CN109688717B - Manufacturing method and system of high-precision fine-line PCB (printed Circuit Board) electroplating thin plate - Google Patents
Manufacturing method and system of high-precision fine-line PCB (printed Circuit Board) electroplating thin plate Download PDFInfo
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- CN109688717B CN109688717B CN201811568605.5A CN201811568605A CN109688717B CN 109688717 B CN109688717 B CN 109688717B CN 201811568605 A CN201811568605 A CN 201811568605A CN 109688717 B CN109688717 B CN 109688717B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
Abstract
The invention relates to the technical field of manufacturing of PCB (printed circuit board) electroplated sheets, and particularly discloses a method and a system for manufacturing a high-precision fine-line PCB electroplated sheet, wherein the system comprises a PCB conveying device and/or a PCB electroplating device, and the PCB conveying device particularly comprises a conveying traveling reel and/or a transmission traveling reel; the conveying line roller is provided with a plurality of line roller wheels; the transmission travelling wheel is provided with a bearing, and two sides of the bearing are provided with standard scales; the PCB electroplating device comprises a travelling reel vertically placed in a floating frame. The invention has the beneficial effects that: the probability of phenomena such as clamping, bending and breaking of the high-precision circuit PCB electroplating thin plate in the manufacturing process of the high-precision circuit PCB electroplating thin plate is reduced, and the manufacturing yield of the PCB electroplating thin plate is increased.
Description
Technical Field
The invention relates to the technical field of manufacturing of PCB (printed circuit board) electroplated sheets, in particular to a method and a system for manufacturing a high-precision fine-line PCB electroplated sheet.
Background
The high-precision circuit PCB electroplating thin plate (sometimes referred to as a PCB in the application) is mainly characterized by high integration, so that the thickness of the thin plate is thin under the condition of dense circuits, and the phenomena of horizontal line clamping plate, bent plate, broken plate and the like are easy to appear in the processes of electroplating circuits and the like. Through carefully observing the discovery again, the thin plate board perk is mainly because the rumble both sides of going are little with the conveying area of contact in the middle of, and the face both sides conveying dynamics is inhomogeneous, leads to board both sides transfer rate different, makes the face conveying slope to thereby lead to the board face card to go in the middle of the rumble, thereby the face at back continues to advance and leads to a large amount of cardboards.
In specific manufacture process, the important reason that the running roller does not rotate is also the thin plate bending plate and the clamping plate, and the important reason that the running roller does not rotate is found through observation and is caused by dislocation of the transmission gear.
The bending phenomenon of the thin plate is found in VCP electroplating copper plating, and the phenomena of abnormal floating frame structure, uneven external electroplating jet flow and copper ball falling are found through emptying the liquid medicine.
Disclosure of Invention
The invention provides a method and a system for manufacturing a high-precision fine circuit PCB (printed circuit board) electroplating thin plate, which solve the technical problem that the phenomena of clamping, bending, breaking and the like are easy to occur in the manufacturing process of the conventional high-precision fine circuit PCB electroplating thin plate.
In order to solve the above technical problems, the present invention provides a method for manufacturing a high-precision fine line PCB electroplating sheet, comprising a PCB conveying step and/or a PCB electroplating step, characterized in that,
the PCB transferring step specifically includes:
s1, increasing the density of a running roller wheel for conveying a running roller;
s2, increasing the transmission force applied to the transmission line roller;
s3, and/or making standard scales on two sides of a bearing of the transmission line roller by taking a transmission gear of the transmission line roller as a reference;
the PCB electroplating step specifically comprises:
and S4, vertically placing the travelling wheels in the floating frame.
Further, the step S1 is specifically:
s11, increasing the density of a middle line roller wheel of the transmission line roller;
s12, increasing the density of the two side running wheel wheels of the conveying running wheel.
Further, in step S3, the making of the standard scales on both sides of the bearing of the transmission traveling wheel specifically includes:
s31, symmetrically determining the installation positions of transmission gears on two sides of a bearing of the transmission travelling wheel respectively;
and S32, manufacturing the standard scales on two sides of the installation position of the transmission gear.
Further, in step S3, making standard scales on two sides of the bearing of the transmission traveling wheel specifically includes:
the standard scales are manufactured on two sides of each transmission gear, and the transmission gears are symmetrically arranged on two sides of a bearing of the transmission travelling wheel.
Further, the step S4 is specifically:
the lines of rumbles in the floating frame are vertically placed into two parallel rows, and the two rows of gaps formed by the lines of rumbles are used for placing a PCB thin plate for electroplating.
The invention also provides a manufacturing system of the high-precision fine line PCB electroplating sheet, which comprises a PCB conveying device and/or a PCB electroplating device, wherein the PCB conveying device specifically comprises a conveying travelling winch and/or a transmission travelling winch; the conveying line roller is provided with a plurality of line roller wheels; the transmission travelling wheel is provided with a bearing, and two sides of the bearing are provided with standard scales;
the PCB electroplating device comprises a travelling reel vertically placed in a floating frame.
Specifically, the line rumble wheel of a plurality of lines that the rumble was equipped with is gone including a plurality of middles and goes the rumble wheel, and/or a plurality of both sides of symmetry and go the rumble wheel.
Specifically, two sides of a bearing of the transmission travelling winch are respectively determined with symmetrical transmission gear installation positions, the standard scales are manufactured on two sides of the transmission gear installation positions, and the transmission gear installation positions are used for being installed in the transmission gears.
Specifically, transmission gears are symmetrically arranged on two sides of a bearing of the transmission travelling wheel, and the standard scales are arranged on two sides of each transmission gear.
Specifically, the line rumble in the floating frame is provided with two parallel rows, two rows the gap that line rumble formed is used for putting into the PCB sheet metal and electroplates.
The invention provides a method and a system for manufacturing a high-precision fine-line PCB (printed Circuit Board) electroplating sheet, which have the beneficial effects that:
1. the density of the row roller wheels in the middle and/or two sides of the transmission row roller is increased, namely the transmission row roller with higher density of the row roller wheels is adopted, and/or the transmission force of the PCB surface and the row roller is increased, so that the transmission force of the transmission row roller to the PCB is more balanced, and the phenomenon of inclination of the surface transmission process is avoided; meanwhile, the density of the rollers at the two sides and/or the middle of the conveying line roller is increased, so that no space is reserved at the plate corner in the line roller process, and the manufacturing yield of the plate surface is ensured;
2. standard scales are manufactured on two sides of a transmission line roller shaft, then the positions of a transmission gear on the two sides of the line roller shaft are recorded, namely the transmission line roller with the standard scales is adopted, so that the position can be conveniently checked in later point inspection and maintenance, the transmission gear is prevented from being misplaced, meanwhile, the line rollers in different installation positions limit the position of the transmission gear through the standard scales, equipment assembly and equipment universality are facilitated, and the maintenance difficulty is reduced;
3. the row rollers in the floating frame are vertically arranged into two parallel rows, a gap formed by the two rows of row rollers is reduced, and the copper balls cannot fall off and are clamped into the gap; the PCB surface with uneven jet flow is prevented from rubbing with the floating frame to cause scratching; the clamping plate caused by uneven jet flow at the joint between the copper cylinder floating frames in the transmission process of the thin plate is prevented; meanwhile, the plate surface is driven in the cylinder without the need of traveling roller transmission, so that the traveling rollers are simply fixed without a complex transmission device, the density of the traveling rollers can be properly increased according to the thickness of the plate surface, or the traveling roller wheels are arranged in a staggered mode, and the electroplating uniformity can not be influenced.
Drawings
FIG. 1 is a schematic diagram of a mechanism for conveying a roller in a method and a system for manufacturing a high-precision thin circuit PCB (printed circuit board) electroplated thin plate according to an embodiment of the invention;
FIG. 2 is a schematic diagram of a mechanism of a transmission roller in the method and system for manufacturing a high-precision thin circuit PCB (printed circuit board) electroplated sheet according to an embodiment of the invention;
fig. 3 is a top view of a row roller and a floating frame in the method and system for manufacturing a high-precision thin circuit PCB electroplated thin plate according to the embodiment of the present invention.
Detailed Description
The embodiments of the present invention will be described in detail below with reference to the accompanying drawings, which are given solely for the purpose of illustration and are not to be construed as limitations of the invention, including the drawings which are incorporated herein by reference and for illustration only and are not to be construed as limitations of the invention, since many variations thereof are possible without departing from the spirit and scope of the invention.
Example 1
The high-precision circuit PCB electroplating thin plate (sometimes referred to as a PCB in the application) is mainly characterized by high integration, so that the thickness of the thin plate is thin under the condition of dense circuits, and the phenomena of horizontal line clamping plate, bent plate, broken plate and the like are easy to appear in the processes of electroplating circuits and the like. Through carefully observing the discovery again, the thin plate board perk is mainly because the rumble both sides of going are little with the conveying area of contact in the middle of, and the face both sides conveying dynamics is inhomogeneous, leads to board both sides transfer rate different, makes the face conveying slope to thereby lead to the board face card to go in the middle of the rumble, thereby the face at back continues to advance and leads to a large amount of cardboards.
In view of the above problems, the embodiment of the invention provides a method for manufacturing a high-precision fine line PCB (printed circuit board) electroplated thin plate, which increases the density of a line reel wheel for conveying a line reel and simultaneously increases the conveying force applied to the conveying line reel; alternatively, in the case where the transmission force is already large, the density of the row sheave wheels transmitting the row sheaves is simply increased.
Further, the density of the row sheave wheels for conveying the row sheaves may be increased, the density of the middle row sheave wheel for conveying the row sheaves may be increased, the middle row sheave wheel and the left and right row sheave wheels may be installed at the same number and at the same interval, and 3 of them as shown in fig. 1 may be preferably used.
In the embodiment, the density of the row roller wheels in the middle and/or two sides of the conveying row roller is increased, and/or the transmission force of the PCB surface and the row roller is increased, so that the transmission force of the conveying row roller on the PCB is more balanced, and the phenomenon of inclination of the PCB surface in the conveying process is avoided; simultaneously, the density of the rollers at the two sides and/or the middle of the conveying line roller is increased, and the plate corners are not clamped in the line roller process, so that the production yield of the plate surface is ensured.
Example 2
In specific manufacture process, the important reason that the running roller does not rotate is also the thin plate bending plate and the clamping plate, and the important reason that the running roller does not rotate is found through observation and is caused by dislocation of the transmission gear.
In order to solve the technical problem, the embodiment provides a method for manufacturing a high-precision fine circuit PCB electroplated thin plate, specifically, a transmission gear of a transmission line wheel is used as a reference, and standard scales are manufactured on two sides of a bearing of the transmission line wheel. The standard scales are manufactured on two sides of the bearing of the transmission running roller, and the two conditions can be realized: the first method is that transmission gears are not arranged on two sides of a bearing, the installation positions of the transmission gears are respectively determined on two sides of the bearing of the transmission travelling wheel symmetrically, and then standard scales are manufactured on two sides of the installation position of the transmission gear; the second is that the transmission gear is installed in advance, and then the transmission gear is used as a reference to manufacture standard scales, namely the standard scales are manufactured on two sides of each transmission gear, and the transmission gears are symmetrically installed on two sides of a bearing of the transmission travelling wheel.
As shown in fig. 2, the standard position, that is, the start position of the scale is also used as the verification position in the later spot check maintenance.
This embodiment all makes the standard scale on the rumble axle both sides of going in the transmission, then with drive gear in the position record on rumble axle both sides of going, checks the position when the maintenance is examined to the later stage point of being convenient for, prevents the drive gear dislocation, the rumble of going of different mounted position simultaneously, prescribes a limit to drive gear's position through the standard scale, makes things convenient for equipment and equipment general, reduces the maintenance degree of difficulty.
Example 3
The bending phenomenon of the thin plate is found in VCP electroplating copper plating, and the phenomena of abnormal floating frame structure, uneven external electroplating jet flow and copper ball falling are found through emptying the liquid medicine.
In order to solve the technical problem, the embodiment provides a manufacturing method of a high-precision thin circuit PCB electroplated thin plate, specifically, the row rollers in the floating frame are vertically placed, further the row rollers in the floating frame are vertically placed into two parallel rows, and the two rows of gaps formed by the row rollers are used for placing the PCB thin plate for electroplating, as shown in fig. 3, wherein the row roller between one row roller in each row of the row rollers and the other row roller can be staggered, and according to the thickness of the thin plate, the density of the row rollers can be generally increased as in the embodiment (the thinner the thin plate is, the higher the density of the row roller is), so as to ensure the uniformity of electroplating.
In the embodiment, the row rollers in the floating frame are vertically arranged into two parallel rows, the gap formed by the two rows of row rollers is reduced, and the copper ball cannot fall off and is clamped in the gap; the PCB surface with uneven jet flow is prevented from rubbing with the floating frame to cause scratching; the clamping plate caused by uneven jet flow at the joint between the copper cylinder floating frames in the transmission process of the thin plate is prevented; meanwhile, the plate surface is driven in the cylinder without the need of traveling roller transmission, so that the traveling rollers are simply fixed without a complex transmission device, the density of the traveling rollers can be properly increased according to the thickness of the plate surface, or the traveling roller wheels are arranged in a staggered mode, and the electroplating uniformity can not be influenced.
Example 4
The embodiment is the sum of the embodiments 1, 2 and 3, that is, in the specific implementation scheme, strict control of each link is achieved, the yield of the manufactured PCB electroplated thin plate can be maximized, and the actual processing requirement can be met.
Example 5
The embodiment corresponds to the embodiment 1, and aims at the same technical problem as the embodiment 1, the manufacturing system of the high-precision fine circuit PCB electroplating thin plate provided by the embodiment of the invention comprises a PCB conveying device, wherein the conveying line reel is provided with a plurality of line reel wheels. Specifically, the line rumble wheel of a plurality of lines that the rumble was equipped with is gone including a plurality of middles and goes the rumble wheel, and/or a plurality of both sides of symmetry and go the rumble wheel. That is, the number of the middle row wheel may be plural, the number of the middle row wheel and the number of the left and right row wheels may be plural in the same number and at the same interval, and 3 of them as shown in fig. 1 may be preferably used.
According to the embodiment, the transmission line rollers with higher line roller wheel density are adopted, and/or the transmission force of the PCB surface and the line rollers is increased, so that the transmission force of the transmission line rollers to the PCB is more balanced, and the phenomenon of inclination of the PCB surface in the transmission process is avoided; simultaneously, the density of the rollers at the two sides and/or the middle of the conveying line roller is increased, and the plate corners are not clamped in the line roller process, so that the production yield of the plate surface is ensured.
Example 6
This embodiment is corresponding to embodiment 2, and for solving the same technical problem with embodiment 2, this embodiment provides a manufacturing system of high-precision fine line PCB electroplating sheet, including PCB conveyer, PCB conveyer specifically includes the line rumble of transmission, the line rumble of transmission is equipped with the bearing, the preparation of bearing both sides has the standard scale.
Preferably, symmetrical transmission gear mounting positions are respectively determined at two sides of a bearing of the transmission travelling winch, the standard scales are manufactured at two sides of the transmission gear mounting positions, and the transmission gear mounting positions are used for being installed in the transmission gears.
Specifically, a transmission gear of a transmission line roller is used as a reference, and standard scales are manufactured on two sides of a bearing of the transmission line roller. The standard scales are manufactured on two sides of the bearing of the transmission running roller, and the two conditions can be realized: the first method is that transmission gears are not arranged on two sides of a bearing, the installation positions of the transmission gears are respectively determined on two sides of the bearing of the transmission travelling wheel symmetrically, and then standard scales are manufactured on two sides of the installation position of the transmission gear; the second is that the transmission gear is installed in advance, and then the transmission gear is used as a reference to manufacture standard scales, namely the standard scales are manufactured on two sides of each transmission gear, and the transmission gears are symmetrically installed on two sides of a bearing of the transmission travelling wheel.
As shown in fig. 2, the standard position, that is, the start position of the scale is also used as the verification position in the later spot check maintenance.
This embodiment adopts and to go the rumble axle both sides in the transmission and all make the transmission line rumble that has the standard scale, then with drive gear in the position record on line rumble axle both sides, the later stage point of being convenient for checks the position when maintaining, prevents the drive gear dislocation, and the line rumble of different mounted position simultaneously prescribes a limit to drive gear's position through the standard scale, makes things convenient for equipment and equipment general, reduces the maintenance degree of difficulty.
Example 7
This embodiment corresponds to embodiment 3, and in order to solve the same technical problem with embodiment 3, this embodiment provides a manufacturing system of high-precision fine circuit PCB electroplated sheet, including PCB electroplating device, PCB electroplating device specifically includes the capable rumble of vertical placement in the floating frame. The capable rumble in the floating frame is provided with two parallel rows, two rows the gap that the capable rumble formed is used for putting into the PCB sheet metal and electroplates, as shown in figure 3, wherein, but the capable rumble wheel staggered arrangement between the capable rumble of every row and another row rumble, according to sheet thickness, can generally increase the density of the capable rumble wheel of embodiment (the sheet metal is thinner more, the density of the capable rumble wheel sets up higher) to guarantee the homogeneity of electroplating.
In the embodiment, the row rollers in the floating frame are vertically arranged into two parallel rows, the gap formed by the two rows of row rollers is reduced, and the copper ball cannot fall off and is clamped in the gap; the PCB surface with uneven jet flow is prevented from rubbing with the floating frame to cause scratching; the clamping plate caused by uneven jet flow at the joint between the copper cylinder floating frames in the transmission process of the thin plate is prevented; meanwhile, the plate surface is driven in the cylinder without the need of traveling roller transmission, so that the traveling rollers are simply fixed without a complex transmission device, the density of the traveling rollers can be properly increased according to the thickness of the plate surface, or the traveling roller wheels are arranged in a staggered mode, and the electroplating uniformity can not be influenced.
Example 8
The embodiment is the sum of the embodiments 5, 6 and 7, that is, in a specific implementation scheme, the devices described in the embodiments 5, 6 and 7 are adopted in corresponding links, so that the yield of the manufactured PCB electroplated thin plate can be maximized, and the actual processing requirements can be met.
The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such changes, modifications, substitutions, combinations, and simplifications are intended to be included in the scope of the present invention.
Claims (6)
1. A method for manufacturing a high-precision fine-line PCB (printed Circuit Board) electroplating sheet comprises a PCB transmission step and a PCB electroplating step, and is characterized in that,
the PCB transferring step specifically includes:
s1, increasing the density of a running roller wheel for conveying a running roller;
s2, or increasing the transmission force applied to the transmission line roller;
s3, making standard scales on two sides of a bearing of the transmission travelling winch by taking a transmission gear of the transmission travelling winch as a reference;
the PCB electroplating step specifically comprises:
s4, vertically placing the travelling wheels in the floating frame;
the step S1 specifically includes:
s11, increasing the density of a middle line roller wheel of the transmission line roller;
s12, increasing the density of the two side running roller wheels of the conveying running roller.
2. The method for manufacturing a high precision fine wire PCB thin electroplated plate as claimed in claim 1, wherein in said step S3, said manufacturing standard scales on both sides of the bearing of said transmission line wheel specifically comprises:
s31, symmetrically determining the installation positions of transmission gears on two sides of a bearing of the transmission travelling wheel respectively;
and S32, manufacturing the standard scales on two sides of the installation position of the transmission gear.
3. The method for manufacturing a high precision fine circuit PCB electroplating thin plate as claimed in claim 1, wherein the step S4 is specifically as follows:
the lines of rumbles in the floating frame are vertically placed into two parallel rows, and the two rows of gaps formed by the lines of rumbles are used for placing a PCB thin plate for electroplating.
4. The utility model provides a manufacturing system of high-accuracy fine line PCB electroplates sheet metal, includes PCB conveyer and PCB electroplating device, its characterized in that:
the PCB conveying device specifically comprises a conveying travelling reel and a transmission travelling reel; the conveying line roller is provided with a plurality of line roller wheels; the transmission travelling wheel is provided with a bearing, and two sides of the bearing are provided with standard scales;
the PCB electroplating device specifically comprises a travelling winch vertically arranged in a floating frame;
the rumble wheel is gone including a plurality of middles to a plurality of rumble wheels of going that the rumble of going that the conveying was equipped with, and the rumble wheel is gone with a plurality of both sides of symmetry.
5. The system for manufacturing a high precision fine line PCB plating thin plate as claimed in claim 4, characterized in that: symmetrical transmission gear mounting positions are respectively determined on two sides of a bearing of the transmission travelling wheel, the standard scales are manufactured on two sides of the transmission gear mounting positions, and the transmission gear mounting positions are used for being installed in the transmission gears.
6. The system for manufacturing a high precision fine line PCB plating thin plate as claimed in claim 4, characterized in that: the line rumble in the floating frame is provided with two parallel rows, two rows the gap that line rumble formed is used for putting into the PCB sheet metal and electroplates.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811568605.5A CN109688717B (en) | 2018-12-21 | 2018-12-21 | Manufacturing method and system of high-precision fine-line PCB (printed Circuit Board) electroplating thin plate |
| PCT/CN2018/124092 WO2020124649A1 (en) | 2018-12-21 | 2018-12-26 | Method and system for manufacturing electroplated high-precision thin circuit pcb |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811568605.5A CN109688717B (en) | 2018-12-21 | 2018-12-21 | Manufacturing method and system of high-precision fine-line PCB (printed Circuit Board) electroplating thin plate |
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| Publication Number | Publication Date |
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| CN109688717A CN109688717A (en) | 2019-04-26 |
| CN109688717B true CN109688717B (en) | 2021-02-05 |
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| CN201811568605.5A Active CN109688717B (en) | 2018-12-21 | 2018-12-21 | Manufacturing method and system of high-precision fine-line PCB (printed Circuit Board) electroplating thin plate |
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| CN (1) | CN109688717B (en) |
| WO (1) | WO2020124649A1 (en) |
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| CN111246687A (en) * | 2020-03-10 | 2020-06-05 | 广东科翔电子科技股份有限公司 | Method for manufacturing high-precision multi-order intelligent unmanned aerial vehicle printed circuit board |
| CN114291488A (en) * | 2022-01-04 | 2022-04-08 | 曾倩 | Horizontal large-area etching machine bearing conveying structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3984597B2 (en) * | 2004-02-02 | 2007-10-03 | 丸仲工業株式会社 | Submerged conveying plating method and plating apparatus for thin plate products |
| CN201686327U (en) * | 2010-06-02 | 2010-12-29 | 东莞宇宙电路板设备有限公司 | PCB conveying device |
| CN201992033U (en) * | 2011-03-11 | 2011-09-28 | 深圳市崇达电路技术股份有限公司 | Running roller with identification structure |
| CN102905469B (en) * | 2011-07-25 | 2015-08-19 | 北大方正集团有限公司 | For making apparatus for leveling and the method for printed circuit board (PCB) |
| CN202684537U (en) * | 2012-04-26 | 2013-01-23 | 成都槟果科技有限公司 | Automatic positioning frame |
| CN203104963U (en) * | 2012-09-28 | 2013-07-31 | 深圳市航盛电路科技股份有限公司 | Circuit board water sucking line roller clamping device |
| CN103619124B (en) * | 2013-11-25 | 2016-06-29 | 广东依顿电子科技股份有限公司 | A kind of production method of wiring board thin plate |
| CN104185377A (en) * | 2014-08-21 | 2014-12-03 | 深圳崇达多层线路板有限公司 | Fine-line PCB manufacturing method |
| CN204145896U (en) * | 2014-09-30 | 2015-02-04 | 广州杰赛科技股份有限公司 | A kind of operation servicing unit of thin plate |
| US10184189B2 (en) * | 2016-07-18 | 2019-01-22 | ECSI Fibrotools, Inc. | Apparatus and method of contact electroplating of isolated structures |
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| WO2020124649A1 (en) | 2020-06-25 |
| CN109688717A (en) | 2019-04-26 |
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