KR200390905Y1 - PCB mask structure of plating equipment - Google Patents

PCB mask structure of plating equipment Download PDF

Info

Publication number
KR200390905Y1
KR200390905Y1 KR20-2005-0011321U KR20050011321U KR200390905Y1 KR 200390905 Y1 KR200390905 Y1 KR 200390905Y1 KR 20050011321 U KR20050011321 U KR 20050011321U KR 200390905 Y1 KR200390905 Y1 KR 200390905Y1
Authority
KR
South Korea
Prior art keywords
pcb
plating
mask
rack
held
Prior art date
Application number
KR20-2005-0011321U
Other languages
Korean (ko)
Inventor
박용순
Original Assignee
주식회사 티케이씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 티케이씨 filed Critical 주식회사 티케이씨
Priority to KR20-2005-0011321U priority Critical patent/KR200390905Y1/en
Application granted granted Critical
Publication of KR200390905Y1 publication Critical patent/KR200390905Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/18—Construction of rack or frame

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

본 고안은 인쇄회로기판(이하, PCB라 칭함) 도금 작업시 이 PCB에 전기 전도성의 편차를 저감하여 양질의 도금을 형성시키는 도금설비의 인쇄회로기판 마스크 구조에 관한 것으로, 캐리어 바아(1)를 따라 현가되는 행거(2)의 랙크(3)에 보유 지지되어 도금조(4)의 도금액(5)에 침전되면서 도금처리되는 PCB(6)의 도금 공정설비에 있어서, 상기 랙크에 보유 지지된 PCB(6) 전후면 양쪽에는 각각의 마스크(7)를 착탈식으로 끼워 넣는 마스크 가이드(8)가 설치되고, 이 마스크 가이드(8) 내에 삽입되는 마스크(7)는 PCB(6)와 같은 사각형 구조를 갖추되, 테두리(7a)를 갖는 개방공간(7b)이 형성되어 있다.The present invention relates to a printed circuit board mask structure of a plating facility that reduces the variation of electrical conductivity on the PCB during the plating operation of the printed circuit board (hereinafter referred to as PCB), thereby forming a carrier bar (1). In the plating process equipment of the PCB (6) which is held by the rack (3) of the hanger (2) which is suspended along the way, is deposited in the plating solution (5) of the plating bath (4), the PCB held by the rack (6) On both front and rear surfaces, a mask guide 8 for detachably inserting each mask 7 is provided, and the mask 7 inserted into the mask guide 8 has a rectangular structure such as the PCB 6. An open space 7b having a rim 7a is formed.

Description

도금설비의 인쇄회로기판 마스크 구조{PCB mask structure of plating equipment}Printed circuit board mask structure of plating equipment {PCB mask structure of plating equipment}

본 고안은 인쇄회로기판(이하, PCB라 칭함) 도금 작업시 이 PCB에 전기 전도성의 편차를 저감하여 양질의 도금을 형성시키는 도금설비의 인쇄회로기판 마스크 구조에 관한 것이다.The present invention relates to a printed circuit board mask structure of a plating facility for forming a high quality plating by reducing the variation of electrical conductivity on the PCB during the printed circuit board (hereinafter referred to as PCB) plating work.

통상 PCB 도금 공정시 행거에 의하여 이송 운반되는 PCB는 전처리공정과 도금공정 및 후처리공정을 거쳐 도금이 완료되는바, 이중 PCB 도금공정은 전기 전도성을 이용하여 도금액이 담겨진 도금조에 PCB가 침전되어 이송되면서 회로에 금, 은, 동, 니켈 등이 도금 되어진다.In general, the PCB, which is transported by a hanger during PCB plating, is plated through a pretreatment process, a plating process, and a post-treatment process. In the double PCB plating process, PCB is deposited and transferred to a plating bath containing plating solution using electrical conductivity. As a result, the circuits are plated with gold, silver, copper and nickel.

즉 행거의 랙크에 의해 보유 지지된 PCB는 도금조의 도금액에 침전되어 도금이 이루어지게 되는데, 이때 도금조에 침전된 PCB 도금시 고전류와 저전류 전기 전도성에 의해 PCB기판 전체에 고르게 전류가 공급되지 않는다.That is, the PCB held by the rack of the hanger is deposited by plating in the plating solution of the plating bath. At this time, the current is not evenly supplied to the entire PCB substrate by the high current and the low current electrical conductivity when plating the PCB deposited in the plating bath.

예를 들어 랙크에 의해 보유 지지된 PCB의 각 모서리 부분에는 고전류 전기 전도성이 발생하는 반면, PCB 중앙부분에는 저전류 전기 전도성이 발생하여 도금작업시 이들 전기 전도성의 고저에 의해 도금편차가 발생하게 되며, 이러한 도금편차는 도금되는 PCB의 균일성을 떨어뜨리고 불량률을 증가시키는 문제점이 제기되었다.For example, high current electrical conductivity occurs at each corner of the PCB held by the rack, while low current electrical conductivity occurs at the center of the PCB, and plating deviation occurs due to the high and low electrical conductivity during plating. In addition, this plating deviation has caused a problem of reducing the uniformity of the PCB to be plated and increase the defective rate.

이에 본 고안은 상기와 같은 종래 문제점을 해결하기 위해 안출된 것으로, PCB 도금시 도금조에 공급되는 고전류와 저전류에 의한 도금편차를 최소화시키어 도금이 PCB 전체에 고르게 이루어지면서 PCB 도금 제조비용도 저감시키는 도금설비의 인쇄회로기판 마스크 구조를 제공함에 그 목적이 있다.Therefore, the present invention has been devised to solve the conventional problems as described above. By minimizing the plating deviation caused by the high current and the low current supplied to the plating bath during the PCB plating, the plating is evenly made throughout the PCB, thereby reducing the PCB plating manufacturing cost. The purpose is to provide a printed circuit board mask structure of the plating equipment.

상기와 같은 목적을 달성하기 위한 본 고안은 캐리어 바아를 따라 현가되는 행거의 랙크에 보유 지지되어 도금조의 도금액에 침전되면서 도금처리되는 PCB의 도금 공정설비에 있어서, 상기 랙크에 보유 지지된 PCB 전후면 양쪽에는 각각의 마스크를 착탈식으로 끼워넣는 마스크 가이드가 설치되고, 이 마스크 가이드 내에 삽입되는 마스크는 PCB와 같이 사각형 구조를 갖추되, 테두리를 갖는 개방공간이 형성되어 있으며 이 개방공간은 도금할 PCB의 면적보다 약간 크게 형성되어 있다.The present invention for achieving the above object is in the plating process equipment of the PCB is plated while being held in the rack of the hanger suspended along the carrier bar and precipitated in the plating solution of the plating bath, PCB front and rear surfaces held in the rack Mask guides are installed on both sides of the mask to detachably insert the masks. The masks inserted into the mask guides have a rectangular structure like a PCB, and have an open space having an edge, and the open space of the PCB to be plated is formed. It is slightly larger than the area.

이하, 본 고안을 첨부된 예시도면에 의거 상세히 설명한다.Hereinafter, the present invention will be described in detail based on the accompanying drawings.

도 1과 도 2는 본 고안에 따른 마스크가 도금조에 설치된 정면도와 그 횡단면도이고, 도 3은 도 2의 부분 확대 단면도이며, 도 4는 본 고안의 요부인 마스크 구조의 확대 정면도이다.1 and 2 are a front view and a cross-sectional view of the mask according to the present invention installed in the plating bath, Figure 3 is a partial enlarged cross-sectional view of Figure 2, Figure 4 is an enlarged front view of a mask structure that is the main part of the present invention.

본 고안은 캐리어 바아(1)를 따라 현가되는 행거(2)의 랙크(3)에 보유 지지되어 도금조(4)의 도금액(5)에 침전되면서 도금처리되는 PCB(6)의 도금 공정설비에 있어서, 상기 랙크(3)에 보유 지지된 PCB(6) 전후면 양쪽에는 각각의 마스크(7)를 착탈식으로 끼워 넣는 마스크 가이드(8)가 설치되고, 이 마스크 가이드(8) 내에 삽입되는 마스크(7)는 PCB(6)와 같은 사각형 구조를 갖추되, 테두리(7a)를 갖는 개방공간(7b)이 형성되어 있으며, 이 개방공간(7b)은 도금할 PCB(6)의 면적보다 약간 크게 형성되어 있다.The present invention is held in the rack (3) of the hanger (2) suspended along the carrier bar (1) is deposited in the plating solution (5) of the plating bath (4) to the plating process equipment of the PCB (6) to be plated In this case, a mask guide 8 for detachably inserting each mask 7 is provided on both front and rear surfaces of the PCB 6 held by the rack 3, and a mask inserted into the mask guide 8 7) has the same rectangular structure as the PCB 6, but has an open space 7b having an edge 7a, which is slightly larger than the area of the PCB 6 to be plated. It is.

그리고 상기 도금조(4)의 하단부에는 PCB(6)가 도금액(5)에서 침전되어 이동할 때 이 PCB(6)를 보유 지지하는 랙크(3)가 안정적으로 이동할 수 있도록 랙크 안내 가이드(9)가 설치되어 있으며, 이 랙크 안내 가이드(9) 양쪽으로 마스크 가이드(8)들이 접하여 설치되어 있다.And at the lower end of the plating bath 4, the rack guide guide 9 is provided so that the rack 3 holding the PCB 6 can be stably moved when the PCB 6 is precipitated in the plating solution 5 and moved. The mask guides 8 are provided in contact with both sides of the rack guide guides 9.

한편, 도 4와 같은 마스크(7)는 도 1에 도시된 바와 같이 도금조(4)에서 랙크(3)에 의해 이송되는 PCB(6)의 이송공정 전체에 따라 다수 개가 연속으로 설치되어 있는데, 이 갯수는 도금조의 크기와 도금할 PCB(6) 공정에 따라 다양하게 변경될 수 있음은 물론이다.On the other hand, as shown in FIG. 4, as shown in FIG. 1, a plurality of masks 7 are continuously installed in accordance with the entire transfer process of the PCB 6 transferred by the rack 3 from the plating bath 4. This number can of course vary depending on the size of the plating bath and the PCB 6 process to be plated.

또한, 한 개의 마스크(4)에 형성된 4각형의 개방공간(7b)은 도금할 PCB(6)의 전면크기에 비하여 약간 크게 설정되어 있으며, 이 개방공간(7b)을 따라 4각 테두리(7a)가 형성되어 있다.In addition, the quadrangular open space 7b formed in one mask 4 is set slightly larger than the front size of the PCB 6 to be plated, and the quadrilateral edge 7a is along the open space 7b. Is formed.

한편, 본 고안이 도 1과 도 2와 같이 도금조(4)에 설치된 상태에서 랙크(3)에 보유 지지된 PCB(6)를 도금액(5) 내에서 도금할 경우, 도금되는 PCB(6)의 모서리 부근에 집중적으로 발생하는 고전류 전기 전도성이 마스크(7)의 테두리(7a)에 의해 방지되면서 개방공간(7b)을 통하여 도금액(5)의 전기 전도성을 고르게 유도하여 이 PCB(6)의 도금편차를 저감시키도록 되어 있다.On the other hand, when the present invention is plated in the plating solution 5 the PCB 6 held in the rack 3 in the state installed in the plating bath 4 as shown in Figs. 1 and 2, the PCB 6 to be plated The high current electrical conductivity that occurs intensively around the edges of the mask 7 is prevented by the edge 7a of the mask 7, while evenly inducing the electrical conductivity of the plating solution 5 through the open space 7b to plate the PCB 6. The deviation is reduced.

상기와 같이 본 고안에 따른 도금설비의 인쇄회로기판 마스크 구조는 PCB(6)도금시 이 PCB의 테두리 부근에 주로 집중적으로 발생하는 고전류의 전기 전도성을 방지하여 전기 전도성이 PCB(6)에 고르게 전달되도록 유도함에 따라 도금편차를 저감하고 PCB 도금의 제조비용을 감축시킬 수 있는 효과를 지닌다.As described above, the printed circuit board mask structure of the plating facility according to the present invention prevents high current electrical conductivity mainly generated near the edge of the PCB when plating the PCB 6, thereby uniformly transferring the electrical conductivity to the PCB 6. By inducing it, the plating deviation can be reduced and the manufacturing cost of PCB plating can be reduced.

도 1은 본 고안의 도금설비의 도금구조에 설치된 정면도,1 is a front view installed in the plating structure of the plating equipment of the present invention,

도 2는 도 1의 횡단면도,2 is a cross-sectional view of FIG.

도 3은 도 2의 A부분 확대 단면도,3 is an enlarged cross-sectional view of portion A of FIG. 2;

도 4는 본 고안의 요부인 인쇄회로기판 마스크의 확대 정면도이다.4 is an enlarged front view of a PCB mask which is a main part of the present invention.

-도면의 주요부분에 대한 부호의 설명-Explanation of symbols on the main parts of the drawing

1 : 캐리어 바아, 2 : 행거(Hanger),1: carrier bar, 2: hanger,

3 : 랙크(Rack), 4 : 도금조,3: rack, 4: plating bath,

5 : 도금액, 6 : PCB(Printed Circuit Board),5: plating solution, 6: PCB (Printed Circuit Board),

7 : 마스크(Mask), 7a : 테두리,7: Mask, 7a: Border,

7b : 개방공간, 8 : 마스크 가이드,7b: open space, 8: mask guide,

9 : 랙크 안내 가이드.9: rack guide guide.

Claims (1)

캐리어 바아(1)를 따라 현가되는 행거(2)의 랙크(3)에 보유 지지되어 도금조(4)의 도금액(5)에 침전되면서 도금처리되는 PCB(6)의 도금 공정설비의 마스크 구조에 있어서, It is held in the rack 3 of the hanger 2 suspended along the carrier bar 1, and deposited in the plating solution 5 of the plating bath 4, and deposited on the mask structure of the plating process facility of the PCB 6, which is plated. In 상기 랙크(3)에 보유 지지된 PCB(6) 전후면 양쪽에는 각각의 마스크(7)를 착탈식으로 끼워 넣는 마스크 가이드(8)가 설치되고, 이 마스크 가이드(8) 내에 삽입되는 마스크(7)는 PCB(6)와 같은 사각형 구조를 갖추되, 테두리(7a)를 갖는 개방공간(7b)이 형성되어 이루어진 것을 특징으로 하는 도금설비의 인쇄회로기판 마스크 구조.On both sides of the front and rear surfaces of the PCB 6 held by the rack 3, a mask guide 8 for detachably inserting each mask 7 is provided, and the mask 7 inserted into the mask guide 8 is provided. The PCB 6 has a rectangular structure, such as, the printed circuit board mask structure of the plating equipment, characterized in that the open space (7b) having an edge (7a) is formed.
KR20-2005-0011321U 2005-04-23 2005-04-23 PCB mask structure of plating equipment KR200390905Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR20-2005-0011321U KR200390905Y1 (en) 2005-04-23 2005-04-23 PCB mask structure of plating equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20-2005-0011321U KR200390905Y1 (en) 2005-04-23 2005-04-23 PCB mask structure of plating equipment

Publications (1)

Publication Number Publication Date
KR200390905Y1 true KR200390905Y1 (en) 2005-07-29

Family

ID=43692142

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20-2005-0011321U KR200390905Y1 (en) 2005-04-23 2005-04-23 PCB mask structure of plating equipment

Country Status (1)

Country Link
KR (1) KR200390905Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100845237B1 (en) 2006-09-01 2008-07-10 에스티주식회사 Interval adjustable apparatus of guide for Transfering Boards at copper Plating Line for boards manufacture

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100845237B1 (en) 2006-09-01 2008-07-10 에스티주식회사 Interval adjustable apparatus of guide for Transfering Boards at copper Plating Line for boards manufacture

Similar Documents

Publication Publication Date Title
KR20170026112A (en) Plating apparatus, plating method, and substrate holder
US10968530B2 (en) Electroplating device
KR101917848B1 (en) suction plating device
JP2014129592A (en) Electrolytic plating shield board and electrolytic plating device possessing the same
CN105063730B (en) Electroplating roller
KR200390905Y1 (en) PCB mask structure of plating equipment
JP4794598B2 (en) Plating equipment
KR200389466Y1 (en) PCB mask structure of plating equipment
JP2009293114A (en) Electrolytic plating device and electrolytic plating method
KR20090132090A (en) Jig for printed circuit board plating
JP5822212B2 (en) Electrolytic plating equipment
KR20100026794A (en) Rack for non-electric cupper plating of printed circuit board
KR101135955B1 (en) Mask box structure for PCB of plating equipment
TWI564440B (en) Plating device
CN214572325U (en) Electroplating cathode shielding device
KR101688004B1 (en) A Jig Device for Multistage Plated of Printed Circuit Boards
JP5105172B2 (en) Fixing jig for printed circuit board plating
CN112359399A (en) Electroplating cathode shielding device
JPH04173994A (en) Jig for electroplating of printed circuit board and electroplating method using this jig
CN214529289U (en) Carrier with offset angle
CN102134735A (en) Carrying tool for printed circuit board (PCB)
KR102362127B1 (en) Equipment for manufacturing flexible circuit board
CN219991768U (en) High-quality micropore copper plating device of HDI circuit board
TW202233904A (en) Carrier with offset angle including a sliding table, a vertical frame and a plurality of clamping elements
JP2009120939A (en) Plating apparatus

Legal Events

Date Code Title Description
REGI Registration of establishment
T201 Request for technology evaluation of utility model
FPAY Annual fee payment

Payment date: 20110718

Year of fee payment: 7

EXTG Extinguishment