CN109688717A - A kind of production method and system of high-precision fine rule road PCB electroplating thin plate - Google Patents
A kind of production method and system of high-precision fine rule road PCB electroplating thin plate Download PDFInfo
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- CN109688717A CN109688717A CN201811568605.5A CN201811568605A CN109688717A CN 109688717 A CN109688717 A CN 109688717A CN 201811568605 A CN201811568605 A CN 201811568605A CN 109688717 A CN109688717 A CN 109688717A
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- row rumble
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 44
- 238000009713 electroplating Methods 0.000 title claims abstract description 41
- 230000005540 biological transmission Effects 0.000 claims abstract description 129
- 238000009434 installation Methods 0.000 claims description 20
- 238000007747 plating Methods 0.000 claims description 10
- 238000012546 transfer Methods 0.000 claims description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 238000012423 maintenance Methods 0.000 description 3
- 241000446313 Lamella Species 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 239000011111 cardboard Substances 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention relates to the manufacture technology fields of PCB electroplating thin plate, specifically disclose the production method and system of a kind of high-precision fine rule road PCB electroplating thin plate, the system comprises PCB transmission device and/or PCB electroplanting device, the PCB transmission device specifically includes transmission row rumble and/or transmission row rumble；The transmission row rumble is equipped with multiple row rumble wheels；The transmission row rumble is equipped with bearing, and the bearing both sides production has master scale；The PCB electroplanting device specifically includes the row rumble being placed in scaffold vertically.The beneficial effects of the present invention are: high-precision fine rule road PCB electroplating thin plate is reduced in its manufacturing process, the probability of phenomena such as snap-gauge, bent plate, disconnected plate is occurred, is increased the production yield of PCB electroplating thin plate.
Description
Technical field
The present invention relates to the manufacture technology field of PCB electroplating thin plate more particularly to a kind of high-precision fine rule road PCB electroplating thin plates
Production method and system.
Background technique
High-precision fine rule road PCB electroplating thin plate (being also referred to as pcb board in the application sometimes) feature is mainly highly integrated, because
And the thickness of the intensive situation lower plate of route is also relatively thin, usually in the processes such as electroplating line, is easy to appear horizontal cable card board, curved
Phenomena such as plate, disconnected plate, for this phenomenon, by observation, discovery is mainly that plate angle tilts generation during transportation.Using son
It is thin it has been observed that sheet panel top sticks up and is primarily due to row rumble both sides and intermediate transmission contact area is small, plate face both sides transmission dynamics
Unevenly, cause plate both sides transmission speed different, make plate face transmission inclination, be stuck among row rumble so as to cause plate face, it is subsequent
Plate face moves on so as to cause a large amount of snap-gauge.
In specific manufacturing process, can also find that row rumble does not rotate is also the major reason of thin plate bent plate and snap-gauge, is passed through
The major reason that observation discovery row rumble does not rotate is that transmission gear dislocation causes.
Discovery has thin plate to bend phenomenon in VCP plating copper facing, is the discovery that scaffold framework is abnormal, additional by emptying liquid medicine
Plating jet flow is uneven, copper ball is fallen causes.
Summary of the invention
The technical issues of present invention provides the production method and system of a kind of high-precision fine rule road PCB electroplating thin plate, solution be,
Existing high-precision fine rule road PCB electroplating thin plate is in its manufacturing process, phenomena such as being easy to appear snap-gauge, bent plate, disconnected plate.
In order to solve the above technical problems, the present invention provides a kind of production method of high-precision fine rule road PCB electroplating thin plate, including
PCB transfer step and/or PCB plating step, which is characterized in that
The PCB transfer step specifically includes:
S1. increase the density of the row rumble wheel of transmission row rumble；
S2. and/or, increase the conveying capacity being applied on the transmission row rumble；
S3. and/or, using the transmission gear for being driven row rumble as reference, standard is made on the bearing both sides of the transmission row rumble
Scale；
The PCB plating step specifically includes:
S4. the row rumble in scaffold is placed vertically.
Further, the step S1 specifically:
S11. increase the density of the center row rumble wheel of transmission row rumble；
S12. and/or, increase the density of the both sides row rumble wheel of transmission row rumble.
Further, in the step S3, the bearing both sides in the transmission row rumble make master scale, specifically
Include:
S31. transmission gear installation site is symmetrically determined respectively on the bearing both sides of the transmission row rumble；
S32. the master scale is made in the two sides of the transmission gear installation site.
Further, in the step S3, the bearing both sides in the transmission row rumble make master scale, specifically
Are as follows:
The master scale is made in the two sides of each transmission gear, the transmission gear is symmetrically mounted at described
It is driven the bearing both sides of row rumble.
Further, the step S4 specifically:
Row rumble in scaffold is placed as parallel two rows vertically, the gap that two rows of row rumbles are formed is for being put into PCB
Thin plate is electroplated.
The present invention also provides a kind of manufacturing system of high-precision fine rule road PCB electroplating thin plate, including PCB transmission device and/or
PCB electroplanting device, the PCB transmission device specifically include transmission row rumble and/or transmission row rumble；The transmission row rumble is equipped with multiple
Row rumble wheel；The transmission row rumble is equipped with bearing, and the bearing both sides production has master scale；
The PCB electroplanting device specifically includes the row rumble being placed in scaffold vertically.
Specifically, multiple row rumble wheels that the transmission row rumble is equipped with include multiple center row rumble wheels, and/or symmetrical multiple
Both sides row rumble wheel.
Specifically, determination has symmetrical transmission gear installation site, the mark respectively on the bearing both sides of the transmission row rumble
Quasi- scale is produced on the two sides of the transmission gear installation site, and the transmission gear installation site is for being packed into the driving cog
Wheel.
Specifically, the bearing both sides of the transmission row rumble are symmetrically equipped with transmission gear, and the master scale is produced on
The two sides of each transmission gear.
Specifically, the row rumble in the scaffold is provided with parallel two rows, and the gap that two rows of row rumbles are formed is for putting
Enter thin PCB to be electroplated.
The production method and system of a kind of high-precision fine rule road PCB electroplating thin plate provided by the invention, the beneficial effect is that:
1, it will transmit among row rumble and/or the row rumble wheel density on both sides increase, that is to say bigger using row rumble wheel density
Row rumble is transmitted, and/or increases the driving force in pcb board face and row rumble, so that transmission row rumble is more balanced to the driving force of pcb board,
Plate face transmit process is not in tilt phenomenon；The idler wheel density on the both sides and/or centre that will transmit row rumble simultaneously increases, and allows plate
Angle does not have space to be stuck in during row rumble, to guarantee the production yield of plate face；
2, all make on transmission row rumble axis both sides and have master scale, then transmission gear is expert at the position note on rumble axis both sides
Record that is to say the transmission row rumble for having master scale using production, checks position when examining and maintain convenient for later period point, prevents transmission gear
Dislocation, while the row rumble of different installation sites, the position of transmission gear is limited by master scale, facilitates equipment assembling and equipment
It is general, reduce maintenance difficulty；
3, the row rumble in scaffold is placed as parallel two rows vertically, the gap that two seniority among brothers and sisters rumbles are formed becomes smaller, and copper ball will not
It falls and is caught in wherein；It prevents jet flow unevenness pcb board face from rubbing with scaffold, causes to wipe and spend；Prevent thin plate in transmit process
Due to the joining place jet flow among copper cylinder scaffold it is uneven caused by snap-gauge；Plate face is driven in cylinder simultaneously does not need row rumble biography
It is dynamic, thus row rumble is only simply fixed, and does not need complicated transmission device, can also suitably be increased according to the thickness of plate face
Row rumble density, or row rumble wheel is staggered, electroplating evenness will not be influenced.
Detailed description of the invention
Fig. 1 be a kind of high-precision fine rule road PCB electroplating thin plate provided in an embodiment of the present invention production method and system in pass
It sees off the structural scheme of mechanism of rumble；
Fig. 2 be a kind of high-precision fine rule road PCB electroplating thin plate provided in an embodiment of the present invention production method and system in pass
The structural scheme of mechanism of dynamic row rumble；
Fig. 3 is in the production method and system of a kind of high-precision fine rule road PCB electroplating thin plate provided in an embodiment of the present invention
The top view of row rumble and scaffold.
Specific embodiment
Embodiments of the present invention are specifically illustrated with reference to the accompanying drawing, embodiment is only given for illustrative purposes,
It can not be interpreted as limitation of the invention, including attached drawing is only for reference and illustrates use, not constitute and the invention patent is protected
The limitation of range, because on the basis of not departing from spirit and scope of the invention many changes can be carried out to the present invention.
Embodiment 1
High-precision fine rule road PCB electroplating thin plate (being also referred to as pcb board in the application sometimes) feature is mainly highly integrated, because
And the thickness of the intensive situation lower plate of route is also relatively thin, usually in the processes such as electroplating line, is easy to appear horizontal cable card board, curved
Phenomena such as plate, disconnected plate, for this phenomenon, by observation, discovery is mainly that plate angle tilts generation during transportation.Using son
It is thin it has been observed that sheet panel top sticks up and is primarily due to row rumble both sides and intermediate transmission contact area is small, plate face both sides transmission dynamics
Unevenly, cause plate both sides transmission speed different, make plate face transmission inclination, be stuck among row rumble so as to cause plate face, it is subsequent
Plate face moves on so as to cause a large amount of snap-gauge.
In view of the above problems, a kind of production method of high-precision fine rule road PCB electroplating thin plate provided in an embodiment of the present invention, increases
The density of the row rumble wheel of big transmission row rumble, while increasing the conveying capacity being applied on the transmission row rumble；Alternatively, conveying capacity
Through only increasing the density of the row rumble wheel of transmission row rumble in biggish situation.
Further, the density for increasing the row rumble wheel of transmission row rumble can be the center row rumble wheel for increasing transmission row rumble
Density can be the row rumble wheel of center row rumble wheel and the right and left all in accordance with equivalent amount, same interval installation, it is preferred to use
As shown in Figure 13.
The present embodiment will transmit among row rumble and/or the row rumble wheel density on both sides increases, and/or increases pcb board face and row
The driving force of rumble, so that transmission row rumble is more balanced to the driving force of pcb board, plate face transmit process is not in tilt phenomenon；
The idler wheel density on the both sides and/or centre of transmitting row rumble is increased simultaneously, plate angle is allowed not have space to be stuck in during row rumble, thus
Guarantee the production yield of plate face.
Embodiment 2
In specific manufacturing process, can also find that row rumble does not rotate is also the major reason of thin plate bent plate and snap-gauge, is passed through
The major reason that observation discovery row rumble does not rotate is that transmission gear dislocation causes.
To solve this technical problem, the present embodiment provides a kind of production methods of high-precision fine rule road PCB electroplating thin plate, specifically
It is to make master scale on the bearing both sides of the transmission row rumble to be driven the transmission gear of row rumble as reference.It is so-called described
The bearing both sides for being driven row rumble make master scale, and be also possible to two kinds of situations: the first is that transmission is not installed on bearing both sides
Gear first symmetrically determines transmission gear installation site on the bearing both sides of the transmission row rumble, then according in the biography respectively
The two sides of moving gear installation site make master scale；Second is that transmission gear first installs, at this moment with transmission gear
For reference, master scale is made, that is to say and make the master scale, the driving cog in the two sides of each transmission gear
Wheel is symmetrically mounted at the bearing both sides of the transmission row rumble.
The initial position of scale zone as shown in Figure 2, normal place namely scale is also examined when maintaining as later period point
Check position.
The present embodiment all makes on transmission row rumble axis both sides and has master scale, and then transmission gear is expert at rumble axis both sides
Position record, checks position when examining and maintain convenient for later period point, prevents transmission gear from misplacing, while the row rumble of different installation sites,
The position that transmission gear is limited by master scale facilitates equipment assembling and Device-General, reduces maintenance difficulty.
Embodiment 3
Discovery has thin plate to bend phenomenon in VCP plating copper facing, is the discovery that scaffold framework is abnormal, additional by emptying liquid medicine
Plating jet flow is uneven, copper ball is fallen causes.
To solve this technical problem, the present embodiment provides a kind of production methods of high-precision fine rule road PCB electroplating thin plate, specifically
It is to place the row rumble in scaffold vertically, the row rumble in scaffold is further placed as parallel two rows vertically, described in two rows
The gap that row rumble is formed is electroplated for being put into thin PCB, as shown in Figure 3, wherein a line rumble in each seniority among brothers and sisters rumble and another
Row rumble wheel between a line rumble can be staggered, and according to lamella thickness, can increase the density (thin plate of row rumble wheel as embodiment
Thinner, the density of row rumble wheel is arranged higher), to guarantee the uniformity of plating.
Row rumble in scaffold is placed as parallel two rows by the present embodiment vertically, and the gap that two seniority among brothers and sisters rumbles are formed becomes smaller, copper
Ball does not fall out and is caught in wherein；It prevents jet flow unevenness pcb board face from rubbing with scaffold, causes to wipe and spend；Prevent thin plate from passing
Pass through journey due to the joining place jet flow among copper cylinder scaffold it is uneven caused by snap-gauge；Plate face is driven in cylinder simultaneously does not need to go
Rumble transmission, thus row rumble is only simply fixed, and does not need complicated transmission device, it can also be appropriate according to the thickness of plate face
Increase row rumble density, or row rumble wheel is staggered, electroplating evenness will not be influenced.
Embodiment 4
The present embodiment is the summation of embodiment 1,2,3, that is to say in specific embodiment, accomplishes the tight of each link
Lattice are checked on, and be can be realized the maximization of production PCB electroplating thin plate yield, are met actual processing demand.
Embodiment 5
The present embodiment corresponds to embodiment 1, provided in an embodiment of the present invention for technical problem same as Example 1
A kind of manufacturing system of high-precision fine rule road PCB electroplating thin plate, including PCB transmission device, the transmission row rumble are equipped with multiple row rumbles
Wheel.Specifically, multiple row rumble wheels that the transmission row rumble is equipped with include multiple center row rumble wheels, and/or symmetrical multiple both sides
Row rumble wheel.It that is to say, can be center row rumble wheel and be set as multiple, can be the row rumble wheel by center row rumble wheel and the right and left
All in accordance with equivalent amount, equally be set to it is multiple, it is preferred to use as shown in Figure 13.
The present embodiment transmission row rumble bigger using row rumble wheel density, and/or increase the driving force in pcb board face and row rumble,
So that transmission row rumble is more balanced to the driving force of pcb board, plate face transmit process is not in tilt phenomenon；Transmission is gone simultaneously
The both sides of rumble and/or the idler wheel density of centre increase, and allow plate angle not have space to be stuck in during row rumble, to guarantee the system of plate face
Make yield.
Embodiment 6
The present embodiment corresponds to embodiment 2, and to solve technical problem same as Example 2, the present embodiment provides one kind
The manufacturing system of high-precision fine rule road PCB electroplating thin plate, including PCB transmission device, the PCB transmission device specifically include transmission row
Rumble, the transmission row rumble are equipped with bearing, and the bearing both sides production has master scale.
Preferably, determination has symmetrical transmission gear installation site, the mark respectively on the bearing both sides of the transmission row rumble
Quasi- scale is produced on the two sides of the transmission gear installation site, and the transmission gear installation site is for being packed into the driving cog
Wheel.
Specifically using the transmission gear for being driven row rumble as reference, carved in the bearing both sides production standard of the transmission row rumble
Degree.The so-called bearing both sides in the transmission row rumble make master scale, and be also possible to two kinds of situations: the first is bearing both sides
Transmission gear is not installed, first symmetrically determines transmission gear installation site respectively on the bearing both sides of the transmission row rumble, so
Master scale is made according in the two sides of the transmission gear installation site afterwards；Second is that transmission gear first installs, this
When using transmission gear as reference, make master scale, that is to say that making the standard in the two sides of each transmission gear carves
Degree, the transmission gear are symmetrically mounted at the bearing both sides of the transmission row rumble.
The initial position of scale zone as shown in Figure 2, normal place namely scale is also examined when maintaining as later period point
Check position.
The present embodiment, which uses, all makes the transmission row rumble for having master scale on transmission row rumble axis both sides, then by transmission gear
Be expert at rumble axis both sides position record, convenient for later period point examine maintain when check position, prevent transmission gear from misplacing, while not TongAn
The row rumble of holding position limits the position of transmission gear by master scale, facilitates equipment assembling and Device-General, reduces maintenance and protects
Support difficulty.
Embodiment 7
The present embodiment corresponds to embodiment 3, and to solve technical problem same as Example 3, the present embodiment provides one kind
The manufacturing system of high-precision fine rule road PCB electroplating thin plate, including PCB electroplanting device, the PCB electroplanting device specifically includes to be put vertically
Set the row rumble in scaffold.Row rumble in the scaffold is provided with parallel two rows, and the gap that two rows of row rumbles are formed is used for
It is put into thin PCB to be electroplated, as shown in Figure 3, wherein the row rumble wheel between a line rumble and another row rumble in each seniority among brothers and sisters rumble
It can be staggered, according to lamella thickness, can increasing the density of row rumble wheel as embodiment, (thin plate is thinner, the density of row rumble wheel
It is arranged higher), to guarantee the uniformity of plating.
Row rumble in scaffold is placed as parallel two rows by the present embodiment vertically, and the gap that two seniority among brothers and sisters rumbles are formed becomes smaller, copper
Ball does not fall out and is caught in wherein；It prevents jet flow unevenness pcb board face from rubbing with scaffold, causes to wipe and spend；Prevent thin plate from passing
Pass through journey due to the joining place jet flow among copper cylinder scaffold it is uneven caused by snap-gauge；Plate face is driven in cylinder simultaneously does not need to go
Rumble transmission, thus row rumble is only simply fixed, and does not need complicated transmission device, it can also be appropriate according to the thickness of plate face
Increase row rumble density, or row rumble wheel is staggered, electroplating evenness will not be influenced.
Embodiment 8
The present embodiment is the summation of embodiment 5,6,7, that is to say in specific embodiment, accomplishes that corresponding link all uses
Device described in embodiment 5,6,7 can be realized the maximization of production PCB electroplating thin plate yield, meet actual processing demand.
The above embodiment is a preferred embodiment of the present invention, but embodiments of the present invention are not by above-described embodiment
Limitation, other any changes, modifications, substitutions, combinations, simplifications made without departing from the spirit and principles of the present invention,
It should be equivalent substitute mode, be included within the scope of the present invention.
Claims (10)
1. a kind of production method of high-precision fine rule road PCB electroplating thin plate, including PCB transfer step and/or PCB plating step,
It is characterized in that,
The PCB transfer step specifically includes:
S1. increase the density of the row rumble wheel of transmission row rumble；
S2. and/or, increase the conveying capacity being applied on the transmission row rumble；
S3. and/or, using the transmission gear for being driven row rumble as reference, master scale is made on the bearing both sides of the transmission row rumble；
The PCB plating step specifically includes:
S4. the row rumble in scaffold is placed vertically.
2. a kind of production method of high-precision fine rule road PCB electroplating thin plate as described in claim 1, which is characterized in that the step
Rapid S1 specifically:
S11. increase the density of the center row rumble wheel of transmission row rumble；
S12. and/or, increase the density of the both sides row rumble wheel of transmission row rumble.
3. a kind of production method of high-precision fine rule road PCB electroplating thin plate as described in claim 1, which is characterized in that described
In step S3, the bearing both sides in the transmission row rumble make master scale, specifically include:
S31. transmission gear installation site is symmetrically determined respectively on the bearing both sides of the transmission row rumble；
S32. the master scale is made in the two sides of the transmission gear installation site.
4. a kind of production method of high-precision fine rule road PCB electroplating thin plate as described in claim 1, which is characterized in that described
In step S3, the bearing both sides in the transmission row rumble make master scale, specifically:
The master scale is made in the two sides of each transmission gear, the transmission gear is symmetrically mounted at the transmission
The bearing both sides of row rumble.
5. a kind of production method of high-precision fine rule road PCB electroplating thin plate as claimed in claim 4, which is characterized in that the step
Rapid S4 specifically:
Row rumble in scaffold is placed as parallel two rows vertically, the gap that two rows of row rumbles are formed is for being put into thin PCB
It is electroplated.
6. a kind of manufacturing system of high-precision fine rule road PCB electroplating thin plate, including PCB transmission device and/or PCB electroplanting device,
It is characterized in that:
The PCB transmission device specifically includes transmission row rumble and/or transmission row rumble；The transmission row rumble is equipped with multiple row rumble wheels；
The transmission row rumble is equipped with bearing, and the bearing both sides production has master scale；
The PCB electroplanting device specifically includes the row rumble being placed in scaffold vertically.
7. a kind of manufacturing system of high-precision fine rule road PCB electroplating thin plate as claimed in claim 6, it is characterised in that: the biography
Multiple row rumble wheels that rumble of seeing off is equipped with include multiple center row rumble wheels, and/or symmetrical multiple both sides row rumble wheels.
8. a kind of manufacturing system of high-precision fine rule road PCB electroplating thin plate as claimed in claim 6, it is characterised in that: the biography
Determination has symmetrical transmission gear installation site respectively on the bearing both sides of dynamic row rumble, and the master scale is produced on the driving cog
The two sides of installation site are taken turns, the transmission gear installation site is for being packed into the transmission gear.
9. a kind of manufacturing system of high-precision fine rule road PCB electroplating thin plate as claimed in claim 6, it is characterised in that: the biography
The bearing both sides of dynamic row rumble are symmetrically equipped with transmission gear, and the master scale is produced on the two of each transmission gear
Side.
10. a kind of manufacturing system of high-precision fine rule road PCB electroplating thin plate as described in claim 1, it is characterised in that: described floating
Row rumble in frame is provided with parallel two rows, and the gap that two rows of row rumbles are formed is electroplated for being put into thin PCB.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811568605.5A CN109688717B (en) | 2018-12-21 | 2018-12-21 | Manufacturing method and system of high-precision fine-line PCB (printed Circuit Board) electroplating thin plate |
| PCT/CN2018/124092 WO2020124649A1 (en) | 2018-12-21 | 2018-12-26 | Method and system for manufacturing electroplated high-precision thin circuit pcb |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811568605.5A CN109688717B (en) | 2018-12-21 | 2018-12-21 | Manufacturing method and system of high-precision fine-line PCB (printed Circuit Board) electroplating thin plate |
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| Publication Number | Publication Date |
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| CN109688717A true CN109688717A (en) | 2019-04-26 |
| CN109688717B CN109688717B (en) | 2021-02-05 |
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| CN201811568605.5A Active CN109688717B (en) | 2018-12-21 | 2018-12-21 | Manufacturing method and system of high-precision fine-line PCB (printed Circuit Board) electroplating thin plate |
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| WO (1) | WO2020124649A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111246687A (en) * | 2020-03-10 | 2020-06-05 | 广东科翔电子科技股份有限公司 | Method for manufacturing high-precision multi-order intelligent unmanned aerial vehicle printed circuit board |
| CN114291488A (en) * | 2022-01-04 | 2022-04-08 | 曾倩 | Horizontal large-area etching machine bearing conveying structure |
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| CN201686327U (en) * | 2010-06-02 | 2010-12-29 | 东莞宇宙电路板设备有限公司 | PCB conveying device |
| CN201992033U (en) * | 2011-03-11 | 2011-09-28 | 深圳市崇达电路技术股份有限公司 | Running roller with identification structure |
| CN102905469A (en) * | 2011-07-25 | 2013-01-30 | 北大方正集团有限公司 | Leveling device and method for producing printed circuit board (PCB) |
| CN202684537U (en) * | 2012-04-26 | 2013-01-23 | 成都槟果科技有限公司 | Automatic positioning frame |
| CN103619124A (en) * | 2013-11-25 | 2014-03-05 | 广东依顿电子科技股份有限公司 | Method for producing circuit board thin plates |
| CN204145896U (en) * | 2014-09-30 | 2015-02-04 | 广州杰赛科技股份有限公司 | A kind of operation servicing unit of thin plate |
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| CN111246687A (en) * | 2020-03-10 | 2020-06-05 | 广东科翔电子科技股份有限公司 | Method for manufacturing high-precision multi-order intelligent unmanned aerial vehicle printed circuit board |
| WO2021179519A1 (en) * | 2020-03-10 | 2021-09-16 | 广东科翔电子科技股份有限公司 | Preparation method for high-precision multi-stage printed circuit board of intelligent unmanned aerial vehicle |
| CN114291488A (en) * | 2022-01-04 | 2022-04-08 | 曾倩 | Horizontal large-area etching machine bearing conveying structure |
Also Published As
| Publication number | Publication date |
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| CN109688717B (en) | 2021-02-05 |
| WO2020124649A1 (en) | 2020-06-25 |
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