CN1865520B - Sheet product plating method - Google Patents
Sheet product plating method Download PDFInfo
- Publication number
- CN1865520B CN1865520B CN2006100757638A CN200610075763A CN1865520B CN 1865520 B CN1865520 B CN 1865520B CN 2006100757638 A CN2006100757638 A CN 2006100757638A CN 200610075763 A CN200610075763 A CN 200610075763A CN 1865520 B CN1865520 B CN 1865520B
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- Prior art keywords
- sheet
- article
- shutter
- treated
- plating tank
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Abstract
The plating method for sheet production comprises: using a hanging clamper to hold the top of PCB, conveying the sheet product in long electroplating slot with anodes on two sides continually for electroplating; wherein, the said hanging clamper can also be used supply power. This invention can ensure plating coat thickness evenly, and has no damage or bending effect.
Description
Technical field
The present invention relates to the electro-plating method of the sheet-like article of tellite etc., in particular, the present invention relates to the solution and coating method of following sheet-like article, in the method, state at the top of this sheet-like article of clamping that dangles by the suspension bracket that is used for power supply, in the inside of rectangular plating tank this sheet-like article is transported continuously laterally and in upright arrangemently, simultaneously it is electroplated.
Background technology
Solution and coating method as the sheet-like article of tellite etc., people know following electroplanting device, wherein, by the dangle top of this sheet-like article of clamping of the suspension bracket that is used for power supply, in the inside of rectangular plating tank this sheet-like article is transported continuously laterally and in upright arrangemently, simultaneously, to its electroplate (such as, with reference to patent documentation 1 and patent documentation 2).In addition, people know the electroplating processes system, wherein, relative too high sheet both side ends and the bottom of current density, form uniform current density (such as, with reference to patent documentation 3).
Below this patent documentation 3 is described.Fig. 6 is the simplification front view of the electroplating system shown in Figure 1 of patent documentation 3, and Fig. 7 is the side-view of vertically cutting open of the electroplating system shown in Figure 2 of patent documentation 3.Clip 3 clampings of the suspension bracket 2 of sheet-like article 1 by being used for power supply, with overhang in the past treatment trough 5 be transported on the elevating lever 4.This transports according to transporting pawl 6 an ancient unit of weight to live snap-latch piece 7 and realize that the mode of extruding carries out, and this snap-latch piece 7 is outstanding from the top of the suspension bracket 2 that is used for power supply.
By the sheet-like article of carrying on the elevating lever 41, treatment trough 5 is extruded to the carriage direction admission port end of rectangular plating tank 8 in the past, and here, elevating lever 4 drops to the position of cathode rod 9, passes out to cathode rod 9 successively by transporting pawl 6.
Rectangular direction both sides at rectangular plating tank 8 are provided with anode 10, and the mode of transporting sheet-like article 1 according to position therebetween is provided with swing and prevents guide plate 11 in both sides.And then the shutter 12 of the current density adjustment usefulness of sheet bottom is arranged at its below, prevents that with above-mentioned swing guide plate 11 is connected indirectly.And shutter 12 is by elevating lever 13, is connected with not shown riser, so that its height can pass through the workpiece size adjustment of sheet-like article 1.According to side end at sheet-like article 1, the mode that current density can not be too high, narrower according to the rules spacing amplitude is transported out along cathode rod 9 successively.
In addition, people know the anti-locking mechanism of swing, wherein, the object being treated holding member is set, this object being treated holding member is made of the base portion, the engagement part that is installed on the top of this base portion that form by the quadrate support that keeps object being treated, the slip moving-member that is installed on the below of this base portion, on the object being treated holding member, keep above-mentioned object being treated, engage with the slide rail of top and the slide-and-guide parts of below, simultaneously this object being treated is moved in plating tank inside (such as, with reference to patent documentation 4).
Also have, people also know following solution and coating method, wherein, jet apparatus is set, this jet apparatus edge and the perpendicular direction jet electro-plating liquid of the carriage direction of object being treated, and the tabular guide plate is set between this jet apparatus and object being treated, the length direction of plate is parallel with above-mentioned carriage direction, and the width of plate tilts according to the plate end edge portion mode up of object being treated side, by guide plate the electroplate liquid that sprays from above-mentioned jet apparatus is carried out rectification, make its contact with object being treated (such as, with reference to patent documentation 5).
Patent documentation 1:JP spy opens clear 59-153899
Patent documentation 2:JP is real to open clear 60-102258
Patent documentation 3:JP spy opens flat 11-61495
Patent documentation 4:JP is real to open clear 59-21668
Patent documentation 5:JP spy opens 2000-178784
In patent documentation 1 and patent documentation 2 described inventions, the homogeneity of electroplating thickness is incomplete.
In patent documentation 3 described inventions, owing to carry out transporting and locating of sheet-like article by roller chain, sheet-like article narrows down according to spacing, in plating tank, transport continuously laterally and in upright arrangemently, carry out the identical effect of galvanized occasion so have approx with rectangular sheet, the current density of the middle layer segment of sheet-like article is even.In addition, because the position of sheet top ends is definite, so can make the current density of sheet top ends also even by adjusting the anodic position.In addition, because the shutter of current density adjustment usefulness is set in the sheet bottom, so can make whole current density even, this electroplating system formation is carried out in the galvanized mechanism 1 according to homogeneous thickness to sheet-like article.
But, as long as it then is useful mechanism that sheet-like article does not produce distortion, but, if such as being the such type of flexible printed circuit substrate with flexibility, then have because of generation deflections such as the liquid in the plating tank flow, transports, prevent that guide, shutter from contacting, the problem of damaging, bending with swing.
Because in patent documentation 4 described inventions, object being treated is fixed on the holding member that is made of support etc., move in the inside of plating tank, so can prevent the deflection of object being treated.But, because of there being support, can't remain on the side end of object being treated, can not be too high and the narrower spacing width of regulation in order to make current density, so this mode is not preferred.
Summary of the invention
Therefore, the object of the present invention is to provide a kind of solution and coating method, wherein, state at the top of the sheet-like article of the clamping tellite that dangles by the suspension bracket that is used for power supply etc., in the inside of rectangular plating tank this sheet-like article is transported continuously laterally and in upright arrangemently, simultaneously, it is electroplated, even be such as, under the situation that flexible printed circuit substrate is such, still keep carrying out galvanized function, simultaneously with homogeneous thickness with flexible type, deflections such as can not flowing, transport because of the liquid in the plating tank produces the problem of damage, bending.
The present invention proposes to achieve these goals, technical scheme 1 described invention provides a kind of solution and coating method of sheet-like article, wherein, be in the rectangular plating tank, the both sides of the path that passes through at object being treated are provided with anode, by the dangle state of this object being treated of clamping of the suspension bracket that is used for power supply, on cathode rod, it is transported continuously, simultaneously this object being treated be impregnated in the inside of plating tank, it is electroplated, it is characterized in that being installed on the state of the bottom of above-mentioned object being treated, electroplate at the shutter that forms by the insulativity material of the homogenizing that is used for current density.
According to this scheme, because in plating tank, object being treated laterally transports continuously in the mode that spacing narrows down, so the current density of the middle layer segment of object being treated is even.On the other hand, the shutter that can not too high mode be installed on the bottom of object being treated according to the current density of the bottom of object being treated is realized restraining effect.Therefore, whole object being treated is uniform current density.In addition, even under the situation of object being treated for the type with flexibility such such as flexible printed circuit substrate, because of the deadweight of above-mentioned shutter, still rectifiable deflection.
According to this scheme, when object being treated passed through between the guide from transporting, only the shutter with the bottom that is installed on object being treated contacted, and the carriage direction from both sides to object being treated leads.Therefore, directly do not contact owing to transport guide, so object being treated does not damage, bends with object being treated.
According to this scheme and since the magnet of before and after the carriage direction of shutter, imbedding according to the mode effect of the attraction of adjacent shutter, so the position of shutter relation is fixing, the spacing of adjacent object being treated is stablized.Therefore, transporting of object being treated can successfully be carried out, and can enlarge the spacing of transporting guide.
The present invention can establish following method, wherein, as described above, state at the top of the sheet-like article of the clamping tellite that dangles by the suspension bracket that is used for power supply etc., this sheet-like article is transported in rectangular plating tank continuously laterally in upright arrangemently, simultaneously, it is carried out electrolysis, such as, even under the situation with flexible parts such, still keep galvanized function, simultaneously with homogeneous thickness for flexible printed circuit substrate, can not flow, transport etc. deflection takes place, produce the problem of damage, bending because of the liquid in the plating tank.
Description of drawings
Fig. 1～Fig. 5 represents embodiments of the invention, and Fig. 6～Fig. 7 represents prior art.
Fig. 1 is illustrated in the front view that the state of shutter is installed on the sheet-like article of the clamping of dangling;
Fig. 2 (1) is for being illustrated in the side-view that an example of shutter is installed on the sheet-like article, and Fig. 2 (2) is for being illustrated in the vertical view that an example of shutter is installed on the sheet-like article;
Fig. 3 is illustrated in the side-view that another example of shutter is installed on the sheet-like article;
Fig. 4 has installed the sheet-like article of shutter for the expression clamping of dangling, with the explanatory view of its state that transports in the inside of rectangular plating tank;
Fig. 5 has installed the sheet-like article of shutter and the explanatory view of the position relation of transporting guide for expression;
Fig. 6 is for the dangle sheet-like article in clamping past of expression, with the explanatory view of its state that transports in the inside of rectangular plating tank;
Fig. 7 is for the dangle sheet-like article in clamping past of expression, with the longitudinal sectional view of its state that transports in the inside of rectangular plating tank.
Embodiment
Enumerate preferred embodiment below, the electro-plating method of sheet-like article of the present invention is described.By following manner realize such as, even under the situation with flexible sheet-like article such for flexible printed circuit substrate, still when keeping galvanized function according to uniform thickness, prevent because of the stream of the liquid in the plating tank, former thereby the deflection of transporting etc., sheet-like article is not damaged, the purpose of bending, this mode is: in the inside of rectangular plating tank path, the both sides of the path that passes through at sheet-like article are provided with anode, by the suspension bracket that the is used for power supply clamping sheet-like article that dangles, on cathode rod, transport this sheet-like article continuously at this state, simultaneously, being impregnated in plating tank inside electroplates it, in the method, the shutter that forms at the insulativity material by the even usefulness of current density is installed on the state of the bottom of sheet-like article, electroplates.
By Fig. 1～Fig. 5, embodiments of the invention are specifically described.In addition, the integral part identical with the described prior art of Fig. 7 with Fig. 6 adopts same label.
At first, technical scheme 1 described inventive embodiment is described according to Fig. 1～Fig. 3.Fig. 1 is illustrated in by the suspension bracket 2 that the is used for power supply state of clamping as the sheet-like article 1 of object being treated that dangle, shutter 20 is installed on the state of the bottom of sheet-like article 1, Fig. 2 (1) represents from the enlarged view of the mounting portion of laterally watching shutter 20, Fig. 2 (2) is the vertical view of Fig. 2 (1), and Fig. 3 is the figure of the distortion example of expression shutter.
Above-mentioned shutter 20 is formed by the insulativity material, and the cross-sectional shape of this insulativity material is an opening, and it is by V font and square combining, and this shutter 20 is installed on a part on the two sides, bottom of sheet-like article 1.To this position of this sheet-like article 1, carry out pilot hole processing in advance, insert not shown guide finger, fixedly shutter 20.
Like this, by guide finger, shutter 20 is fixed in the bottom of sheet-like article 1, thus, need not over like that, according to the workpiece size of sheet-like article 1, adjust the height of shutter by elevating lever, sheet-like article 1 can keep certain at ordinary times with the position relation of shutter 20.In addition, by the deadweight of shutter 20, such as, even have under the situation of flexible object being treated still rectifiable deflection like that at flexible printed circuit substrate.In addition, best, the bottom side of shutter 20 is the shape of big opening, so that suppress the residual of above-mentioned treatment solution.
As the distortion example of shutter, shown in the image pattern 3 like that, also can be the shutter 21 of the shape of the two sides, bottom of plate-shaped member and sheet-like article 1 facing.In addition, as aforementioned, adopt guide finger that shutter is fixed on the sheet-like article 1, still, the thick occasion that arrives to a certain degree of thickness at sheet-like article 1 also can adopt the leaf spring that is formed by insulating material to wait and replace guide finger and the fixed method.
Below by Fig. 4～Fig. 5, technical scheme 2 described inventive embodiments are described.Fig. 4 is illustrated in the state that above-mentioned shutter 20 is installed on the bottom of sheet-like article 1, and the state that transports in the inside of rectangular plating tank 8, Fig. 5 represent to be arranged at the amplification view that transports guide of both sides of the direction of passage of the sheet-like article 1 that shutter 20 is installed.
In the past, according in the mid-way of rectangular plating tank 8, the mode of transporting sheet-like article 1 is provided with swing and prevents guide plate, but,, replace swing to prevent guide plate according to the present invention, and according to a determining deviation, on the bottom surface of rectangular plating tank 8, stand and establish a plurality of guides 30 that transport.Watch from the top, this transports guide 30 and is circular-arc, is arranged at the both sides of the direction of passage of the sheet-like article 1 that shutter 20 is installed, and from the contact both sides of shutter 20, the carriage direction of sheet-like article 1 is led.
Like this, different with the type in past, according to the present invention, contact with sheet-like article 1 owing to transport guide 30, so sheet-like article 1 does not produce damage, bends, can lead to carriage direction safely and successfully.
Below by Fig. 2～Fig. 4, technical scheme 3 described inventive embodiments are described.Image pattern 2 and shown in Figure 3 near the end, front and back of the carriage direction of shutter 20 or 21, is imbedded magnet 40.Like this, because by in advance magnet 40 being imbedded the end, front and back of carriage direction, shown in the b arrow of image pattern 4 part like that, the inside of rectangular plating tank 8 transport sheet-like article 1 during, imbed in one of them shutter 20 magnet 40 according to another shutter 20 of imbedding adjacency in the mode effect that attracts of magnet 40, so the position of shutter 20 relation is fixing, the goods spacing of adjacent sheet-like article 1 is stable.
In addition, because shutter 20 is grow shaft-like approx, so can enlarge the spacing of transporting guide 30, transporting further of sheet-like article 1 successfully carried out.In addition, the magnetic force of above-mentioned magnet 40 must attract according to forming adjacent shutter 20, and then, in the magnetic means adjustment that when rectangular plating tank 8 is deviate from, can leave easily, but best, the magneticflux-density roughly on the surface of shutter 20 is in the scope of 400～1000G.
In addition,, can carry out various changes, in addition, obviously the present invention relates to the scheme of this change as long as in the scope that does not break away from spirit of the present invention.
Claims (3)
1. the solution and coating method of a sheet-like article, wherein, in rectangular plating tank, the both sides of the path that passes through at object being treated are provided with anode, by the dangle state of this object being treated of clamping of the suspension bracket that is used for power supply, on cathode rod, it is transported continuously, simultaneously this object being treated be impregnated in the inside of plating tank, electroplate, it is characterized in that:
Be installed on the state of the bottom of above-mentioned object being treated at the shutter that forms by the insulativity material of the homogenizing that is used for current density, electroplate.
2. the solution and coating method of sheet-like article according to claim 1, it is characterized in that in above-mentioned rectangular plating tank, the both sides of the path that passes through at above-mentioned object being treated are provided with transports guide, and this transports guide and forms according to the mode that only contacts with above-mentioned shutter.
3. the solution and coating method of sheet-like article according to claim 1 and 2 is characterized in that before and after the carriage direction of above-mentioned shutter, according to imbedding magnet in the mode that adjacent shutter attracts when inner by above-mentioned rectangular plating tank.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005140980 | 2005-05-13 | ||
| JP2005-140980 | 2005-05-13 | ||
| JP2005140980A JP4700406B2 (en) | 2005-05-13 | 2005-05-13 | Sheet product plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1865520A CN1865520A (en) | 2006-11-22 |
| CN1865520B true CN1865520B (en) | 2010-09-29 |
Family
ID=37424661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006100757638A Expired - Fee Related CN1865520B (en) | 2005-05-13 | 2006-04-26 | Sheet product plating method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4700406B2 (en) |
| CN (1) | CN1865520B (en) |
| TW (1) | TW200639276A (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101054701B (en) * | 2007-02-08 | 2010-12-08 | 上海美维科技有限公司 | Method of increasing electroplating evenness |
| KR101070841B1 (en) | 2011-06-02 | 2011-10-06 | 장병원 | The plate method of a thin plate printed-circuit board and thereof ware |
| KR101080896B1 (en) | 2011-06-10 | 2011-11-07 | 장병원 | The holder can be to uniform copper plating of printed-circuit board surface |
| JP5731917B2 (en) * | 2011-06-30 | 2015-06-10 | 上村工業株式会社 | Surface treatment equipment and plating tank |
| CN102286770A (en) * | 2011-08-26 | 2011-12-21 | 珠海市祥芝电子有限公司 | Special clamp for electroplating |
| KR101300325B1 (en) * | 2011-12-21 | 2013-08-28 | 삼성전기주식회사 | Apparatus for plating substrate and control method thereof |
| CN103305896B (en) * | 2012-03-07 | 2015-09-09 | 昆山东威电镀设备技术有限公司 | Continuous electroplating liquid conduction device and continuous liq electro-plating method |
| TW201416302A (en) * | 2012-10-19 | 2014-05-01 | Manz Taiwan Ltd | Fixture and conveying system |
| CN103374744A (en) * | 2013-07-11 | 2013-10-30 | 皆利士多层线路版(中山)有限公司 | PCB (printed circuit board) electroplating copper attached tank |
| CN105239143B (en) * | 2015-09-30 | 2018-11-20 | 东莞市威力固电路板设备有限公司 | Electroplating device material feeding system and its control method |
| JP6305485B2 (en) * | 2016-09-14 | 2018-04-04 | 本田技研工業株式会社 | Transport device |
| JP6329681B1 (en) * | 2017-10-31 | 2018-05-23 | 株式会社荏原製作所 | Plating apparatus and plating method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1267341A (en) * | 1997-08-21 | 2000-09-20 | 阿托特德国有限公司 | Device and method for evening out thickness of metal layers on electrical contact points on items that are to be treated |
| CN1428462A (en) * | 2001-12-27 | 2003-07-09 | 丸仲工业株式会社 | Product guide mechanism for electroplanting processing device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6142937A (en) * | 1984-08-07 | 1986-03-01 | Fujitsu Ltd | Manufacture of integrated circuit substrate |
| JPH0385849A (en) * | 1989-08-30 | 1991-04-11 | Hitachi Ltd | Facsimile equipment |
| JPH05148693A (en) * | 1992-01-14 | 1993-06-15 | Toshiba Corp | Copper electroplating jig |
| JP2728338B2 (en) * | 1992-05-21 | 1998-03-18 | 上村工業株式会社 | Printed circuit board masking device |
| JP3677488B2 (en) * | 2002-05-14 | 2005-08-03 | 丸仲工業株式会社 | Clip-type work hanger in electroplating equipment |
-
2005
- 2005-05-13 JP JP2005140980A patent/JP4700406B2/en not_active Expired - Fee Related
- 2005-12-29 TW TW094147354A patent/TW200639276A/en unknown
-
2006
- 2006-04-26 CN CN2006100757638A patent/CN1865520B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1267341A (en) * | 1997-08-21 | 2000-09-20 | 阿托特德国有限公司 | Device and method for evening out thickness of metal layers on electrical contact points on items that are to be treated |
| CN1428462A (en) * | 2001-12-27 | 2003-07-09 | 丸仲工业株式会社 | Product guide mechanism for electroplanting processing device |
Non-Patent Citations (4)
| Title |
|---|
| JP特开2003-105595A 2003.04.09 |
| JP特开2004-149858A 2004.05.27 |
| JP特开2004-277783A 2004.10.07 |
| JP特开平11-61495A 1999.03.05 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200639276A (en) | 2006-11-16 |
| CN1865520A (en) | 2006-11-22 |
| JP2006316322A (en) | 2006-11-24 |
| TWI305804B (en) | 2009-02-01 |
| JP4700406B2 (en) | 2011-06-15 |
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