JP2007023348A - Electroplating treatment system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technique for appropriately plating a product conveyed to a plating treatment tank. <P>SOLUTION: The electroplating treatment system S comprises: a tank 14 for storing a plating treatment liquid; a tool 2 for hanging a sheet-shaped rectangular product W to be plated into the treatment liquid from the above of the tank 14; and plating orbits 11 for guiding the tool 2 along the tank 14, and applies the electroplating to the sheet-shaped rectangular product W moving in the treatment liquid in such a manner that the tool 2 is guided along the orbits 11 by the supply of electricity. The orbits 11 are composed of a pair of parallel guide rails 111, 111, and are mounted with a running part 113 of running the guide rails, and the tool 2 is suspended from the running part 113 in a state of being located between the pair of guide rails. The pair of guide rails 111, 111 each have a dust cover 117 for preventing the falling of friction scrap caused by friction generated with the running part 113 of running the guide rails to the tank 14 for plating treatment. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electroplating processing system, and more particularly to an electroplating processing system provided with a jig used when moving a printed circuit board or other sheet-like strip product in a processing solution in a plating processing tank.

  As a plating system for sheet-like strip products W such as printed circuit boards, sheet-like strip products W are moved by feeding the processing liquid stored in the plating tank while feeding the product while the product is suspended. An electroplating processing system in which electroplating is performed on the surface of the film is well known (see Patent Document 1).

  As shown in FIGS. 3 to 5, the electroplating processing system described in Patent Document 1 includes a preprocessing step A that is a processing step before performing plating, a plating processing step B that performs plating, and a plating process. A post-processing step C which is a processing step after performing the above-described processing, and a return step D which is a step after passing through the post-processing step C and returns the processing to the pre-processing step A.

  For convenience, the transport path on the track 1 where the processes in the pretreatment process A, the plating process B, and the post-processing process C are performed is referred to as the forward path, and the process in which the process in the jig returning process D is performed. The conveyance path on 10 is called a return path.

  In the case of the process ABC, the transport direction of the sheet-shaped strip product W is the same on the track 1, but in the case of the process D, the product is transported on the track 10 in the direction opposite to the process ABC. Then, the plating process is executed in the order of all steps A-B-C-D (the conveyance direction is indicated by a bar arrow in FIG. 3).

The track 1 that is the forward path is subjected to the plating track 11 in which the processing in the plating process B is executed, the front track 12 in which the processing in the preprocessing step A is executed, and the processing in the post-processing step C. The rear track 13 extends continuously, and is arranged in the order of front track 12 -plating track 11 -rear track 13.
Each of these tracks is actually a rail, and the jig 2 that hangs the sheet-like strip product W slides on the rail (see FIG. 4).

The process in the plating process B is executed in the plating tank 14, the process in the pretreatment process A is executed in the pretreatment tank 15, and the process in the posttreatment process C is executed in the posttreatment tank 16. Is done.
On the track 10 that is the return path, only the process in the jig returning process D is executed (see FIG. 5).

  The track 10 and the track 1 are parallel to each other with a predetermined interval. Then, the both ends of the track 1 and the track 10 are moved from the case where the sheet-shaped strip product W is transported in the forward path to the case where the transport is performed in the backward path, or from the case where the sheet-like strip product W is performed in the forward path. Trajectory transfer for translating the sheet-like strip product W between the trajectory 1 and the trajectory 10 and changing the transport path of the sheet-like strip product W from the previous trajectory 1 (10) to the other trajectory 10 (1). A device 40 is provided (see FIG. 3).

  In the pre-processing step A and the post-processing step C, as shown in FIGS. 4 and 5, the pusher 6 that engages with the engaging piece 7 that is formed to protrude from the upper end portion of the jig 2 is engaged with this. The jig 2 in which the sheet-like strip product W is suspended is transported by transporting it on the forward path or the return path in a state of being engaged with the piece 7.

Specifically, in the case of the plating process B, the jig 2 is transported from the pretreatment process A or toward the posttreatment process C, and in the case of the return process D, from the posttreatment process C or to the pretreatment process A. Then, the jig 2 is conveyed.
The conveyance of the jig 2 that suspends the sheet-like strip product W is intermittent, and a predetermined gap is provided between the sheet-like strip products W when the conveyance is performed.

  In the plating process B, the sheet-like strip product W is immersed in the plating solution stored in the plating tank 14 and brought into contact therewith. In this state, a potential difference is generated between the cathode electrode that is in contact with the edge of the sheet-like strip product W and the anode electrode provided in the plating tank 14 through the conductive jig 2. By giving, metal plating is performed on a groove or a connection hole formed in a desired portion of the sheet-like strip product W.

  The cathode electrode is disposed on a rail related to the plating track 11 disposed in the plating process B. Therefore, the rail is hereinafter referred to as a cathode rail 1. The anode electrode 22 is disposed in the plating tank 14 (see FIG. 6 or FIG. 7). A current flows from the anode electrode 22 toward the cathode rail 1 on which a cathode electrode (not shown) is disposed. These electrodes are supplied with a direct current from a power source (not shown). A negative direct current power source P is connected to the cathode rail electrode, and a positive direct current power source P is connected to the anode electrode 22.

  By the way, when the jig 2 slides on the cathode rail 1, fine scraps of the cathode rail 1 and the jig 2 are generated due to friction between the cathode rail 1 and the jig 2, and this falls. If the scraps are generated when the jig 2 that slides on the cathode rail 1 is positioned on the upper part of the plating tank 14, the scraps fall as impurities into the plating solution in the plating tank 14. It may be mixed with the plating solution.

  Therefore, in order to prevent impurities from dropping into the plating solution, as shown in FIG. 6, a dust cover as an impurity drop prevention tool having an L-shaped cross section extending along the cathode rail 1 at the lower portion of the cathode rail 1. 17 may be deployed.

  In this case, however, as can be seen from FIG. 6, unless the jig 2 is bent in a crank shape and the jig 2 avoids the dust cover 17, the sheet-like strip product W can be immersed in the processing liquid. Can not. Then, when the sheet-like strip product W is suspended from the jig 2 bent in the crank shape in this way, the jig 2 is shaped so as to hang straight, and the sheet-like strip product W is suspended from the jig 2. When the jig 2 is bent in a crank shape, it can be seen that the suspended sheet-like strip product W is in an unstable state. If the sheet-like strip product W is supported in an unstable state, the uniformity of the plating process may be reduced.

  Therefore, as shown in FIG. 7, the cathode rail 1 is disposed outside the plating processing tank 14, and a strong support 20 extending in an inverted L shape is provided from there to the plating processing tank 14. By immersing the sheet-like strip product W in the plating treatment liquid in the tank through the tool 2, the sheet-like strip product W can be drooped straight and impurities can be prevented from dropping into the plating solution. Conceivable. Of course, the support 20 is also electrically conductive.

  However, in this case, the apparatus becomes large, and from the cathode rail 1 where the cathode electrode is arranged to the sheet-like strip product W in the plating tank 14 where the anode electrode 22 is arranged. There is a problem that the circuit resistance (impedance) between the cathode rail 1 and the sheet-like strip product W increases due to the long distance. If the circuit resistance increases, the uniformity of the plating process may be reduced.

In addition, even if the support tool 20 is strengthened, if the support tool 20 has a cantilever shape, the sheet-like strip product W and the jig 2 and the support tool 20 that support the sheet-shaped strip product W are also shaken as shown by a two-dot chain line in FIG. It is possible to move.
The swinging reduces the uniformity of the plating process of the sheet-like strip product W.
JP 2000-54197 A

  The present invention has been invented in view of such circumstances, and the problem to be solved is to suspend the product even if a dust cover for preventing impurities from dropping into the plating solution is provided. An object of the present invention is to provide a technique capable of hanging a jig to be lowered straight.

  In order to achieve the above object, an electroplating processing system according to the present invention includes a tank for storing a processing solution for plating processing, and a sheet-like strip product to be plated in the processing solution from above the tank. To the sheet-like strip product that has a jig that hangs down and a track that guides the jig along the tank, and that moves in the processing liquid by being guided along the track. In the electroplating processing system for electroplating the sheet-like strip product by feeding power, the track is a pair of parallel guide rails, and the pair of guide rails includes a traveling unit that travels the pair of guide rails. Is mounted on the traveling portion, and the jig is suspended between the pair of guide rails, and each of the pair of guide rails is below the pair of guide rails. A dust cover that prevents the scrap generated by the friction generated between the guide rail and the traveling portion from falling on the plating treatment tank when the traveling portion travels along the guide rail. It is characterized by.

  According to the present invention, the dust cover attached to each of the pair of guide rails has a gap between the dust covers as well as a gap between the guide rails because the guide rails are parallel. Therefore, when the jig is suspended while being positioned between the pair of guide rails via the gap, there is no dust cover in the extending direction of the jig. For this reason, the jig can hang straight between the pair of guide rails.

  If the jig can hang down straight, the sheet-like strip product on which the jig hangs will sink into the processing liquid in the tank at the shortest distance. If the jig is short, the sheet-like strip product suspended by the jig is less oscillated and the circuit resistance is reduced. Further, since the dust cover is provided, it is not necessary to place the guide rail away from the tank and to place it outside so that the scraps do not enter the plating tank 14. In this relation, the support corresponding to the support extending from the outside of the tank to the inside of the tank described in the prior art is unnecessary. Therefore, the apparatus can be miniaturized.

  The treatment liquid may be any treatment liquid as long as it can apply a potential difference to perform liquid treatment on the sheet-like strip product. Examples of such treatment liquid include plating liquid and electrolytic etching liquid. Examples of the sheet-like strip product include, but are not particularly limited to, wafers and LCD glass substrates for liquid crystals.

  Each of the pair of guide rails is provided with the cathode electrode, the tank is provided with an anode electrode, and one of the sheet-like strip products according to one guide rail of the pair of guide rails. The other surface of the sheet-like strip product relating to the other guide rail and the other guide rail may be energized with the cathode electrode, respectively.

In this case, the current flowing from the cathode electrode related to one guide rail is set to a current flowing only to one surface of the sheet-shaped strip product W, and the current flowing from the cathode electrode related to the other guide rail is set to the current of the sheet-shaped strip product W. Since the current can flow only on the other side, electroplating can be performed only on one side of the sheet-like strip product.

In addition, the present invention is not limited to the case of the electroplating processing system, and can be applied to a case where the vehicle travels on a rail and there is a risk of foreign matter falling from there.
That is, a tank for storing a processing solution for plating, a jig for dropping a sheet-like strip product to be plated into the processing solution from above the tank, and the jig along the tank In the plating system for plating the sheet-like strip product moving in the processing liquid by guiding the jig along the track, the track has a pair of parallel guides. The pair of guide rails is mounted with a traveling unit that travels on the pair of guide rails, and the traveling unit has the jig positioned between the pair of guide rails. Each of the pair of guide rails that are suspended is located below them, and the friction that occurs between the guide rails and the traveling portions when the traveling portions travel on the guide rails. Rubbing debris caused by is also a plating system having a dust cover to prevent the falling into the tank for plating.

  According to the electroplating processing system of the present invention, the apparatus can be miniaturized. In addition, the product can be dropped straight and impurities can be prevented from dropping into the plating solution. For this reason, the uniformity of a plating process can be aimed at.

Embodiments of the present invention will be described with reference to the drawings.
Only the differences of the electroplating processing system S according to the present invention from the above-described prior art will be described, and the same portions are denoted by the same reference numerals and description thereof will be omitted.

FIG. 1 is a cross-sectional view of an essential part of an electroplating processing system S according to the present embodiment, which corresponds to FIG. 6, and FIG. 2 is a perspective view of FIG.
The track 1 (10) is a pair of parallel guide rails 111 and 111. The pair of guide rails 111 and 111 is provided with a traveling portion 113, and the traveling portion 113 has a jig 2 from its lower surface. Is suspended.

  The traveling unit 113 is configured such that the upper edge 111a of the guide rail 111 can be slid in a state where the end surface of the elongated plate-like body is set up vertically. Therefore, the traveling part 113 has a shape in which the lower edge is hollowed out in a concave shape and has a gate in a cross-sectional shape (see FIG. 2). A hollow recess is indicated by reference numeral 114.

The jig 2 is formed by attaching a grip portion 2b for gripping a sheet-like strip product W to an arm 2a extending downward.
The arm 2a is suspended in a state where the arm 2a is positioned in the gap r between the pair of guide rails 111 and 111.

  Each of the pair of guide rails 111 and 111 has a dust cover 115 below them. The dust cover 115 prevents the scraps 112 generated by the friction generated between the guide rail 111 and the traveling unit 113 when the traveling unit 113 travels on the guide rails 111 and 111 from dropping on the plating tank 14. It is a long and thin box-like body that extends along the longitudinal direction of the guide rail 111 and has a channel shape in a cross section so as to wrap the guide rail 111 from below and open upward. .

Next, the effect of the electroplating processing system S having such a configuration will be described.
The dust cover 115 attached to each of the pair of guide rails 111 has a gap r between the dust covers 115 as well as a gap between the guide rails 111 because the guide rails 111 are parallel.

  Therefore, when the jig 2 is suspended in a state of being positioned between the pair of guide rails 111 and 111 via the gap r, the dust cover 115 does not exist below the extension direction of the jig 2. . For this reason, the jig 2 hangs straight between the pair of guide rails 111. If the jig 2 can be drooped straight, the sheet-like strip product W on which the jig 2 is dripped will sink into the processing solution in the plating tank 14 at the shortest distance. If the jig 2 is short, the circuit resistance between the cathode rail 1 on which the cathode electrode is disposed and the sheet-like strip product W is reduced.

  Further, since the dust cover 115 is provided, it is not necessary to dispose the guide rail 111 outside the plating processing tank 14 and to prevent the scraps from entering the plating processing tank 14. In this relation, a component corresponding to the support 20 described in the prior art is unnecessary. Therefore, the system can be miniaturized.

  According to the electroplating processing system S, the quality of the plated sheet-like strip product W is improved because the plating has a uniform thickness.

  Furthermore, since each of the pair of guide rails 111 and 111 is provided with the cathode electrode 21, the current flowing from the cathode electrode 21 related to the one guide rail 111 is applied to one surface of the sheet-like strip product W. If the current flowing from the cathode electrode 21 related to the other guide rail 111 is the current flowing only to the other surface of the sheet-shaped strip product W, electroplating can be performed only on one surface of the sheet-shaped strip product W. Because it can, the application range of plating can be expanded.

  In the case of this embodiment, the electrical system has so far been provided with two guide rails, the cathode rails 21 are connected to the respective guide rails 111, 111, and the cathode electrode 21 associated with one of the guide rails 111 The current that flows is only a current that flows on one surface of the sheet-shaped strip product W, and the current that flows from the cathode electrode related to the other guide rail 111 is a current that flows only on the other surface of the sheet-shaped strip product W, By forming a potential difference between the cathode electrode 21 related to the guide rail 111 and the anode electrode 22 provided in the plating tank 14, the sheet-shaped strip product W was formed at a desired location (in this case, a desired surface). It is the same as the conventional technology in that metal plating is performed on the groove or the connection hole, and a category that can be used by those skilled in the art. Some reason, the electric circuit will be omitted.

Furthermore, the present invention is not limited to the above-described illustrated examples, and it is needless to say that various modifications can be made without departing from the gist of the present invention.
For example, although the case of the electroplating processing system has been exemplified in the above-described embodiment, the present invention can be applied to a case where the vehicle travels on a rail and there is a risk of foreign matter falling from there. As an example, the case where it applies to an electroless-plating apparatus can be illustrated. In this case, power is not supplied to the sheet-like strip product. That is, the cathode electrode is not disposed on the cathode rail that is the pair of guide rails, and the anode electrode is not disposed on the plating tank.

In short, the plating processing system in this case includes a tank for storing a processing solution for plating processing, a jig for dropping a sheet-shaped strip product to be plated into the processing solution from above the tank, and the treatment. A plating processing system for plating the sheet-like strip product moving in the processing liquid by guiding the jig along the track, and guiding the tool along the tank. The track is a pair of parallel guide rails, and the pair of guide rails is mounted with a traveling unit that travels the pair of guide rails, and the jig includes the pair of guide rails. Each of the pair of guide rails is positioned below the pair of guide rails, and the traveling portion travels on the guide rails to cause the guide rails to travel. It can be said that plating system having a dust cover rubbing debris caused by friction occurring between the traveling part is prevented from falling into the tank for plating.

It is a principal part cross-sectional view of the electroplating processing system which concerns on this invention, Comprising: It is a figure corresponded in FIG. It is a schematic perspective view of FIG. It is a top view for demonstrating the conventional electroplating processing system. FIG. 4 is a IV-IV line view of the electroplating processing system of FIG. 3. It is a VV line view of the electroplating processing system of FIG. It is a cross-sectional view of FIG. It is a figure for demonstrating another prior art example corresponded to FIG.

Explanation of symbols

1 Cathode rail (track)
2 Jig 2a Arm 2b Holding part 6 Pushing body 7 Engagement piece 10 Track 11 Plating track 12 Front track 13 Rear track 14 Plating tank 15 Pre-processing tank 16 Post-processing tank 17 Dust cover 20 Support tool 21 Cathode electrode 22 Anode electrode 40 Track transfer device 111 Guide rail 111a Upper edge 112 Scrap 113 Running part 114 Drawn-out recess 117 Dust cover A Pretreatment process B Plating process C Posttreatment process D Return process P DC power source S Electroplating system W Sheet-shaped strip product r Gap

Claims (3)

A tank for storing a processing solution for plating,
A jig for dropping a sheet-shaped strip product to be plated into the treatment liquid from above the tank;
A track for guiding the jig along the tank,
In the electroplating processing system for electroplating the sheet-like strip product by feeding power to the sheet-like strip product moving in the processing liquid by guiding the jig along this track,
The track is a pair of parallel guide rails, and the pair of guide rails is mounted with a traveling portion that travels the pair of guide rails, and the jig includes the jig and the pair of guide rails. Suspended between the rails,
Each of the pair of guide rails is positioned below them, and the scrap generated by the friction generated between the guide rail and the traveling portion when the traveling portion travels on the guide rail is used for the plating process. An electroplating processing system having a dust cover that prevents falling into a tank.   Each of the pair of guide rails is provided with the cathode electrode, the tank is provided with an anode electrode, and one of the sheet-like strip products according to one guide rail of the pair of guide rails. The electroplating system according to claim 1, wherein the other surface of the sheet-like strip product relating to the other guide rail and the other surface of the sheet-shaped strip product are respectively energized with the cathode electrode. A tank for storing a processing solution for plating,
A jig for dropping a sheet-shaped strip product to be plated into the treatment liquid from above the tank;
A track for guiding the jig along the tank,
In the plating processing system for plating the sheet-like strip product that moves in the processing liquid by guiding the jig along this track,
The track is a pair of parallel guide rails, and the pair of guide rails is mounted with a traveling portion that travels the pair of guide rails, and the jig includes the jig and the pair of guide rails. Suspended between the rails,
Each of the pair of guide rails is positioned below them, and the scrap generated by the friction generated between the guide rail and the traveling portion when the traveling portion travels on the guide rail is used for the plating process. A plating system with a dust cover that prevents it from falling into the tank.

Images