JP5805055B2 - Horizontal conveyance type electroplating equipment - Google Patents

Description

  The present invention is a horizontal transport type electroplating apparatus that performs electrolytic plating while horizontally transporting a plate-like object to be plated such as a printed circuit board, resulting from adhesion of bubbles of oxygen gas bubbles generated from an anode during the electrolytic plating process. The present invention relates to a technique that eliminates variations in the plating film to be formed and enables the formation of a uniform plating film.

  In Patent Document 1, an upper anode and a lower anode are disposed in an electrolytic bath in an electrolytic chamber, and a plate-like object to be plated is continuously passed between the upper anode and the lower anode in the electrolytic bath in a horizontal state. Thus, an electrolytic treatment apparatus for electrodepositing a metal on the surface of a plate-like object to be plated has been disclosed.

  In such an electrolytic treatment apparatus, particularly when an insoluble anode is used as the anode, a large amount of oxygen gas is generated from the anode, and this oxygen gas becomes a large amount of oxygen gas bubbles in the electrolytic bath and is mixed in the electrolytic bath. Diffused. Bubbles mixed and diffused in the electrolytic bath stay on and adhere to the surface of the plate-shaped object to be electroplated while being conveyed horizontally between the upper and lower anodes. In particular, a large amount of oxygen gas bubbles tend to stay on the lower surface of the plate-like object to be horizontally conveyed due to the rising phenomenon of oxygen gas bubbles. A large amount of oxygen gas bubbles staying and adhering to the surface of the plate-shaped object to be horizontally conveyed interferes with the contact between the surface of the object to be plated and the electrolytic bath, and the surface of the object to be plated is uniformly plated. This is a great hindrance to the formation of the film.

  The present inventor has developed and proposed a plating apparatus for the purpose of eliminating the adverse effects caused by such bubble adhesion (Patent Document 2). In the apparatus of Patent Document 2, oxygen gas bubbles adhering to the plate surface of a plate-like object to be horizontally conveyed are directly blown off in the direction of the side of the conveyance passage by an oblique jet of an oblique jet discharge pipe, and then blown off. Oxygen gas bubbles that have risen in the electrolytic bath due to the rising phenomenon flow out of the tank from the overflow port on the side of the electrolytic plating tank.

  However, in the bubble removing means of Patent Document 2, the oxygen gas bubbles diffuse near the plate surface of the object to be plated, and the adverse effects caused by the bubble adhesion cannot be completely eliminated. Further, bubbles (oxygen gas bubbles) cannot be efficiently discharged out of the liquid as oxygen gas.

JP-A-63-76898 Utility Model Registration No. 317336

  In view of such circumstances, the present invention provides a plate-like object to be plated, such as a printed circuit board, which is transported in a horizontal position between the upper and lower anodes in the electrolytic bath in the horizontal direction. In a horizontal electrolytic plating apparatus that performs electrolytic plating, oxygen gas bubbles generated from the anode during the electrolytic plating process can be efficiently collected at a predetermined position, and the collected oxygen gas bubbles can be efficiently discharged from the liquid to the outside as oxygen gas. In this way, the problem that oxygen gas bubbles generated from the anode during the electrolytic plating process are diffused and mixed in the liquid is eliminated, and thus the problem is that the bubbles adhere to the surface of the object to be plated. An object of the present invention is to eliminate the unevenness of the plated film and to form a uniform plated film on the surface of the plate-shaped object to be plated.

In order to solve the above-described problems, the present invention (invention of claim 1) is configured such that a pair of conveyance driving means that are driven endlessly is disposed with a conveyance path for a plate-shaped object to be spaced apart. A plurality of clamps are respectively attached to the transport drive means, and the plurality of clamps hold both side edges of the plate-like object having parallel side edges, and the electrolytic plating solution for the electrolytic plating tank Is disposed in the electrolytic plating solution in the electrolytic plating bath, and is transported horizontally by the transport device. A plurality of plate-like upper anodes disposed in parallel with the transport passage surface at a vertical position of a horizontal transport passage surface of the object to be plated and arranged side by side with a certain interval in the transport passage direction With a lower anode and a lower anode respectively. In the horizontal conveyance type electroplating apparatus for forming a plating film on the surface of the object to be plated by horizontally passing the object to be plated supplied with a cathode current (cathode current) from the clamp between the anodes, A lower diaphragm is provided between the horizontal transport passage surface of the object to be plated and the lower anode to vertically separate the horizontal transport passage surface of the object to be plated from the facing surface (upper surface) of the lower anode. An upper diaphragm is disposed between the horizontal transport passage surface of the object to be plated and the upper anode to vertically separate the horizontal transport passage surface of the object to be plated from the opposing surface (lower surface) of the upper anode. The diaphragm is formed of a film made of a material that allows metal ions from the anode to pass but does not allow oxygen gas bubbles generated from the anode to pass through. The liquid flow generating means is disposed in the vicinity of one side of the lower anode. ,this A bubble collecting / discharging device is disposed in the vicinity of the side portion on the opposite side of the partial anode, and the liquid flow generating means is configured such that bubbles (oxygen gas bubbles) generated from the lower anode are separated above the lower anode and the lower anode. A liquid flow that gently moves toward the outside in the side direction opposite to the position where the liquid flow generating means is disposed is generated (discharged) through a separation zone between the lower diaphragm and the disposed lower diaphragm. The bubble collecting and discharging device is a liquid discharge means, and the bubble collecting and discharging device collects a bubble collecting portion having a bubble (oxygen gas bubble) receiving port opened toward the separation zone between the lower anode and the lower diaphragm, and the bubble collecting portion. A gas discharge portion having a vertical discharge passage for discharging the generated bubbles from the bubble collection portion as oxygen gas above (in the air) above the surface of the electrolytic plating solution, a side portion of the lower diaphragm, and a bubble collection portion Horizontal transportation characterized by having a shielding part that shields the gap at the top A feed type electroplating apparatus is provided.

According to this invention, bubbles (oxygen gas bubbles) generated from each lower anode can be blocked by the lower diaphragm from diffusing and moving in the direction of the horizontal transport passage surface of the object to be plated, and are generated from each upper anode. The upper diaphragm can prevent bubbles (oxygen gas bubbles) from diffusing and moving in the direction of the horizontal conveyance passage of the object to be plated, and bubbles (oxygen gas bubbles) near the object to be plated while being horizontally conveyed Can be prevented, and the problem of bubbles (oxygen gas bubbles) adhering to the object to be plated can be eliminated. In addition, by providing the diaphragm (upper diaphragm, lower diaphragm), it is possible to reduce the consumption of plating additives (such as brightener) that occurs when an insoluble anode is used as the anode (upper anode, lower anode).

Furthermore, according to the present invention, bubbles (oxygen gas bubbles) generated from the lower anode are gradually flown from the separation zone between the lower anode and the lower diaphragm toward the outside in one side direction by the liquid flow of the liquid flow generating means. The moved bubbles are collected in the bubble collecting part from the bubble (oxygen gas bubble) receiving port of the bubble collecting and discharging device, and the bubbles (oxygen gas bubbles) collected in the bubble collecting part are oxygen gas from the gas discharging part. Is discharged above the liquid level (in the air). This eliminates the adverse effect that bubbles (oxygen gas bubbles) generated from the lower anode stay on the lower surface side of the lower diaphragm.

  In order to solve the above-described problem, the present invention (invention of claim 2) is configured so that bubbles (oxygen gas bubbles) generated from the upper anode on the upper surface side of the upper anode are above the surface of the electrolytic plating solution ( A bubble collection exhaust hood that discharges as oxygen gas is attached to each upper anode in the air, and this foam collection discharge hood has an upper surface of the upper anode to define a bubble collection chamber on the upper surface side of the upper anode. A covering portion, and a discharge portion that protrudes from the center portion of the covering portion and has a gas discharge opening above the liquid surface of the electrolytic plating solution, and the covering surface of the covering portion is Provided is a horizontal conveyance type electroplating apparatus characterized by having an inclined surface that is inclined upward toward the discharge portion.

  According to the present invention, bubbles (oxygen gas bubbles) generated from each upper anode are discharged through the center of the electrolytic plating solution along the inclined surface of the bubble collecting chamber of the bubble collecting discharge hood attached to each upper anode. Rises toward the center and is collected in the central discharge. Bubbles (oxygen gas bubbles) collected in the discharge section are discharged from the discharge port as oxygen gas above the liquid level (in the air).

In order to solve the above problems, the present invention (the invention of claim 3) divides the unit of the lower anode and the lower diaphragm into two ranges before and after the conveying direction, and corresponds to the divided two ranges. Liquid flow generating means provided in the vicinity of one side of the lower anode opposite to each other, and the side of the lower anode opposite to the position of the liquid flow generating means. A bubble collecting and discharging device is provided in the vicinity, and the liquid flow generating means is a separation zone between an oxygen gas bubble generated from the lower anode and a lower diaphragm in which the lower anode is spaced above the lower anode. A liquid flow discharge means for generating a liquid flow that is gently moved toward the outside in the side direction opposite to the position where the liquid flow generation means is disposed. Oxygen gas towards the spacing zone between the lower diaphragm and the lower diaphragm A bubble collecting part having an opening in the receiving port, and a gas discharge part having a vertical discharge passage for discharging bubbles collected in the bubble collecting part as oxygen gas from the foam collecting part above the liquid surface of the electrolytic plating solution; A horizontal transport type electroplating apparatus is provided, comprising a shielding part that shields between the side part of the lower diaphragm and the bubble collecting part at the upper part thereof.

  Further, in the present invention, the liquid flow generating means is provided with a liquid flow discharge pipe extending in the transport direction in the vicinity of the side of the lower anode, and the liquid flow discharge pipe is spaced in the transport direction. A plurality of discharge nozzles are formed, and the plating solution is discharged from the discharge nozzles toward the separation zone between the lower anode and the lower diaphragm, and the discharge liquid flow causes the inside of the separation zone to be discharged. Is a liquid flow discharge means that generates (discharges) a gentle liquid flow that flows from one side toward the opposite side.

  According to the present invention, a plate-like object to be plated such as a printed circuit board is conveyed horizontally in a horizontal posture between the upper and lower anodes in the electrolytic bath. In electroplating equipment, oxygen gas bubbles generated from the anode during the electroplating process can be efficiently collected at a predetermined position, and the collected oxygen gas bubbles can be efficiently discharged from the liquid to the outside as oxygen gas. The adverse effect of oxygen gas bubbles generated from the anode during the treatment being diffused and mixed in the liquid can be prevented. Therefore, it is possible to eliminate variations in the plating film due to the adverse effect of bubbles adhering to the surface of the object to be plated during the electrolytic plating process, and to form a uniform plating film on the surface of the plate-like object to be plated.

1 is an overall schematic plan view showing an embodiment of the present invention. It is a partially vertical side view showing an embodiment of the present invention. It is an enlarged plan view which shows an embodiment of the present invention partially. It is the enlarged front view which carried out the longitudinal cross-section partially showing the embodiment of the present invention.

Embodiments of the present invention will be described with reference to the drawings. In the horizontal conveyance type electroplating apparatus shown in FIGS. 1 to 4, a pair of conveyance driving means 4 and 4 which are driven endlessly are formed with plate-like objects to be plated P (for example, a printed wiring board or the like, forming holes or recesses). A plurality of clamps 5 are respectively attached to the transport driving means 4, and both side edges parallel to each other with the plurality of clamps 5. The both sides of the plate-like object P having a surface are held, and the electrolytic plating solution W in the electroplating bath 1 is continuously in the horizontal position in a horizontal posture in which the plate surface of the object P is vertically moved. The transfer device 3 for transfer and the electrolytic plating solution W in the electrolytic plating treatment tank 1 are disposed in the upper and lower positions of the horizontal transfer passage surface PL of the object P to be horizontally transferred by the transfer device 3. It is arranged in parallel with the transport passage surface PL and is one in the transport passage direction. A plurality of plate-like (including a perforated plate shape such as lath plate) upper and lower anodes 20 and 21 arranged in a row are provided respectively, and the space between the upper and lower anodes 20 and 21 is described above. The plating object P to which the cathode current (cathode current) is fed from the clamp 5 is horizontally passed to form a plating film on the surface of the object to be plated P.

  FIG. 1 shows that a plate-like object P is supplied from the left side to an electrolytic plating tank 1 by a loading means 6 such as a loading drive roller in a horizontal state with the plate surface up and down. FIG. 2 shows a schematic plan view of the apparatus that is continuously conveyed in the direction of arrow A, passes through, and is discharged to the right from the processing tank 1 by an unloading means 7 such as an unloading drive roller after electrolytic plating. A horizontally long inlet (not shown) for loading the object P to be plated in the horizontal state into the electrolytic plating tank 1, and a horizontally long outlet for unloading the object P in the horizontal state from the electrolytic plating tank 1 ( (Not shown), two upper and lower seal rollers 8 are horizontally disposed inside the processing tank 1 corresponding to the carry-in port and the carry-out port, so that the electrolytic plating solution W does not leak from the carry-in port or the carry-out port. So that it is sealed. In FIG. 2, reference numeral 9 is an overflow port formed on the side wall of the plating tank 1, and adjusts the level of the electrolytic plating solution W.

  The conveying device 3 includes conveying driving means 4 and 4 each having a driving chain 10 (or a driving belt) that is driven endlessly on both sides of the conveying path 2 of the plate-shaped object P. A large number of clamps 5 (in FIG. 1, the clamps 5 are shown only in a partial range of the drive chain 10) are arranged at regular intervals on the transport drive means 4 (drive chain 10). Are attached at equal intervals over the range), and a plurality of clamps 5 that move parallel linear drive path portions with the conveying path 2 in between, and a plate-like object having both side edges parallel to each other. The both side edges of the plated product P are gripped from above and below, and the electrolytic plating solution W in the electrolytic plating bath 1 is unidirectionally (in the direction of arrow A) in a horizontal state with the plate surface of the plated product P up and down. ) Constructed to transport continuously horizontally It has been. The transport drive means 4 (drive chain 10) is hung on the sprockets 11 and 11, and is driven to rotate endlessly by rotating one of the sprockets 11 by a transport drive motor (not shown). Yes. The conveyance drive means 4 (drive chain 10) provided on both sides with the conveyance path 2 in between are configured to be driven around at a constant speed. The conveying speed of the plate-like object P to be conveyed by the conveying devices 3 and 3 is 0.5 m to 2 m per minute, and is variable depending on the plating process conditions of the object P to be plated.

  As shown in the schematic configuration of FIG. 2, the clamp 5 is fed with a cathode current in the air, and the lower part is in a position where it can move in the electrolytic plating solution W in the electrolytic plating bath 1. A clamp contact portion 12 (upper clamp contact portion and lower clamp contact portion) that has a long structure in the vertical direction and that grips and releases the side edge of the plate-like object P in the vertical direction at the lower end portion It has. The liquid contact portion in the liquid of the clamp 5 made of a current-carrying material excluding the clamp contact portion 12 is subjected to insulation coating. The clamp 5 shown in FIG. 2 is attached to the transport driving means 4 (drive chain 10) and is fixed to a fixed guide rail 14 (this fixed side clamp rod 14) which is engaged with a fixed guide rail (power supply rail) 13 described later. The lower clamp contact portion is formed at the lower end of the movable side clamp rod 15), and the movable side clamp rod 15 is provided on the fixed side clamp rod 14 so as to be movable up and down. The upper clamp contact portion is moved downward by the spring pressure of the compression spring 16, and the clamp contact portion 12 (upper clamp contact portion and lower clamp contact portion) is normally controlled to be closed in the vertical direction. A clamp opening / closing guide (not shown) having a height difference is disposed in the clamp movement path at the start position and the end position of the conveyance path 2, and when the clamp 5 passes the clamp opening / closing guide position, the upper portion of the clamp A clamp opening / closing guide engaging member (not shown) provided on the upper side of the clamp opening / closing guide is engaged with a higher guide surface portion of the clamp opening / closing guide, and the upper clamp contact portion of the movable side clamp rod 15 is against the spring pressure of the compression spring 16. It is configured to move upward so as to be separated from the lower clamp contact portion of the fixed-side clamp rod 14 and to control the clamp contact portion 12 to be opened in the vertical direction. As a result, the clamp 5 passing through the starting end of the conveyance path 2 for the plate-shaped object P is controlled from an open state to a closed state in which the side edge of the object P can be clamped, and the object P is conveyed. The clamp 5 passing through the end portion of the passage 2 can be controlled from a closed state to an open state in which the side edge of the object to be plated can be opened.

  A fixed guide rail (feeding rail) 13 made of a conductive metal material having a rectangular cross section shown in FIG. 2 is arranged at a position below the linear drive path inside the transport drive means 4 (drive chain 10). Are arranged in parallel. The fixed guide rail (power supply rail) 13 extends over the range of the conveyance path 2. The clamp 5 that moves on the inner linear drive path is slidably contacted with the fixed guide rail (power supply rail) 13 and moved while being guided. In the illustrated embodiment, the fixed guide rail 13 functions as a power supply rail, and the cathode current is supplied from the fixed guide rail (power supply rail) 13 to the object P to be plated through the conductive clamp 5.

  In this embodiment, a plate-like anode (including a perforated plate such as a lath plate) (upper anode 20, lower anode 21) is used as an insoluble anode (iridium or iridium) connected to a power supply (not shown). Titanium etc.) are used. The plate-like upper anode 20 and lower anode 21 are each composed of a plurality of units, and the plurality of plate-like upper anode 20 and lower anode 21 are plate-like that are horizontally transported in the solution of the electrolytic plating solution W. Arranged parallel to the plate surface of the object to be plated P at the upper and lower positions of the horizontal conveying passage surface PL of the object to be plated P, and arranged side by side with a certain interval in the conveying direction of the object to be plated P. ing. A plate-shaped object P to which a cathode current (cathode current) is fed through the clamp 5 is horizontally provided between the upper and lower anodes 20 and 21 for depositing metal ions in the electrolytic plating solution W of the electrolytic plating bath 1. In the process of being passed through, the surface is subjected to electroplating.

  As shown in FIGS. 1, 3, and 4, a jet discharge pipe 22 that discharges a plating solution from above and below is disposed in the liquid toward the transport passage surface PL of the plate-like object P to be plated. The jet discharge pipe 22 extends a pipe line in a direction orthogonal to the transport direction, forms a plurality of discharge nozzles (not shown) at intervals in the pipe path, and the transport passage surface extends from the plurality of discharge nozzles. The plating solution is discharged toward the entire width of PL. The jet discharge pipes 22 are arranged between the upper anodes 20 arranged in a plurality at a predetermined interval in the transport direction and between the lower anodes 21 arranged in a plurality at a predetermined interval in the transport direction. It is arranged. The plating solution is discharged from the discharge nozzle formed in the middle part of the pipe of the jet discharge pipe 22 directly below or directly above, and the outer side from the discharge nozzle formed on both sides of the pipe of the jet discharge pipe 22 The plating solution is discharged obliquely in the direction.

  As described in the background art, in such an electrolytic processing apparatus, when an insoluble anode is used as the anode, a large amount of oxygen gas is generated from the anode, and this oxygen gas is generated in a large amount of oxygen gas bubbles in the electrolytic bath. And mixed and diffused in the electrolytic bath W. Bubbles mixed and diffused in the electrolytic bath stay on and adhere to the surface of the plate-shaped object to be electroplated while being conveyed horizontally between the upper and lower anodes. In particular, a large amount of oxygen gas bubbles tend to stay on the lower surface of the plate-like object to be horizontally conveyed due to the rising phenomenon of oxygen gas bubbles. A large amount of oxygen gas bubbles staying and adhering to the surface of the plate-shaped object to be horizontally conveyed interferes with the contact between the surface of the object to be plated and the electrolytic bath, and the surface of the object to be plated is uniformly plated. This is a great hindrance to the formation of the film.

  In order to solve this problem, the present invention employs the following novel means.

  In the present invention, the horizontal transfer passage surface PL of the object to be plated P is vertically moved from the opposite surface (upper surface) of the lower anode 21 between the horizontal transfer passage surface PL of the object P to be plated and the lower anode 21. A lower diaphragm 26 to be isolated is disposed, and the object to be plated P is horizontally conveyed from the opposing surface (lower surface) of the upper anode 20 between the object to be plated P's horizontal conveying passage surface PL and the upper anode 20. An upper diaphragm 25 that isolates the passage surface PL in the vertical direction is provided.

  Each of the diaphragms 25 and 26 is formed of a microporous thin film made of a material that allows metal ions from the anode to pass therethrough but does not allow bubbles (oxygen gas bubbles) and slime generated from the anode to pass through. In this embodiment, as each of the diaphragms 25 and 26, a microporous thin film of synthetic fiber (polypropylene or the like) is used. When a microporous thin film is used as the diaphragm, the periphery of the film is fixed with a fixing frame member 27, and a reinforcing rib for correcting the deformation of the diaphragm surface is attached if necessary.

  According to this invention, bubbles (oxygen gas bubbles) generated from the respective lower anodes 21 can be blocked by the lower diaphragm 26 from diffusing and moving in the direction of the horizontal transport passage surface PL of the object P to be plated, and The upper substrate 25 can block the bubbles (oxygen gas bubbles) generated from the anode 20 from diffusing and moving in the direction of the horizontal conveyance passage surface PL of the object P, and the object P to be plated while being horizontally conveyed. It is possible to prevent the adverse effect of bubbles (oxygen gas bubbles) staying near the substrate, and to eliminate the adverse effect of bubbles (oxygen gas bubbles) adhering to the substrate P. In addition, by providing the diaphragm (upper diaphragm 25, lower diaphragm 26), consumption of plating additives (such as brighteners) generated when an insoluble anode is used as the anode (upper anode 20, lower anode 21) is reduced. it can.

  In the present invention, the bubble (oxygen gas bubble) generated from the upper anode 20 on the upper surface side of the upper anode 20 is discharged as oxygen gas above the liquid surface of the electroplating solution W (in the air) as a plastic bubble. A collective discharge hood 30 is attached to each upper anode 20. The foam collecting and discharging hood 30 is formed so as to cover the upper surface of the upper anode 20 to define a foam collecting chamber 32 on the upper surface side of the upper anode 20, and to protrude from the center of the covering portion 31. An inclined surface provided with a discharge portion 33 having a gas discharge port 34 opened above the liquid surface of the electrolytic plating solution W, and the cover surface of the cover portion 31 is inclined upward toward the discharge portion 33. It is characterized by being 35. In FIG. 1, one foam assembly discharge hood 30 is omitted for easy understanding.

  According to the present invention, bubbles (oxygen gas bubbles) generated from each upper anode 20 are contained in the electrolytic plating solution W along the inclined surface 35 of the bubble collecting chamber 32 of the bubble collecting discharge hood 30 attached to each upper anode. Are raised toward the central discharge portion 33 and collected in the central discharge portion 33. Bubbles (oxygen gas bubbles) collected in the discharge part 33 are discharged from the discharge port 34 as oxygen gas above the liquid level (in the air).

  Further, according to the present invention, the liquid flow generating means 40 is disposed in the vicinity of one side portion of the lower anode 21, and the bubble collecting / discharging device 50 is disposed in the vicinity of the opposite side portion of the lower anode 21. It is characterized by that.

  The liquid flow generating means 40 passes through a separation zone 41 between the lower anode 21 and the lower diaphragm 26 spaced above the lower anode 21 in which bubbles (oxygen gas bubbles) generated from the lower anode 21 pass. The liquid flow discharge means generates (discharges) a liquid flow that is gently moved toward the outside in the side direction opposite to the position where the liquid flow generation means 40 is disposed. In FIG. 2, a liquid flow gently flowing from the left side to the right side is generated by the liquid flow generating means 40 disposed on the left side, and bubbles (oxygen gas bubbles) generated from the lower anode 21 pass through the separation zone 41 in the right direction. This shows the phenomenon of slow movement.

  In the embodiment shown in FIGS. 2 to 4, the liquid flow generating means 40 is provided with a plastic liquid flow discharge pipe 42 extending in the transport direction in the vicinity of the side of the lower anode 21, A plurality of discharge nozzles (not shown) are formed in the liquid flow discharge pipe 42 at intervals in the transport direction, and the discharge nozzles are connected to the separation zone between the lower anode 21 and the lower diaphragm 26. It is assumed that the plating solution is discharged toward 41, and this discharging solution flow generates (discharges) a gradual liquid flow that flows in the spacing zone 41 from one side to the opposite side. As a liquid flow discharge means.

  The foam collecting / discharging device 50 includes a foam collecting part 51 having a foam receiving port 52 opened toward the separation zone 41 between the lower anode 21 and the lower diaphragm 26, and bubbles collected in the foam collecting part 51. A gas discharge part 54 having a vertical discharge passage 53 for discharging oxygen gas as an oxygen gas above the surface of the electrolytic plating solution W from the bubble collecting part 51, the side of the lower diaphragm 26, and the bubble collecting part It is characterized by having a shielding part 55 that shields between 51 at the upper part. The discharge passage 53 is provided with a filter 56 that closes the upper portion of the discharge passage 53, and this filter 56 allows oxygen gas to pass through, but functions to prevent upward spraying of the electrolytic plating solution W. As shown in FIG. 4, the bubble collecting portion 51 is formed long and wide in the transport passage direction, and the discharge passage 53 is formed so as to gradually narrow from the bubble collecting portion 51.

  According to the present invention, bubbles (oxygen gas bubbles) generated from the lower anode 21 are flown from the separation zone 41 between the lower anode 21 and the lower diaphragm 26 to the outside in one side direction by the liquid flow of the liquid flow generating means 40. The bubbles that have been moved gently toward the bubble collecting port 51 are collected in the bubble collecting unit 51 from the bubble receiving port 52 of the bubble collecting and discharging device 50, and the bubbles (oxygen gas bubbles) collected in the bubble collecting unit 51 pass through the discharge passage 53. Then, the gas is discharged from the gas discharge portion 54 as oxygen gas above the liquid level (in the air). This eliminates the adverse effect that bubbles (oxygen gas bubbles) generated from the lower anode stay on the lower surface side of the lower diaphragm.

  When a microporous thin film is used as the diaphragm, the periphery of the film is fixed with a fixing frame member 27, and reinforcing ribs for correcting the deformation of the diaphragm surface are attached as necessary. In particular, in the lower diaphragm 26, bubbles are likely to stay in the fixed frame member 27 and the ribs. However, since the bubbles (oxygen gas bubbles) generated from the lower anode in the liquid flow of the liquid flow generating means 40 of the present invention are moved outward, the bubbles (oxygen gas bubbles) generated from the lower anode are transferred to the lower diaphragm. The adverse effect of staying on the lower surface side can be eliminated.

  In the embodiment of FIG. 3, the unit of the lower anode 21 and the lower diaphragm 26 are divided into two substantially equal ranges before and after in the transport direction, and the liquid flow generating means 40 provided corresponding to the two divided ranges. , 40 (discharge nozzles) are disposed in the vicinity of one side of the lower anode 21 opposite to each other, and the position of the lower anode 21 on the side opposite to the position where the liquid flow generating means 40, 40 are disposed. In the vicinity of the side portions, foam collecting and discharging devices 50 and 50 are provided, respectively. Thereby, in the range of the lower anode 21 and the lower diaphragm 26 of one unit, the liquid flows of the liquid flow generating means 40, 40 are made to be liquid flows (indicated by arrows in FIG. 3) in opposite directions. Also, the foam collecting / discharging device 50 for receiving the bubbles moved by the liquid flow of the liquid flow generating means 40, 40 is disposed on the opposite side. Of course, in the range of the plurality of lower anodes 21 and the lower diaphragm 26 arranged in the transport passage direction, the liquid flow is alternately directed in the opposite direction on the left and right.

  In this way, when the liquid flow direction of the liquid flow generating means 40 is alternated between left and right within the range of the lower anode 21 and the lower diaphragm 26 as one unit, bubbles (oxygen gas bubbles) generated from the lower anode 21 are lower. The harmful effect of staying on the lower surface side of the diaphragm 26 can be eliminated more effectively.

  In FIG. 2, only the liquid flow that gently flows in the direction of the arrow from the left side to the right side by the liquid flow generation means 40 disposed on the left side is shown in order to avoid the confusion of the liquid flow. Only the phenomenon in which the gas bubbles are gently moved from the left to the right is shown. Of course, in FIG. 2, the liquid flow generating means 40 disposed on the right side forms a liquid flow that gently flows from the right side to the left side, and bubbles (oxygen gas bubbles) in the separation zone 41 are gently moved from the right side to the left side.

DESCRIPTION OF SYMBOLS 1 Electroplating processing tank W Electrolytic plating liquid P To-be-plated object PL Conveyance passage surface 2 Conveyance path 3 Conveyance device 4,4 Conveyance drive means 5 Clamp 10 Drive chain 12 Clamp contact part 13 Fixed guide rail (power supply rail)
DESCRIPTION OF SYMBOLS 20 Upper anode 21 Lower anode 22 Jet discharge pipe 25 Upper diaphragm 26 Lower diaphragm 30 Foam collection discharge hood 31 Cover part 32 Foam collection chamber 33 Discharge part 34 Gas discharge port 35 Inclined surface 40 Liquid flow generation means 41 Separation zone 42 Liquid flow Discharge pipe 50 Foam assembly discharge device 51 Foam assembly portion 52 Foam receiving port 53 Discharge passage 54 Gas exhaust portion 55 Shielding portion 56 Filter

Claims (4)

A pair of conveyance drive means that are driven around the endlessly are disposed with a conveyance path for the plate-like object to be plated in between, and a plurality of clamps are respectively attached to the conveyance drive means. Grab both side edges of a plate-shaped object having both side edges parallel to each other in the horizontal position with the plate surface of the object to be plated up and down in the electrolytic plating solution in the electrolytic plating bath A transfer device that is continuously transferred to the electrolytic plating solution in the electrolytic plating bath, and the transfer passage surface is positioned above and below a horizontal transfer passage surface of an object to be plated that is horizontally transferred by the transfer device. And a plurality of plate-like upper and lower anodes arranged parallel to each other and arranged at a certain interval in the transport passage direction, respectively, and between the upper anode and the lower anode from the clamp Plated with cathode current In a horizontal conveyance type electroplating apparatus for forming a plating film on the surface of the object to be plated by horizontally passing, the lower anode is disposed between the horizontal conveyance passage surface of the object to be plated and the lower anode. A lower diaphragm for vertically separating the horizontal transfer passage surface of the object to be plated from the facing surface is disposed, and the surface facing the upper anode is disposed between the horizontal transfer passage surface of the object to be plated and the upper anode. An upper diaphragm that vertically separates the horizontal transfer passage surface of the object to be plated is provided, and each diaphragm is formed of a film made of a material that allows metal ions from the anode to pass but does not allow oxygen gas bubbles generated from the anode to pass. The liquid flow generating means is disposed in the vicinity of one side portion of the lower anode, and the bubble collecting / discharging device is disposed in the vicinity of the side portion on the opposite side of the lower anode to generate the liquid flow. Means originate from the lower anode Oxygen gas bubbles that pass through the separation zone between the lower anode and the lower diaphragm spaced above the lower anode, and to the outside in the side direction opposite to the position where the liquid flow generating means is disposed. A liquid discharge means for generating a liquid flow that is gently moved toward the surface. And a gas discharge part having a vertical discharge passage for discharging bubbles collected in the bubble collection part as oxygen gas from the foam collection part above the surface of the electrolytic plating solution, and a side part of the lower diaphragm A horizontal conveyance type electroplating apparatus , comprising a shielding portion that shields between the foam assembly portion and the bubble collecting portion at an upper portion thereof .   A foam assembly exhaust hood for exhausting oxygen gas bubbles generated from the upper anode as oxygen gas above the liquid surface of the electroplating solution is attached to the upper surface side of the upper anode, respectively. A covering portion covering the upper surface of the upper anode to define a bubble collecting chamber on the side, and a protruding portion formed in the central portion of the covering portion, with a gas outlet opening above the liquid surface of the electrolytic plating solution The horizontal conveyance type electroplating apparatus according to claim 1, further comprising: a discharge portion, wherein a covering surface of the covering portion is inclined upward toward the discharge portion. A pair of conveyance drive means that are driven around the endlessly are disposed with a conveyance path for the plate-like object to be plated in between, and a plurality of clamps are respectively attached to the conveyance drive means. Grab both side edges of a plate-shaped object having both side edges parallel to each other in the horizontal position with the plate surface of the object to be plated up and down in the electrolytic plating solution in the electrolytic plating bath A transfer device that is continuously transferred to the electrolytic plating solution in the electrolytic plating bath, and the transfer passage surface is positioned above and below a horizontal transfer passage surface of an object to be plated that is horizontally transferred by the transfer device. And a plurality of plate-like upper and lower anodes arranged parallel to each other and arranged at a certain interval in the transport passage direction, respectively, and between the upper anode and the lower anode from the clamp Plated with cathode current In a horizontal conveyance type electroplating apparatus for forming a plating film on the surface of the object to be plated by horizontally passing, the lower anode is disposed between the horizontal conveyance passage surface of the object to be plated and the lower anode. A lower diaphragm for vertically separating the horizontal transfer passage surface of the object to be plated from the facing surface is disposed, and the surface facing the upper anode is disposed between the horizontal transfer passage surface of the object to be plated and the upper anode. An upper diaphragm that vertically separates the horizontal transfer passage surface of the object to be plated is provided, and each diaphragm is formed of a film made of a material that allows metal ions from the anode to pass but does not allow oxygen gas bubbles generated from the anode to pass. The lower anode and the lower diaphragm of one unit are divided into two ranges before and after the conveying direction, and the liquid flow generating means provided corresponding to the two divided ranges is provided on the opposite side of the lower anode. one side The foam assembly discharging device is disposed in the vicinity of the side portion of the lower anode on the opposite side to the position where the liquid flow generating means is disposed, respectively, in the vicinity of the side portions, Oxygen gas bubbles generated from the lower anode pass through the separation zone between the lower anode and the lower diaphragm spaced above the lower anode, and the side opposite to the position where the liquid flow generating means is disposed A liquid discharge means for generating a liquid flow that is gently moved toward the outside of the direction, and the bubble collecting and discharging device has an oxygen gas bubble receiving port toward the separation zone between the lower anode and the lower diaphragm. An open bubble collecting portion, a gas discharge portion having a vertical discharge passage for discharging bubbles collected in the bubble collecting portion as oxygen gas above the liquid surface of the electrolytic plating solution from the bubble collecting portion, and the lower portion Between the side of the diaphragm and the foam assembly at the top A horizontal conveyance type electroplating apparatus comprising a shielding portion for shielding. The liquid flow generating means is provided with a liquid flow discharge pipe extending in the transport direction in the vicinity of the side of the lower anode, and a plurality of discharge nozzles are provided in the liquid flow discharge pipe at intervals in the transport direction. The discharge nozzle is used to discharge the plating solution from the discharge nozzle toward the separation zone between the lower anode and the lower diaphragm, and the inside of the separation zone is caused from one side by the discharge liquid flow. The horizontal conveyance type electroplating apparatus according to any one of claims 1 to 3, wherein the apparatus is a liquid discharge means that generates a gentle liquid flow that flows in the direction of the opposite side portion. .

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