inconvenience of leaking.

したがって、各開口部15は、従来例(図13)の場合と同様な縦長スリット形状であるが、幅方向寸法は従来例のように神経質的に細かく選択決定する必要がない。上記のように開口部15からX方向に勢いよく大量の処理液(Qr)が流出する現象が生じないので、自由裁量的に決めることができる。また、ガイド(81PL,81PR等)を設ける必要もないので、装置簡素化および低コスト化を促進できる。   Therefore, each opening 15 has a vertically long slit shape similar to that in the conventional example (FIG. 13), but the width direction dimension does not need to be determined and determined in a nervous manner as in the conventional example. As described above, since a phenomenon in which a large amount of the processing liquid (Qr) flows out from the opening 15 in the X direction does not occur, it can be determined freely. Further, since there is no need to provide a guide (81PL, 81PR, etc.), simplification of the apparatus and cost reduction can be promoted.

因みに、この実施の形態では、製作上の事情等を考慮してワーク200の厚み(t)の約5倍(5t)から10倍(10t)に狭くしてある(図5を参照)。   Incidentally, in this embodiment, the thickness is reduced from about 5 times (5t) to 10 times (10t) of the thickness (t) of the workpiece 200 in consideration of manufacturing circumstances (see FIG. 5).

さて、下向流動液室11の上方側開口部13を通して供給された処理液Qspは、室内を流下した後、下方側開口部19を通して排出されかつこの排出処理液Qdpは回収槽40に回収される。また、回収された処理液は、液再循環手段50によって下向流動液室11(11L,11R)の上方側(13)に再供給しつつ再循環使用可能に形成されている。   The processing liquid Qsp supplied through the upper opening 13 of the downward fluid chamber 11 flows down through the chamber and is then discharged through the lower opening 19 and the discharged processing liquid Qdp is recovered in the recovery tank 40. The Further, the recovered processing liquid is configured to be recirculated while being re-supplied to the upper side (13) of the downward flowing liquid chamber 11 (11L, 11R) by the liquid recirculation means 50.

この液再循環手段50は、吸込管51,再循環ポンプ55,フィルタ56および供給管52等から形成され、回収槽40から吸引した処理液を加圧して下向流動液室11(11L,11R)の上方側に再供給する。この実施の形態では、各起立隔壁32AL,32ARの上端部に供給管52に連通する枝管52L,52Rを設け、この枝管52L,52Rに接続された液噴出ヘッダー53L,53Rから上部開口部13を通して処理液を再供給する。液噴出ヘッダー53L,53Rは、X方向に伸びかつ当該各下向流動液室11L,11R内に間断無くかつ必要十分な量の処理液を噴出することができる。   The liquid recirculation means 50 is formed of a suction pipe 51, a recirculation pump 55, a filter 56, a supply pipe 52, and the like, pressurizing the processing liquid sucked from the recovery tank 40, and downward fluid chamber 11 (11L, 11R). ) To the upper side. In this embodiment, branch pipes 52L and 52R communicating with the supply pipe 52 are provided at the upper ends of the upright partition walls 32AL and 32AR, and upper openings are formed from the liquid ejection headers 53L and 53R connected to the branch pipes 52L and 52R. 13 to re-supply the processing solution. The liquid ejection headers 53L and 53R extend in the X direction and can eject a necessary and sufficient amount of processing liquid into the downward flowing liquid chambers 11L and 11R without interruption.

かくして、下向流動液室11L,11R内の処理液Qは、重力作用により下方に向かって連続して流下する。搬入されたワーク200を中心に観察すれば、左右の下向流動液室11L,11Rのそれぞれに処理液の下向連続流動(域)を形成したことに等しい。したがって、従来例の場合(図13)のように激しい漏れ噴出液Qrとの衝突がないから、ワーク20の先端辺(200F)に折れや湾曲が生じない。つまり、処理液中にワーク200を確実かつ円滑に搬入することができる。   Thus, the processing liquid Q in the downward flow liquid chambers 11L and 11R continuously flows downward due to the gravitational action. Observing around the loaded workpiece 200, it is equivalent to forming a downward continuous flow (region) of the processing liquid in each of the left and right downward flowing liquid chambers 11L and 11R. Therefore, unlike the conventional example (FIG. 13), there is no severe collision with the leaked jet liquid Qr, so that the tip side (200F) of the workpiece 20 is not bent or curved. That is, the workpiece 200 can be reliably and smoothly carried into the processing liquid.

また、この流下処理液(下向連続流動液)Qdnは、浸漬(搬入)されたワーク200の各面(表裏面)に等価の液圧を付与することになる。つまり、ワーク200の左右に圧力差が生じない。しかも、下向連続流動液(流下液)は、上端部が冶具80に挟持された縦吊状態のワーク200に、その上端部側から下端部側に向けた引張力を生じさせるように働く。   In addition, the flow-down treatment liquid (downward continuous flow liquid) Qdn applies an equivalent hydraulic pressure to each surface (front and back surfaces) of the immersed workpiece 200. That is, there is no pressure difference between the left and right of the workpiece 200. Moreover, the downward continuous flowing liquid (falling liquid) acts on the vertically suspended workpiece 200 having the upper end sandwiched between the jigs 80 so as to generate a tensile force from the upper end to the lower end.

かくして、搬入されたワーク200は、上端部(80)が固定端とされかつ自由端(先端部)が下方に引っ張られるので、左右に揺動したり湾曲することなく、真直ぐ1枚板として縦吊状態のまま処理液中を円滑に搬送される。因みに、第3の実施形態の如く電解処理槽10EPの場合には、ワーク200と各電極との間隔(極間距離)が一定になるので、高精度処理を安定して行える。   Thus, since the upper end (80) is a fixed end and the free end (tip end) is pulled downward, the workpiece 200 that has been loaded is vertically straightened as a single plate without swinging left or right or bending. It is smoothly transported in the processing liquid in the suspended state. Incidentally, in the case of the electrolytic treatment tank 10EP as in the third embodiment, the interval (distance between the electrodes) between the workpiece 200 and each electrode is constant, so that high-precision treatment can be performed stably.

かかる構成の第1の実施形態によれば、処理槽10の下方側で回収した処理液をその上方側から再供給して再循環使用しつつ処理槽に処理液を下向きに連続流動させ、平板形状物(200)を連続流動する処理液中に押し込むようにして処理槽に搬入しかつ搬送中に当該平板形状物に下向きに連続流動する処理液を用いて表面処理を施し、表面処理終了後に平板形状物を連続流動する処理液中から押し出すようにして処理槽から搬出させる表面処理方法を、確実かつ高能率で実施することができる。   According to the first embodiment having such a configuration, the processing liquid collected on the lower side of the processing tank 10 is re-supplied from the upper side and recirculated and used, and the processing liquid is continuously flowed downward in the processing tank, The shaped article (200) is carried into the treatment tank so as to be pushed into the continuously flowing treatment liquid, and surface treatment is performed on the flat plate shaped article using the treatment liquid continuously flowing downward during the conveyance, and after the surface treatment is completed. The surface treatment method of extruding a flat plate-shaped object from the treatment tank by extruding it from the continuously flowing treatment liquid can be carried out reliably and efficiently.

詳しくは、液再循環手段50(55)を駆動して、貯液タンク40から吸引した処理液を加圧しつつ液噴出ヘッダー53L,53Rから処理槽10内の上方側開口部13を通して下向流動液室11(11L,11R)に供給する。下向流動液室11(11L,11R)内には、処理液の下向連続流動(域)が生成される。この下向連続流動(域)は、処理液が垂直に自然流下する層流状態の液流である。   Specifically, the liquid recirculation means 50 (55) is driven to pressurize the processing liquid sucked from the liquid storage tank 40 and flow downward from the liquid ejection headers 53L and 53R through the upper opening 13 in the processing tank 10. Supply to the liquid chamber 11 (11L, 11R). A downward continuous flow (zone) of the processing liquid is generated in the downward flowing liquid chamber 11 (11L, 11R). This downward continuous flow (zone) is a liquid flow in a laminar flow state in which the processing liquid naturally flows vertically.

したがって、上流側の搬入用開口部15INおよび下流側の搬出用開口部15OTから搬送方向に処理液が勢いよく噴出することはない。静かに下方側開口部19から流下排出されて下方の回収槽40に回収される。処理液の再循環使用により、運転中は下向連続流動が続く。   Therefore, the processing liquid does not spout out from the upstream loading opening 15IN and the downstream unloading opening 15OT in the transport direction. The water is gently discharged from the lower opening 19 and collected in the lower collection tank 40. Due to the recirculating use of the processing liquid, a downward continuous flow continues during operation.

ここで、搬送方向の上流側(図1の紙面手前側)から縦吊状態で搬送されて来た平板形状物(ワーク200)は、搬入用開口部15INから処理槽10(11)内に搬入される。従来例の場合のように搬送方向への噴出液流に逆らって突入させるのではなく、連続流動する処理液中に押し込むようにして搬入される。換言すれば、層流状態の連続流動処理液に横方向(搬送方向)から割り込ませるように、ワーク200をその先端辺200F(図6,図12を参照)から静かに押し入れる。したがって、搬入時の折れや湾曲は生じない。つまり、平板形状物(200)を縦吊状態のまま処理槽10(11)内で下向きに流動する処理液中に確実かつ円滑に搬入させることができる。   Here, the plate-shaped object (work 200) transported in a vertically suspended state from the upstream side in the transport direction (the front side in FIG. 1) is transported into the processing tank 10 (11) from the transport opening 15IN. Is done. Instead of rushing against the jet liquid flow in the transport direction as in the case of the conventional example, it is carried in by being pushed into the continuously flowing processing liquid. In other words, the workpiece 200 is gently pushed from the front end side 200F (see FIGS. 6 and 12) so as to interrupt the laminar flow continuous liquid processing solution from the lateral direction (conveyance direction). Therefore, there is no folding or bending at the time of loading. That is, the flat plate-shaped object (200) can be reliably and smoothly carried into the processing liquid that flows downward in the processing tank 10 (11) while being vertically suspended.

また、処理槽10(11)内では、ワーク200の各面(表裏面)に等圧が加わるので、圧力差に起因する揺れが生じない。さらに、下向連続流動処理液は、ワーク200を下方に引っ張る作用を誘発する。したがって、処理液中での円滑搬送が担保される。   Further, in the treatment tank 10 (11), an equal pressure is applied to each surface (front and back surfaces) of the workpiece 200, so that the vibration due to the pressure difference does not occur. Further, the downward continuous fluid treatment liquid induces an action of pulling the workpiece 200 downward. Therefore, smooth conveyance in the processing liquid is ensured.

この処理液中でワーク200に表面処理を施すことができる。この際、下向連続流動処理液の表面払拭作用によりワーク200の表裏面の活性が高められる。ムラがなく全面的均一でかつ高品質な表面処理を迅速に行える。また、従来例の場合(図10,図11,図12)のように、槽内に液撹拌手段やバブリング手段を設ける必要がない。   The surface treatment can be applied to the workpiece 200 in this treatment liquid. At this time, the activity of the front and back surfaces of the workpiece 200 is enhanced by the surface wiping action of the downward continuous fluid treatment liquid. Uniform and high-quality surface treatment can be performed quickly without any unevenness. Further, unlike the conventional example (FIGS. 10, 11, and 12), there is no need to provide liquid stirring means or bubbling means in the tank.

表面処理後のワーク200は、下向連続流動処理液中から押し出すようにして処理槽10(11)から外部に搬出されかつその下流側に搬送される。後端辺200B(図6を参照)が搬出用開口部15OTから完全に出るまで、ワーク200の両面(表裏面)の液圧均一と下方への引っ張り作用が働くので、この点からも円滑な搬出ができる。   The workpiece 200 after the surface treatment is carried out from the treatment tank 10 (11) to the outside so as to be pushed out from the downward continuous fluid treatment solution, and is conveyed downstream thereof. Until the rear end side 200B (see FIG. 6) completely comes out of the unloading opening 15OT, the hydraulic pressure is uniform on both surfaces (front and back surfaces) of the workpiece 200 and the downward pulling action works. Can be carried out.

かくして、連続搬送と高品質処理とを確実かつ安定して行え、結果として、複数枚の平板形状物(プリント回路基板200)を連続的に表面処理することができる。しかも、具現化が容易で、構造簡単かつ取り扱いが容易(簡単)である。
(第2の実施の形態)
Thus, continuous conveyance and high quality processing can be performed reliably and stably, and as a result, a plurality of flat plate-shaped objects (printed circuit board 200) can be continuously surface-treated. Moreover, it is easy to implement, simple in structure and easy to handle (simple).
(Second Embodiment)

この第2の実施の形態は、図2に示される。基本的な構成・機能は第1の実施形態の場合(図1)と同様であるが、処理槽10(11,21)を1対の溢出槽30L,30Rを対向配設することで表面処理装置を構築可能に形成してある。   This second embodiment is shown in FIG. The basic configuration and function are the same as in the case of the first embodiment (FIG. 1), but the surface treatment is performed by arranging the treatment tank 10 (11, 21) with a pair of overflow tanks 30L, 30R facing each other. The device can be constructed.

すなわち、表面処理装置は、1対の溢出槽30L,30Rを対向配設して下向流動液室11(11L,11R)と上向流動液室21L,21Rとを形成し、下向流動液室11(11L,11R)が処理液を下向連続流動可能かつ上向流動液室21L,21Rが上向連続流動可能に形成され、下向流動液室11(11L,11R)に搬入用開口部15INおよび搬出用開口部15OTを設けかつ処理液の再循環使用に必要な回収槽40および液再循環手段50を設け、第1の実施形態の場合と同様にワーク200を下向流動液室に搬入可能かつ搬出可能であるとともに下向流動液室11内の搬送中に下向連続流動処理液Qdnを用いて表面処理可能に形成されている。   That is, in the surface treatment apparatus, a pair of overflow tanks 30L and 30R are arranged to face each other to form the downward fluid chamber 11 (11L and 11R) and the upward fluid chambers 21L and 21R. The chamber 11 (11L, 11R) is formed so that the processing liquid can continuously flow downward, and the upward fluid chambers 21L, 21R can be continuously flowed upward, and the opening for carrying in the downward fluid chamber 11 (11L, 11R) And a recovery tank 40 and a liquid recirculation means 50 necessary for recirculation and use of the processing liquid are provided, and the workpiece 200 is placed in the downward fluid chamber as in the first embodiment. And is capable of being surface-treated using the downward continuous fluid treatment liquid Qdn during conveyance in the downward fluid chamber 11.

なお、第1の実施形態において説明した事項と共通する部分については、その説明を簡略化しまたは省略する。   In addition, about the part which is common in the matter demonstrated in 1st Embodiment, the description is simplified or abbreviate | omitted.

図2において、1対の溢出槽30L,30Rは、各内側起立隔壁32L,32Rが搬送経路12を挟み対面するようにして対向配設される。各溢出槽30L,30Rは、上部開放型のオーバーフロー槽で、各内側起立隔壁32L,32Rの上端部を越えて溢出(オーバーフロー)する処理液Qspを下向流動液室11(11L,11R)内に供給する。処理液の供給がオーバーフロー方式であるから、第1の実施形態の場合に比較して、一段と静かで円滑かつ安定した均一供給ができる。   In FIG. 2, the pair of overflow tanks 30 </ b> L and 30 </ b> R are opposed to each other so that the inner standing partition walls 32 </ b> L and 32 </ b> R face each other with the conveyance path 12 therebetween. The overflow tanks 30L and 30R are upper open type overflow tanks, and the processing liquid Qsp that overflows (overflows) beyond the upper ends of the inner standing partition walls 32L and 32R is contained in the downward flow liquid chamber 11 (11L and 11R). To supply. Since the supply of the processing liquid is an overflow method, it is possible to perform a quieter, smoother and more stable uniform supply as compared with the case of the first embodiment.

処理槽10の一部を構成する下向流動液室11(11L,11R)は、各内側起立隔壁32L,32Rで区画された区画内空間として形成される。下向流動液室11(11L,11R)は、各溢出槽30L,30Rの上端部を越えて溢出しかつ上方側開口部13から供給された処理液Qspを下向きに連続流動可能である。   The downward flowing liquid chamber 11 (11L, 11R) constituting a part of the processing tank 10 is formed as an intra-compartment space defined by the inner standing partition walls 32L, 32R. The downward flowing liquid chamber 11 (11L, 11R) overflows the upper ends of the overflow tanks 30L, 30R and can continuously flow the processing liquid Qsp supplied from the upper opening 13 downward.

また、処理槽10の一部を構成する上向流動液室21L,21Rは、各溢出槽30L,30Rの内部空間として形成される。上向流動液室21L,21Rは、下方側から再供給された処理液を上向きに連続流動可能である。つまり、上向流動液室21L,21Rは、下方側から供給された処理液を利用して上向きに連続して流動する処理液Qupつまり上向液流動(域)を生成する。溢出槽30L,30Rの内底部には整流ボックス36L,36Rを設け、安定した上向流を生成可能かつ維持可能に形成してある。   Further, the upward fluid chambers 21L and 21R constituting a part of the processing tank 10 are formed as internal spaces of the overflow tanks 30L and 30R. The upward fluid chambers 21L and 21R are capable of continuously flowing the processing liquid resupplied from the lower side upward. That is, the upward flowing liquid chambers 21L and 21R generate the processing liquid Qup that flows continuously upward, that is, the upward liquid flow (zone) by using the processing liquid supplied from the lower side. Rectification boxes 36L and 36R are provided at the inner bottoms of the overflow tanks 30L and 30R, so that a stable upward flow can be generated and maintained.

そして、下向流動液室11(11L,11R)の搬送方向の上流側に搬入用開口部15INを設けかつその下流側に搬出用開口部15OTを設けてある。開口部の幅は、溢出槽30L,30Rの各内側起立隔壁32L,32R間の距離である。ただし、調整板を付設するなどして、各内側起立隔壁32L,32R間の距離相当幅よりも狭い幅に形成してもよい。   A carry-in opening 15IN is provided on the upstream side in the transport direction of the downward fluid chamber 11 (11L, 11R), and a carry-out opening 15OT is provided on the downstream side thereof. The width of the opening is the distance between the inner standing partition walls 32L and 32R of the overflow tanks 30L and 30R. However, a width narrower than the width corresponding to the distance between the inner standing partition walls 32L and 32R may be formed by attaching an adjustment plate.

回収槽40は、下向流動液室11(11L,11R)の下方側開口部19から流下排出された処理液を回収することができる。液再循環手段50は、回収された処理液を加圧してかつ各整流ボックス(整流ヘッダーでもよい。)36L,36Rを通じて各上向流動液室21L,21Rに再供給しつつ処理液を再循環使用する。   The collection tank 40 can collect the processing liquid discharged from the lower opening 19 of the downward fluid chamber 11 (11L, 11R). The liquid recirculation means 50 pressurizes the collected processing liquid and recirculates the processing liquid while re-supplying it to the upward flow liquid chambers 21L and 21R through the rectifying boxes (which may be rectifying headers) 36L and 36R. use.

かくして、ワーク200を搬送方向の上流側に設けられた搬入用開口部15INを通しかつ連続流動する処理液中に押し込むようにして下向流動液室11に搬入可能であるとともに処理済のワークをその下流側に設けられた搬出用開口部15OTを通しかつ連続流動する処理液中から押し出すようにして下向流動液室11から搬出可能に形成し、下向流動液室内の搬送中に下向きに連続流動する処理液を用いてワーク200に表面処理を施すことができる。   Thus, the workpiece 200 can be carried into the downward flowing liquid chamber 11 while being pushed through the loading opening 15IN provided on the upstream side in the conveyance direction and into the continuously flowing treatment liquid. It is formed so as to be able to be discharged from the downward flowing liquid chamber 11 so as to be pushed out from the processing liquid flowing continuously through the unloading opening 15OT provided on the downstream side, and downward while being conveyed in the downward flowing liquid chamber. The surface treatment can be performed on the workpiece 200 using a continuously flowing treatment liquid.

しかして、この第2の実施の形態によれば、第1の実施形態の場合と同様に平板形状物(ワーク200)を縦吊状態のまま処理槽10(11)内で下向きに流動する処理液中に確実かつ円滑に搬入させることができる。しかも、1対の溢出槽30L,30Rを用いて下向流動液室11および上向流動液室21を形成すればよいので、具現化が一段と容易で、処理液流動を一段と安定化できる。   Thus, according to the second embodiment, as in the case of the first embodiment, the plate-shaped object (work 200) flows downward in the treatment tank 10 (11) while being vertically suspended. It can be reliably and smoothly carried into the liquid. Moreover, since the downward fluid chamber 11 and the upward fluid chamber 21 may be formed using the pair of overflow tanks 30L and 30R, the embodiment can be realized more easily, and the processing fluid flow can be further stabilized.

また、1対の溢出槽30L,30Rの搬送経路12を中心とした配設間隔を変更するだけで、下向流動液室11(11L,11R)の内容積や搬入用開口部15INおよび搬出用開口部15OTの幅を調整できるので、ワーク200の厚さや搬送速度等に対する適応性が広い。
(第3の実施の形態)
Furthermore, the internal volume of the downward fluid chamber 11 (11L, 11R), the opening 15IN for carrying in, and the carrying out are simply changed by changing the arrangement interval around the conveying path 12 of the pair of overflow tanks 30L, 30R. Since the width of the opening 15OT can be adjusted, the adaptability to the thickness of the workpiece 200, the conveyance speed, and the like is wide.
(Third embodiment)

この第3の実施の形態は、図3〜図8に示される。基本的な構成・機能は第2の実施形態の場合(図2)と同様であるが、表面処理が電解処理(ここでは、めっき処理)とされかつ処理槽10が電解処理槽10EPとして形成してある。また、請求項2の発明に係る表面処理方法を実施するために最良である。   This third embodiment is shown in FIGS. The basic configuration and function are the same as in the case of the second embodiment (FIG. 2), but the surface treatment is electrolytic treatment (here, plating treatment) and the treatment tank 10 is formed as an electrolytic treatment tank 10EP. It is. Further, it is the best for carrying out the surface treatment method according to the invention of claim 2.

図3において、表面処理(電解処理)装置は、第2の実施形態の場合と同様な各上向流動液室21L,21R内に当該各内側起立隔壁(37L,37R)を挟んでワーク200の各面(表裏面)に対向可能に電極35KL,35KRを配設するとともに、各内側起立隔壁(37L,37R)が電極35KL,35KRと平板形状物(200)との間の通電を促進可能かつ上向流動液室21L,21Rから下向流動液室11L,11Rへの処理液のバイパス(素通り)流動を抑制可能に形成されている。   In FIG. 3, the surface treatment (electrolytic treatment) apparatus is similar to the case of the second embodiment in that the workpiece 200 is sandwiched between the upwardly flowing fluid chambers 21L and 21R and the inner standing partition walls (37L and 37R). The electrodes 35KL and 35KR are disposed so as to be able to face each surface (front and back surfaces), and the inner standing partition walls (37L and 37R) can promote energization between the electrodes 35KL and 35KR and the plate-shaped object (200). The flow of the processing liquid from the upward fluid chambers 21L and 21R to the downward fluid chambers 11L and 11R can be suppressed.

つまり、上向流動液室21L,21Rは、電極室21EPL,21EPRを形成する。同様に、各下向流動液室11L,11Rは、電解処理室11EPL,11EPRを形成する。   That is, the upward fluid chambers 21L and 21R form electrode chambers 21EPL and 21EPR. Similarly, the downward fluid chambers 11L and 11R form electrolytic processing chambers 11EPL and 11EPR.

電極35KL,35KRは、アノードバッグ35L,35R内に収容された多数の銅ボールからなり、給電中において処理液中に銅イオンを生成供給することができる。この電極35KL,35KRは、上向流動液Qupによって表面が洗われるので、銅イオンを高効率かつ安定して生成供給することができる。この点で、処理液組成の管理が楽になる。   The electrodes 35KL and 35KR are made of a large number of copper balls accommodated in the anode bags 35L and 35R, and can generate and supply copper ions in the processing liquid during power feeding. Since the surfaces of the electrodes 35KL and 35KR are washed by the upward flowing liquid Qup, copper ions can be generated and supplied with high efficiency and stability. In this respect, management of the treatment liquid composition becomes easy.

また、アノードバッグ35L,35Rは、図5に示す装着用フック部材34L,34Rを介して当該各溢出槽30EPL,30EPRに着脱可能に取付けられる。銅ボールの補給や交換を含むメンテナンスを簡単に行える。   The anode bags 35L and 35R are detachably attached to the overflow tanks 30EPL and 30EPR via mounting hook members 34L and 34R shown in FIG. Maintenance including replenishment and replacement of copper balls can be performed easily.

この実施の形態では、構造簡素化およびコスト低減のために、各内側起立隔壁(32L,32R)を図3,図8に示す多孔板37から形成してある。各多孔板37L,37Rには、通電促進効果およびバイパス流動抑制効果を得るために選択された小径(例えば、1mmφ)の貫通孔37hが多数設けられている。 In this embodiment, in order to simplify the structure and reduce the cost, the inner standing partition walls (32L, 32R) are formed from the porous plate 37 shown in FIGS. Each perforated plate 37L, 37R is provided with a large number of through-holes 37h having a small diameter (for example, 1 mmφ ) selected in order to obtain an energization promoting effect and a bypass flow suppressing effect.

なお、内側起立隔壁(32L,32R)は、例えば布製シート部材や全体を包囲可能な布製バッグから形成としてもよい。図9の場合は、内側枠部材31に布製シート部材38を張り付けた場合を示す。処理液のバイパス流動を抑制する作用を一段と強化することができる。   The inner standing partition walls (32L, 32R) may be formed of, for example, a cloth sheet member or a cloth bag that can surround the whole. In the case of FIG. 9, a case where the cloth sheet member 38 is attached to the inner frame member 31 is shown. The effect | action which suppresses the bypass flow of a process liquid can be strengthened further.

図4〜図7において、電解処理槽10EPの一部を形成する上記した内側枠部材31L,31Rの上端部には、図5に示す液面調整堰板33L,33Rが設けられ、上部開口部13への処理液の供給位置(高さ)を調整することができる。液面調整堰板33L,33Rは、搬送される冶具80との干渉を回避させるために上方拡大形状にしてある。   4-7, the liquid level adjustment weir plates 33L and 33R shown in FIG. 5 are provided at the upper ends of the inner frame members 31L and 31R that form a part of the electrolytic treatment tank 10EP, and the upper opening portion. The supply position (height) of the processing liquid to 13 can be adjusted. The liquid level adjustment weir plates 33L and 33R have an upwardly enlarged shape in order to avoid interference with the jig 80 being conveyed.

ワーク搬送手段70は、搬送構造体71とこの搬送構造体71に搬送駆動力を与えるベルトコンベア78とから形成され、ワーク200を定速(例えば、1〜2m/minに設定)かつ連続で槽内を搬送可能に形成してある。搬送構造体71は、図5,図6に示す搬送(X)方向に延設されたレール77と,このレール77に沿って摺動(あるいは転動)可能に装着されたキャリア72と,このキャリア72の一部を構成する横腕木部材73の先端に取付けられた保持部材74と,この保持部材74に着脱可能な冶具80とから形成されている。   The work transfer means 70 is formed of a transfer structure 71 and a belt conveyor 78 that applies a transfer driving force to the transfer structure 71, and the work 200 is placed at a constant speed (for example, set to 1 to 2 m / min) and continuously in a tank. It is formed so that it can be conveyed inside. The transport structure 71 includes a rail 77 extending in the transport (X) direction shown in FIGS. 5 and 6, a carrier 72 mounted so as to be slidable (or rollable) along the rail 77, The holding member 74 is attached to the distal end of a cross arm member 73 that constitutes a part of the carrier 72, and a jig 80 that can be attached to and detached from the holding member 74.

この実施の形態では、レール77,キャリア72,ベルトコンベア78等を電解処理槽10EPの外側(図4で右側)に位置をずらせて配置して、構造・手段の相対摺動部で発生する微細な塵埃が10EP内に落下することを防止する。一層の高品質処理を期する。   In this embodiment, the rail 77, the carrier 72, the belt conveyor 78, etc. are arranged outside the electrolytic treatment tank 10EP (on the right side in FIG. 4) so as to be finely generated at the relative sliding portion of the structure / means. Prevent dust from falling into 10EP. Expect higher quality processing.

なお、給電手段は、銅製レール77とキャリア72との摺接によりかつ搬送構造体71(72,73,74,80)を介してワーク200に給電する。つまり、電源装置(図示省略)のマイナス(−)極をワーク(陰極)200に接続する。なお、電極(陽極)35KL,35KRにプラス(+)極が接続される。   The power supply means supplies power to the workpiece 200 by sliding contact between the copper rail 77 and the carrier 72 and via the transport structure 71 (72, 73, 74, 80). That is, the negative (−) pole of the power supply device (not shown) is connected to the work (cathode) 200. A plus (+) electrode is connected to the electrodes (anode) 35KL and 35KR.

冶具(挟持具)80は、図5に示すように保持部材74にネジ止め固定される本体ベースと,支点を中心に回動可能なクランプと,クランプの一端(先端)を本体ベースに常時押圧かつ常時挟持するための付勢力を付与するスプリングとから形成され、クランプの先端と本体ベースとの間でワーク200の上端部を挟持する。   As shown in FIG. 5, the jig (clamping tool) 80 has a main body base fixed to the holding member 74 by screws, a clamp that can be rotated around a fulcrum, and one end (tip) of the clamp that is constantly pressed against the main body base. The upper end of the workpiece 200 is sandwiched between the tip of the clamp and the main body base.

回収槽40は、図6,図7に示すように、処理槽10EP(30EPL,30EPR)の槽長(X方向の長さ)に比較して長く(約2倍長)してある。処理液の組成管理の容易化および再循環の円滑化等のためである。また、開口部15IN・15OTからのシブキも回収できかつ装置周辺を汚さない。   As shown in FIGS. 6 and 7, the collection tank 40 is longer (about twice as long) as the tank length (length in the X direction) of the processing tank 10EP (30EPL, 30EPR). This is for facilitating the composition management of the treatment liquid and facilitating recirculation. In addition, it is possible to collect shibuki from the openings 15IN and 15OT and not contaminate the periphery of the apparatus.

したがって、処理槽10EPつまり溢出槽30EPL,30EPRの前後空間にはガイド手段90L,90Rを設け、電解処理室11EPL,11EPR内に搬入される以前のワーク200と搬出された以後の製品(200)の搬送姿勢を一定に維持可能に形成してある。   Therefore, guide means 90L and 90R are provided in the front and rear spaces of the processing tank 10EP, that is, the overflow tanks 30EPL and 30EPR, and the workpiece 200 before being carried into the electrolytic treatment chambers 11EPL and 11EPR and the product (200) after being carried out. The conveyance posture is formed so as to be maintained constant.

ガイド手段90は、図6および図7に示す上流側ガイド手段91Uと下流側ガイド手段91Dとから形成され、複数(5本)の合成樹脂ロープを上下方向に等間隔で張設しかつ搬送経路12を挟み1対を対向配置させた構造である。なお、従来例(特許文献1)の処理液中に装着するガイド手段とは相異する。   The guide means 90 is formed of an upstream guide means 91U and a downstream guide means 91D shown in FIGS. 6 and 7, and a plurality of (five) synthetic resin ropes are stretched at equal intervals in the vertical direction and are transported. This is a structure in which a pair of 12 is disposed opposite to each other. In addition, it is different from the guide means mounted in the processing liquid of the conventional example (Patent Document 1).

かかる第3の実施の形態によれば、処理槽10EPの一部を構成する電解処理室11EP(11EPL,11EPR)の下方側で回収した処理液を処理槽の一部を構成する電極室21EP(21EPL,21EPR)の下方側から供給して処理液を上向きに連続流動させ、電極室を流動した処理液を電解処理室に上方側から再供給することで再循環使用しつつ電解処理室に処理液を下向きに連続流動させ、平板形状物(ワーク200)を下向きに連続流動処理液中に押し込むようにして電解処理室に搬入しかつ搬送中に電極と平板形状物との間に給電しつつ当該平板形状物に下向連続流動処理液を用いて表面処理を施し、表面処理終了後に平板形状物を連続流動処理液中から押し出すようにして電解処理室から搬出させる表面処理方法を、確実に実施することができる。   According to the third embodiment, the electrode chamber 21EP (a part of the treatment tank) is a treatment liquid collected on the lower side of the electrolytic treatment chamber 11EP (11EPL, 11EPR) constituting a part of the treatment tank 10EP. 21EPL, 21EPR) is supplied from the lower side to continuously flow the processing liquid upward, and the processing liquid that has flowed through the electrode chamber is re-supplied from the upper side to the electrolytic processing chamber so that it can be recycled and used in the electrolytic processing chamber. The liquid is continuously flowed downward, the flat plate-shaped object (work 200) is pushed downward into the continuous flow treatment liquid, is carried into the electrolytic treatment chamber, and power is supplied between the electrode and the flat plate-shaped object during transfer. A surface treatment method is carried out by applying a surface treatment to the flat plate-like product using a downward continuous fluid treatment liquid, and after the surface treatment is finished, the flat plate-like material is pushed out of the continuous fluid treatment solution and carried out of the electrolytic treatment chamber. It can be carried in.

しかして、この第3の実施の形態によれば、第2の実施形態の場合と同様な効果を奏することができることに加え、平板形状物(ワーク200)と電極35KL,35KRとの間の給電を伴う電解処理を高能率で行える。   Thus, according to the third embodiment, in addition to the effects similar to those of the second embodiment, power feeding between the flat plate-shaped object (work 200) and the electrodes 35KL and 35KR is possible. Electrolytic treatment with a high efficiency can be performed.

さらにまた、一段と多様化するプリント回路基板200への適応性が広くかつ高品質基板の提供に大きく貢献することができる。   Furthermore, the present invention can greatly contribute to the provision of a high-quality board that is widely adaptable to the increasingly diversified printed circuit board 200.

本発明は、薄く、可撓性に富んだ平板形状物(例えば、プリント回路基板)を処理液中に直接に搬入して表面処理させたい場合に有用である。   The present invention is useful when it is desired to carry out a surface treatment by directly bringing a thin and flexible flat plate shape (for example, a printed circuit board) into a processing solution.

本発明の第1の実施形態に係る表面処理装置を主に処理槽を中心として説明するための模式的に表わした正面図である。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a front view schematically showing a surface treatment apparatus according to a first embodiment of the present invention, mainly for explaining a treatment tank. 本発明の第2の実施形態に係る表面処理装置を主に処理槽を中心として説明するための模式的に表わした正面図である。It is the front view which represented typically for the surface treatment apparatus concerning the 2nd Embodiment of this invention to mainly demonstrate a processing tank. 本発明の第3の実施形態に係る表面処理装置を主に処理槽を中心として説明するための模式的に表わした正面図である。It is the front view which represented typically for describing the surface treatment apparatus concerning the 3rd Embodiment of this invention centering around a processing tank. 同じく、全体構成を説明するための正面図である。Similarly, it is a front view for demonstrating the whole structure. 同じく、処理槽を詳細に説明するための正面図である。Similarly, it is a front view for explaining a processing tank in detail. 同じく、全体構成を説明するための側面図である。Similarly, it is a side view for demonstrating the whole structure. 同じく、全体構成を説明するための平面図である。Similarly, it is a top view for demonstrating the whole structure. 同じく、多孔板からなる内側起立隔壁を説明するための図である。Similarly, it is a figure for demonstrating the inside standing partition which consists of a perforated plate. 同じく、内側起立隔壁の変形例を説明するための図である。Similarly, it is a figure for demonstrating the modification of an inner side standing partition. バッチ処理方式の従来例を説明するための図である。It is a figure for demonstrating the prior art example of a batch processing system. 連続処理方式の従来例を説明するための図である。It is a figure for demonstrating the prior art example of a continuous processing system. 折衷方式の従来例を説明するための図である。It is a figure for demonstrating the prior art example of a compromise method. 平板形状物を連続処理方式で処理する場合の問題点を説明するための図である。It is a figure for demonstrating the problem in the case of processing a flat shape object by a continuous processing system. 平板形状物を連続処理方式で処理する場合のガイド装置例を説明するための図である。It is a figure for demonstrating the example of a guide apparatus in the case of processing a flat shape object by a continuous processing system.

符号の説明Explanation of symbols

10 処理槽
11 処理室
11L,11R 下向流動液室
12 搬送経路
15IN 搬入用開口部
15OT 搬出用開口部
21 上向流動液室
30 溢出槽
32 内側起立隔壁
35K 電極
10EP 電解処理槽
11EP 電解処理室
21EP 電極室
30EP 溢出槽
35 アノードバッグ
37 多孔板(内側起立隔壁)
38 布製シート部材(内側起立隔壁)
40 回収槽
50 液再循環手段
55 再循環ポンプ
70 ワーク搬送手段
71 搬送構造体
78 ベルトコンベア
80 冶具
90 ガイド手段
200 ワーク(プリント回路基板…平板形状物)
DESCRIPTION OF SYMBOLS 10 Processing tank 11 Processing chamber 11L, 11R Downward flow liquid chamber 12 Transfer route 15IN Loading opening 15OT Outlet opening 21 Upward flowing liquid chamber 30 Overflow tank 32 Inner standing partition 35K Electrode 10EP Electrolytic processing tank 11EP Electrolytic processing chamber 21EP electrode chamber 30EP overflow tank 35 anode bag 37 perforated plate (inner standing partition)
38 Fabric sheet material (inner standing bulkhead)
DESCRIPTION OF SYMBOLS 40 Recovery tank 50 Liquid recirculation means 55 Recirculation pump 70 Work conveyance means 71 Conveyance structure 78 Belt conveyor 80 Jig 90 Guide means 200 Workpiece (printed circuit board ... flat plate shape object)

Claims (8)

搬送方向の上流側から縦吊状態で搬送されて来た平板形状物を処理槽に搬入し、処理槽の処理液中で平板形状物に表面処理を施し、表面処理後の平板形状物を処理槽から搬出してその下流側に搬送させることで、複数枚の平板形状物を連続的に表面処理する平板形状物の表面処理方法において、
前記処理槽の下方側で回収した処理液をその上方側から再供給して再循環使用しつつ前記処理槽に処理液を下向きに連続流動させ、
前記平板形状物を連続流動する処理液中に押し込むようにして前記処理槽に搬入しかつ搬送中に当該平板形状物に下向きに連続流動する処理液を用いて表面処理を施し、表面処理終了後に前記平板形状物を連続流動する処理液中から押し出すようにして前記処理槽から搬出させる、平板形状物の表面処理方法。
The plate-shaped object conveyed in a vertically suspended state from the upstream side in the conveying direction is carried into the treatment tank, the surface treatment is performed on the plate-shaped object in the treatment liquid of the treatment tank, and the plate-shaped object after the surface treatment is processed. In the surface treatment method of a flat plate-shaped object for continuously surface-treating a plurality of flat plate-shaped objects by carrying them out of the tank and transporting them downstream.
The treatment liquid collected on the lower side of the treatment tank is re-supplied from the upper side and recirculated for use while continuously flowing the treatment liquid downward in the treatment tank,
The flat plate-like product is carried into the treatment tank so as to be pushed into the continuously flowing treatment liquid, and surface treatment is performed using a treatment liquid that continuously flows downward to the flat plate-like product during conveyance, and after the surface treatment is completed. A method for treating a surface of a flat plate-shaped product, wherein the flat plate-shaped product is carried out of the processing tank so as to be extruded from a processing liquid that is continuously flowing.
搬送方向の上流側から縦吊状態で搬送されて来た平板形状物を処理槽に搬入し、処理槽の処理液中で平板形状物に表面処理を施し、表面処理後の平板形状物を処理槽から搬出してその下流側に搬送させることで、複数枚の平板形状物を連続的に表面処理する平板形状物の表面処理方法において、
前記処理槽の一部を構成する電解処理室の下方側で回収した処理液を前記処理槽の一部を構成する電極室の下方側から供給して電極室で処理液を上向きに連続流動させ、
電極室を連続流動した処理液を電解処理室に上方側から再供給することで再循環使用しつつ電解処理室に処理液を下向きに連続流動させ、
前記平板形状物を連続流動する処理液中に押し込むようにして電解処理室に搬入しかつ搬送中に電極と平板形状物との間に給電しつつ当該平板形状物に下向きに連続流動する処理液を用いて表面処理を施し、表面処理終了後に前記平板形状物を連続流動する処理液中から押し出すようにして電解処理室から搬出させる、平板形状物の表面処理方法。
The plate-shaped object conveyed in a vertically suspended state from the upstream side in the conveying direction is carried into the treatment tank, the surface treatment is performed on the plate-shaped object in the treatment liquid of the treatment tank, and the plate-shaped object after the surface treatment is processed. In the surface treatment method of a flat plate-shaped object that continuously surface-treats a plurality of flat plate-shaped objects by carrying them out of the tank and transporting them downstream.
The processing liquid collected on the lower side of the electrolytic treatment chamber constituting a part of the treatment tank is supplied from the lower side of the electrode chamber constituting a part of the treatment tank, and the treatment liquid is continuously flowed upward in the electrode chamber. ,
The treatment liquid continuously flowing in the electrode chamber is re-supplied from the upper side to the electrolytic treatment chamber, and the treatment liquid is continuously flowed downward in the electrolytic treatment chamber while being recirculated.
The processing liquid that is carried into the electrolytic processing chamber so as to push the flat plate-shaped object into the continuously flowing processing liquid, and continuously flows downward to the flat plate-shaped object while supplying power between the electrode and the flat plate-shaped object during transfer. A surface treatment method for a flat plate-shaped article, wherein after the surface treatment is finished, the flat plate-shaped article is extruded from the electrolytic treatment chamber so as to be pushed out of a continuously flowing treatment liquid.
搬送方向の上流側から縦吊状態で搬送されて来た平板形状物を処理槽に搬入し、処理槽の処理液中で平板形状物に表面処理を施し、表面処理後の平板形状物を処理槽から搬出してその下流側に搬送させることで、複数枚の平板形状物を連続的に表面処理可能に形成された平板形状物の表面処理装置において、
前記処理槽を、搬送経路を挟み対向配設された1対の起立隔壁で区画しかつ上方側から供給された処理液Qspを下向きに連続流動可能な下向流動液室から形成し、
この下向流動液室の下方側に流下した処理液を回収可能かつ回収された処理液を下向流動液室の上方側に再供給しつつ再循環使用可能に形成し、
前記平板形状物を前記搬送方向の上流側に設けられた搬入用開口部を通しかつ連続流動する処理液中に押し込むようにして下向流動液室に搬入可能であるとともに処理済の平板形状物をその下流側に設けられた搬出用開口部を通しかつ連続流動する処理液中から押し出すようにして下向流動液室から搬出可能に形成し、下向流動液室内の搬送中に下向きに連続流動する処理液を用いて前記平板形状物に表面処理可能に形成された、平板形状物の表面処理装置。
The plate-shaped object conveyed in a vertically suspended state from the upstream side in the conveying direction is carried into the treatment tank, the surface treatment is performed on the plate-shaped object in the treatment liquid of the treatment tank, and the plate-shaped object after the surface treatment is processed. In the surface treatment apparatus for flat plate-shaped objects formed so as to be capable of continuously surface-treating a plurality of flat plate-shaped objects by carrying them out of the tank and transporting them downstream.
The processing tank is defined by a pair of upstanding partitions arranged opposite to each other across the transport path, and the processing liquid Qsp supplied from the upper side is formed from a downward flowing liquid chamber capable of continuously flowing downward,
The processing liquid that has flowed down to the lower side of the downward flow liquid chamber can be recovered, and the recovered processing liquid is formed so that it can be recirculated while being re-supplied to the upper side of the downward flow liquid chamber,
The flat plate-shaped object can be carried into the downward flowing liquid chamber by being pushed into the processing liquid flowing continuously through the loading opening provided on the upstream side in the conveying direction and processed. Is formed so as to be able to be discharged from the downward flowing liquid chamber through the discharge opening provided on the downstream side and extruded from the continuously flowing processing liquid, and continuously downward while being conveyed in the downward flowing liquid chamber. A surface treatment apparatus for a flat plate-shaped object, which is formed on the flat plate-shaped object by using a flowing treatment liquid.
搬送方向の上流側から縦吊状態で搬送されて来た平板形状物を処理槽に搬入し、処理槽の処理液中で平板形状物に表面処理を施し、表面処理後の平板形状物を処理槽から搬出してその下流側に搬送させることで、複数枚の平板形状物を連続的に表面処理可能に形成された平板形状物の表面処理装置において、
1対の溢出槽を当該各内側起立隔壁が搬送経路を挟み対面するようにして対向配設するとともに前記処理槽の一部を構成する下向流動液室が各内側起立隔壁で区画された区画内空間として形成されかつ前記処理槽の一部を構成する上向流動液室が当該各溢出槽の内部空間として形成され、
下向流動液室が当該各溢出槽の上端部を越えて溢出しかつ上方側開口部から供給された処理液Qspを下向きに連続流動可能に形成されるとともに上向流動液室が下方側から再供給された処理液Qspを上向きに連続流動可能に形成され、

下向流動液室の前記搬送方向の上流側に搬入用開口部を設けかつその下流側に搬出用開口部を設け、
下向流動液室の下方側開口部から流下排出された処理液を回収可能な回収槽と、回収された処理液を加圧しかつ上方側開口部を通して各上向流動液室に再供給しつつ処理液を再循環使用可能な液再循環手段とを設け、
前記平板形状物を搬入用開口部を通しかつ連続流動する処理液中に押し込むようにして下向流動液室に搬入可能であるとともに処理済の平板形状物を搬出用開口部を通しかつ連続流動する処理液中から押し出すようにして下向流動液室から搬出可能に形成し、下向流動液室内の搬送中に下向きに連続流動する処理液を用いて前記平板形状物に表面処理可能に形成された、平板形状物の表面処理装置。
The plate-shaped object conveyed in a vertically suspended state from the upstream side in the conveying direction is carried into the treatment tank, the surface treatment is performed on the plate-shaped object in the treatment liquid of the treatment tank, and the plate-shaped object after the surface treatment is processed. In the surface treatment apparatus for flat plate-shaped objects formed so as to be capable of continuously surface-treating a plurality of flat plate-shaped objects by carrying them out of the tank and transporting them downstream.
A compartment in which a pair of overflow tanks are arranged to face each other so that the inner standing partition walls face each other across the conveyance path, and a downward fluid chamber constituting a part of the processing tank is partitioned by the inner standing partition walls An upward flowing liquid chamber formed as an internal space and constituting a part of the treatment tank is formed as an internal space of each overflow tank,
The downward flowing liquid chamber overflows beyond the upper end of each overflow tank, and the processing liquid Qsp supplied from the upper opening is formed to be able to continuously flow downward, and the upward flowing liquid chamber is formed from the lower side. The re-supplied processing liquid Qsp is formed to be capable of continuous flow upward,

An opening for loading is provided on the upstream side in the conveying direction of the downward fluid chamber, and an opening for discharging is provided on the downstream side thereof.
A recovery tank capable of recovering the processing liquid discharged down from the lower opening of the downward fluid chamber, and pressurizing the recovered processing liquid and re-supplying it to each upward fluid chamber through the upper opening A liquid recirculation means capable of recirculating treatment liquid,
The flat plate-shaped object can be carried into the downward flow liquid chamber by being pushed through the loading opening and into the continuously flowing processing liquid, and the processed flat plate-shaped object is continuously flowed through the unloading opening. It is formed so that it can be carried out from the downward flowing liquid chamber as it is pushed out from the processing liquid to be processed, and the plate-shaped object is formed so that it can be surface-treated using a processing liquid that continuously flows downward during conveyance in the downward flowing liquid chamber. An apparatus for treating the surface of a flat plate.
前記各上向流動液室内に当該各内側起立隔壁を挟んで前記平板形状物の各面に対向可能に電極を配設するとともに各内側起立隔壁が電極と平板形状物との間の通電を促進可能かつ上向流動液室から下向流動液室への処理液のバイパス流動を抑制可能に形成されている、請求項4記載の平板形状物の表面処理装置。   An electrode is disposed in each upward flowing liquid chamber so as to be opposed to each surface of the flat plate-shaped object with each inner standing partition wall interposed therebetween, and each inner standing wall promotes energization between the electrode and the flat plate-shaped object. The surface treatment apparatus for a flat plate-shaped object according to claim 4, which is formed so as to be capable of suppressing a bypass flow of the processing liquid from the upward fluid chamber to the downward fluid chamber. 前記内側起立隔壁が多孔板から形成されている、請求項5記載の平板形状物の表面処理装置。   The surface treatment apparatus for a flat plate-shaped object according to claim 5, wherein the inner standing partition wall is formed of a perforated plate. 前記内側起立隔壁が布製シート部材から形成されている、請求項5記載の平板形状物の表面処理装置。   The surface treatment apparatus for a flat plate-shaped object according to claim 5, wherein the inner standing partition wall is formed of a cloth sheet member. 前記平板形状物がプリント回路基板とされかつワーク搬送手段側の複数の冶具でプリント回路基板の上端部を挟持させた縦吊状態で搬送可能に形成されている、請求項3から請求項7までのいずれか1項に記載された表面処理装置。   The flat plate-shaped object is a printed circuit board and is formed so as to be transportable in a vertically suspended state in which the upper end portion of the printed circuit board is sandwiched by a plurality of jigs on the workpiece transport means side. The surface treatment apparatus described in any one of the above.
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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009091597A (en) * 2007-10-03 2009-04-30 Japan Envirotic Industry Co Ltd Treatment apparatus
KR101085613B1 (en) * 2009-01-20 2011-11-22 삼성전기주식회사 Electroless plating device
WO2012011727A2 (en) * 2010-07-20 2012-01-26 주식회사 케이엠더블유 Electroplating apparatus
KR20140027876A (en) 2012-08-27 2014-03-07 우에무라 고교 가부시키가이샤 Apparatus for surface treatment
KR20140055995A (en) 2012-10-31 2014-05-09 우에무라 고교 가부시키가이샤 Surface treating apparatus
JP2017025414A (en) * 2016-11-09 2017-02-02 上村工業株式会社 Surface treatment device
JPWO2017168745A1 (en) * 2016-04-01 2018-04-05 株式会社ケミトロン Conductor forming apparatus and conductor manufacturing method
US10435778B2 (en) 2016-09-27 2019-10-08 C. Uyemura & Co., Ltd. Surface treating apparatus
CN111424268A (en) * 2019-01-10 2020-07-17 上村工业株式会社 Surface treatment device
CN111424269A (en) * 2019-01-10 2020-07-17 上村工业株式会社 Surface treatment device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60131995A (en) * 1983-12-20 1985-07-13 Toyo Giken Kogyo Kk Continuous plating method of terminal part of printed wiring board
JPS60262991A (en) * 1984-06-08 1985-12-26 Hitachi Cable Ltd Plating method using downward flow of solution

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60131995A (en) * 1983-12-20 1985-07-13 Toyo Giken Kogyo Kk Continuous plating method of terminal part of printed wiring board
JPS60262991A (en) * 1984-06-08 1985-12-26 Hitachi Cable Ltd Plating method using downward flow of solution

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WO2012011727A2 (en) * 2010-07-20 2012-01-26 주식회사 케이엠더블유 Electroplating apparatus
KR20120008891A (en) * 2010-07-20 2012-02-01 주식회사 케이엠더블유 Electroplating apparatus
WO2012011727A3 (en) * 2010-07-20 2012-05-03 주식회사 케이엠더블유 Electroplating apparatus
CN103025922A (en) * 2010-07-20 2013-04-03 株式会社Kmw Electroplating apparatus
KR101693217B1 (en) 2010-07-20 2017-01-05 주식회사 케이엠더블유 Electroplating apparatus
CN103025922B (en) * 2010-07-20 2016-06-01 株式会社Kmw electroplating device
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US9120113B2 (en) 2012-08-27 2015-09-01 C. Uyemura & Co., Ltd. Surface treating apparatus
US9359676B2 (en) 2012-10-31 2016-06-07 C. Uyemura & Co., Ltd. Surface treating apparatus
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