JP3984597B2 - Submerged conveying plating method and plating apparatus for thin plate products - Google Patents

Description

  The present invention relates to a submerged conveyance type plating method and a plating apparatus for performing a plating process while conveying an object to be plated in a plating solution, and in particular, a thin flexible print. Even when a thin plate-like product such as a substrate sheet is used, the product can be smoothly transported in the liquid while being kept in the product shape without taking time and can be plated.

The upper part of a sheet-like rectangular product such as a printed circuit board sheet plated by a jig that is supported by a power supply rail that functions as a cathode bar is hanged in a suspended state, and the lower side from this clamping position is free. It is a product-free part in a suspended state, and the sheet-like product suspended in a suspended state by the jig is fed along the power supply rail while supplying power from the power supply rail to the upper part of the product through the jig. A plating part that is electroplated while being transported at a relatively low constant speed in a horizontal orientation in which the sheet surface of the sheet-like product is parallel to the transport direction in the plating solution in the horizontally long plating tank. A submerged transport plating method and a plating apparatus having a transport process are known (for example, Patent Document 1).

  On the other hand, as an object to be plated, there is an increasing demand for plating a thin plate-like product such as a flexible printed circuit board sheet having a thickness of about 30 to 50 microns. When such a thin plate product is held in a suspended state only with the upper part of the product with a jig, and the lower part of the product is suspended in a free suspended state from the upper holding position, Due to the liquid resistance of the plating solution, the free part of the product cannot hold the desired product shape, and if it is terrible, it will be crumpled.

For this reason, when plating a thin plate product such as a flexible printed circuit board sheet having a thin pellet while transporting in the liquid, conventionally, the rectangular thin plate product is held on the four sides by a frame member, The thin plate-like product held by the frame member was transported in the liquid and plated. However, the work of attaching and removing the frame member to and from a large number of thin plate products requires manpower and takes a lot of time and effort.
Japanese Patent No. 2943070

In view of such a situation, the present invention holds the product upper part of a thin plate-like product such as a flexible printed circuit board sheet with a thin slap in a suspended state by a jig that is supported by a bar so as to be laterally movable. Using a jig with simple attachment means that is easy to attach and remove, with the lower side being in a free suspended state, the thin plate product suspended in a suspended state by this jig is plated along the bar Even when plating is carried out while the plate surface of the thin plate product is transported in a horizontal orientation parallel to the transport direction in the plating solution in the tank, the liquid can be smoothly maintained while maintaining the product shape of the product. It is intended to be able to carry out the plating process by transporting inside.

In order to solve the above-described problems, the submerged conveyance type plating method for a thin plate product according to the first aspect of the present invention is supported by a power supply rail functioning as a cathode bar so as to be laterally movable. The product upper part of a thin plate-like product such as a thin printed circuit board sheet to be plated by a jig is held in a suspended state, and a product free part in which the lower side from the holding position is freely suspended is provided as the jig. The thin plate-like product suspended in a suspended state is fed in the plating solution in the horizontally long plating tank along the power supply rail while supplying power from the power supply rail to the upper part of the product via the jig. submerged-conveyance plating with a plating unit transport step which is adapted to an electroplating process while conveying at a constant feed rate in landscape orientation thin plate-shaped plate surface of the product is parallel to the conveying direction In the method, the submerged product transport track has a large number of nozzles that eject the plating solution substantially evenly on the left and right sides along the submerged product transport track of the product-free portion of the thin plate product transported in the plating unit transport step. Nozzle jet means is provided close to the nozzle, and the nozzle jet means ejects the jet flow from the nozzle almost uniformly ejected from both the left and right sides of the submerged product transport orbit to the submerged product transport orbit. A product jet transported through the plating unit transport process is a guided jet jetted obliquely inward in the transport direction of the product-free unit being transported and in the horizontal direction toward the submerged product transport track side. The submerged product transport trajectory of the product free section transported through the plating section transport process by the induced jet flow is set to a jet speed higher than the speed of the submerged product transport trajectory. An electroplating process is carried out while smoothly transporting the product-free part of the thin plate product suspended in a suspended state along the plating part guiding jet guide part, the resistance of which is continuously weakened. It is characterized by doing so.

  Moreover, the submerged conveyance type plating treatment method of the thin plate product of the present invention described in claim 2 is a method in which a limitation is added to the plating treatment method of claim 1, and the induced jet is , Ejected obliquely inward in the horizontal direction toward the submerged product transport track side in the transport direction of the product free section transported on the submerged product transport track, and ejected obliquely downward in the vertical direction. It is characterized by having made it.

In order to solve the above-mentioned problem, the submerged conveyance type plating apparatus of the present invention according to claim 3 of the present invention can be moved laterally to a power supply rail functioning as a cathode bar. The product upper part of a thin plate-like product such as a thin printed circuit board sheet plated by a supported jig is held in a suspended state, and a product free part in which a lower side from the holding position is in a free suspended state, The thin plate product suspended in a suspended state by a jig is plated in the plating solution in a horizontally long plating tank along the power supply rail while supplying power from the power supply rail to the upper part of the product via the jig. the part conveying means so as to electroplating process while conveying in horizontal position at a constant feed rate plate surface of the thin plate-like product is parallel to the conveying direction in the horizontal direction through said jig In a submerged transport type plating processing apparatus having a plating part transporting step, a large number of plating liquids are ejected on both the left and right sides along the submerged product transporting track of the product-free part of the thin plate product transported in the plating part transporting step. Nozzle tubes are arranged in an upright state at intervals in the conveying direction, and a number of nozzles that eject plating solution at a predetermined interval in the height direction to these plating solution ejection nozzle tubes are provided in the submerged product conveyance track. Nozzle jet means provided close to each other is provided, and the jet flow from the nozzles ejected from the left and right sides of the submerged product transport orbit is almost uniformly transported on the submerged product transport orbit by the nozzle jet means. An induced jet that is jetted obliquely inward in the horizontal direction toward the submerged product transfer track side in the transfer direction of the product-free portion, and this guide jet transfers the plating portion transfer step The ejection speed is set to be higher than the product conveyance speed, and the in-liquid resistance of the submerged product conveyance trajectory continuously follows the in-liquid product conveyance trajectory of the product free part conveyed by the induction jet flow in the plating part conveyance process. It is formed as a weakened plating part induction jet guide part, and electroplating is performed while smoothly transporting the product-free part of the thin plate product suspended in a suspended state along this plating part induction jet guide part It is characterized by that.

In order to solve the above-mentioned problem, the submerged transport type plating apparatus of the present invention described in claim 4 of the present invention has the same power supply rail functioning as a cathode bar. The upper part of a thin plate-like product such as a thin printed circuit board sheet plated by a jig that is supported by a rail composed of a carry-in rail and a carry-out rail that can be aligned in a straight line is held in a suspended state. A product-free part in which the lower side from the clamping position is in a free suspended state, and the thin plate product suspended in a suspended state by the jig is used as a plating solution in a horizontally long plating tank. horizontally thin plate-like product of the plate surface carrying direction and fed in at a horizontal position parallel along a conveyor track colinear portion conveying step and the plating unit conveying step and the delivering section conveying step medium Is carried in the order, a constant feed through the jig the plating solution along the power feed rail while feeding the product top through the jig from the supply rail in the plating unit transport step by plating section conveying means The electroplating process is performed while conveying the thin plate product at a speed , and in the feeding portion conveyance step, the thin plate product is moved from a carry-in position supported by the carry-in rail to a predetermined portion on the start side of the plating portion conveyance step. The feeding part transporting means is intermittently transported to the feeding position via the jig at a feed speed faster than the feeding speed of the plating part transporting process, and in the sending part transporting process, plating is performed in the plating part transporting process. In addition, the thin plate product is sent from a predetermined delivery position on the end side of the plating part conveyance process to a delivery position supported by the delivery rail. In phloem plating apparatus in the liquid transport equation so as to intermittently conveyed at a faster feed rate than the feed rate of the plating unit conveying step through the jig by conveying means, a constant the plating unit conveying step A number of plating solution jet nozzle tubes are arranged in an upright state at intervals in the transport direction on the left and right sides along the submerged product transport path of the product-free portion of the thin plate product transported at a feed rate , and these Nozzle jet means is provided in the plating liquid jet nozzle pipe, which is provided with a number of nozzles for jetting the plating liquid at a predetermined interval in the height direction close to the submerged product transporting track. The jet flow from the nozzles ejected almost evenly from the left and right sides of the product transport track is in the transport direction of the product free portion transported on the submerged product transport track, and the submerged product transport The guide jet is jetted obliquely inward in the horizontal direction toward the feeding track side, and this guide jet is set to a jet speed that is faster than the product transport speed to be transported in the plating section transport process. Forming a submerged product transport path of the product-free section transported in the transport process as a plating section guide jet guide portion in which the submerged resistance of the submerged product transport path is continuously weakened; The product-free portion of the thin plate product is interposed between both sides of the product-free portion of the thin plate-like product that is transported at a feed rate faster than the feed speed of the plating portion transport step. A plate-like carry-in guide that is carried into the carry-in position together with the product while being guided oppositely is disposed, and is fed between the plate-like carry-in guide and the plating portion guide jet guide portion. An inductive guide transport part, and the feeding part transporting process is carried at a feed rate faster than the feeding speed of the plating part transporting process. Plate-like carry-out guides arranged opposite to each other on both sides are arranged, the plate-like carry-in guide in the feed-in portion transporting step, the feed-in portion guide guide portion, and the plating-portion-inducing jet in the plating portion transport step The product-free portion of the thin plate-like product suspended in a suspended state along the plate-like carry-out guide in the guide portion and the sending-out portion carrying step is smoothly conveyed.

  Further, the submerged conveyance type plating apparatus of the present invention according to claim 5 of the present invention is a plating process apparatus according to claim 3 or 4 which is limited to the above-described plating apparatus. The jet is jetted obliquely inward in the horizontal direction toward the submerged product transport track side in the transport direction of the product free portion transported on the submerged product transport track, and obliquely downward in the vertical direction. It is characterized by being ejected.

  Further, the submerged conveyance type plating apparatus of the present invention according to claim 6 of the present invention is obtained by adding a limitation to the plating apparatus of claim 4, and The guide is provided with a circulating jet generating means for generating a circulating jet forcibly circulating at a speed faster than the product transport speed transported in the delivery part transport process in the product transport direction in the plate transport guide. The jet generating means is arranged on the entrance side of the plate-like carry-out guide, and is arranged on the outlet side of the plate-like carry-out guide, and the jet means for jetting the plating solution from the entrance side into the plate-like carry-out guide. It is characterized by comprising a suction means for sucking the plating solution sprayed into the plate-like carry-out guide, and a circulation path connecting the suction means and the spray means via a circulation pump.

  In addition, the submerged conveyance type plating apparatus of the present invention described in claim 7 of the present invention is a submerged conveying type plating apparatus in which the limitation is added to the plating apparatus of claim 4, and the infeed section guide A large number of plating solutions on the left and right sides along the submerged product transport path of the product-free portion of the thin plate product that is transported through the guide section at a feeding speed faster than the feeding speed of the plating section transport process. The nozzle nozzle pipes are arranged in a standing state at intervals in the conveying direction, and a number of nozzles for ejecting the plating liquid at predetermined intervals in the height direction are arranged on the plating liquid jet nozzle pipes in the liquid product conveying track. Nozzle jet means provided close to the nozzle, and the product which is carried on the submerged product transport track by the jet flow ejected from the left and right sides of the submerged product transport track substantially uniformly by the nozzle jet means. A guided jet that is jetted obliquely inward in the horizontal direction toward the submerged product transport track side, and this guided jet is a jet speed that is faster than the product transport speed transported in the feeding section transport process And the arrangement interval in the conveyance direction of a large number of the nozzles arranged opposite to both sides of the submerged product conveyance trajectory is formed narrower than the arrangement interval of the large number of nozzles arranged in the plating part conveyance process. The infeed submerged product conveyance track of the product-free unit conveyed in the infeed unit conveyance step by this induction jet flow is continuously weakened in the liquid resistance of the submerged product conveyance track. It is characterized by comprising.

  In addition, the submerged conveying type plating apparatus of the present invention described in claim 8 of the present invention is a submerged type plating apparatus in which the limitation is added to the plating apparatus of claim 4, The guide portion is opposed to the both sides of the product-free portion of the thin plate product that are transported at a feeding speed faster than the feeding speed of the plating portion transporting step in the feeding portion transporting step. It is characterized in that it is constituted by an infeed portion guide plate guide arranged.

  In addition, the submerged conveying type plating apparatus of the present invention according to claim 9 of the present invention is a plate processing apparatus in which a limitation is added to the plating apparatus of claim 4. The guide is lowered from the carry-out position so as to be carried out together with the product to the raised position where the product is taken out from the plating solution in the plating tank, while opposing the product-free portion of the thin plate product. It is configured to move up and down between the carry-out position, which is a position, and the raised position.

According to the plating processing method and the plating processing apparatus of the present invention, the product upper part of a thin plate-like product such as a flexible printed circuit board sheet having a thin surface is held in a suspended state by a jig supported so as to be laterally movable by a bar. Using a jig with simple attachment means that is easy to detach and attach to the lower side below the upper clamping position, the sheet-like product suspended in a suspended state by this jig is moved along the bar. Even when plating is performed while the plate surface of the thin plate product is transported in a horizontal orientation parallel to the transport direction in the plating solution in the plating tank, the product shape of the product is maintained. It can be smoothly conveyed in the liquid and plated.

  Furthermore, according to the plating apparatus of the present invention, the product feeding speed is different, the feeding part transporting process, the plating part transporting process, and the feeding part transporting process are clamped only on the upper part of the product by a jig, and the lower side is in a free suspended state. It is possible to smoothly transport the thin plate product in the liquid.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 is a front view of the present invention, FIG. 2 is a schematic plan view of the present invention, FIG. 3 is an enlarged plan view of a main part of the present invention showing a product transport state in a plating section transport process, and FIG. 4 is a side view of the present invention. It is. FIG. 5 is a front view of the present invention showing another embodiment in which the configuration is partially changed, and FIG. 6 is a schematic plan view of the apparatus of FIG.

The plating apparatus of the present invention shown in the figure is supported by a rail 1 composed of a carry-in rail 1A and a carry-out rail 1C which can be aligned on the same straight line with a power supply rail 1B functioning as a cathode bar in between. The product upper portion of the thin plate product W such as a thin printed circuit board sheet plated by the jig 2 is suspended in a suspended state, and a product free portion W1 in which the lower side from the sandwiched position is in a free suspended state, said thin plate products W that are suspended in the suspended state by the jig 2, the plate surface of the thin plate-like products W through the plating solution a in the horizontal direction in the horizontal plating tank 3 along the rail 1 is carried in the order of the transport direction and fed along a conveyor track collinear sideways posture parallel section conveying step F1 and the plating unit conveying step F2 and feed unit conveying step F3, the plating portion conveyor Engineering In F2, while feeding power from the power supply rail 1B through the jig 2 to the upper part of the product, the plating solution A is relatively slow and constant through the jig 2 by the plating part transport means along the power supply rail 1B. Electroplating is carried out while conveying the thin plate product W at a feeding speed of the plating portion. In the feeding portion conveyance step F1, the thin plate product W is transferred from the loading position supported by the carry-in rail 1A to the plating portion conveyance step F2. To the predetermined feeding position on the start side of the first portion, the feeding portion conveying means intermittently conveys the jig 2 through the jig 2 at a feeding speed higher than the feeding speed of the plating portion conveying step F2, and the feeding portion conveying step F3. Then, the thin plate product W plated in the plating part conveying step F2 is removed from a predetermined delivery position on the end side of the plating part conveying step F2. And so as to intermittently conveyed at a faster feed rate than the feed rate of the plating unit conveying step F2 through the jig 2 by delivering section conveying means to the carry-out position is supported by the serial unloading rail 1C.

  In the embodiment shown in the drawing, as the plating part conveying means for moving the jig 2 (that is, the product W) laterally (in the direction of the arrow F2) along the power supply rail 1B in the plating part conveying step F2, in the embodiment shown in FIG. The engagement claw 4 engaged with the toothed conveyance belt 5 to be moved is used by using conveyance means utilizing engagement between the engagement claw 4 attached to the tool 2 side and the endless toothed conveyance belt 5. The jig 2, that is, the thin plate product W is conveyed through the plating solution A in the plating tank 3 at a relatively slow feed rate of about 5 to 10 mm / second. The feeding portion conveyance so that the lateral interval of the plurality of rectangular thin plate products W conveyed in the liquid in the plating portion conveyance step F2 is a narrow gap width in which current is not excessively concentrated on the side end surface of the product W. The plating part transporting process from the loading position (product W position on the right side in FIG. 1) in the process F1 to a predetermined feeding position (second product W position from the right in FIG. 1) on the start side of the plating part transporting process F2. Feeding is performed sequentially and intermittently at a feed rate of about 50 to 100 mm / second, which is faster than the feed rate of F2. In this embodiment, a known pusher 7A that is engaged with an engaging protrusion 6 protruding from the upper portion of the jig 2 is used as the feeding portion conveying means. The pusher 7A is configured to be locked to the engaging protrusion 6 in the pushing direction, but to run on the opposite return direction without being locked to the engaging protrusion 6. The engaging claw 4 attached to the jig 2 that is fed at a feeding speed faster than the traveling speed of the toothed conveying belt 5 is slid to a predetermined feeding position on the toothed conveying belt 5 (see FIG. 1 is engaged with the engaging teeth of the toothed conveying belt 5 at the second jig 2 position from the right side of 1, and is subsequently conveyed by the conveying of the toothed conveying belt 5.

  In the delivery part conveying step F3, the sheet-like product W plated is sent from the predetermined delivery position (the second product W position from the left in FIG. 1) on the end side of the plating part conveying step F2 to the delivery rail 1C. Are carried out intermittently and sequentially at a feed rate of about 50 to 100 mm / second, which is faster than the feed rate of the plating part transporting process F2, up to the carry-out position (the product W position on the left side in FIG. 1). As this delivery part conveyance means, the well-known pusher 7B similar to the above-mentioned delivery part conveyance means is used.

  The carry-in rail 1A is configured to move up and down between the lowered position and the raised position shown in FIG. 1, and puts the product W pretreated by a pretreatment unit (not shown) into the plating solution A from the raised position. The product W is lowered to the designated loading position (arrow D), and the product W is transported to the plating portion at this lowered position (the loading position of the product W shown on the right side in FIG. 1) aligned with the power supply rail 1B that is always in the lowered position. It is made to send to process F2. Further, the carry-out rail 1C is configured to move up and down between the lowered position and the raised position shown in FIG. 1, and the product W in the carry-out position (the product W position shown on the left side in FIG. 1) is plated. It is raised (arrow U) to the raised position where it is taken out from the liquid A so that it can be sent to a post-processing unit (not shown).

  In addition, the jig 2 has a sliding portion 8 that is movably mounted on the rail 1 (power supply rail 1B, carry-in rail 1A, carry-out rail 1C), and a product upper portion of the thin plate product W in a suspended state. A plurality of clip-type product clamping portions 9 that can be detachably clamped are provided. The product sandwiching portion 9 is attached so that both ends of the upper part of the thin plate product W can also be sandwiched, and the upper both ends of the product W are held so as not to flutter during transport in liquid. The product clamping portion 9 of the jig 2 put in the plating solution A is covered with an insulating material such as silicon rubber except for the power supply contact portion to the product W. Further, a plurality of engaging claws 4 are attached to the jig 2 as described above.

  In this way, the thin plate-like product W having the product upper portion held by the jig 2 in a suspended state and the product free portion W1 in a suspended state free from the holding position is placed in the plating tank 3. The plating solution A is transported in the order of the feeding part transporting process F1, the plating part transporting process F2, and the sending part transporting process F3 along the transport track on the same straight line. It should be noted that anodes 10 such as anode cases in which anode balls are placed on both side walls in the plating treatment tank 3 are arranged in parallel in the solution of the plating section transporting process F2, and the anodes 10 and 10 arranged in parallel are arranged. The thin plate product W is transported in the middle between the ten.

  A large number of plating solutions on both the left and right sides along the submerged product conveyance path of the product-free portion W1 of the thin plate product W conveyed in the plating unit conveyance process F2 at a relatively slow feeding speed of about 5 to 10 mm / second. The ejection nozzle pipes 11 are arranged in an upright state with an interval in the transport direction, and these plating solution ejection nozzle pipes 11 are made to correspond to the product free portion W1 at an almost constant interval in the vertical direction of the pipe. Nozzle jet means is provided in which a large number of nozzles (spout ports) 12 for jetting the plating solution are disposed close to and opposed to the submerged product transport path. The nozzles 12 are arranged at equal intervals with the product W in the liquid transport path in between, so that the plating solution is ejected almost uniformly toward the plate surface of the product W. As shown in FIG. 3, the jet flow ejected from these nozzles 12 has the same ejection angle on the left and right with respect to the submerged product transport track, and the product free section transported on the submerged product transport track. The inclined jet is ejected at an ejection angle inclined inwardly in the horizontal direction toward the submerged product conveyance path in the conveyance direction of W1, and this inclined jet is caused to act as the induced jet 12J. The spray angle of the plating solution ejected from the nozzle 12 with respect to the submerged product transport path (shown by the product free portion W1 in FIG. 3) (the eject angle indicated by the symbol B in FIG. 3) is about 5 degrees to about About 40 degrees, preferably about 10 degrees to about 30 degrees. Further, the guide jet 12J is jetted obliquely downward in the vertical direction as shown in FIG. The reason why jetting is performed obliquely downward in this manner is to make the product free portion W1 being conveyed act so as to be guided downward to make it easy to maintain the posture of the product. The induced jets 12J ejected from these nozzles 12 are set to a jetting speed that is faster than the product transport speed transported in the plating part transporting process F2, and the products transported in the plating part transporting process F2 by these guided jets 12J. The plating part guide jet guide part G is formed in which the submerged product transport path of the free part W1 is a guide channel in which the submerged resistance of the submerged product transport path is continuously weakened.

  The plating solution ejection nozzle tube 11 may be configured by forming a nozzle (ejection port) in a plastic pipe, but as shown in FIGS. 1 and 3, the plastic pipe (round pipe) 13 is formed. A plastic reinforcing member 14 having a convex section in section extending along the straight pipe direction of the plastic pipe (round pipe) 13 is fixed to the reinforcing member 14 in an attached state by an adhesive means. A large number of through-holes are formed at intervals, and these through-holes are communicated with the inside of the plastic pipe 13 so that the through-holes are configured as the nozzles (spout ports) 12 and ejected. The direction of the plating solution is improved.

  The nozzle jet means will be further described. The lower end portion of the plating solution jet nozzle tube 11 is fixed so as to communicate with a plating solution supply box 15 fixedly arranged on the bottom side in the plating treatment tank 3. The upper end is closed with a blind cap 16. A circulation pump (not shown) is disposed outside the plating tank 3, a suction pipe (not shown) is connected to the suction side of the circulation pump, and the other side of the suction pipe is connected to the plating tank 3. The discharge pipe (not shown) is connected to the discharge side of the circulation pump, and the other side of the discharge pipe is connected to the suction port 17 of the plating solution supply box 15. It is connected. The plating solution A in the plating tank 3 is forced to flow along this circulation path, and the forcedly flowing plating solution A is ejected from each nozzle 12 of the plating solution ejection nozzle tube 11 through the plating solution supply box 15. Is done.

  The plating solution ejection nozzle tube 11 is disposed between the anode 10 disposed on both side walls in the plating tank 3 and the submerged product conveyance track of the product W to be conveyed, and the plating solution ejection nozzle tube 11. The metal ions supplied from the anode 10 and taken out from the anode are deposited on the product.

  Proximity of submerged product transport path of the product-free portion W1 of the thin plate product W transported in the feed section transport process F1 at a feed rate of about 50 to 100 mm / second faster than the feed speed of the plating section transport process F2. On the opposite sides, the product free portion W1 of the thin plate product W is guided in opposition to each other while being lowered together with the product W (arrow D in FIG. 1). A plate-like carry-in guide 20 to be carried into the carry-in position is disposed, and a feeding portion guide guide portion G2 is interposed between the plate-like carry-in guide 20 and the plating portion guide jet guide portion G. It is.

  In the embodiment of FIGS. 1 and 2, the feeding part guiding guide part G2 is used to transport the feeding part transporting process F1 at a feeding speed faster than the feeding speed of the plating part transporting process F2. A plurality of infeed portion plating solution ejection nozzle tubes 21 are arranged on both sides of the submerged product conveyance path of the product free portion W1 in a standing state at intervals in the conveyance direction, and these infeed portion plating solution ejection nozzle tubes 21 are disposed. A plurality of nozzles 22 for ejecting a plating solution at a certain interval in the height direction are constituted by a feeding portion guide jet guide 25 by nozzle jet means which is disposed close to and opposed to the submerged product transport track. . As shown in FIG. 2, the jet flow ejected from these nozzles 22 has the same ejection angle on the left and right with respect to the submerged product transport path, and the product free section transported on the submerged product transport path. The inclined jet is ejected at an ejection angle inclined inwardly in the horizontal direction toward the submerged product conveyance track in the conveyance direction of W1, and this inclined jet is caused to act as the induced jet 22J. The guide jets 22J ejected from these nozzles 22 are set at a jetting speed that is faster than the product transport speed transported in the infeed portion transport process F1, and are arranged on opposite sides of the submerged product transport track. The arrangement interval of 22 in the conveyance direction is formed narrower than the arrangement interval of a large number of the nozzles 12 arranged in the plating part conveyance process F2. In addition, the induced jet 22J ejected from the nozzle 22 is ejected when the product W is fed and conveyed in the feeding part conveyance step F1, and the ejection is stopped when the product W is not fed and conveyed. ing. An infeed portion guide jet guide in which the in-liquid resistance of the in-liquid product transport track is continuously weakened in the in-liquid product transport track of the product-free portion W1 that is transported in the infeed portion transport process F1 by these induced jets 22J. 25.

  In the same way as the plating solution ejection nozzle tube 11 arranged in the plating unit conveyance step F2, the plating solution ejection nozzle tube 21 for the feeding unit arranged in the feeding unit conveyance step F1 is connected to a plastic pipe. A plastic reinforcing member 14 having a convex cross section extending along the straight pipe direction is fixed, and a large number of through holes are formed in the reinforcing member at a predetermined interval. By communicating with the inside of the pipe 14, the directivity of the sprayed plating solution is enhanced by using the through hole as the nozzle (spout port) 22.

  In addition, the feeding portion plating solution ejection nozzle tube 21 arranged in the feeding portion conveyance step F1 is similar to the plating solution ejection nozzle tube 11 arranged in the plating portion conveyance step F2, and the feeding portion plating is performed. The lower end portion of the liquid jet nozzle pipe 21 is fixed so as to communicate with the plating solution supply box 26 for the feeding portion fixedly arranged on the bottom side in the plating tank 3, and the upper end portion is closed with the blind cap 16. It is peeling off. A circulation pump (not shown) is disposed outside the plating tank 3, a suction pipe (not shown) is connected to the suction side of the circulation pump, and the other side of the suction pipe is connected to the plating tank 3. The discharge pipe (not shown) is connected to the discharge side of the circulation pump, and the other side of the discharge pipe is connected to the suction port 27 of the plating solution supply box 26. It is connected. The plating solution A in the plating tank 3 is forcedly flowed along this circulation path, and the forcedly flowing plating solution A passes through the plating solution supply box 26 for the feeding portion, and the feeding portion plating solution ejection nozzle tube 21. Are ejected from each nozzle 22.

  5 and 6, the sheet-like product W that is fed at the feeding portion guide guide portion G2 at a feeding speed faster than the feeding speed at the feeding portion feeding step F1 in the plating portion feeding step F2. The plate-like infeed portion guide plate guide 30 is disposed opposite to both sides of the in-liquid product conveyance track of the product-free portion W1 which are close to each other. As shown in FIG. 6, a C-shaped widened portion 31 is formed on the inlet side of the feeding portion guide plate guide 30 as seen from the plane direction so that the product can easily pass therethrough. The lower side of the feeding part guide plate guide 30 is fixed to the bottom wall side in the plating tank 3. The embodiment shown in FIGS. 5 and 6 is the same as the embodiment shown in FIGS. 1 to 4 except that the infeed portion guide guide portion G2 is constituted by the infeed portion guide plate guide 30. is there.

  Proximity of submerged product transport path of the product-free portion W1 of the thin plate product W transported in the feed section transport process F3 at a feed speed of about 50 to 100 mm / second faster than the feed speed of the plating section transport process F2. Plate-shaped carry-out guides 33 arranged opposite to both sides are arranged. As shown in FIG. 2 and FIG. 6, a C-shaped widened portion 34 is formed on the entrance side of the plate-like carry-out guide 33 in order to facilitate the passage of the product. Further, a circulation is generated in the plate-like carry-out guide 33 to generate a circulation jet that is forced to circulate in the plate-like carry-out guide 33 in the product transfer direction at a speed faster than the product carrying speed that is carried in the delivery unit carrying step. A jet generating means 35 is provided, and the circulating jet generating means 35 is arranged on the entrance side of the plate-like carry-out guide 33 and is ejected means 36 (see FIG. 6) for jetting the plating solution from the entrance side into the plate-like carry-out guide 33. A plating solution ejection nozzle tube in which a large number of injection ports are formed in the vertical direction of the tube, and a suction that is arranged on the outlet side of the plate-like carry-out guide 33 and sucks the plating solution ejected into the plate-like carry-out guide 33 Means 37 (plating solution suction nozzle tube in which a number of suction ports are formed in the vertical direction of the tube), discharge port 38 of the suction means 37 (plating solution ejection nozzle tube) and the ejection means 36 (plating solution suction nozzle) Are constituted by a circulation path for the suction port 39 of the tube) was connected via a circulation pump (not shown). The circulating jet generated by the circulating jet generating means 35 is generated when the product W is sent out and transported in the delivery part transporting process F3, and is stopped when the product W is not delivered and transported. Has been.

  In addition, the plate-like carry-out guide 33 guides the plating together with the product while opposingly guiding the product-free portion W1 of the thin plate-like product W from the carry-out position (the product W position on the left side in FIG. 1). It is configured to move up and down between the unloading position, which is a lowered position, and the raised position so as to be unloaded from the liquid A to the raised position.

  In this way, the feeding part transporting process F1, the plating part transporting process F2, and the feeding part transporting process F3, which have different product feed speeds, are sandwiched only by the jig 2 at the upper part of the product and the lower side is in a free suspended state The thin plate product W is smoothly conveyed in the liquid.

It is a front view of the present invention. 1 is a schematic plan view of the present invention. It is a principal part enlarged plan view of this invention. It is a side view of the present invention. It is a front view which shows the other Example of this invention. It is a schematic plan view which shows the other Example of this invention.

Explanation of symbols

F1 Feeding part transport process F2 Plating part transport process F3 Sending part transport process 1 Rail 1A Carry-in rail 1B Power supply rail 1C Carry-out rail 2 Jig W Thin plate product W1 Product free part 3 Plating tank A A plating solution 4 Engagement claw 5 Teeth Conveying belt 6 Engagement protrusion 7A Pushing body 7B Pushing body 9 Product clamping part 10 Anode 11 Plating liquid jet nozzle tube 12 Nozzle 12J Induction jet G Plating part induction jet guide part 20 Plate-shaped carry-in guide G2 Feeding part guide part 21 Feeding Plating liquid jet nozzle tube 22 Nozzle 22J Guide jet 25 Feed part guide jet guide 30 Feed part guide plate guide 33 Plate carry-out guide 35 Circulating jet generating means 36 Jet means 37 Suction means

Claims (9)

The upper part of a thin plate-like product such as a thin printed circuit board sheet that is plated by a jig that is supported laterally by a power supply rail that functions as a cathode bar is held in a suspended state, and the lower side from this holding position is free. It is a product-free part in a suspended state, and the thin plate product suspended in a suspended state by the jig is fed along the power supply rail while supplying power from the power supply rail to the upper part of the product through the jig. A plating part transporting process in which the electroplating process is carried out while the plate surface of the thin plate product is transported at a constant feed speed in a horizontal orientation in which the plate surface of the thin plate product is parallel to the transport direction in the plating solution in the horizontally long plating tank In the submerged transport type plating method,
A number of nozzles that eject the plating solution substantially uniformly on both the left and right sides along the submerged product transport track of the product-free portion of the thin plate product transported in the plating unit transporting process are brought close to the submerged product transport track. Nozzle jet means is provided, and the nozzle jet means transports the jet flow from the nozzle almost uniformly ejected from both the left and right sides of the submerged product transport track on the submerged product transport track. The product-free part is a guided jet that is jetted obliquely inward in the horizontal direction toward the submerged product transport track, and this guided jet is faster than the product transport speed transported in the plating part transport process. The submerged product transport trajectory of the submerged product transport trajectory is continuously set in the submerged product transport trajectory of the product free portion that is set to the ejection speed and is transported through the plating unit transport step by the induced jet flow. An electroplating process was performed while smoothly transporting the product-free part of the thin plate product suspended in a suspended state along the plating part induction jet guide part. A plating method for conveying a thin plate product in liquid.   2. The plating method according to claim 1, wherein the guide jet is ejected obliquely inward in a transport direction of the product-free portion transported on the submerged product transport track and toward the submerged product transport track side in a horizontal direction. And a submerged transport plating method for a thin plate product characterized by being ejected obliquely downward in the vertical direction. The upper part of a thin plate-like product such as a thin printed circuit board sheet that is plated by a jig that is supported laterally by a power supply rail that functions as a cathode bar is held in a suspended state, and the lower side from this holding position is free. It is a product-free part in a suspended state, and the thin plate product suspended in a suspended state by the jig is fed along the power supply rail while supplying power from the power supply rail to the upper part of the product through the jig. Electricity is transferred while the plating solution in the horizontally long plating tank is transported at a constant feed rate in a horizontal orientation in which the plate surface of the thin plate product is parallel to the transport direction by the plating section transport means in the horizontal direction by the plating section transport means. In a submerged transport type plating processing apparatus having a plating part transporting process for plating,
A large number of plating solution jet nozzle tubes are arranged in a standing state at intervals in the transport direction on both the left and right sides along the submerged product transport track of the product-free portion of the thin plate product transported in the plating unit transport step. In addition, nozzle jet means comprising a large number of nozzles for jetting the plating liquid at a predetermined interval in the height direction are provided close to the submerged product transport track in these plating liquid jet nozzle pipes, and the nozzle jet means The jet flow from the nozzles ejected from both the left and right sides of the submerged product transport track in the transport direction of the product free portion transported through the submerged product transport track and the submerged product transport track side. The guide jet is jetted obliquely inward in the horizontal direction, and this guide jet is set to a jet speed that is faster than the product transport speed transported in the plating section transport process. Forming the submerged product transport path of the product free section transported in the plating section transporting step as a plating section guide jet guide section in which the submerged resistance of the submerged product transport path is continuously weakened. In-liquid conveyance type of thin plate product characterized in that electroplating treatment is carried out while smoothly transporting the product free part of the thin plate product suspended in a suspended state along the plating portion guide jet guide portion Plating equipment. A thin plate such as a thin printed circuit board sheet plated by a jig that is supported on a rail composed of a carry-in rail and a carry-out rail that can be aligned on the same straight line with a power supply rail that functions as a cathode bar in between. The product upper part of the product is held in a suspended state, and a product-free part in which the lower side from the holding position is in a free suspended state, and the thin plate product suspended in the suspended state by the jig is connected to the rail In the plating solution in the horizontally long plating treatment tank, the feeding part conveyance process and the plating part conveyance are carried out along the conveyance path on the same straight line in the horizontal orientation in which the plate surface of the thin plate product is parallel to the conveyance direction. It is conveyed in the order of the process and the delivery part conveyance process. In the plating part conveyance process, along the power supply rail while supplying power from the power supply rail to the upper part of the product via the jig. The Tsu key solution by plating part conveying means so as to electroplating process while conveying the sheet-shaped product at a constant feed rate through the jig, the infeed said carrying rail the thin plate product in transport step Is carried intermittently at a feed rate higher than the feed rate of the plating part transporting process by the feed part transporting means from the carry-in position supported by the feed part to a predetermined feeding position on the start side of the plating part transporting process. In the delivery unit conveyance step, the thin plate product plated in the plating unit conveyance step is moved from a predetermined delivery position on the end side of the plating unit conveyance step to a delivery position supported by the delivery rail. Liquid that is intermittently transported at a feed speed faster than the feed speed of the plating section transport process through the jig by the transport section transport means. In the plating apparatus of the transfer type,
A large number of plating solution jet nozzle tubes are provided at intervals in the conveying direction on both the left and right sides along the submerged product conveying path of the product-free portion of the thin plate product conveyed at a constant feed speed in the plating unit conveying step. Provided with a nozzle jet means formed by arranging a number of nozzles for ejecting a plating solution at a predetermined interval in the height direction close to the submerged product transporting trajectory. The jet flow from the nozzle, which is ejected from the left and right sides of the submerged product transport track by the nozzle jet means, is carried out in the transport direction of the product free portion transported through the submerged product transport track and the liquid. An induced jet that is jetted obliquely inward in the horizontal direction toward the intermediate product transport track side, and this guided jet is set to a jet speed that is faster than the product transport speed transported in the plating section transport process. The submerged product transport track of the product-free unit transported through the plating unit transport process by the guided jet is formed as a plating unit guide jet guide portion in which the liquid resistance of the submerged product transport track is continuously weakened. The sheet-shaped product is transported at a feeding speed faster than the feeding speed of the plating unit transporting process, on both sides of the product-free portion of the product-free part, which are close to each other in the submerged product transport track. A plate-like carry-in guide that is carried into the carry-in position together with the product is disposed while being guided oppositely with the product-free portion interposed therebetween, and the plate-like carry-in guide and the plating portion guide jet guide portion The product-free product of the thin plate product, which is disposed with a feeding portion guide guide interposed therebetween and is transported at a feeding speed faster than the feeding speed of the plating portion conveying step in the feeding portion conveying step. A plate-like carry-out guide disposed opposite to both sides of the in-liquid product carrying track is disposed, and the plate-like carry-in guide, the feeding portion guide guide portion, and the plating portion conveyance in the feeding portion conveying step The product-free portion of the thin plate-like product suspended in a suspended state along the plate-like carry-out guide in the plating portion induction step in the process and the plate-like carry-out guide in the delivery portion conveyance step is smoothly conveyed. In-liquid plating processing equipment for thin plate products.   5. The plating apparatus according to claim 3, wherein the induced jet is obliquely inward in a horizontal direction toward the submerged product transport track side in the transport direction of the product free portion transported on the submerged product transport track. And a submerged transport type plating apparatus for thin plate products, wherein the apparatus is jetted obliquely downward in the vertical direction.   5. The plating apparatus according to claim 4, wherein the plate-like carry-out guide is circulated forcibly through the plate-like carry-out guide at a speed higher than the product carrying speed carried in the feeding portion carrying step in the product transfer direction. There is provided a circulating jet generating means for generating a jet, and the circulating jet generating means is disposed on the entrance side of the plate-like carry-out guide and ejects the plating solution from the entrance side into the plate-like carry-out guide. A suction means that is disposed on the outlet side of the plate-like carry-out guide and sucks the plating solution ejected into the plate-like carry-out guide, and a circulation in which the suction means and the jet means are connected via a circulation pump. A submerged transport type plating apparatus for thin plate products, characterized by comprising a path.   5. The plating apparatus according to claim 4, wherein the feeding part guiding guide part is a liquid in the product-free part of the thin plate product that is transported at a feeding speed higher than the feeding speed of the feeding part transporting process in the feeding part transporting process. A large number of plating solution ejection nozzle tubes are arranged on the left and right sides along the intermediate product conveyance track in a standing state at intervals in the conveyance direction, and the plating solution is spaced at a predetermined interval in the height direction from these plating solution ejection nozzle tubes. A nozzle jet means is provided in which a number of nozzles for jetting are provided close to the submerged product transport path, and the jet flow ejected from the left and right sides of the submerged product transport path by the nozzle jet means is substantially evenly distributed. An induced jet that is jetted obliquely inward in the horizontal direction toward the submerged product transport track side in the transport direction of the product free portion transported on the submerged product transport track, The guide jet is set to a jet speed that is faster than the product transport speed transported in the feeding section transport process, and the plating interval is set in the transport direction of a large number of the nozzles arranged opposite to both sides of the submerged product transport track. It is formed narrower than the arrangement interval of a large number of the nozzles arranged in the part conveyance step, and the liquid-free product conveyance trajectory of the product free part that is conveyed through the infeed part conveyance process by this induced jet A submerged transport type plating apparatus for a thin plate product, characterized in that it is constituted by an infeed portion guide jet guide in which the submerged resistance of the product transport track is continuously weakened.   5. The plating apparatus according to claim 4, wherein the feeding part guiding guide part is a liquid in the product-free part of the thin plate product that is transported at a feeding speed higher than the feeding speed of the feeding part transporting process in the feeding part transporting process. A submerged conveyance type plating apparatus for a thin plate product, characterized in that it is constituted by an infeed portion guide plate guide disposed opposite to both sides of the intermediate product conveyance track. 5. The plating apparatus according to claim 4, wherein the plate-shaped carry-out guide guides the plate-shaped product in the plating tank together with the product while opposingly guiding the product-free portion of the thin-plate product from the carry-out position. A submerged conveyance type plating process for a thin plate product, characterized in that it is configured to move up and down between the unloading position which is a lowered position and the raised position so as to be unloaded from the liquid to the raised position. apparatus.

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