WO2017018096A1

WO2017018096A1 - Suction plating apparatus

Info

Publication number: WO2017018096A1
Application number: PCT/JP2016/068318
Authority: WO
Inventors: 美智雄川崎
Original assignee: 株式会社エリアデザイン
Priority date: 2015-07-29
Filing date: 2016-06-21
Publication date: 2017-02-02
Also published as: CN107002274B; CN107002274A; KR101917848B1; KR20170028870A; JP6448494B2; JP2017031438A

Abstract

[Problem] To provide a suction plating apparatus according to the present invention that includes improvements in clips for holding a workpiece and liquid circulation of a plating solution. [Solution] This suction plating apparatus 1 is provided with: a pre-processing stage A comprising at least a hot-water washing unit, a water washing unit and an acid degreasing unit; a plating stage B; and a post-processing stage C comprising at least a water washing unit and a drying unit. A plating unit 2, which operates in the plating stage B, comprises at least: a plating tank 20 containing a plating solution for plating a workpiece 40; a plurality of clips 10 for holding the upper end of the workpiece 40 and allowing current to flow through the workpiece 40; a conveyor 30 for moving the plurality of clips 10 along the plating tank 20; and a circulation unit D for circulating the plating solution 21 in the plating tank 20. The workpiece 40 is disposed parallel to the direction of movement of the clips 10 and the clips 10 hold the upper end of the workpiece 40. A tip part of each clip 10 holding the workpiece 40 is treated so that a predetermined region of a portion thereof not in contact with the workpiece 40 is insulated. The predetermined insulated regions of the clips 10 are immersed in the plating solution 21 in the plating tank 20 with the workpiece 40.

Description

Suction plating equipment

The present invention relates to a suction plating apparatus for plating product workpieces, in which the product workpiece is moved in the plating solution in a state of being vertically immersed in the plating solution by a clip conveyor, thereby achieving efficient plating. Relates to the device.

Patent Document 1 (Japanese Patent Application Laid-Open No. 2001-196728) discloses that in a multilayer printed wiring board, a uniform plating film can be formed on the inner wall surface even with a fine blind via hole corresponding to a fine wiring circuit. For manufacturing printed wiring boards for circuits with high yield, a number of single-wafer suction plating devices are arranged on the floor of a non-airtight room, and information on the opening and loading of printed wiring boards in this suction plating device row The printed wiring board is hooked to the support provided in the plate and plated, and the support is vibrated to cause a flow in the plating solution, defoaming treatment, and in the non-airtight chamber A suction plating apparatus is disclosed in which an exhaust pump is connected and plating is performed in a state where the non-hermetic chamber is set to a reduced pressure atmosphere.

Patent Document 2 (Japanese Patent Laid-Open No. 2002-47599) prevents a printed circuit board from being bent (warped) due to the flow of a liquid in a plating tank during a plating process in a printed circuit board plating jig. Disclosed is a plating jig that enhances the strength of a holding member and prevents the clip from being scattered by a reaction force when the clip is detached from the holding material and the locking portion is locked to the vertical wall portion. . In the cited document 2, in order to solve the problem, the support member on the downstream side in the plating solution flow direction of one of the support members constituting the pair of bifurcated support portions is arranged substantially at right angles to the holding member. It is disclosed that the printed circuit board is prevented from being bent by the influence of the plating solution circulating in the plating bath.

Patent Document 3 (Japanese Patent Application Laid-Open No. 2003-73895) discloses a jig that is versatile with respect to the size of a product to be plated, in a jig for moving the product to be plated while suspended on a rail in continuous electroplating. Disclosed. This jig makes the left and right vertical sides of the product to be plated sandwiched between the vertical beam and the pressing member, and presses and urges the object to be plated to the vertical beam with a spring provided on the pressing member. It is a structure that clamps these from the outside in the thickness direction with the clip tool having a U-shaped cross section as it is, so that the spring inevitably compresses according to the thickness of the product to be plated by fitting the clip tool As a result, it is disclosed that versatility can be secured even for products to be plated having different plate thicknesses.

Patent Document 4 (Japanese Patent Laid-Open No. 2014-224300) discloses that in the plating process, the plating solution in the processing tank is agitated in order to increase the plating processing efficiency or improve the finish. In this Patent Document 4, in order to more uniformly stir the processing liquid in the processing tank, an extraction means for extracting the processing liquid put in the processing tank, a processing liquid extracted from the extraction means, and a separately supplied gas A device for forming a coating film on the work surface by providing a microbubble generator that derives microbubbles using the above and agitating the treatment liquid with the microbubbles generated from the microbubble generator is disclosed.

JP 2001-196728 A JP 2002-47599 A JP 2003-73895 A JP 2014-224300 A

The plating technology in the semiconductor industry, which has evolved gradually, but demanded higher specifications, has never been 100% satisfied with user requirements, and always explores acceptable levels. It has become. This is not only the quality of the work, but also the quantity is required without degrading the quality. Among them, in electroplating, the thinness of workpieces that are produced every year is required, and the response is becoming increasingly difficult. One of the factors is the limit of current and voltage transmitted to the product workpiece, which leads to sparks, burns, variations in plating thickness, and plating defects.

Therefore, the present invention provides a suction plating apparatus in which the device mechanism is devised and the speed of productivity can be increased without damaging the workpiece by a linked system.

Further, the suction plating apparatus according to the present invention includes an improvement in the clip portion that holds the workpiece and an improvement related to the circulation of the plating solution.

Issues with the clip transport system include: avoiding sparks at the energized contact part of the work, transporting a soft work without damaging it with a stable low constant tension, and avoiding unnecessary power supply without causing stray currents. It is possible to freely adjust the plating thickness variation on both sides, and to adjust the thickness of the workpiece up and down and left and right.

In addition, liquid circulation issues include stable conveyance while correcting the warping of the workpiece, ensuring the current density and its stability without drastically increasing the amount of liquid exchange and reducing the metal concentration in the liquid. In order to ensure good liquid circulation, it is possible to concentrate and replace the liquid in the immediate vicinity of the workpiece, to be able to quickly update the liquid on the workpiece surface and to secure the current-carrying capacity, to supply a large volume of new liquid, and to update the liquid. In order to realize a desmear effect and a rapid plating effect, a rapid flow is generated on the workpiece surface.

As described above, the present invention provides a suction plating apparatus that can solve the above-described problems.

In the first aspect of the present invention, the product work is transported by vertically dipping in the plating solution, and this transport is performed by a clip conveyor. Since the clip at this time works as a current-carrying (grounding) material, it must be a conductive material. However, it must cope with the chemical resistance of the plating solution. Chrome plating> titanium> stainless steel or the like is used. The portion of the clip that is immersed in the liquid needs to be covered with an insulating material such as rubber, and only the contact portion with the workpiece needs to strongly hold the workpiece from both sides. In this case, the insulation of the clip protection needs to be 99% or more so that current does not flow directly to the clip without passing the workpiece from the anode side. This is because if it is 99% or more, it does not affect the finish, and it has been proved that a very small amount of penetration helps prevent contact failure. Further, in order to prevent contact spark between the workpiece and the clip, the tip including the clip is submerged in the liquid.

Also, the advantage of vertical transport is that the plating state on both sides can be made symmetric or can be changed to the desired balance. In addition, since the work is standing, there is no fear that dust will be placed, and since the clip is conveyed, there is an advantage that no extra tension is generated even if the processing length is long. Furthermore, stability can be obtained by increasing the allowable energization amount by changing the clip pitch.

In addition, it has been found that in the immersion type plating tanks so far, the stored chemical solution has not been stirred as much as expected, which has greatly influenced the results. Even when the chemical solution is fed with a large flow rate pump, stagnation occurs in the flow, and due to the influence of the fluid pressure, more fluid is generated on the upper side of the liquid level, and the amount of convection decreases as the level decreases from the liquid level. Generated and far from ideal agitation. For this reason, in the second aspect of the present invention, the liquid flow amount in the necessary range is intensively increased so that the liquid exchange of the work peripheral edge necessary for plating can be easily performed.

From the above, the present invention is a suction plating apparatus comprising a pretreatment process comprising at least a hot water washing section, a water washing section and an acidic degreasing section, a plating process, and a post-treatment process comprising at least a water washing section and a drying section. The plating section for performing the plating step includes a plating tank for storing a plating solution for plating the workpiece, a plurality of clips for holding the upper end of the workpiece and energizing the workpiece, and the plurality of clips. And a circulating part for circulating a plating solution in the plating tank, the workpiece is arranged in parallel with the moving direction of the clip, and the clip is a workpiece. The upper end of the clip and the portion of the tip that holds the workpiece of the clip that is not in contact with the workpiece are insulated in a predetermined range, The predetermined range is insulated lip together with the workpiece is to be buried in the plating solution of the plating tank.

The clip includes a pair of arms for sandwiching the workpiece, electrode portions disposed opposite to each other at the tips of the pair of arms, and opening / closing means for opening and closing the pair of arms. In addition, it is desirable that the periphery of the electrode portion is insulated so that the tip surface of each electrode portion is exposed, and a predetermined range of the tip portion of the arm is insulated. Further, it is preferable that the insulator around the electrode portion is arranged so as to slightly extend from the front end surface of the electrode portion when the arm is open.

This allows the tip of the clip to be buried in the plating solution together with the workpiece, so that contact spark between the workpiece and the clip can be prevented. In addition, since the tip portion of the clip is insulated within a predetermined range, it is possible to prevent plating from adhering to the clip.

The plating tank includes a plating solution suction port formed in the center of the bottom of the plating tank along the moving direction of the conveyor, and further, on both sides of the workpiece, an anode electrode plate facing the workpiece and a plating solution It is desirable that the discharge ports are alternately arranged in the moving direction of the workpiece.

Furthermore, it is desirable that the discharge port is disposed above the workpiece, and a plurality of the discharge ports may be disposed along the longitudinal direction of the workpiece.

Further, the circulation section includes at least a suction pump connected to the suction port, a plating solution storage tank (management tank) connected to the suction pump, and a discharge pump connected to the discharge port. It is desirable to have it. Moreover, it is desirable to provide a filter for filtering the plating solution between the discharge pump and the discharge port.

In this case, because the plating solution is sucked from directly under the workpiece, even if there are extra wrinkles or curled warping on the workpiece body, the plating solution with a very fast flow rate will flow downward on both sides of the workpiece. In order to move, an effect of stretching the work straight downward is also produced, and stable conveyance can be obtained.

Also, since the suction capacity from the suction port is subject to a drop from the plating tank, suction can be performed at an overwhelming speed even if the discharge pump has a large capacity. Since the plating solution flow perpendicular to the workpiece can be created by placing the balance in a balanced manner, the low-concentration plating solution that has passed the metal ions to the workpiece surface is immediately returned to the management layer and constantly adjusted. Since it is possible to continue to provide a new plating solution that has just been formed on the workpiece surface, a high current density can be realized.

In addition, the plating solution passes through the work surface in a thin screen at a high speed, which can create attractive force on the work surface, which removes foreign matter adhering to the work, and also has uneven patterns, through holes, and via holes. This produces a desmear effect on the inside of the material, and further improves the adhesion of the plating itself, thereby accelerating the smooth flow of current.

Furthermore, as a by-product, the return from overflow until now has been solved by the difficulty of the size of the transfer, or by spilling the spilled liquid before and after the workpiece, and furthermore, there is no wave of plating liquid in the plating tank. Various advantages and cost reductions can be achieved even during device design.

The current density of conventional electrolytic copper plating has been limited to 3 to 5 A / dm2 if stability is required, and 6 to 8 A / dm2 for high-speed plating. According to this, stable plating at 12 A / dm 2 is demonstrated, and high-speed plating up to 15 A / dm 2 is possible without causing any damage to the workpiece.

According to the present invention, the tip portion of the clip is insulated, and the workpiece including the tip portion of the clip is buried and moved in the plating solution, so that the contact spark generated between the workpiece and the clip is prevented. Therefore, efficient plating can be performed. In addition, a suction port is provided in the center of the bottom of the plating tank corresponding to the movement range of the workpiece so that the plating solution circulates along the surface of the workpiece, so that the workpiece is not damaged and productivity can be improved. It can be done.

It is explanatory drawing which showed an example of the whole structure of the suction plating apparatus which concerns on this invention. It is explanatory drawing which showed an example of the plating part. It is the top view which showed an example of the plating part. It is a section lineblock diagram showing an example of a plating tank. It is explanatory drawing which showed the closed state of a clip. It is explanatory drawing which showed the open state of the clip.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

The suction plating apparatus 1 according to the embodiment of the present invention is roughly divided into three stages, a pretreatment process A, a plating process B, and a posttreatment process C, as shown in FIG. The pretreatment step A includes, for example, a first hot water washing part A1 for washing a workpiece with hot water, an acid washing degreasing part A2 for degreasing the workpiece subjected to hot water washing, and a degreasing liquid used for degreasing from the workpiece surface. 2 water washing part A3, water washing part A4 for washing the workpiece surface with water, and acid activation part A5 which performs final acid treatment on the workpiece surface, removes an extremely thin oxide film, and brings out an activated vegetable ground. The workpiece surface is treated so that a good plating treatment can be performed on the workpiece surface.

The plating unit 2 executes a plating process B for performing copper sulfate plating, for example. Further, the post-processing step C includes a water washing part C1 for washing away the plating solution, a rust prevention part C2 for carrying out a rust-proofing process on the work surface, a water washing part C3 for carrying out water washing of the rust-proofed work surface, and air on the work surface. And an air part C4 for blowing off water and the like, and a drying part C5 for drying the work surface.

The plating unit 2 includes a conveyor 30 that moves the plurality of clips 10 holding the workpiece 40 along the plating tank 20 as shown in FIGS. 2 to 4. A plating solution 21 is accommodated in the plating tank 20. A suction port 22 provided in the center of the bottom of the plating tank 20 is formed with a predetermined length along the moving direction of the clip 10. In particular, the suction port 22 is located below the workpiece 40 held by the clip 10.

In addition, discharge pipes 23 and anode electrode plates 24 having plating solution discharge ports on both sides of the work 40 along the moving direction of the work 40 are alternately arranged in parallel along the moving direction. . The anode electrode plate 24 is connected to the anode electrode wire 24a by a connection screw 24b. The connection screw 24b is formed of a conductive material.

Further, the plating section 2 includes a suction pump 25 connected to the suction port 22, a plating solution storage tank (management tank) 26 connected to the suction pump 25, and a discharge pipe having the discharge port. 23 and the circulation part D comprised at least by the discharge pump 27 connected through the filter 28 is comprised. The discharge pipe 23 is formed with a plurality of discharge ports along the longitudinal direction. Further, in place of the discharge pipe 23, a discharge pipe 23 'positioned near the surface of the plating solution 21 of the plating tank 20 may be used.

With the above configuration, by driving the suction pump 25 and the discharge pump 27, the plating solution is ejected from the discharge port of the discharge pipe 23 toward the workpiece 40 and at the same time, the plating solution is sucked from the suction port 22. Therefore, as shown in FIG. 4, since the plating solution 21 descends rapidly along the surface of the workpiece 40, the workpiece 40 is stretched straight downward, so that bending and warping of the workpiece 40 can be prevented.

In addition, the low concentration plating solution that has passed the metal ions to the workpiece surface can be immediately returned to the management tank 26, and a new plating solution that has just been adjusted can be continuously provided on the surface of the workpiece 40. It can be realized.

Further, as shown in FIGS. 5 and 6, the clip 10 is provided with a pair of

arms

11, 11 and

electrode portions

12, 12 provided opposite to each other at one end of the pair of

arms

11, 11. It is done. The pair of

arms

11, 11 are rotatably supported by a rotation fulcrum 32 provided on a rod 31 extending from the conveyor 30 via

support portions

13, 13. Further, springs 14 and 14 for urging the

arms

11 and 11 in the closing direction are arranged between the

arms

11 and 11 and the rod 31, and a clip provided at the other tip of the

arms

11 and 11. Opening and

closing rollers

15 and 15 are provided. The clip 10 constitutes a cathode electrode via the conveyor 30. Further, as shown in FIG. 6, the clip opening and

closing rollers

15 and 15 are urged inward by the opening and

closing rails

16 and 16 so that the clip 10 is opened. As shown in FIG. When 15 and 15 deviate from the open /

close rails

16 and 16, the

springs

14 and 14 are closed to hold the workpiece.

In addition, the clip 10 according to the present invention is subjected to insulation treatment around the

respective electrode portions

12 and 12 and a predetermined range of the

arms

11 and 11 to form an insulating film. The insulating film includes an arm-side insulating film 50 that insulates a predetermined range of the

arms

11 and 11 and an electrode-side insulating film 51 formed around each of the

electrode portions

12 and 12. 51 is configured to extend a predetermined range from the

electrode portions

12 and 12 in a state where the clip 10 is opened.

The workpiece 40 is held by the clip 10, and the tip surfaces 12 a of the

electrode portions

12, 12 of the clip 10 come into contact with the workpiece 40, whereby the workpiece 40 is transferred from the anode electrode plate 24 to the workpiece 40 via the plating solution 21. Current flows, metal cations adhere to the surface of the workpiece 40, and plating is formed on the surface of the workpiece 40.

Since the contact portion between the workpiece 40 and the

electrode portions

12 and 12 of the clip 10 is immersed in the plating solution 21, contact spark between the workpiece and the clip 10 can be prevented. . Furthermore, since the insulating

coatings

50 and 51 are formed on the portion of the clip 10 where the plating solution is immersed, plating adhesion to the clip 10 can be prevented.

A Pretreatment process A1 1st hot water washing part A2 Pickling degreasing part A3 2nd hot water washing part A4 Water washing part A5 Acid active part B Plating process C Post-treatment process C1 Water washing part C2 Rust prevention part C3 Water washing part C4 Air part C5 Drying part D Circulation part 1 Suction plating device 2 Plating part 10 Clip part 11 Arm 12 Electrode part 13 Support part 14 Spring 15 Opening and closing roller 16 Opening and closing rail 20 Plating tank 21 Plating solution 22 Suction port 23 Discharge pipe 23 'Discharge pipe 24 Anode electrode plate 25 Suction pump 26 Plating solution storage tank (management tank)
27 Discharge pump 28 Filter 30 Conveyor 40 Work piece 50 Arm side insulation film 51 Electrode side insulation film

Claims

In the suction plating apparatus comprising at least a pretreatment process comprising a hot water washing section, a water washing section and an acidic degreasing section, a plating process, and a post-treatment process comprising at least a water washing section and a drying section,
The plating unit that performs the plating step includes a plating tank that stores a plating solution for plating the workpiece, a plurality of clips for holding the upper end of the workpiece and energizing the workpiece, and the plurality of clips. Consists of a conveyor that moves along the plating tank and a circulation unit that circulates the plating solution in the plating tank,
The workpiece is arranged in parallel with the moving direction of the clip, and the clip holds the upper end of the workpiece,
The portion that does not contact the workpiece of the tip portion holding the workpiece of the clip is insulated in a predetermined range,
A suction plating apparatus, wherein a predetermined range where the clip is insulated is immersed in a plating solution of the plating tank together with a workpiece.
The clip includes a pair of arms for sandwiching the workpiece, electrode portions disposed opposite to each other at the tips of the pair of arms, and opening / closing means for opening and closing the pair of arms, The suction plating according to claim 1, wherein the periphery of the electrode part is insulated so as to expose the tip surface of each electrode part, and a predetermined range of the tip part of the arm is insulated. apparatus.
The plating tank includes a plating solution suction port formed in the center of the bottom of the plating tank along the moving direction of the conveyor, and further, on both sides of the workpiece, an anode electrode plate facing the workpiece and a plating solution The suction plating apparatus according to claim 1, wherein the discharge ports are alternately arranged in a moving direction of the workpiece.
The suction plating apparatus according to claim 3, wherein the discharge port is disposed above the workpiece.
The suction plating apparatus according to claim 3, wherein a plurality of the discharge ports are arranged along a longitudinal direction of the workpiece.
The circulation unit includes at least a suction pump connected to the suction port, a plating solution storage tank connected to the suction pump, and a discharge pump connected to the discharge port. The suction plating apparatus according to any one of claims 3 to 5.