JP3173836U - Horizontal electrolytic plating apparatus provided with means for removing oxygen gas bubbles adhering to a plate-like workpiece - Google Patents

Abstract

An object of the present invention is to efficiently remove oxygen gas bubbles adhering to a plate surface of an object to be processed during electrolytic plating while the plate-like object to be processed is horizontally conveyed between upper and lower anodes in an electrolytic bath. And a horizontal electrolytic plating apparatus that enables the formation of a uniform plating film.
Disclosed are oblique jet discharge pipes 20A and 20B in which discharge nozzles for discharging an oblique jet G directed in the direction of the side of the transport passage are formed at the upper and lower positions of the transport passage 2 of the plate-like workpiece P. In addition, an overflow tank 25 provided with overflow ports 26 was disposed on both the left and right sides of the electrolytic plating tank 1 with the conveyance passage 2 in between. Oxygen gas bubbles adhering to the plate surface of the plate-like workpiece are blown off in the direction of the side of the transport passage by the oblique jet G of the oblique jet discharge pipes 20A and 20B. Oxygen gas bubbles that are blown off and rise in the electrolytic bath due to the rising phenomenon are guided by the flow of the overflow liquid and flow out from the overflow port 26 to the overflow tank 25.
[Selection] Figure 2

Description

  The present invention is a horizontal electrolytic plating apparatus that performs electrolytic plating while horizontally conveying a plate-like workpiece such as a printed circuit board, and efficiently generates a large amount of oxygen gas bubbles adhering to the plate surface of the workpiece during the electrolytic plating treatment. The present invention relates to a technique that eliminates the unevenness of the plating film caused by bubble adhesion and enables the formation of a uniform plating film.

  In Patent Document 1, an upper anode and a lower anode are disposed in an electrolytic bath in an electrolytic chamber, and a plate-like object is continuously passed in a horizontal state between the upper anode and the lower anode in the electrolytic bath, An electrolytic treatment apparatus for electrodepositing metal on a plate-like object has been disclosed.

  In such an electrolytic treatment apparatus, when an insoluble anode is used as the anode, a large amount of oxygen gas is generated from the anode, and this oxygen gas becomes a large amount of oxygen gas bubbles in the electrolytic bath. To rise. Oxygen gas bubbles generated in large quantities are likely to stay and adhere to the plate surface of the plate-like object to be electroplated while being conveyed horizontally in a horizontal posture. Large amounts of oxygen gas bubbles tend to accumulate due to the rising phenomenon of oxygen gas bubbles. A large amount of oxygen gas bubbles adhering to the plate surface (especially the lower surface) of the plate-like workpiece to be transported horizontally hinders the contact between the plate surface to be plated and the electrolytic bath, and is uniform on the plate surface of the plate-like workpiece. This is a great hindrance to the formation of a smooth plating film.

Japanese Patent Publication No. 6-31476

  In view of such a situation, the present invention provides a plate of the plate-like object to be processed in the process in which the plate-like object to be processed such as a printed circuit board is conveyed in a horizontal position between the upper and lower anodes in the electrolytic bath. In a horizontal electroplating apparatus for electrolytic plating on the surface, a large amount of oxygen gas bubbles adhering to the plate surface of the plate-like workpiece are efficiently removed during the electroplating process, and the plating film resulting from the adhesion of the oxygen gas bubbles It is a technical problem to eliminate the variation of the above and form a uniform plating film on the plate-like workpiece.

  In order to solve the above-described problem, the present invention (the invention of claim 1) is configured to provide a plurality of endless rotations of both side edges of a plate-like workpiece (for example, a printed wiring board) having parallel side edges. A holding device that holds the clamp and continuously conveys the electrolytic plating solution in the electrolytic plating bath horizontally in a horizontal posture in which the plate surface of the plate-like object is up and down, and the electrolytic plating treatment of the electrolytic plating bath An upper anode and a lower anode are disposed in the liquid and disposed at the upper and lower positions of the transport path of the plate-like workpiece to be horizontally transported by the transport device, and are transported between the upper anode and the lower anode. In the horizontal electrolytic plating apparatus for forming a plating film on the surface of the plate-like workpiece by horizontally passing the plate-like workpiece fed with a cathode current through the clamp as a power feeding means, Plating process An upper oblique jet discharge pipe and a lower oblique jet discharge pipe are disposed in the processing liquid of the tank at the upper and lower positions sandwiching the conveyance path of the plate-like workpiece, and the upper and lower oblique jet discharge pipes are A plurality of discharge nozzles are formed at intervals in a direction intersecting the transport direction of the workpiece, and the discharge nozzles of the upper and lower oblique jet discharge pipes horizontally pass through the transport passage. Each of the processing liquids is discharged toward the opposite upper and lower plate surfaces, and an oblique jet that discharges the processing liquid obliquely toward the same side direction of either one of the left and right sides of the transport passage is formed. The upper and lower oblique jet discharge pipes formed with discharge nozzles that discharge the oblique jet directed toward the left side of the transport passage at a plurality of positions spaced in the transport direction of the transport passage. Toward the right side of the transport path Disposed as upper and lower oblique jet discharge pipes formed with discharge nozzles for discharging oblique jets, and overflow tanks provided with overflow ports on both the left and right sides of the electroplating treatment tank with the conveyance passage in between In addition, oxygen gas bubbles adhering to the plate-like object to be processed are characterized in that the treatment liquid in the plating treatment tank overflowing from the overflow ports provided on the left and right sides of the electrolytic plating treatment tank flows out to the overflow treatment tank. A horizontal electrolytic plating apparatus provided with a removing means is provided.

  According to this device, oxygen gas bubbles adhering to the plate surface of the plate-like workpiece are separated from the plate surface by the oblique jet discharged from the discharge nozzle of the oblique jet discharge pipe and forcedly moved in the direction of the side of the transport passage. The oxygen gas bubbles that are forcibly moved rise in the electrolytic bath at the destination due to the rising phenomenon, and the oxygen gas bubbles that have risen in the electrolytic bath are induced by the flow of the processing liquid overflowing from the overflow port and overflowing. It flows into the tank. In this way, the present invention is arranged on both the left and right sides of the electrolytic plating tank between the oblique jet discharge pipe and the conveyance passage formed with the discharge nozzle that discharges the oblique jet directed toward the left and right sides of the conveyance passage. By the action of the overflow tank, the oxygen gas bubbles adhering to the plate surface can be effectively removed, and the removed oxygen gas bubbles can be guided to the overflow liquid and flow out to the overflow tank. Therefore, according to the invention, variations in the plating film due to oxygen gas bubbles adhering to the plate surface of the plate-like workpiece can be eliminated, and a uniform plating film can be formed on the plate surface of the plate-like workpiece.

  Further, in order to solve the above-described problems, the present invention (the invention of claim 2) is directed to an upper and lower oblique jet discharge pipe formed with a discharge nozzle for discharging an oblique jet directed toward the left side of the transport passage. And upper and lower oblique jet discharge pipes, which form discharge nozzles that discharge oblique jets directed toward the right side of the transport passage, are alternately arranged at a plurality of positions at regular intervals in the transport direction of the transport passage. A horizontal electrolytic plating apparatus provided with a means for removing oxygen gas bubbles adhering to a plate-like workpiece is provided.

  According to this device, since the plate-like object to be horizontally passed through the conveyance path receives the oblique jet flow in the left-right direction alternately on the plate surface, oxygen gas bubbles adhering to the plate surface are alternately turned in the left-right direction. The oxygen gas bubbles can be separated from the plate surface and removed more efficiently. Furthermore, the processing liquid near the plate surface of the plate-like object to be processed that passes horizontally through the conveyance path can be uniformly stirred and mixed, and the stagnation of the processing liquid near the plate surface can be effectively eliminated.

  Further, in order to solve the above-described problems, the present invention (the invention of claim 3) is such that the formation range of a large number of discharge nozzles formed in the lower oblique jet discharge pipe is wider than the lateral width of the conveying path of the plate-like workpiece. Provided is a horizontal electrolytic plating apparatus provided with means for removing oxygen gas bubbles adhering to a plate-like object to be processed, characterized by being in a range. According to this device, a large amount of oxygen gas bubbles adhering to the lower surface portion of the plate-like workpiece to be horizontally conveyed can be particularly effectively removed. Therefore, it is possible to eliminate the adverse effect that a large amount of oxygen gas bubbles easily accumulate due to the rising phenomenon of oxygen gas bubbles on the lower surface portion of the plate-like object to be horizontally conveyed.

  In addition, the upper oblique jet discharge pipe of the present invention is disposed between the conveyance path of the plate-shaped workpiece and the upper anode, and the lower oblique jet discharge pipe is disposed between the conveyance path of the plate-shaped workpiece and the lower anode. It is set up.

  The present invention also includes a liquid management tank for receiving the processing liquid discharged from the overflow tank through the liquid discharge pipe, and the liquid management tank and the upper and lower oblique jet discharge pipes are connected to each other through the liquid supply pipe. A circulation pump is provided in the middle of the liquid supply pipe, and the processing liquid in the liquid management tank is fed to the upper and lower oblique jet discharge pipes through the liquid supply pipe by the operation of the circulation pump. Provided is a horizontal electrolytic plating apparatus equipped with a means for removing oxygen gas bubbles adhering to a plate-like object to be processed, which is a liquid circulation type.

  According to the present invention, electrolytic plating is performed on the plate surface of the plate-like object to be processed in the process in which the plate-like object to be processed such as a printed circuit board is conveyed horizontally in a horizontal posture between the upper and lower anodes in the electrolytic bath. In horizontal electroplating equipment, a large amount of oxygen gas bubbles adhering to the plate surface of the plate-like workpiece can be efficiently removed during the electroplating process, eliminating variations in the plating film caused by the adhesion of oxygen gas bubbles. In addition, a uniform plating film can be formed on the plate-like workpiece.

1 is a schematic plan view showing an embodiment of the present invention. It is a partially vertical side view showing an embodiment of the present invention. It is the schematic side view which showed the diagonal jet to the left-right direction explanatoryly. It is the schematic front view which showed the arrangement | positioning state of an upper and lower diagonal jet discharge pipe.

  An embodiment of the present invention will be described with reference to the drawings. The horizontal electrolytic plating apparatus shown in FIGS. 1 and 2 is configured to rotate endlessly on both side edges of a plate-like workpiece P (for example, a thin plate-like workpiece such as a printed wiring board) having both side edges parallel to each other. A transfer device 3 that is held by the clamp 5 and continuously conveys in a horizontal posture in a horizontal posture in which the plate surface of the plate-like object P is vertically moved in the treatment liquid (electrolytic plating treatment liquid) W of the electrolytic plating treatment tank 1; Anode 15 (upper anode 15A) disposed in the processing liquid W of the electrolytic plating tank 1 and disposed at the upper and lower positions of the conveying path 2 of the plate-like object P to be horizontally conveyed by the conveying device 3. , A lower anode 15B), and the plate-like workpiece P fed with a cathode current through the clamp 5 as a conveying and feeding means is horizontally passed between the upper anode 15A and the lower anode 15B. , Gold on the surface of the plate-shaped workpiece P And it forms a plating film.

  FIG. 1 shows that a plate-like workpiece P is supplied to the electroplating treatment tank 1 from the left side in a horizontal state with the plate surface up and down, and the treatment tank 1 is continuously conveyed in the direction of arrow A in the horizontal state. FIG. 2 shows a schematic plan view of the apparatus that passes through and is discharged rightward from the processing tank 1 after electrolytic plating. In addition, the horizontally long plate-like workpiece P is carried into the electrolytic plating tank 1 and the horizontally long plate-like workpiece P is carried out from the electrolytic plating tank 1 to the horizontally long outlet 1b. Is provided with two upper and lower sealing rollers (not shown) horizontally inside the processing tank 1 corresponding to the carry-in port 1a and the carry-out port 1b, so that the processing liquid W does not leak from the carry-in port 1a and the carry-out port 1b. So that it is sealed.

  The conveying device 3 is provided with conveying means provided with conveying driving belts 4 and 4 that are rotationally driven endlessly on both sides of the conveying path 2 of the plate-like workpiece P, and this conveying driving belt 4. A plurality of clamps 5 are attached at equal intervals to each other, and a plurality of clamps 5 that move in parallel inside linear drive path portions with the conveyance path 2 in between are plate-like shapes having parallel side edges. The both side edges of the workpiece P are sandwiched from above and below, and the plate surface of the plate-like workpiece P is turned upside down in one direction (in the direction of arrow A) in the plating solution W in the electrolytic plating bath 1. ) Is continuously transported horizontally.

  The conveyance drive belt 4 is wound around rollers 6 and 6, and is rotated endlessly by rotating one roller 6 by a conveyance drive motor (not shown). The roller 6 is provided with teeth that match the conveyance drive belt (timing belt) 4. The clamps 5... Attached at equal intervals to the transport drive belt 4 that is rotationally driven by the endless are side edges of a rectangular plate-shaped workpiece P with a plurality of clamps 5 as shown in FIG. It is installed at an interval that can be held. In FIG. 1, the clamps 5... Are shown only in a partial range of the endless transport drive belt 4, but are attached at equal intervals over the entire range of the transport drive belt 4. The transport drive belts 4 and 4 provided on both sides with the transport path 2 in between are configured to be synchronously rotated at a constant speed. The conveying speed of the plate-like object P by the conveying devices 3 and 3 is 0.5 m to 2 m per minute, and is variable depending on the surface treatment conditions of the plate-like object.

  As shown in FIG. 2, the clamp 5 is disposed at a position where the upper portion is fed with a cathode current in the air and the lower portion is movable in the plating solution W of the electrolytic plating bath 1. The clamp contact portion 7 (upper clamp contact portion and lower clamp contact portion) that holds and opens the side end portion of the plate-like workpiece P in the vertical direction is provided at the lower end portion. . The liquid contact portion in the liquid of the clamp 5 made of a current-carrying material excluding the clamp contact portion 7 is subjected to insulation coating. The clamp 5 shown in FIG. 2 is attached to the conveyance drive belt 4 and is fixed to a fixed side clamp rod 9 (latched on the lower end portion of the fixed side clamp rod 9) that is engaged with a fixed guide rail (feed rail) 8 described later. A clamp contact portion is formed), and a fixed clamp 9 is provided with a movable clamp 10 that can be moved up and down, and an upper clamp contact formed at the lower end of the movable clamp 10 Is moved downward by the spring pressure of the compression spring 11, and the clamp contact portion 7 (the upper clamp contact portion and the lower clamp contact portion) is normally controlled to be closed in the vertical direction. A clamp opening / closing guide (not shown) having a height difference is disposed in the clamp movement path at the start end portion 2a position and the terminal end portion 2b position of the conveyance path 2, and when the clamp 5 passes the clamp opening / closing guide position, A clamp opening / closing guide engaging member (not shown) provided in the upper portion is engaged with a high-order guide surface portion of the clamp opening / closing guide, and resists against the spring pressure of the compression spring 11 and the upper clamp contact of the movable side clamp rod 10. And the clamp contact portion 7 is controlled to be in an open state in which the clamp contact portion 7 is separated in the vertical direction. Accordingly, the clamp 5 passing through the starting end 2a of the conveyance path 2 for the workpiece P is controlled from the open state to the closed state where the side edge of the workpiece can be clamped, and the conveyance path 2 of the conveyance path 2 for the workpiece P is controlled. The clamp 5 passing through the end portion 2b can be controlled from a closed state to an open state in which the side edge of the workpiece can be opened.

  A fixed guide rail (feeding rail) 8 made of a conductive metal material having a rectangular cross section shown in FIG. 2 is arranged at a position below the linear drive path inside the transport drive belt 4 in parallel with the linear drive path. It is. The fixed guide rail (power supply rail) 8 extends over the range of the conveyance path 2. The clamp 5 that moves on the inner linear drive path is slidably contacted and guided by the fixed guide rail (feeding rail) 8. In the present invention, the fixed guide rail 8 is made to function as a power supply rail, and a cathode current is supplied from the fixed guide rail (power supply rail) 8 to the thin plate-shaped workpiece P through the conductive clamp 5.

  As the anode 15 (upper anode 15A, lower anode 15B), in this embodiment, an anode formed in a plate shape is used. The plate-like anode 15 (upper anode 15A, lower anode 15B) is placed on the plate-like workpiece P in the vertical position of the conveyance path 2 of the plate-like workpiece P that is horizontally conveyed in the plating treatment liquid W. A plurality of them are arranged in parallel to the surface and with a certain space in the conveying direction of the plate-like workpiece P. In the process of horizontally passing the plate-like workpiece P fed with a cathode current through the clamp 5 between the upper and lower anodes 15 for depositing metal ions in the plating solution W of the electrolytic plating bath 1. The surface is electroplated.

  As described in the background art, in such an electrolytic processing apparatus, when an insoluble anode is used as the anode 15, a large amount of oxygen gas is generated from the anode 15, and this oxygen gas is generated in a large amount in the electrolytic bath. The oxygen gas bubbles are raised in the electrolytic bath W. Oxygen gas bubbles generated in large quantities are likely to stay and adhere to the plate surface of the plate-like object P to be electroplated while being conveyed in a horizontal position in a horizontal posture. In particular, the lower surface of the plate-like object P to be horizontally conveyed The part tends to accumulate a large amount of oxygen gas bubbles due to the rising phenomenon of oxygen gas bubbles. A large amount of oxygen gas bubbles adhering to the plate surface (particularly the lower surface portion) of the plate-like object P to be horizontally conveyed obstructs the contact between the plate surface to be plated and the electrolytic bath, and the plate surface of the plate-like object to be treated. This is a great hindrance to the formation of a uniform plating film.

  In order to solve this problem, the present invention provides an oblique jet discharge pipe 20 (an upper oblique jet discharge pipe 20A and a lower oblique jet discharge formed with discharge nozzles for discharging an oblique jet directed toward the left and right sides of the transport passage 2. Pipes 20B) and overflow tanks 25, 25 provided with overflow ports 26 are provided on both the left and right sides of the electrolytic plating treatment tank 1 with the conveyance passage 2 therebetween.

  The oblique jet discharge pipe 20 is in the processing liquid W of the electrolytic plating treatment tank 1 and is arranged at an upper and lower position with the conveying passage 2 for the plate-like workpiece P interposed therebetween, and an upper oblique jet discharge pipe 20A and a lower oblique jet pipe. A jet discharge pipe 20B is provided. The upper and lower oblique jet discharge pipes 20A and 20B extend a resin-made round pipe-like pipe line in a direction substantially orthogonal to the conveying direction of the plate-like workpiece P, A large number of discharge nozzles (not shown) are formed at regular intervals in a direction orthogonal to the conveyance direction of the workpiece. The discharge nozzles of the upper and lower oblique jet discharge pipes 20A and 20B are opposed to the upper and lower plate surfaces of the plate-like workpiece P that horizontally pass through the transport passage 2 as shown in FIG. 2 and FIG. Each of the processing liquids is discharged toward the surface, and an oblique jet G that discharges the processing liquid W obliquely toward the same side of either one of the left and right sides of the transport passage 2 is formed. The upper and lower oblique jet discharge pipes 20A and 20B are obliquely directed toward the left side of the transport passage 2 at a plurality of positions spaced in the transport direction of the transport passage 2 as shown in FIG. The upper and lower oblique jet discharge pipes 20A and 20B in which the discharge nozzle for discharging the jet G is formed, and the upper and lower oblique jet discharge in which the discharge nozzle for discharging the oblique jet G directed toward the right side of the transport passage is formed. It arrange | positions as pipe | tube 20A, 20B, respectively.

  As shown in FIGS. 1 and 2, the upper oblique jet discharge pipe 20A is disposed between the conveying path 2 of the plate-like object P and the upper anode 15A, and the lower oblique jet discharge pipe 20B is a plate-like treatment. It is disposed between the conveyance path 2 for the object P and the lower anode 15B. The upper and lower plate-like anodes 15A and 15B are not limited to this embodiment, and a plurality of upper and lower plate-like anodes 15A and 15B are arranged with a certain space in the conveying direction of the object to be processed. May be arranged.

  The overflow tanks 25, 25 are configured to allow the processing liquid in the plating tank 1 overflowing from the overflow ports 26 provided on the left and right sides of the electrolytic plating tank 1 to flow into the overflow tank 25 as an overflow liquid. In this embodiment, the overflow port 26 is formed long along the side portion of the electrolytic plating tank 1.

  As shown in FIG. 2, a liquid management tank 28 that receives the processing liquid discharged from the overflow tanks 25 and 25 via the liquid discharge pipe 27 (the liquid concentration and the like are adjusted in the liquid management tank 28). Is disposed at a position lower than the overflow tanks 25, 25. The liquid management tank 28 and upper and lower oblique jet discharge pipes 20A and 20B are liquid supply pipes 21 (reference numeral 21A is a liquid supply pipe for supplying jet liquid to the upper oblique jet discharge pipe 20A, and reference numeral 21B is a lower oblique jet discharge pipe 20B. The liquid supply pipes for supplying the jet liquid are respectively shown in FIG. 2, and a circulation pump 29 is provided in the middle of the liquid supply pipe 21. By the operation of the circulation pump 29, the processing liquid in the liquid management tank 28 is fed to the upper and lower oblique jet discharge pipes 20A and 20B via the liquid supply pipe 21 (21A and 21B), and the oblique jet discharge pipe 20 A liquid circulation type is discharged from the discharge nozzle as an oblique jet.

  As can be understood from FIG. 2, the oxygen gas bubbles B adhering to the plate surface of the plate-like workpiece P are oblique jets G discharged from the discharge nozzles of the oblique jet discharge pipes 20 from the plate surface toward the side of the transport passage. The oxygen gas bubbles B that are blown off and forcibly moved, and are forcibly moved, rise in the electrolytic bath W at the moving destination due to the rising phenomenon, and the oxygen gas bubbles B that have risen in the electrolytic bath W are It is guided by the flow of the processing liquid overflowing and overflowing from the overflow port 26 and flows out from the overflow port 26 to the overflow tank 25. In FIG. 2, only the oblique jet G directed in one side direction is shown, and the oblique jet G directed in the opposite direction is omitted in order to avoid the complexity of the drawing. As described above, the present invention is arranged on both the left and right sides of the electrolytic plating tank between the oblique jet discharge pipe 20 and the conveyance passage formed with the discharge nozzle for discharging the oblique jet directed toward the left and right sides of the conveyance passage. Oxygen gas bubbles adhering to the plate surface can be effectively removed by the action of the overflow tank 25 provided, and the removed oxygen gas bubbles can be guided to a liquid overflowing and discharged to the overflow tank. Therefore, according to the invention, variations in the plating film due to oxygen gas bubbles adhering to the plate surface of the plate-like workpiece can be eliminated, and a uniform plating film can be formed on the plate surface of the plate-like workpiece.

  As shown in FIGS. 1 and 3, the upper and lower jet discharge pipes 20 </ b> A and 20 </ b> B disposed at the upper and lower relative positions with the conveyance passage 2 in between are oblique to discharge the processing liquid obliquely toward the same side direction. Upper and lower oblique jet discharge pipes 20A and 20B formed with a plurality of discharge nozzles for discharging jets and forming discharge nozzles for discharging oblique jets directed toward the left side of the transport passage 2, and the right side of the transport passage 2 The upper and lower oblique jet discharge pipes 20A and 20B formed with discharge nozzles that discharge oblique jets directed in the direction of the side are alternately arranged at a plurality of positions at regular intervals in the transport direction of the transport passage 2. . In FIG. 1, the direction of the arrow shown along the oblique jet discharge pipe 20 indicates the moving direction (spraying direction) of oxygen gas bubbles by the oblique jet.

  According to the embodiment of FIG. 1 in which the upper and lower oblique jet discharge pipes 20A and 20B for discharging the oblique jet directed toward the left and right side portions are alternately arranged in the transport direction, a plate shape passing horizontally through the transport path 2 Since the workpiece P is alternately subjected to the right and left oblique jets on the plate surface, the oxygen gas bubbles adhering to the plate surface are alternately blown off in the left and right directions and can be forcibly moved, thereby making the oxygen gas bubbles more efficient. Can be removed from the plate surface and removed. Furthermore, the processing liquid W in the vicinity of the plate surface of the plate-like object P passing through the transport passage 2 can be evenly stirred and mixed, and the stagnation of the processing liquid W in the vicinity of the plate surface can be effectively eliminated.

  In the embodiment of FIG. 1, the same number (six in FIG. 1) of upper and lower oblique jet discharge pipes 20A and 20B are arranged at the upper and lower relative positions (as shown in FIG. 4) with the conveying passage in between. ing. The arrangement interval of the upper and lower oblique jet discharge pipes 20A and 20B arranged in the upper and lower relative positions (as shown in FIG. 4) in the conveyance direction of the conveyance passage 2 is set narrower than the embodiment of FIG. It is preferable that the number of the upper and lower oblique jet discharge pipes 20A and 20B be larger than the number of the embodiment in FIG. As described above, a large amount of oxygen gas bubbles easily accumulate on the lower surface portion of the plate-like workpiece P that is horizontally conveyed due to the rising phenomenon of oxygen gas bubbles. Thus, if a large number of upper and lower oblique jet discharge pipes 20A and 20B are arranged, a large amount of oxygen gas bubbles adhering to the lower surface portion of the plate-like object to be horizontally conveyed can be more effectively removed. it can.

  1 and 2, the length of the lower oblique jet discharge pipe 20B is made longer than the width of the conveying passage 2 of the plate-like workpiece P, and a number of the lower oblique jet discharge pipes 20B are formed. The formation range of the discharge nozzle is set to a range wider than the lateral width of the conveyance path 2 of the plate-like workpiece P. As described above, a large amount of oxygen gas bubbles easily accumulate on the lower surface portion of the plate-like workpiece to be horizontally conveyed due to the rising phenomenon of oxygen gas bubbles. Thus, if the formation range of many discharge nozzles formed in the lower oblique jet discharge pipe 20B is a range wider than the lateral width of the conveyance path 2 of the plate-like object P, the plate-like object to be horizontally conveyed A large amount of oxygen gas bubbles adhering to the lower surface portion of P can be particularly effectively removed.

1 Electrolytic plating tank W Treatment liquid (Electroplating treatment liquid)
P plate-like object 2 conveyance path 3 conveyance device 4 conveyance drive belt 5 clamp 7 clamp contact portion 8 fixed guide rail (power supply rail)
DESCRIPTION OF SYMBOLS 15 Anode 15A Upper anode 15B Lower anode 20 Oblique jet discharge pipe 20A Upper oblique jet discharge pipe 20B Lower oblique jet discharge pipe G Oblique jet 21 (21A, 21B) Liquid supply pipe 25 Overflow tank 26 Overflow port 27 Liquid discharge pipe 28 Liquid management Tank 29 Circulation pump

Claims (5)

Hold both side edges of plate-like workpieces with parallel side edges by multiple endlessly driven clamps, and the plate surface of the plate-like workpieces moves up and down in the treatment solution of the electroplating bath. A horizontal conveying device in a horizontal posture and a vertical position of a conveying path of a plate-like workpiece to be horizontally conveyed by the conveying device, disposed in the treatment liquid of the electrolytic plating tank. The plate-like workpiece to which a cathode current is fed through the clamp as a feeding and feeding means is horizontally passed between the upper anode and the lower anode, In a horizontal electroplating apparatus that forms a plating film on the surface of a plate-like workpiece,
An upper oblique jet discharge pipe and a lower oblique jet discharge pipe are disposed in a treatment liquid of the electrolytic plating treatment tank at a vertical position with the conveyance path of the plate-like workpiece interposed therebetween. The jet discharge pipe forms a large number of discharge nozzles at intervals in a direction intersecting the transport direction of the workpiece, and the discharge nozzles of the upper and lower oblique jet discharge pipes horizontally pass through the transport passage. It is formed so that a processing liquid is discharged toward the opposite upper and lower plate surfaces of the object to be processed and an oblique jet is discharged that discharges the processing liquid obliquely toward the same side portion on either the left or right side of the transfer path. The upper and lower oblique jet discharge pipes are formed at a plurality of positions spaced in the conveying direction of the conveying passage, and the upper and lower oblique portions are formed with discharge nozzles for discharging oblique jets directed toward the left side of the conveying passage. Jet discharge pipe and right side of conveyance path Disposed as upper and lower oblique jet discharge pipes having discharge nozzles for discharging oblique jets directed in the lateral direction, and provided with overflow ports on both the left and right sides of the electrolytic plating tank with the conveyance passage in between. A plate-like object to be processed is characterized in that a treatment liquid in the plating tank overflowing from overflow ports provided on the left and right sides of the electrolytic plating tank is discharged to the overflow tank. A horizontal electrolytic plating apparatus provided with means for removing adhering oxygen gas bubbles.   An upper and lower oblique jet discharge pipe formed with a discharge nozzle that discharges an oblique jet directed toward the left side of the transport passage, and a discharge nozzle that ejects an oblique jet directed toward the right side of the transport passage. The formed upper and lower oblique jet discharge pipes are alternately disposed at a plurality of positions at a predetermined interval in the transport direction of the transport passage, and adhere to the plate-like object to be processed according to claim 1. A horizontal electrolytic plating apparatus provided with means for removing oxygen gas bubbles.   The plate-shaped workpiece according to claim 1, wherein the formation range of the plurality of discharge nozzles formed in the lower oblique jet discharge pipe is wider than the width of the conveyance path of the plate-shaped workpiece. A horizontal electrolytic plating apparatus provided with means for removing adhering oxygen gas bubbles.   2. The upper oblique jet discharge pipe is disposed between the transport path of the plate-shaped workpiece and the upper anode, and the lower oblique jet discharge pipe is disposed between the transport path of the plate-shaped workpiece and the lower anode. A horizontal electrolytic plating apparatus provided with a means for removing oxygen gas bubbles adhering to the plate-like object to be treated as described in 1.   A liquid management tank for receiving a processing liquid discharged from the overflow tank through a liquid discharge pipe is provided, and the liquid management tank and upper and lower oblique jet discharge pipes are respectively connected via a liquid supply pipe. A circulation pump is provided in the middle of the operation, and the processing liquid in the liquid management tank is supplied to the upper and lower oblique jet discharge pipes via the liquid supply pipe by the operation of the circulation pump. A horizontal electrolytic plating apparatus provided with a means for removing oxygen gas bubbles adhering to the plate-like object to be treated according to Item 1.

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