JP3392518B2 - Plating rack - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating rack for holding an object to be plated in a rectangular flat plate such as a copper clad laminate or a printed wiring board and immersing it in a plating tank. The present invention relates to a plating rack suitable for automating mounting and dismounting.

[0002]

2. Description of the Related Art Conventionally, as a plating rack for holding an object to be plated as described above, for example, Japanese Examined Patent Publication No. 4-14199.
The one disclosed in Japanese Patent Publication No. 1-19416 and the one disclosed in Japanese Utility Model Publication No. 1-19416 are known.

In the rack of Japanese Examined Patent Publication No. 14199/1992, a pair of side rods are provided on a horizontal rod (carrier bar) for power supply, and a clip is attached to the side opposite to the side rods. The printed circuit board is held by sandwiching the end portion of the circuit board. Also, this clip is pushed open so that the printed circuit board can be attached and detached.

Further, in the rack of Japanese Utility Model Publication No. 1-19416, a pair of vertical frame members having grooves are arranged with the grooves facing each other, and a plate-shaped spring is arranged in the grooves so that the object to be plated is formed. The substrate is inserted into the groove and held by the elastic force of the spring.

[0005]

[Problems to be Solved by the Invention] However, Japanese Patent Publication No. 4-1
Since the rack of No. 4199 has a structure in which the end of the board is simply sandwiched between clips, when automating the mounting of the board, accurate alignment between the board and the clip is required.
It is difficult to mount multiple printed circuit boards on one rack. Therefore, it is suitable for a plating tank with a small treatment amount, but is not suitable for a plating tank with a large treatment amount.

Further, since the contact portion between the clip and the substrate is small, there is a problem that the variation in the potential distribution on the substrate surface becomes large when the electrolytic plating process is performed, and the plating film thickness becomes uneven. Further, since the clip is small and its position cannot be changed, it is not possible to cope with the case where the size of the substrate in the vertical direction is changed.

In the case of through-hole plating or the like, the rack is swung in the plating tank in order to remove the air in the through-hole. However, if a few ends of the board are held by clips, especially on a thin board, the rack is swung. There is a problem that the clip is easily detached due to the deformation due to, and easily slipped off.

In the rack of Japanese Utility Model Publication No. 1-19416, it is only necessary to insert the boards along the grooves of the vertical frame member. Therefore, a thick board is suitable for mounting a plurality of boards by automation. Since the substrate must be inserted against the elastic force of, the thin substrate may be deformed, which is not suitable.

Further, since one surface of the substrate contacts the inner surface of the groove, the opposite surface contacts only the tip of the spring, so that the surface area of the power feeding portion is largely different between the front and back surfaces of the substrate, and the current between the front and back surfaces of the substrate is greatly changed. There is a problem that the plating film thickness changes greatly between the front and back.

When the board is removed from the rack, the vertical frame member must be spread laterally or the board must be pulled out from the bottom against the pressing force and frictional force of the spring. If it is done in, it will be hard work and there is a problem in terms of automation.

According to the present invention, substrates of a plurality of sizes can be attached, the substrates are securely fixed to prevent the substrates from dropping in the plating tank, the electrolytic plating film thickness is made uniform, and the pre-plating step is performed. An object of the present invention is to provide a plating rack suitable for automating the work of mounting the board and the work of removing the plated board.

[0012]

The plating rack of the present invention, which has been made to solve the above problems, has a pair of conductive vertical frames arranged in parallel in the same plane, and a pair of conductive vertical frames. Along the receiving surface in the same plane parallel to the above plane of the vertical frame ,
A plate-like conductive biting member disposed separately from the receiving surface, and a protruding portion from the receiving surface to the outside of the receiving surface of the vertical frame.
The stepped part, the bite member and the vertical frame are bite from the outside.
Holding the biting member, the contact portion between the step and the biting member
It is held so that it can swing with the minute as a fulcrum.
The inner edge of the bite member approaches the inner edge of the vertical frame.
And an elastic member that urges in the direction, and is provided at the end of the vertical frame outside the extended surface of the gap between the pair of vertical frames and the bite member and holds the space between the pair of vertical frames in an adjustable manner. A horizontal frame, wherein the receiving surface of the vertical frame and the biting member hold an object to be plated by biting an end of the object to be plated in the shape of a rectangular plate. To do.

[0013]

In the plating rack of the present invention, the object to be plated is disposed along the receiving surfaces of the pair of vertical frames and the vertical frames, and the inner edge of the plate is brought closer to the inner edge of the vertical frame by the elastic member .
It is bitten and held by the biting member biased in the direction . Since the space between the pair of vertical frames is adjustable by a horizontal frame provided at the end of the vertical frame, the space between the vertical frames can be adjusted according to the size of the object to be plated.

Further, since the biting member is arranged along the vertical frame, both ends of the object to be plated can be evenly bited, and the object to be plated can be reliably held.

Further, since the conductive biting member is disposed along the conductive vertical frame, the potential distribution on the surface of the object to be plated can be made more uniform, and the front and back surfaces of the object to be plated can be made more uniform. It is possible to obtain a feeding portion area that is substantially equal to the above.

Further, the bite member is composed of a step and the bite member.
It is held so that it can swing around the contact point as a fulcrum.
At the same time, the inner edge of the biting member approaches the inner edge of the vertical frame.
Since it is urged in the direction to push the outer edge of the bite member against this urging force, the gap between the bite member and the vertical frame can be easily opened, and the horizontal frame Is provided outside the extended surface of the gap between the pair of vertical frames and the bite member, so that the object to be plated can be easily attached and detached by simply sliding the object to be plated.

[0017]

1A is a front view of a plating rack according to an embodiment of the present invention, and FIG. 1B is a side view of the plating rack.
(C) is a bottom view of the plating rack, and FIG.
It is an AA expanded sectional view of (A).

The plating rack of this embodiment is for immersing a printed wiring board (hereinafter referred to as "substrate" in this embodiment) having holes for through holes in a plating tank. A plurality of boards are attached to a rack, and a plurality of racks (for example, 3
One piece) is attached to the carrier bar and the whole carrier bar is immersed in the plating tank. In this embodiment, the "plating rack" will be simply referred to as "rack".

In the figure, 1 is a vertical frame which constitutes the frame in the longitudinal direction of the rack, 2 is a biting member arranged along the vertical frame 1, and 3 is an elasticity for pressing the biting member 2 against the vertical frame 1. Members 4 are horizontal frames attached to the lower end and the upper part of the vertical frame 1. The vertical frame 1, the bite member 2, the elastic member 3, and the horizontal frame 4 are made of a material having good conductivity.

At the upper end of the vertical frame 1, the front end is bent downward to form an engaging portion 1a, and an engaging projection 1b is formed on the rear surface of the engaging portion 1a. Also, the bite member 2
Are arranged along the vertical frame 1 in groups of three on each side,
A surface of the vertical frame 1 on the side of the bite member 2 is used as a receiving surface, and a conductive square bar 5 forming a step outside the receiving surface is provided between the vertical frame 1 and the biting member 2 along the vertical frame 1. It is fixed.

The elastic member 3 is formed by processing a plate material having strong elasticity, such as a steel plate or a stainless plate, and is bent so that its cross-sectional shape becomes an isosceles triangle before being assembled to the rack.

This elastic member 3 is, as shown in FIG.
The biting members 2 and the vertical frame 1 are attached so as to bite from the outside at appropriate points in the longitudinal direction of the vertical frame 1 .
As a result, the bite member 2 has one side of the square bar 5
The contact point with the holding member 2) is used as the fulcrum O, and the elastic member 3
It is held so that it can swing against the elastic force.
Then, the elastic member 3 attaches the bite member 2 to the inner edge 2A thereof.
Urges the vertical frame 1 toward the inner edge of the vertical frame 1 . As shown in FIG. 2, in the elastic member 3, a plate material of a portion corresponding to a side end portion of the rack is curved inward.

The upper and lower horizontal frames 4 have the same structure, and the frame members 4A and 4B fixed to the vertical frames 1 on both sides are combined. Frame material 4A on one side
Is slidably engaged with the other frame member 4B, and the tip of the frame member 4B has a long hole 4A formed in the frame member 4A.
The bolt 4Ba passed through a is screwed to the nut 4Bb attached to the tip of the frame member 4B, so that the frame member 4A
It is fixed to.

The upper and lower horizontal frames 4 are attached to the surface of the vertical frame 1 opposite to the receiving surface on which the bite member 2 is arranged. It is provided outside the extension surface of the gap with the bite member 2.

With the above construction, first, as shown in FIG. 2, the rack is held horizontally with the vertical frame 1 facing downwards.
By loosening the bolts 4Ba of the horizontal frame 4, the frame members 4A and 4B can be slid, the distance between the pair of vertical frames 1 is adjusted to the width of the substrate 10, and the bolts 4Ba are tightened to tighten the pair of vertical frames 1.
Fix the interval of.

Next, for each biting member 2 on both the left and right sides,
As shown in FIG. 3 (A), the outer upper end 2B of the bite member 2 is pressed, and as shown in FIG. 3 (B), the bite member 2 is set to the vertical frame 1 against the elastic force of the elastic member 3. The bite members 2 and the vertical frame 1 are made parallel to each other, and a gap ε corresponding to the thickness of the square bar 5 is provided between the bite members 2 and the vertical frame 1.

In this state, the lower end (engaging portion 1
The substrate 10 is horizontally supplied from the side of the horizontal frame 4 (on the side opposite to a), and both ends of the substrate 10 are slid on the vertical frame 1 and inserted into the gap ε. At this time, the number of substrates 10 (two in the example of FIG. 1) according to the size is inserted in series or sequentially. Then, as shown in FIG. 3 (C), the force pressing the outer upper end 2B of each bite member 2 is released, and the vertical frame 1 and bite member 2 both ends of the substrate 10 by the restoring force of the elastic member 3. Bite. This completes the mounting of the substrate 10.

The rack to which the substrate 10 is attached is attached to a carrier bar, conveyed to a plating tank, and subjected to a predetermined plating treatment. When the plated substrate is removed, the rack is held horizontally with the vertical frame 1 facing downward, and the outer upper ends of the left and right bite members 2 are pressed to remove the bite member, as in the case of attachment. A gap [epsilon] corresponding to the thickness of the square bar 5 is provided between the vertical frame 1 and the vertical frame 1, and the plated substrate is extracted from the gap [epsilon] between the vertical frame 1 and the bite member 2.

FIG. 9 is a view showing a state where the rack of the embodiment is attached to the carrier bar. In this example, three racks A are attached to the carrier bar 20. The carrier bar is used not only for holding the rack and the like, but also for energizing the rack and the like when performing electrolytic plating, and is also called a moving cathode bar.

FIG. 7 is a front view of a board mounting apparatus for automatically mounting boards on the rack A of the embodiment, FIG. 8 is a partially fragmented plan view of the board mounting apparatus, and FIG. B-
FIG. 5 is a view on arrow B, and FIG. 5 is a view on arrow CC of FIG. This board mounting device includes a board supply section 11, a board alignment section 12, and a board mounting section 13, and the rack has a board mounting section 13
The substrate is supplied to the substrate supply unit 11 → the substrate alignment unit 12 →
It is conveyed in the order of the board mounting portion 13.

The substrate supply section 11 is provided with a large number of rollers 11b on the upper surface of the pedestal 11a, and these rollers 11b are the motors 1
It is rotated by 1c. Then, the substrates supplied from the substrate accommodation unit at the preceding stage are conveyed in the direction of the arrow in FIG. 7 by the rotation of the roller 11b, and the necessary number of substrates to be mounted on one rack are sequentially supplied to the substrate alignment unit 12.

The substrate aligning section 12 is provided with a large number of rollers 12b on the upper surface of the pedestal 12a.
It is rotated by 2c. Above the roller 12b, there is provided a suction pad 12d whose longitudinal direction is the substrate transport direction and whose lower surface is a suction surface. The suction pad 12d is moved up and down by the air cylinder 12e and by the horizontal slide mechanism 12f. It is reciprocated between the board aligning section 12 and the board mounting section 13.

Further, as shown in FIG. 8, a fixed guide 12g protruding from the roller surface through the gap between the rollers 12b is arranged on one side of the transport surface on the pedestal 12a, and the fixed guide 12g is also provided. A moving guide 12h protruding from the roller surface is arranged on the opposite side. Further, a stopper 12i that moves up and down with respect to the roller surface is provided on the board mounting portion 13 side, and a plurality of stages of movement stoppers 12 parallel to the stopper 12i are provided on the transport surface on the pedestal 12a.
j is provided.

The movement stopper 12j moves up and down with respect to the roller surface and can reciprocate in the substrate conveying direction when it is below the roller surface, and the position of the movement stopper 12j in the substrate conveying direction. Is set according to the length of the substrate.

In the substrate aligning unit 12, the substrate supplying unit 11
The substrate supplied from is sent by the rotation of the roller 12b, and when the first substrate comes into contact with the stopper 12i and stops,
The movement stopper 12j, whose position is set according to the length of the substrate, moves the roller 12b near the rear end of the first substrate.
Is lifted from the gap. Then, when the next substrate is sent, it abuts against this movement stopper 12j and stops, and similarly, the movement stopper 12j in the subsequent stage is raised near the rear end portion of this substrate, and the next substrate hits this movement stopper 12j. Stop in contact.

In this way, the substrates are sequentially stopped and the alignment in the front-rear direction is completed. The distance between the stopper 12i and the front-stage movement stopper 12j and the distance between the front-stage and rear-stage movement stoppers 12j are set to be slightly wider than the length of the substrate.

When the required number of substrates to be mounted on one rack is taken in from the substrate supply unit 11, the movement guide 1
2h is moved to the fixed guide 12g side, and the substrate is sandwiched between the fixed guide 12g and the moving guide 12h to complete the horizontal alignment. In this way, the movement stopper 12j
Thus, the stop positions of the second and subsequent substrates are regulated, so that the alignment becomes easy even when the substrates are thin.

When the alignment is completed, the suction pad 12d is lowered by the air cylinder 12e, and the suction pad 1
The lower surface of 2d attracts the substrates on the roller 12b in an aligned state. Then, after lowering the stopper 12i and the moving stopper 12j, the suction pad 12d is moved by the horizontal slide mechanism 12f to hold each substrate in an aligned state and transfer it to the substrate mounting portion 13 in the direction of the arrow in FIG. .

The board mounting portion 13 is provided with an elevating conveyor 13b arranged on the frame 13a along the rack transport direction. Also, the platform 13a has an elevator conveyor 13b.
Two sliders 13c are provided in parallel with the fixed rack opening / closing device 131 on the slider 13c. The fixed rack opening / closing device 131 is based on the long stands 131a and 132a suspended in a direction orthogonal to the slider 13c. A rack opening / closing device 132 is provided respectively.

The fixed rack opening / closing device 131 and the moving rack opening / closing device 132 are reciprocally moved in the rack conveying direction by the slide mechanism 13d arranged under the frame 13a. It should be noted that the fixed rack opening / closing device 131 has a slight movement range set outward from a predetermined reference position corresponding to the fixed guide 12g of the board aligning unit 12, and the moving rack opening / closing device 132 moves according to the interval of the vertical frame of the rack. The range is set.

The fixed rack opening / closing device 131 and the moving rack opening / closing device 132 face each other and have a substantially symmetrical structure, and the vertical plate 13 is provided along the long stands 131a and 132a, respectively.
1b and 132b are erected, and the vertical plates 131b and 132
Air cylinders 131c and 132c are vertically arranged side by side in b.

At the upper ends of the vertical plates 131b and 132b, receiving plates 131d and 132d are arranged along the vertical frame 1 of the rack, and at the rods of the air cylinders 131c and 132c, the receiving plates 131d and 132d are provided. Opposing presser plate 1
Long plates 131f and 132f, on which 31e and 132e are arranged, are attached. Further, the vertical plates 131b and 132b
Auxiliary rollers 131g and 132g for supporting the substrate when the substrate is mounted on the rack are attached to the opposing surface side.

A horizontal frame holding mechanism 133 for holding the horizontal frame of the rack downward is provided on the side of the base 13a on the side of the board aligning portion 12 and on the opposite side thereof, and the horizontal frame holding mechanism 133 moves up and down. The rotating claw 1 is attached to the tip of the moving cylinder 133a.
33b, the rotating claw 133b is engaged with the horizontal frame and slightly descended so that the substrate transferred from the substrate aligning unit 12 can surely pass into the rack.

With the above structure, the board mounting portion 13 operates as follows. First, the elevating conveyor 13b has a long plate 131 at the upper end of the fixed rack opening / closing device 131 and the moving rack opening / closing device 132, as shown by the chain double-dashed line in FIG.
The rack is carried in in a position above f and 132f, and is stopped in this state at the position where the front is near the fixed rack opening / closing device 131.

Next, the elevating conveyor 13b is lowered to the position indicated by the solid line in FIG. At this time, the upper surface of the elevating conveyor 13b is fixed rack opening / closing device 131 and moving rack opening / closing device 13
It is set so as to be located slightly below the upper surfaces of the second receiving plates 131d and 132d, and in this state, the fixed rack opening / closing device 131 is slightly moved inward.

At this time, the lower surface of the vertical frame of the rack is received by the taper surface formed at the tip of the receiving plate 131d of the fixed rack opening / closing device 131, and the fixed rack opening / closing device 131.
The vertical frame of the rack and the biting member are accommodated between the receiving plate 131d and the pressing plate 131e of the fixed rack opening / closing device 131.
Is stopped at a predetermined position regulated by the position.

Further, as the fixed rack opening / closing device 131 operates, the moving rack opening / closing device 132 moves inward, and similarly to the above, the vertical frame on the opposite side of the rack and the support plate 13 for the bite member.
It is housed between 2d and the holding plate 132e.

When the vertical frames and the bite members on both sides of the rack are housed in the fixed rack opening / closing device 131 and the moving rack opening / closing device 132, the horizontal frame is held by the horizontal frame holding mechanism 133, and the horizontal frame holding mechanism 133 is pressed, as shown in FIG.
As shown in FIG. 3, the fixed rack opening / closing device 131 and the moving rack opening / closing device 132 are provided with the air cylinders 131c, 13c.
2c is driven to make a space between the biting member 2 and the vertical frame 1 so that each biting member 2 is parallel to the vertical frame 1 as described with reference to FIG.

In this state, when the both ends of the substrate supplied from the substrate aligning unit 12 are inserted between the bite member 2 and the vertical frame 1, the air cylinders 131c and 132c are released and the substrate shown in FIG. As shown in C), the board 10 is fixed to the rack to complete the board mounting.

When the substrate is mounted on the rack, the fixed rack opening / closing device 131 and the moving rack opening / closing device 132 move to the outside, and the rack is placed on the elevating conveyor 13b to elevate the elevating conveyor 13b and elevating the conveyor 13b. To drive the rack to the next step. Then, in the next step, the racks on which the substrates are mounted are aligned, the rack is mounted on the carrier bar, the carrier bar is transported to the plating tank, and the like.

The substrate on which plating has been completed is automatically removed by a substrate removing device having a structure similar to that of the above-mentioned substrate attaching device. That is, the same operation as the board attaching section 13 is performed in the board removing section having the same structure as the board attaching section 13 to open a gap between the biting member of the plated rack and the vertical frame.

In this state, the board unloading section having the same structure as the suction pad 12d and the horizontal slide mechanism 12f of the board arranging section 12 performs an operation reverse to that of the board arranging section 12, and the rack is plated at the board unloading section. The plated substrate that has been fitted is adsorbed and carried out. Then, the carried-out plated substrate is carried on a carrying surface provided with rollers such as the substrate aligning unit 12 and the substrate supplying unit 11, and is carried to, for example, a drying unit.

By the way, plating pretreatment, electroless plating,
In a panel plating process in which electrolytic plating is continuously performed on the same rack, the rack and carrier bar with the plated substrate removed are plated on the rack and carrier bar. And peeling treatment is performed. Further, since a predetermined time is required for the plating process and the stripping process, space can be saved by using the same transport route for transporting the rack and the carrier bar and the transport route for the plating process in this stripping tank.

Therefore, a board mounting device and a board removing device are installed side by side, and the rack from which the plated board has been removed is supplied from the board removing portion to the board mounting portion 13 so that the same rack and carrier bar as the plating processing are carried. It should be transported to the plating tank (peeling tank) by a route.

With this structure, the board removing portion of the board removing device is the board attaching portion 1 of the board attaching device.
3 can be shared as a rack supply unit.
Therefore, by providing a width adjusting mechanism for setting the width of the vertical frame of the rack at the board removing portion, it is possible to correspond to the width of the board to be mounted by the board mounting device.

Since the board removing section can have the same structure as the board mounting section 13, for the sake of simplicity, the board removing section will be described with reference to FIGS. 4 to 5. As shown by the alternate long and short dash line, the bolt tightening / releasing mechanism 21 is arranged at a position adjacent to the horizontal frame holding mechanism 233 corresponding to the ends of the fixed rack opening / closing device 231 and the moving rack opening / closing device 232.

As shown in FIG. 4, this bolt tightening / loosening mechanism 21 has a wrench 21 at the tip of a motor 21a that rotates in the forward and reverse directions.
b, it is set at a fixed position from the reference position of the fixed rack opening / closing device 231, that is, at an interval from the vertical frame 1 of the frame member 4B of the rack shown in FIG. 1 to the bolt 4Ba.

With the above structure, when the rack is supplied and the vertical frame and the biting member are housed in the fixed rack opening / closing device 231 and the moving rack opening / closing device 232, the horizontal frame is held down by the horizontal frame holding mechanism 233, The bolt 4Ba of the material 4B is engaged with the wrench 21b of the bolt tightening / loosening mechanism 21.

Then, the motor 21a is driven in a predetermined direction to loosen the bolt 4Ba, the movable rack opening / closing device 232 is moved to the outside or the inside to adjust the interval of the vertical frame 1 to a desired width, and the bolt 4Ba at the predetermined position. Tighten and fix.

In this way, the width of the vertical frame 1 of the rack is set to a desired width, and the rack frame 1 is supplied to the board mounting portion 1.

As described above, since the both ends of the substrate are fixed by the vertical frame 1 and the bite members 2 arranged along the vertical frame 1, the substrate can be securely fixed. Moreover, since the bite member 2 continuously contacts the same end as the vertical frame 1 at the end of the substrate, the potential distribution becomes uniform on the front and back of the substrate, and the plating film thickness on the front and back is more than that of the conventional one. Will also be uniform.

Further, by simply pressing the bite member 2, a gap can be easily formed between the bite member 2 and the vertical frame 1,
Since the board can be easily attached and detached, the work of attaching and detaching the board can be easily automated.

In the above embodiment, the bite member 2 is provided by disposing the square bar 5 between the vertical frame 1 and the bite member 2.
It is designed to form a step forming a fulcrum of
It goes without saying that the step portion can be formed by using a member having a shape in which the square rod 5 and the square rod 5 are integrally formed.

Further, in the above embodiment, since the fulcrum of the bite member 2 is provided by the stepped portion of the square bar 5, the rigidity of the square bar 5 not only makes the rack itself robust but also the bite member. Stability is good when 2 is opened so as to be parallel to the vertical frame 1.

It is to be noted that without forming such a stepped shape,
For example, a ridge may be formed along the vertical frame at approximately the center of the receiving surface of the vertical frame that faces the biting member, and the contact portion between the tip of the ridge and the biting member may serve as a fulcrum. .

[0066]

As described above, according to the plating rack of the present invention, a pair of conductive vertical frames arranged in parallel in the same plane, and the above-mentioned planes of the pair of vertical frames are parallel to each other. A plate-shaped electrically conductive biting member disposed separately from the receiving surface along the receiving surface in the same plane, and in front of the vertical frame.
A step portion projecting outward from the receiving surface and the bite
The member and the vertical frame are bite from the outside, and the biting member is
Can swing with the contact part between the step part and the bite member as a fulcrum
Holds such that, the inner edge of該咬support member
An elastic member that urges in a direction of approaching the inner edge of the vertical frame, and a pair of vertical members provided at the end of the vertical frame outside the extension surface of the gap between the pair of vertical frames and the bite member. A horizontal frame that adjustably holds the interval between the frames, and the end surface of the rectangular flat plate-shaped object is bitten by the receiving surface of the vertical frame and the bite member to form the object to be plated. Since it is retained, the following effects can be obtained.

Since the interval between the vertical frames can be adjusted by the horizontal frame, it is possible to mount substrates of a plurality of sizes.

Further, since the biting member is arranged along the vertical frame, both ends of the object to be plated can be evenly bited, and the object to be plated can be securely fixed to ensure that the object to be plated is in the plating tank. It is possible to prevent the object to be plated from falling off.

Further, since the conductive biting member is arranged along the conductive vertical frame, the potential distribution on the surface of the object to be plated can be made more uniform and the front and back surfaces of the object to be plated can be made more uniform. It is possible to obtain a power feeding portion area that is substantially equal to the above, and to make the electrolytic plating film thickness uniform.

Further, by pressing the outer end portion of the bite member, the gap between the bite member and the vertical frame can be easily opened, and the horizontal frame is composed of the pair of vertical frame and the bite member. Since it is provided outside the extended surface of the gap, you can easily attach and remove the object to be plated simply by sliding the object to be plated. Installation work of the object to be plated and removal of the plated object to be plated The work can be easily automated.

[Brief description of drawings]

FIG. 1 is a front view, a side view, and a bottom view of a plating rack according to an embodiment of the present invention.

FIG. 2 is an enlarged cross-sectional view taken along the line AA of FIG.

FIG. 3 is a diagram illustrating an opening / closing operation of a plating rack according to the embodiment.

FIG. 4 is a side view of a board mounting portion and a board detaching portion in the embodiment.

FIG. 5 is a rear view of the board mounting portion and the board detaching portion in the embodiment.

FIG. 6 is an operation explanatory view of the main parts of the fixed rack opening / closing device and the moving rack opening / closing device in the embodiment.

FIG. 7 is a front view of the board mounting device in the embodiment.

FIG. 8 is a partially crushed plan view of the board mounting device in the embodiment.

FIG. 9 is a diagram showing a state in which the plating rack of the embodiment is attached to a carrier bar.

[Explanation of symbols]

1 ... Vertical frame, 2 ... Bite member, 3 ... Elastic member, 4 ... Horizontal frame, 5
… Square bar.

Front page continuation (72) Inventor, Araki, No. 31-31 Kurobeoka, Hiratsuka-shi, Kanagawa Japan Tobacco Inc., Production Technology Development Center (72) Inventor, Takanosuke Hinata 1-31, Kurobe-oka, Hiratsuka, Kanagawa No. Japan Tobacco Inc. Production Technology Development Center (56) Reference JP-A-4-325696 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) C25D 17/08 C25D 7/00 H05K 3/18

Claims (2)

(57) [Claims] 1. A along the receiving surface that are located in the same pair of conductive vertical frame disposed parallel to in the plane, the plane parallel to the same plane of the pair of vertical frames, receiving surface Plate-shaped, spaced apart from each other
And a conductive biting member, and a step portion projecting from the receiving surface to the outside of the receiving surface of the vertical frame
And biting the biting member and the vertical frame from the outside, and the biting part
With the contact point between the step and the bite member as the fulcrum
An elastic member that holds the bite member so that it can swing, and biases the inner edge of the bite member toward the inner edge of the vertical frame; and a gap between the pair of vertical frames and the bite member. A horizontal frame that is provided outside the extension surface of the vertical frame and that holds the pair of vertical frames in an adjustable manner, and a rectangle is formed between the receiving surface of the vertical frame and the bite member. A plating rack, characterized in that an end of a plate-shaped object to be plated is bitten to hold the object to be plated. 2. The step portion comprises the vertical frame and the bite member.
Characterized by being composed of square bars arranged between
The rack for plating according to claim 1 .