KR102112448B1 - Apparatus for Plating Printed Circuit Boards - Google Patents

Abstract

The present invention relates to an apparatus for plating a printed circuit board, capable of uniformly forming the plating thickness of a printed circuit board by allowing a plating solution to be injected while the printed circuit board is guided to a center of a plating solution injection apparatus to be fixed. The apparatus for plating a printed circuit board comprises: anode electrodes installed on both inner surfaces of a plating bath; plating solution supply pipes of the plating solution injection apparatus, installed on both ends inside the plating bath to be erected, by inserting lower parts into lower fixing members installed on both ends of a lower surface of the plating bath and fixing upper parts to an inner surface of one side of upper fixing members installed on both ends of the plating bath; a printed circuit board, which is an object to be plated, installed between the plating solution supply pipes of the plating solution injection apparatus; and upper and lower clamps for constricting upper and lower parts of the printed circuit board. In addition, upper fitting guide units and lower fitting guide units are formed to protrude inward between the plating solution supply pipes or on upper and lower parts of each of the plating solution supply pipes, and an upper fitting protrusion unit and a lower fitting protrusion unit formed to protrude from the outside of upper and lower ends of both sides of each of the upper and lower clamps are fitted and coupled to guide grooves of each of the upper fitting guide unit and the lower fitting guide unit.

Description

Apparatus for Plating Printed Circuit Boards}

The present invention relates to a plating apparatus, and more particularly, to guide the printed circuit board conveyed from the plating apparatus for a printed circuit board to the center of the plating liquid spraying device, thereby fixing the plating thickness of the printed circuit board by spraying the plating liquid. It is to be able to form uniformly.

Printed Circuit Board (PCB) serves to mechanically fix components while supplying power, etc., by electrically connecting components to each other through wiring patterns formed on insulating materials such as phenolic resin insulating plates or epoxy resin insulating plates. As to be performed, the printed circuit board includes a single-sided PCB in which wiring is formed only on one side of an insulating substrate, a double-sided PCB in which wiring is formed on both sides, and an MLB (multi-layered printed circuit board) multi-layered.

In the process of manufacturing a double-sided PCB or MLB, both sides of the PCB are formed at the same time by forming circuit patterns on both sides or forming a protective layer made of gold (Au), nickel (Ni), etc. on the contact pad formed on the outermost layer. It may include a step of proceeding the plating at the same time.

Conventional plating apparatus for plating a printed circuit board is to put a plurality of substrates into the plating bath, the plating solution sprayed from the nozzle to perform plating on the substrate. Since several printed circuit boards are contained, the plating liquid is not stagnant due to the non-uniformity of the flow in the plating bath or the flow of the plating liquid flowing into the gap formed between the substrates is not smoothly formed. Therefore, the plating is not made uniformly, which causes a quality defect of the substrate.

According to the prior art Republic of Korea Patent No. 10-1316727 proposed to solve this problem, the vertical continuous plating device is continuously moved in a state in which the printed circuit board contained in the plating bath is hung on a hanger and immersed in a plating solution. The plating is uniformly performed by electroplating copper plating by electroplating reaction by the plating liquid sprayed by the plating liquid spraying device installed at both ends, and the electrochemical reaction is a cathode which is a reducing electrode directly connected to the printed circuit board P (cathode) and an anode installed parallel to the printed circuit board.

However, in the prior art, the printed circuit board is irregularly shaken on both sides by the injection pressure when the plating liquid is sprayed through the plating liquid spraying device while the printed circuit board is suspended from the clamp installed on the hanger, so that the plating liquid is uniformly printed on the printed circuit board. Is not sprayed, and this causes the plating layer to be plated on the printed circuit board to be formed thickly and non-uniformly, resulting in a deviation in plating of the printed circuit board, and this plating deviation decreases the uniformity of the plated substrate and increases the plating defect rate. do.

An object of the present invention is to provide a plating apparatus for a printed circuit board capable of further improving plating quality by reducing plating variations.

The present invention is an anode electrode installed on both inner surfaces of the plating bath; A plating solution supply pipe of a plating liquid spraying device installed on both ends of the plating tank by fixing the lower portion to the lower fixing member installed at both ends of the lower surface of the plating tank and fixing the upper portion to one inner surface of the upper fixing member installed at both ends of the plating tank; A printed circuit board which is an object to be plated installed between the plating liquid supply pipe of the plating liquid injection device and the plating liquid supply pipe of the plating liquid injection device; And an upper clamp and a lower clamp for stenciling the upper and lower portions of the printed circuit board, wherein the upper and lower clamps are inwardly disposed above and below each of the plating liquid supply pipe and the plating liquid supply pipe and between the plating liquid supply pipe and the plating liquid supply pipe. An upper fitting protrusion and a lower fitting protrusion are formed on the guide grooves of the upper fitting guide part and the lower fitting guide part, respectively, protrudingly forming the guide part and the lower fitting guide part, and projecting outwardly on the upper and lower sides of each of the upper clamp and the lower clamp. It is characterized by a fitting configuration.

In the present invention, the plating solution sprayed through the spray nozzle of the plating liquid spraying device is plated on the printed circuit board while the printed circuit board, which is the object to be plated, is fixed without shaking, thereby achieving uniform plating to reduce plating deviation. Therefore, it has the effect of further improving the plating quality.

1 is an overall configuration cross-sectional view of a printed circuit board plating apparatus according to the present invention.
Figure 2a is a cross-sectional view taken from the plating liquid injection device of the printed circuit board plating apparatus according to the present invention.
Figure 2b is a cross-sectional view taken from the plating liquid injection device and the clamp portion of the printed circuit board plating apparatus according to the present invention.
3 is an exploded perspective view of a printed circuit board plating apparatus according to the present invention, in which the plating liquid spraying device and the clamped printed circuit board are separated.
4 is a cross-sectional view of an overall configuration of another embodiment of a printed circuit board plating apparatus according to the present invention.
Figure 5 is a cross-sectional view of the overall configuration of another embodiment of a printed circuit board plating apparatus according to the present invention.

The present invention relates to a printed circuit board plating apparatus that sprays the plating solution injected into the plating tank (10) so that a plating process is performed. In particular, the present invention provides plating for plating both sides of a printed circuit board as shown in FIG. It is intended to provide a device.

1 is a cross-sectional view of the overall configuration of the printed circuit board plating apparatus according to the present invention, and FIG. 2A is a cross-sectional view taken from the plating liquid spraying apparatus of the printed circuit board plating apparatus according to the present invention, and FIG. A cross-sectional view taken from the plating liquid spraying device and the clamp portion of the circuit board plating device, and FIG. 3 is an exploded perspective view of the printed circuit board plating device according to the present invention separating the printed circuit board and the clamping printed circuit board.

The present invention includes anode electrodes 21 and 22 provided on both inner surfaces of the plating bath 10; The lower part is fitted to the lower fixing member 10-1 installed at both ends of the lower surface of the plating bath 10, and the upper part is fixed to one inner surface of the upper fixing member 10-2 installed at both ends of the plating bath 10. A plating liquid supply pipe 30, 31, 32, 33 of the plating liquid spraying device installed on both ends of the plating tank 10; A printed circuit board 40 as a plated object installed between the plating liquid supply pipes 30 and 31 of the plating liquid spraying device and the plating liquid supply pipes 32 and 33 of the plating liquid spraying device; And an upper clamp 51 and a lower clamp 52 for narrowing the upper and lower portions of the printed circuit board 40, between the plating liquid supply pipe 30 and the plating liquid supply pipe 31 and the plating liquid supply pipe The upper fitting guide portion 30A, 32A and the lower fitting guide portion 31A, 33A are projected to the upper and lower portions, respectively, between the 32 and the plating liquid supply pipe 33, and the upper clamp 51 The upper fitting protrusions 51A, the lower fitting protrusions 52A, which protrude outwardly from the upper and lower sides of each of the lower clamp 52 and the lower fitting protrusions 52A, and the upper fitting guide parts 30A, 32A, and lower fitting guide parts 31A (33A) each guide groove (30A ') (32A'), (31A ') (33A') can be configured to fit, and the plating liquid supply pipe 30, 31, 32 of the plating liquid injection device (33) The plating liquid injection branch pipes 30-1 and 32-1 are provided with nozzles 30-1 'and 32-1' at regular intervals.

The plating liquid injection device referred to above circulates the plating liquid inside the plating liquid supply pipes 30, 31, 32, 33, and the plating liquid injection branch pipes 30-1, 32-1 and the plating tank 10 Pump (P), filter (F), between the plating solution supply pipe 30 and the plating solution supply pipe 31 and between the plating solution supply pipe 32 and the plating solution supply pipe 33, each upper fitting guide portion 30A (( 32A) and a lower fitting guide portion (31A) (33A), the configuration, the plating liquid circulated by the pump (P) is supplied to the plating liquid supply pipes 30, 31, 32, 33 as shown in FIG. It is sprayed on both sides of the printed circuit board 40 by the nozzles 30-1 'and 32-1' through the plating liquid injection branch pipes 30-1 and 32-1.

Inside the upper clamp 51 and the lower clamp 52, as shown in Figure 4, the upper and lower edges of the printed circuit board 40 can be clamped by elastic pieces (51-1) (52-1) It is possible to install, and the separation of the printed circuit board 40 narrowed to the elastic pieces 51-1 and 52-1 is easily separated by the elastic force of the elastic pieces 51-1 and 52-1. It can be designed and provided as possible, and the electrochemical reaction is made by the cathode, which is a reduction electrode directly connected to the printed circuit board 40, and the anode electrode 21, 22 installed in parallel with the printed circuit board 40.

Then, the guide protrusion 52-2 protruding to the lower portion of the lower clamp 52 is fitted to the fixed guide member 52-3 fixedly installed on the bottom surface of the plating tank 10, and the upper clamp 51 ) When the upper clamp 51 is transferred in the longitudinal direction within the plating tank 10 by the transfer member 60 installed at the top, the guide protrusion 52-2 protruding to the lower portion of the lower clamp 52 is fixed. It can be stably transported along the guide member 52-3.

The present invention having such a configuration, after storing the plating solution in the plating bath 10, the upper clamp 51 and the lower clamp 52, the upper fitting protrusion 51A, the lower fitting formed on both sides of the upper and lower outwardly projecting The protrusions 52A are fitted into the guide grooves 30A ', 32A', and 31A '(33A') of the upper fitting guides 30A, 32A and lower fitting guides 31A, 33A, respectively. In the state, the plating liquid is supplied to the plating liquid supply pipes 30, 31, and 32, 33 by the control signal of the controller (not shown), and the nozzles are supplied through the plating liquid injection branch pipes 30-1 and 32-1. 30-1 ') (32-1') is to be sprayed on both sides of the printed circuit board 40 to perform plating. In particular, the present invention is the upper clamp 51 and the lower clamp 52 on each side of each side The upper fitting protrusions 51A and the lower fitting protrusions 52A protruding outward from the lower end of the upper fitting guide parts 30A, 32A and lower fitting guide parts 31A, 33A Guide grooves (30A ') (32A'), (31A ') (33A') can be kept in a state of being sandwiched in the plating tank 10 when the plating liquid is sprayed to the upper clamp (51) and lower clamp (52) Since the printed circuit board 40 is constricted, it is possible to prevent the printed circuit board 40 from shaking left and right due to the injection pressure of the plating liquid, thereby printing the same plating liquid injection pressure. Since it is applied to both sides of the circuit board 40, uniform plating can be performed and the thickness of the plating layer can be uniformly reduced, thereby significantly reducing plating deviation, thereby further improving the reliability of plating.

Figure 4 is a cross-sectional view showing another embodiment of the present invention, the nozzle 30-1 '(32-1') through the plating liquid injection branch pipe (30-1) (32-1) constituting the plating liquid injection device When the plating solution is sprayed on both sides of the printed circuit board 40, the upper clamp 51 and the lower clamp 52 are respectively on the upper and lower sides of the upper and lower clamps 52 to further prevent shaking of the printed circuit board 40 by the injection pressure. The upper fitting protrusions 51A and the lower fitting protrusions 52A are provided with iron pieces 51A-1 and 52A-1, and the plating liquid supply pipe 32 and the plating liquid supply protruding upward and downward. Electromagnets 30A-1 (32A-1) and electromagnets 31A-1 (33A) inside each of the upper fitting guides 30A, 32A and lower fitting guides 31A, 33A between the pipes 33 -1) can be installed to fix the printed circuit board 40.

According to this configuration, the upper clamp 51 and the lower clamp 52, the upper fitting protrusion (51A), the lower fitting protrusion (52A) formed by protruding the upper and lower sides of each of the upper clamp guide portion (30A) ( 32A) and the lower fitting guides 31A, 33A, each of the guide grooves 30A ', 32A', and 31A ', 33A' is inserted into the electromagnet by a control signal of a control unit (not shown). When the current is supplied to the 30A-1) (32A-1) and the electromagnets 31A-1 (33A-1), iron pieces installed inside each of the upper fitting protrusion 51A and the lower fitting protrusion 52A by electromagnetic force (51A-1) (52A-1) by attracting the electromagnet (30A-1) (32A-1) and the electromagnet (31A-1) (33A-1) is generated by the attraction of the printed circuit board (40) The stenosis upper clamp 51 and the lower clamp 52 are further fixed to prevent shaking of the printed circuit board 40 in the left and right directions, so that the same plating liquid injection pressure is the amount of the printed circuit board 40. Since it is applied to more reliably injected into the coating quantity, which results can be made uniform plating.

5 is a view showing another embodiment of the present invention, the upper clamp 51 and the lower clamp 52, the upper fitting protrusion 51A, the lower fitting protrusion 52A formed to protrude to the upper and lower sides of each side. Magnets 51A-2 and 52A-2 are installed inside, and upper and upper guide portions 30A and 32A are respectively provided between the plating liquid supply pipe 32 and the plating liquid supply pipe 33 protruding upward and downward. ) And the lower fitting guides 31A, 33A, the magnets 30A-2, 32A-2 and 31A-2 (33A-2) can be installed inside, and according to this configuration, , The upper fitting protrusion 51A, the lower fitting protrusion 52A, the upper fitting guide portion 30A, 32A, and the upper fitting protrusion 51A formed to protrude outwardly from the upper and lower sides of each of the lower upper clamp 51 and the lower clamp 52, and When guided and fitted into the guide grooves 30A ', 32A', and 31A ', 33A' of the lower fitting guides 31A, 33A, the magnets 51A-2, 52A-2, and magnets (30A-2) (32A-2) and magnet (31A-2) Since the 33A-2 is mutually pulled by mutual attraction, it is possible to prevent the shaking of the printed circuit board 40, and when transferring the printed circuit board 40, the upper clamp by the transfer member 60 The transfer can be freed by forcibly transferring the 51 to escape the attraction force between the magnets.

Although the embodiments have been mainly described above, these are merely examples and do not limit the present invention, and those skilled in the art to which the present invention pertains are not exemplified above without departing from the essential characteristics of the embodiments. It will be appreciated that various modifications and applications are possible.

And, the differences related to these modifications and applications should be construed as being included in the scope of the invention defined in the appended claims.

10: plating bath 21, 22: anode electrode
30, 31: plating solution supply pipe 30A, 32A: upper fitting guide
31A, 33A: lower tilt guide 30A-1, 31A-1, 32A-1, 33A-1: electromagnet
40: printed circuit board 51, 52: upper and lower clamp
51-1, 52-1: elastic piece 51A, 52A: upper and lower fitting protrusions
51A-1, 52A-1: Iron piece 60: Transfer member

Claims (5)

Anode electrodes 21 and 22 provided on both inner surfaces of the plating bath 10; The lower part is fitted to the lower fixing member 10-1 installed at both ends of the lower surface of the plating bath 10, and the upper part is fixed to one inner surface of the upper fixing member 10-2 installed at both ends of the plating bath 10. A plating liquid supply pipe 30, 31, 32, 33 of the plating liquid spraying device installed on both ends of the plating tank 10; A printed circuit board 40 as a plated object installed between the plating liquid supply pipes 30 and 31 of the plating liquid spraying device and the plating liquid supply pipes 32 and 33 of the plating liquid spraying device; And an upper clamp 51 and a lower clamp 52 for narrowing the upper and lower portions of the printed circuit board 40, between the plating liquid supply pipe 30 and the plating liquid supply pipe 31 and the plating liquid supply pipe The upper fitting guide portion 30A, 32A and the lower fitting guide portion 31A, 33A are projected to the upper and lower portions, respectively, between the 32 and the plating liquid supply pipe 33, and the upper clamp 51 The upper fitting protrusions 51A, the lower fitting protrusions 52A, which protrude from the upper and lower sides of each of the upper and lower clamps 52, and the upper fitting guides 30A, 32A, and the lower fitting guides 31A (33A) A printed circuit board plating apparatus characterized in that it is fitted into each guide groove (30A ') (32A') and (31A ') (33A'). According to claim 1, The plating liquid supply pipes 30, 31, 32, 33 of the plating liquid spraying device are provided with nozzles 30-1 'and 32-1' at regular intervals. Printed circuit board plating apparatus, characterized in that it is configured to install the plating liquid spray branch pipe (30-1), (32-1) formed. The method according to claim 1, wherein the guide projection (52-2) protruding to the lower portion of the lower clamp (52) is fitted to the fixed guide member (52-3) fixedly installed on the bottom surface of the plating tank (10), and the upper When the upper clamp 51 is transported in the longitudinal direction within the plating tank 10 by the transfer member 60 installed on the upper end of the clamp 51, the guide projection 52-2 protruding below the lower clamp 52 ) Is a printed circuit board plating device characterized in that it is configured to be stably transferred along the fixed guide member (52-3). According to claim 1, The upper clamp 51 and the lower clamp 52, the upper fitting protrusion (51A), protruding outwardly formed on both sides of each of the upper clamp (51A), the lower fitting protrusion (52A) inside the iron piece (51A-1) ( 52A-1), upper and lower guide portions 30A, 32A, and lower fitting guide portions 31A between the plating liquid supply pipe 32 and the plating liquid supply pipe 33 protruding outwardly from the upper and lower sides. (33A) A printed circuit board plating apparatus characterized in that the electromagnets 30A-1 (32A-1) and electromagnets 31A-1 (33A-1) are installed inside. According to claim 1, The upper clamp 51 and the lower clamp 52, both sides of the upper and lower projections protruding outwardly formed upper (51A), the lower fitting projection (52A) inside the magnet (51A-2) ( 52A-2), upper and lower guide portions 30A, 32A, and lower fitting guide portions 31A, respectively, between the plating liquid supply pipe 32 and the plating liquid supply pipe 33 protruding upward and downward. (33A) A printed circuit board plating apparatus characterized in that a magnet 30A-2 (32A-2) and a magnet 31A-2 (33A-2) are installed inside.

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