JP5264341B2 - Vertical conveyor type plating equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide vertical transportation type plating equipment moving a substrate stably in a plating tank and applying plating to the substrate even when the substrate is made thin. <P>SOLUTION: The vertical transportation type plating equipment for plating the substrate 30 while moving the vertically erected substrate 30 in a plating solution 12 in the plating tank 10 includes: a grip 24 holding the upper part of the substrate and suspending the substrate 10 in the plating tank 10; a guide rail 40 arranged in the lower part of the plating tank 10 and along the moving direction of the substrate 30 and guiding the substrate 30 by arranging the lower part of the substrate 30 on a slit part of the center part; and a substrate reinforcing fixture 60 attached to the lower part of the substrate 30 and reinforcing the substrate 30 by applying gravity force thereto. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a vertical conveyance type plating apparatus, and more particularly, to a vertical conveyance type plating apparatus that performs plating while conveying the inside of a plating tank in a state where a substrate is set up vertically.

  Conventionally, a plating method is frequently used in a method of manufacturing a wiring board on which a semiconductor device or the like is mounted. As the plating apparatus, there is a vertical conveyance type electrolytic plating apparatus. In such an electrolytic plating apparatus, the upper part of the substrate is sandwiched between clips, and the substrate is plated while being conveyed vertically in a horizontally long plating tank.

  As a technology related to this, Patent Document 1 describes a wet processing apparatus that performs processing while transporting a substrate while being sandwiched between an upper support roller and a lower support roller from above and below.

Further, in Patent Document 2, even when the vertically long size of the workpiece is changed, the product guide can be easily and reliably attached to the workpiece by adjusting the lifting guide portion to the optimum position for the size switching. A corresponding plating apparatus is described.
JP 2003-104544 A JP 2003-105595 A

  In recent years, higher performance and higher performance of semiconductor devices have demanded higher density and thinner wiring boards, and attempts have been made to reduce the thickness of the board to about 0.2 mm.

  As described in the column of related technology described later, in the above-described vertical transfer type electrolytic plating apparatus, the substrate is plated in a state where the upper portion of the substrate is sandwiched between clips and the lower portion of the substrate is guided by a guide rail. Plating is performed while moving in the horizontal direction.

  However, when the thickness of the substrate is reduced, pressure is applied to the substrate due to the convection of the plating solution and the substrate is easily bent. As a result, the substrate is detached from the guide rail or dropped from the clip. If the substrate falls off in the plating tank, it is necessary to stop the apparatus due to a conveyance trouble, which greatly affects production efficiency and throughput.

  The present invention was created in view of the above problems, and even when the substrate is thinned, the vertical transfer type plating apparatus capable of performing plating by moving the substrate stably in the plating tank. The purpose is to provide.

  In order to solve the above-mentioned problems, the present invention relates to a vertical conveyance type plating apparatus, and in a state where the substrate is set up vertically, a vertical conveyance type plating apparatus which moves in a plating solution in a plating tank to plate the substrate. A first clip for sandwiching an upper portion of the substrate and dropping the substrate into the plating tank; and a lower portion in the plating tank arranged along a moving direction of the substrate, and configured at a central portion. The lower portion of the substrate is disposed in the slit formed to guide the substrate, and the guide rail is disposed below the guide rail. The substrate holding portion is provided on the upper side and attached to the substrate. And a substrate reinforcing jig for reinforcing the substrate.

  In the present invention, in a vertical transfer type plating apparatus for performing plating by moving the inside of a plating tank while standing the substrate vertically, the substrate is reinforced by attaching a substrate reinforcing jig to the lower portion of the substrate. . Thereby, even when the thickness of the substrate is thin and the rigidity is weak (for example, the thickness of the substrate: 0.2 to 0.3 mm), when the pressure is applied to the substrate by the convection of the plating solution, the rigidity of the substrate is reduced. Since it is reinforced by the substrate reinforcing jig, there is no possibility that the substrate is detached from the guide rail.

  Accordingly, it is possible to avoid the stoppage of the apparatus due to a conveyance trouble, so that the production efficiency and the throughput can be improved. Further, since the plating is stably performed on the substrate, the manufacturing yield of the wiring substrate and the like can be improved.

  In the above-described invention, as a method of attaching the substrate reinforcing jig to the substrate, the lower portion of the substrate may be sandwiched by clips, or the lower portion of the substrate may be inserted into the groove.

  In the above-described invention, the substrate reinforcing jig may include rollers on both sides thereof, and the substrate may be conveyed while the rollers are in contact with the lower surface of the guide rail and do not rotate. In the case of this aspect, the contact friction between the substrate reinforcing jig and the guide rail can be reduced, and the substrate can be transported smoothly.

  Furthermore, a support plate may be disposed below the substrate reinforcing jig, or the roller of the substrate reinforcing jig may be rotated while being sandwiched between the guide rail and the support plate.

  As described above, in the present invention, even when the substrate is thinned, the substrate can be stably moved in the plating tank for plating.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

  Prior to describing embodiments of the present invention, problems of related technologies related to the present invention will be described. 1-4 is a figure which shows the vertical conveyance type plating apparatus of related technology.

  As shown in FIG. 1, a related-art vertical conveyance plating apparatus includes a horizontally long plating tank 100 (extending in FIG. 1) containing a plating solution 120. The upper part of the substrate 300 is sandwiched by a cathode clip 220 electrically connected to the cathode 200, and the substrate 300 is immersed in the plating solution 120 in the plating tank 100 in a vertical state.

  In the lower part of the plating tank 100, two guide rails 400 are arranged in parallel along the lateral direction of the plating tank 100, and a slit 420 is formed between them. The lower part of the substrate 300 arranged vertically is arranged in the slit 420 of the guide rail 400.

  Furthermore, anodes 500 are respectively disposed on both ends of the plating tank 100.

  Then, as shown in FIG. 2, the substrate 300 sandwiched between the cathode clips 220 is successively supplied to the horizontally long plating tank 100. Then, plating is performed while the substrate 300 is conveyed in the horizontal direction with the lower portion of the substrate 300 being guided by the guide rail 400. The plating solution 120 flows from both sides of the plating tank 100 to the inside (the substrate 300 side), whereby the substrate 300 is uniformly plated.

  In recent years, there has been a demand for thinner wiring boards due to higher performance of semiconductor devices. For this reason, the thickness of the substrate 300 to be plated is reduced to 0.2 to 0.3 mm.

  As shown in FIG. 3 and FIG. 4, when plating such a thin substrate 300 with the above-described vertical transfer type electrolytic plating apparatus, the substrate 300 is weak in rigidity and easily bent. It cannot withstand the pressure of 120 flow. For this reason, the substrate 300 is detached from the guide rail 400 or pulled off from the cathode clip 220. If the substrate 300 falls off in the plating tank 100, it is necessary to stop the apparatus due to a conveyance trouble, which greatly affects production efficiency and throughput.

  The vertical conveyance type plating apparatus of the embodiment of the present invention described below can solve the above-described problems.

(Embodiment)
5 and 6 are views showing a vertical conveyance type plating apparatus according to an embodiment of the present invention. As shown in FIG. 5, the vertical conveyance type plating apparatus 1 of the present embodiment includes a horizontally long plating tank 10 (extending to the back side in FIG. 5) containing a plating solution 12. A cathode bar 20 is disposed above the plating tank 10 along the laterally long direction. Under the cathode bar 20, a movable hanger 22 and a cathode clip 24 connected thereto are provided.

  The movable hanger 22 and the cathode clip 24 can be moved along the lateral direction of the plating tank 10 while being electrically connected to the cathode bar 20. And the upper part of the board | substrate 30 is clamped by the cathode clip 24, and the board | substrate 30 is immersed in the plating solution 12 in the plating tank 10 in the state standing upright.

  The substrate 30 used in the present embodiment is a thin substrate for constituting a build-up wiring board on which an electronic component (semiconductor chip or the like) is mounted, and has a thickness of 0.1 to 0.5 mm (preferably Is 0.2 to 0.3 mm). As the substrate 30, in addition to an insulating substrate such as a glass epoxy resin, a metal plate (such as copper) or a semiconductor substrate (such as silicon) may be used.

  An anode 50 is disposed on each side of the plating tank 10. As the anode 50, a plurality of rod-like or plate-like electrodes are arranged in a state of being electrically connected.

  Further, the vertical transfer type electroplating apparatus 1 includes a constant current power source 25, the cathode bar 20 is connected to the minus (−) side of the constant current power source 25, and the anode 50 is a plus (plus) of the constant current power source 25. ) Is connected to the side.

  Further, two guide rails 40 are arranged in parallel along the lateral direction of the plating tank 10 (the moving direction of the substrate 30) in the lower part of the plating tank 10, and a slit 42 is formed between them. Has been. The lower portion of the substrate 30 arranged vertically is arranged in the slit 42 of the guide rail 40.

  Further, the vertical transfer type plating apparatus 1 includes a substrate reinforcing jig 60, and the substrate reinforcing jig 60 is attached to the lower part of the substrate 30. The substrate 30 is subjected to gravity by the substrate reinforcing jig 60 to reinforce the rigidity. As shown in the partially enlarged view of FIG. 5, the substrate reinforcing jig 60 includes a clip 62 that holds the lower portion of the substrate 30, a shaft portion 64 that is connected to the clip 62 and protrudes outward, and both ends of the shaft portion 64. And a roller 66 that is rotatably connected to each other.

  The clip 62 includes a holding part 62a and a pressing part 62b connected by a spring 62x. The holding part 62a is pushed inward by the repulsive force of the spring 62x, and the substrate 30 is held. The substrate reinforcing jig 60 is made of a material that is not subjected to electrolytic plating. For example, the substrate reinforcing jig 60 is configured by coating a stainless steel member with a vinyl chloride sol.

  Each lower surface of the two guide rails 40 is an inclined surface S that descends outward from the slit 42 side. The upper portion of the roller 66 of the substrate reinforcing jig 60 contacts the lower surface (inclined surface S) of the guide rail 40, and the roller 66 is rotated simultaneously with the conveyance of the substrate 30.

  FIG. 7 is a perspective view of a specific overall image of the substrate reinforcing jig 60. According to the example of FIG. 7, in the substrate reinforcing jig 60, a plurality of clips 62 are arranged at regular intervals in the horizontal direction. A shaft portion 64 is connected between the plurality of clips 62, and a groove 64 a corresponding to a region facing the clamping portion 62 a of each clip 62 is provided in the central portion of the shaft portion 64. Rollers 66 are coupled to both ends of the shaft portion 64, respectively.

  Then, the pressing portion 62b of the clip 62 is clamped to open the clamping portion 62a, and after the lower portion of the substrate 30 is disposed on the clip 62 and the groove 64a of the shaft portion 64, the pressing portion 62b of the clip 62 is opened. The substrate 30 is clamped by the clamping part 62 a of the clip 62.

  Next, a method for plating the substrate 30 by the above-described vertical conveyance plating apparatus 1 will be described.

  As shown in FIG. 6, the substrate 30 is suspended by sandwiching the upper portion of the substrate 30 with the cathode clip 24 described above, and the lower portion of the substrate 30 is sandwiched by the clip 62 of the substrate reinforcing jig 60 described above. A substrate reinforcing jig 60 is attached to the substrate. As a result, the substrate 30 is immersed in the plating solution 12 in the plating tank 10 while being suspended from the cathode bar 20 by the movable hanger 22 and the cathode clip 24.

  At this time, the substrate 30 is subjected to gravity by the substrate reinforcing jig 60, and is pulled downward to reinforce the rigidity. For example, when the substrate 30 has a thickness of 0.2 to 0.3 mm, the weight of the substrate reinforcing jig 60 is set to 200 to 400 g.

Subsequently, the board | substrate 30 arrange | positioned drooping is conveyed in the horizontal direction of the plating tank 10 with the movable hanger 22. FIG. At this time, the substrate reinforcing jig 60 attached to the lower portion of the substrate 30 is disposed under the slit 42 between the two guard rails 40 disposed in the lower portion of the plating tank 10. The slit 42 of the guard rail 40 is a wide slit at a portion where the substrate 30 is supplied, and is guided into the regular slit 42 from the wide slit as the substrate 30 is conveyed.

  Further, the substrate 30 moves while the roller 66 of the substrate reinforcing jig 60 contacts and rotates on the lower surface of the guard rail 42. Thereby, the contact friction of the board | substrate reinforcement jig | tool 60 and the guard rail 40 can be reduced, and the board | substrate 30 can be conveyed smoothly. Further, since each lower surface of the guide rail 40 is an inclined surface S (partially enlarged view of FIG. 5) that falls from the slit 42 side toward the outside, lateral pressure is applied to the roller 66 by the shaking of the substrate 30. However, the roller 66 is generally fixed to the inclined surface S and has a structure that does not shift laterally.

  Thereby, the board | substrate 30 is stably conveyed along the guide rail 40, without the clip 62 and the board | substrate 30 of the board | substrate reinforcement jig | tool 60 colliding with the guide rail 40. FIG.

  Note that the movable hanger 22 may be provided with a vertical movement function so that the roller 66 of the substrate reinforcing jig 60 is surely in contact with the lower surface of the guide rail 40. Alternatively, the shaft portion 64 to which the roller 66 of the substrate reinforcing jig 60 is attached may be provided with a spring mechanism so that the roller 66 is arranged above the arrangement of FIG. As a result, the roller 66 is always pushed toward the guide rail 40 by the repulsive force of the spring mechanism coupled to the roller 66, so that the roller 66 can be stably brought into contact with the guide rail 40.

  A plating current is supplied from the constant current power source 25 between the cathode clip 24 and the anode 50, and plating is performed on each substrate 30 while the substrates 30 are successively conveyed in the laterally long direction of the plating tank 10 (see FIG. 6). For example, when manufacturing a build-up wiring board, a plating layer for wiring such as copper is formed in an opening portion of a plating resist formed on the seed layer in a semi-additive method.

  At this time, the plating solution 12 is flowing inward from both sides of the plating tank 10, and the pressure due to the flow of the plating solution 12 is applied to the substrate 30. In the present embodiment, since the substrate reinforcing jig 60 is attached to the lower part of the substrate 30 arranged vertically, the substrate 30 is in a state of being tensioned downward by the weight of the substrate reinforcing jig 60. Yes. Accordingly, even when the substrate 30 is thin (0.2 to 0.3 mm), the substrate 30 can withstand the pressure due to the flow of the plating solution 12.

  In addition, even when pressure is applied to the substrate 30 to cause the substrate 30 to move laterally, the roller 66 of the substrate reinforcing jig 60 abuts against the lower surface (inclined surface S) of the guard rail 40 and does not move. Therefore, there is no possibility that the substrate 30 is detached from the guard rail 40.

  As described above, in the vertical transfer type plating apparatus 1 of the present embodiment, the substrate 30 is reinforced by attaching the substrate reinforcing jig 60 to the lower portion of the substrate 30. Thereby, even if pressure is applied to the thin substrate 30 by the convection of the plating solution 12, there is no possibility that the substrate 30 is detached from the guide rail 40.

  Accordingly, it is possible to avoid the stoppage of the apparatus due to a conveyance trouble, so that the production efficiency and the throughput can be improved. In addition, the substrate 30 can be prevented from being damaged due to a conveyance trouble, and the plating can be stably performed on each substrate 30, so that the manufacturing yield of the wiring substrate can be improved.

  In addition, as a method of reinforcing a thin substrate, there is a method of installing a protective plate or the like provided with slits on both sides of the substrate, but the resist pattern is protected especially when a resist pattern is formed on the substrate. Contact with the plate may cause damage. However, in this embodiment, since no obstacle is disposed on both sides of the substrate, the resist pattern is not damaged, and a fine plating pattern can be formed with high reliability.

  In the vertical transfer type plating apparatus 1 of the present embodiment, the substrate reinforcing jig 60 is attached to the lower portion of the substrate 30. Therefore, when long-term processing is taken into consideration, the substrate reinforcing jig 60 is caused by an unexpected apparatus trouble or the like. The case where it falls off and falls is assumed. If the substrate reinforcing jig 60 falls on the bottom surface of the plating tank 10, it is troublesome to take out and the maintenance may become complicated.

  In such a case, as shown in FIG. 8, a support plate 70 may be disposed below the substrate reinforcing jig 60 (between the substrate reinforcing jig 60 and the bottom surface of the plating tank 10). The support plate 70 is disposed in a longitudinal shape along the laterally long direction of the plating tank 10.

  By disposing the support plate 70 directly below the substrate reinforcement jig 60, the substrate reinforcement jig 60 falls onto the support plate 70 even if the substrate reinforcement jig 60 may fall from the substrate 30. Then, the substrate reinforcing jig 60 dropped by the substrate reinforcing jig 60 attached to the substrate 30 to be transported later is pushed and carried to the outlet side of the plating apparatus and can be easily taken out.

  As described above, by disposing the support plate 70 under the substrate reinforcing jig 60, it is possible to improve the maintainability.

(First modification)
FIG. 9 is a cross-sectional view showing a substrate reinforcing jig of a vertical transfer type plating apparatus of a first modification of the present embodiment. As shown in FIG. 9, in the substrate reinforcing jig 60 a of the first modified example, the diameter of the roller 66 is set larger than the overall height of the clip 62. And the support plate 70 is arrange | positioned in the state which contacted the lower part of the roller 66 of the board | substrate reinforcement jig | tool 60a.

  In other words, the roller 66 of the substrate reinforcing jig 60a rotates while being sandwiched between the guide rail 40 and the support plate 70. Thereby, the board | substrate 30 with which the board | substrate reinforcement jig | tool 60a was attached to the lower part can be stably conveyed in the horizontal direction of the plating tank 10. FIG.

  The support plate 70 may be provided with a vertical movement mechanism so that it can move up and down. Further, the support plate 70 may be disposed below the substrate reinforcing jig 60a with a space therebetween.

(Second modification)
FIG. 10 is a cross-sectional view showing a substrate reinforcing jig of a vertical transfer type plating apparatus of a second modification of the present embodiment. As shown in FIG. 10, in the substrate reinforcing jig 60b of the second modified example, when the friction between the substrate reinforcing jig 60b and the guide rail 40 does not matter, the substrate reinforcing jig of FIG. At 60, the roller 66 is omitted.

(Third Modification)
FIGS. 11A and 11B are views showing a substrate reinforcing jig of a vertical transfer type plating apparatus of a third modification of the present embodiment. As shown in FIGS. 11A and 11B, in the substrate reinforcing jig 60c of the third modified example, the thickness of the substrate 30 is used instead of the clip 62 of the substrate reinforcing jig 60 of FIG. A groove 63a corresponding to is provided.

  In the substrate reinforcing jig 60 c of the third modified example, plate-like protrusions 65 are respectively provided at lower portions on both sides of the rod-like member 63, and a belt-like groove 63 a is provided at the upper center portion of the rod-like member 63. The width of the groove 63a is set to be equal to the thickness of the substrate 30, and the substrate reinforcing jig 60c is attached to the substrate 30 by inserting the lower portion of the substrate 30 into the groove 63a of the substrate reinforcing jig 60c.

  The substrate reinforcing jig 60c of the third modified example has a simple structure and can reduce the cost.

(Fourth modification)
FIGS. 12A and 12B are views showing a substrate reinforcing jig of a vertical transfer type plating apparatus of a fourth modified example of the present embodiment. In the substrate reinforcing jig 60d of the fourth modified example, in the substrate reinforcing jig 60c (FIG. 11) of the third modified example, a plurality of rollers 66 are arranged on the side surfaces of the protruding portions 65 on both sides of the rod-shaped member 63 at a predetermined interval. Are connected to each other.

  Further, a support plate 70 is disposed between the bottom of the plating tank 10 and the substrate reinforcing jig 60d, and the rollers 66 of the substrate reinforcing jig 60d are arranged in the same manner as in the first modified example (FIG. 9) described above. It rotates while contacting the lower surface of the guide rail 40 and the upper surface of the support plate 70.

FIG. 1 is a schematic view showing the inside of a plating tank of a vertical conveying type plating apparatus according to the related art relating to the present invention. FIG. 2 is a side view showing a state in which the substrate is conveyed in the plating tank in the vertical conveying type plating apparatus of FIG. FIG. 3 is a diagram (part 1) showing problems of the related art vertical conveyance plating apparatus. FIG. 4 is a diagram (part 2) showing a problem of the vertical conveyance type plating apparatus of the related art. FIG. 5 is a schematic view showing a vertical conveyance type plating apparatus according to an embodiment of the present invention. FIG. 6 is a side view showing a state in which the substrate is conveyed in the plating tank in the vertical conveying type plating apparatus of the embodiment of the present invention. FIG. 7 is a perspective view showing a substrate reinforcing jig of the vertical conveyance type plating apparatus according to the embodiment of the present invention. FIG. 8 is a cross-sectional view showing a state in which a support plate is arranged under the substrate reinforcing jig of the vertical conveyance type plating apparatus of the embodiment of the present invention. FIG. 9 is a cross-sectional view showing a substrate reinforcing jig of a vertical transfer type plating apparatus according to a first modification of the embodiment of the present invention. FIG. 10 is a cross-sectional view showing a substrate reinforcing jig of a vertical transfer type plating apparatus according to a second modification of the embodiment of the present invention. FIGS. 11A and 11B are views showing a substrate reinforcing jig of a vertical transfer type plating apparatus of a third modification of the embodiment of the present invention. FIGS. 12A and 12B are views showing a substrate reinforcing jig of a vertical transfer type plating apparatus of a fourth modification of the embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Vertical conveyance type plating apparatus, 10 ... Plating tank, 12 ... Plating solution, 20 ... Cathode bar, 22 ... Mobile hanger, 24 ... Cathode clip, 25 ... Constant current power supply, 30 ... Substrate, 40 ... Guide rail, 42 ... Slit, 50 ... Anode, 60, 60a-60d ... Substrate reinforcing jig, 62 ... Clip, 62a ... Holding part, 62b ... Pressing part, 62x ... Spring, 63 ... Bar-like member, 63a, 64a ... Groove, 64 ... Shaft portion, 65 ... projecting portion, 66 ... roller, 70 ... support plate, S ... inclined surface.

Claims (10)

A vertical conveying type plating apparatus for plating the substrate by moving the plating solution in the plating tank in a state where the substrate is vertically set up,
A first clip that sandwiches the upper portion of the substrate and hangs the substrate into the plating tank;
A guide rail that is arranged along the moving direction of the substrate in the lower part in the plating tank, and that guides the substrate by arranging the lower part of the substrate in a slit formed in the central part,
A vertical transfer type comprising a substrate reinforcing jig disposed below the guide rail, provided on the substrate with a holding portion of the substrate on the upper side, and reinforced by applying gravity to the substrate. Plating equipment.   2. The longitudinal direction according to claim 1, wherein the substrate reinforcing jig includes rollers on both sides thereof, and the substrate is transported while the rollers are in contact with the lower surface of the guide rail and are not rotated. Mold conveying type plating equipment.   The substrate reinforcing jig includes a second clip having the clamping portion, wherein the plurality of second clips are arranged at regular intervals in the lateral direction, and the plurality of second clips are shaft portions. The vertical conveying type plating apparatus according to claim 1, wherein rollers are connected to both ends of the shaft portion.   The said board | substrate reinforcement jig | tool is equipped with the 2nd clip which has the said clamping part, and the said 2nd clip clamps the lower part of the said board | substrate, It is any one of Claim 1 thru | or 3 characterized by the above-mentioned. The vertical conveyance type plating apparatus as described.   The vertical conveying plating apparatus according to claim 1, wherein the substrate reinforcing jig includes a groove as the clamping portion, and a lower portion of the substrate is inserted into the groove.   The vertical surfaces according to any one of claims 1 to 5, wherein each lower surface of the guide rail disposed on both sides of the slit is an inclined surface that descends outward from the slit side. Mold conveying type plating equipment. The first clip sandwiching the top of the substrate is connected to a cathode;
The vertical conveyance type plating apparatus according to claim 1, wherein an anode is further disposed in the plating tank.   7. A support plate for supporting the substrate reinforcing jig when the substrate reinforcing jig drops from the substrate is disposed between the substrate reinforcing jig and the bottom surface of the plating tank. The vertical conveyance type plating apparatus according to claim 1.   The support plate which contacts the lower part of the said roller is arrange | positioned under the said board | substrate reinforcement jig | tool, The said roller rotates in contact with the said guide rail and the said support plate. The vertical conveyance type plating apparatus as described in any one of Claims.   The vertical conveyance type plating apparatus according to any one of claims 1 to 6, wherein the substrate has a thickness of 0.1 to 0.5 mm.

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