KR102362127B1 - Equipment for manufacturing flexible circuit board - Google Patents

Abstract

The present invention relates to an apparatus for manufacturing a flexible printed circuit board and to a flexible printed circuit board, and in particular, when depositing a flexible printed circuit board, plasma deposition apparatuses are disposed at upper and lower portions of via holes to make the apparatus compact, process speed is improved, , to an apparatus for manufacturing a flexible printed circuit board capable of uniformly forming a seed layer or a metal layer in a via hole, and a flexible printed circuit board.

Description

Device for manufacturing flexible printed circuit boards {EQUIPMENT FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD}

The present invention relates to an apparatus for manufacturing a flexible printed circuit board.

In general, a flexible printed circuit board is a board that can be flexibly bent by forming a circuit pattern on a thin insulating film, and is widely used in portable electronic devices and automation devices or display products that require bending and flexibility when mounted and used.

A flexible printed circuit board is formed by etching a flexible copper clad laminated film to form a circuit pattern, or by printing a circuit pattern on a flexible insulating film with conductive paste or conductive ink.

The flexible printed circuit board includes a terminal for electrically connecting a circuit pattern to another flexible printed circuit board or a device such as a battery. The flexible printed circuit board has two terminal parts for electrical connection, and it is preferable that the two terminal parts are arranged adjacent to each other to facilitate electrical connection. It is provided on the surface opposite to the surface on which the circuit pattern is formed.

Then, a via hole is formed in the insulating film to connect the circuit pattern formed on different surfaces of the insulating film and the terminal part, and a plating layer is formed in the via hole through plating to connect the circuit pattern and the terminal part.

Korean Patent Application Laid-Open No. 2006-0066971 shows that a conductive layer is formed and a plating layer is formed on the conductive layer, but the process of forming a circuit pattern and forming a plating layer on the wall surface of the via hole are performed separately, thereby complicating the process. have.

In addition, Korean Patent Publication No. 1268101 discloses an apparatus for sequentially plasma coating the upper and lower portions of a substrate. In this way, when the upper and lower portions are sequentially coated while moving the substrate horizontally, there is a problem in that the space occupied by the device increases and the time required for the process increases.

Korean Patent Publication No. 2006-0066971 Korean Patent Publication No. 2006-0018511 Korean Patent Publication No. 1268101

The present invention has been devised to solve the above problems, and the purpose of the present invention is to provide an apparatus for manufacturing a flexible printed circuit board in which the apparatus becomes compact, the process speed is improved, and a seed layer or a metal layer can be uniformly formed in a via hole. have.

An apparatus for manufacturing a flexible printed circuit board according to an embodiment of the present invention for achieving the above object includes a plurality of plasma generating units respectively disposed above and below a substrate having via holes to generate plasma, and at least one plasma The generator is disposed on at least one of the remaining plasma generators to deposit both sides simultaneously or one-sided.

A flexible printed circuit board manufacturing apparatus according to another embodiment of the present invention for achieving the above object includes a first process unit for depositing a seed layer on the upper and lower surfaces of the via hole and on the upper surface of the substrate in a substrate having via holes, the seed layer a second process part for forming a photosensitive layer on the photosensitive layer and forming an engraved pattern on the photosensitive layer; The first process part or the third process part includes a plurality of plasma generators respectively disposed above and below the substrate to generate plasma, and at least one plasma generator is disposed on at least one of the remaining plasma generators. to do with

An apparatus for manufacturing a flexible printed circuit board according to another embodiment of the present invention for achieving the above object includes a first process unit for depositing a seed layer above and below the via hole on a substrate in which a via hole is formed, disposed inside the via hole a third process part for forming a metal layer above and below the seed layer; One plasma generating unit is disposed on at least one of the remaining plasma generating units and vacuum deposition is performed on both sides or one side.

Here, at least two of the plasma generating units may be disposed on the same vertical line to simultaneously deposit both surfaces.

In addition, the plasma generating unit includes a first electrode disposed on the substrate, a first gas supply unit supplying a gas to a lower portion of the first electrode, a first power supply unit supplying power to the first electrode, and a lower portion of the substrate It may include a second electrode disposed on the , a second gas supply unit for supplying gas to the upper portion of the second electrode, and a second power supply unit for supplying power to the second electrode.

In addition, the plasma generating unit includes a first electrode disposed on the substrate, a first gas supply unit supplying gas to a lower portion of the first electrode, a first power supply unit supplying power to the first electrode, and the first A second electrode disposed under the electrode, a second gas supply unit supplying gas to the lower portion of the second electrode, a second power supply unit supplying power to the second electrode, and a third electrode disposed under the base material Including, including a direction changing part for changing the direction so that the upper and lower parts of the substrate passing through the first electrode are reversed, wherein the second electrode and the third electrode are disposed on the downstream side of the direction changing part, The two electrodes may be disposed between the substrates.

According to the flexible printed circuit board manufacturing apparatus of the present invention as described above, when the flexible printed circuit board is deposited, the plasma deposition apparatus is disposed at the upper and lower portions of the via hole, so that the apparatus becomes compact, the process speed is improved, and the via hole is seeded A layer or a metal layer may be uniformly formed.

1 is a flowchart of a flexible printed circuit board manufacturing process according to a preferred embodiment of the present invention.
2 is a schematic diagram of an apparatus for manufacturing a flexible printed circuit board according to a preferred embodiment of the present invention;
3 is a schematic diagram of a first process unit and a third process unit according to a preferred embodiment of the present invention.
4 is a schematic diagram of a first process unit and a third process unit according to another embodiment of the present invention.

Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

For reference, among the components of the present invention to be described below, for the same components as in the prior art, reference will be made to the above prior art, and a separate detailed description thereof will be omitted.

As shown in FIG. 1 , the flexible printed circuit board manufacturing process of this embodiment includes a step 300 of forming a seed layer 2 on a substrate 1 , and photosensitive formed on a substrate 1 having via holes 1a formed therein. A first engraved pattern 4b disposed on or below the via hole 1a in the layer 3, and a second engraved pattern 4a disposed farther than the first engraved pattern 4b from the via hole 1a. A step 410 of forming an intaglio pattern 4 to form, a step of forming the metal layer 20 inside the first intaglio pattern 4b, the second intaglio pattern 4a, and the via hole 1a, respectively (420) It is characterized in that it includes.

The substrate 1 of the flexible printed circuit board is an insulating film having a ductility, and a very thin, flexible, transparent or translucent insulating film is used to maintain the shape of the flexible printed circuit board. The insulating film is a PET film or a PI film as an example, and the PI film is thin and flexible, has excellent heat resistance and bending resistance, has little dimensional change and is strong against heat. It is suitable, and the PET film has the advantage of being relatively cheaper than the PI film.

The via hole 1a is formed vertically through the substrate 1 in order to connect the circuit patterns formed on both surfaces of the substrate 1 .

The via hole 1a is formed through laser drilling at a position where the via hole 1a is to be formed in the circuit pattern 1c formed on the substrate 1, that is, at a position of the via hole 1a preset in the designed circuit.

In addition, in the method for manufacturing a flexible printed circuit board according to the present embodiment, the upper surface of the substrate 1 in order to increase adhesion between the seed layer 2 and the substrate 1 during deposition before the step of forming the seed layer 2 . Alternatively, the method further includes a step 200 of pre-treating a surface such as a lower surface or a wall surface of the via hole 1a.

The substrate 1 is a synthetic resin material having ductility, and adhesion with the seed layer 2 deposited during metal deposition may be insufficient. In the step 200 of pretreating the surface of the substrate 1 , the adhesion between the substrate 1 and the seed layer 2 deposited on the substrate 1 is increased by pretreating the surface of the substrate 1 .

The step 200 of pretreating the surface of the substrate 1 may be a process of surface processing the surface of the substrate 1 to a predetermined roughness or more, and a primer 1b that increases the deposition effect on the surface of the substrate 1 It may be a process of applying

In the present embodiment, the step 200 of pretreating the surface of the substrate 1 is a process of applying a primer 1b to increase the deposition effect, that is, adhesion during deposition, on the surface of the substrate 1 as an example.

The step of pretreating the surface of the substrate 1 may be performed before the step 100 of forming the via hole 1a or after the step 100 of forming the via hole 1a.

The step 200 of pretreating the surface of the substrate 1 is performed after the step 100 of forming the via hole 1a, so that the primer 1b is applied to the wall surface of the via hole 1a and deposited on the inner circumferential surface of the via hole 1a. It is preferable to improve the adhesion of the seed layer 2 to be used.

In the step 300 of forming the seed layer 2 , the seed layer 2 is formed by depositing a metal to a predetermined thickness or less.

The seed layer 2 is formed on the wall surface of the via hole 1a and the upper or lower surface of the substrate 1 . In this embodiment, the via hole 1a is formed on the wall surface and the upper surface of the substrate 1 . Alternatively, the seed layer 2 may be formed on the wall surface of the via hole 1a (formed inside the via hole 1a) and the lower surface of the substrate 1 or the wall surface of the via hole 1a and the upper and lower surfaces of the substrate 1 . Accordingly, the seed layer 2 includes a via hole seed layer 2b and a surface seed layer 2a formed on the wall surface of the via hole 1a.

The thickness of the via hole seed layer 2b formed on the wall surface of the via hole 1a may be 1 nm to 19 nm.

In the step 300 of forming the seed layer 2, copper (Cu), silver (Ag), gold (Au), nickel (Ni), chromium (Cr), tungsten (W), molybdenum (Mo), aluminum As an example, vacuum deposition of a metal such as (Al) or an alloy in which at least two of copper, silver, gold, nickel, chromium, tungsten, molybdenum, and aluminum are mixed is performed on one surface of the substrate 1 .

In the engraved pattern 4 forming step 410, the first engraved pattern 4b and the via hole 1a are disposed above or below the via hole 1a in the photosensitive layer 3 formed on the surface of the surface seed layer 2a. and the second engraved pattern (4a) arranged to be alternately formed at the same time.

That is, the engraved pattern 4 is disposed on the upper or lower side of the via hole 1a and is disposed on the left or right side of the first engraved pattern 4b communicating with the via hole 1a and the upper or lower portion of the via hole 1a to the left or right of the via hole. (1a) includes a second intaglio pattern (4a) disposed farther than the first intaglio pattern (4b). That is, the first engraved pattern 4b is disposed coaxially with the via hole 1a in the vertical direction. The first engraved pattern 4b is formed to have a wider width than the via hole 1a.

The intaglio pattern 4 forming step 410 is, in detail, a process 411 of forming the photosensitive layer 3 on the surface seed layer 2a, and a light transmitting pattern 6a covering the portion where the intaglio pattern 4 is formed. ) and covering the photosensitive layer 3 with a mask 6 in which a portion except for the transmissive pattern 6a is opened ( 412 ); and exposing the photosensitive layer 3 covered with the mask 6 to light the photosensitive layer 3 except for the light transmitting pattern 6a, and removing the light transmitting pattern 6a to form an intaglio pattern 4 and a process 413 of

That is, the mask 6 includes a transmissive pattern 6a covering a portion corresponding to the intaglio pattern 4 formed on the photosensitive layer 3 , and is formed in an open form except for the transmissive pattern 6a . do.

In the step 420 of forming the metal layer 20, the first engraved pattern 4b, the second engraved pattern 4a, and the via hole seed layer 2b formed in the via hole 1a are first, second, and third respectively. Metal layers 20b, 20a, and 20c are formed.

In this way, the first, second, and third metal layers 20b, 20a, and 20c are simultaneously formed through a single process to simplify the manufacturing process, and the roughness of the first, second, and third metal layers 20b, 20a, and 20c is also the same. can be formed

The metal layer 20 is deposited on the surface of the seed layer 2 exposed by the engraved pattern 4 or the like.

The metal layer 20 may be made of gold (Au), silver (Ag), or copper (Cu) as an example. The metal layer 20 serves to lower the resistance of the circuit pattern 1c to be described below, and may adjust the overall resistance to be low. In addition, the metal layer 20 may adjust the resistance value of the electric circuit by adjusting the thickness.

After the step 420 of forming the metal layer 20 , the photosensitive layer 3 is removed, and the seed layer 2 is etched to remove a portion of the seed layer 2 except for the portion covered with the metal layer 20 . Thus, the base metal layers 10a and 10b may be formed.

In the step 500 of forming the base metal layers 10a and 10b, the surface seed layer 2a is etched in the same shape as the first and second metal layers 20b and 20a by photolithography to form the base metal layer 10a, Forming 10b) is taken as an example.

For this reason, the circuit pattern 1c is formed on the surface of the base material 1, and the via hole metal layer 1d is formed in the inside of the via hole 1a and the surface of the base material 1.

The method for manufacturing a flexible printed circuit board according to the present embodiment preferably further includes the step 600 of forming a protective layer 30 by coating the surface of the substrate 1 on which the circuit pattern 1c is formed. The step 600 of forming the protective layer 30 is to form the protective layer 30 by applying PI or PAI to one surface of the substrate 1 and then drying or heat curing to protect the circuit pattern 1c and , prevent the circuit pattern 1c from peeling from the base material 1, prevent deformation or peeling of the shape of the circuit pattern 1c due to bending, and ensure sufficient durability against repeated bending .

The apparatus for manufacturing a flexible printed circuit board to be described below includes a step 300 of forming the seed layer 2, a step 410 of forming an intaglio pattern 4, and a metal layer 20 in the above-described flexible printed circuit board manufacturing process. The forming step 420 is performed successively. Alternatively, the flexible printed circuit board manufacturing apparatus may include an additional device to perform the previous process and the subsequent process.

As shown in FIG. 2, in the apparatus for manufacturing a flexible printed circuit board of this embodiment, a seed layer (2) on the upper and lower surfaces of the via hole (1a) and the upper surface of the substrate (1) in the substrate (1) on which the via hole (1a) is formed. A first process part (50, 50') for depositing a second process part ( 60), a third process part 70 for forming a metal layer 20 on the upper and lower sides of the seed layer 2 and the intaglio pattern 4 disposed inside the via hole 1a, wherein the first hole The top portions 50 and 50 ′ or the third processing unit 70 include a plurality of plasma generating units respectively disposed on the upper and lower portions of the substrate 1 to generate plasma, and at least one plasma generating unit generates the remaining plasma. It is disposed on at least one of the parts and characterized in that both sides are deposited simultaneously or single-sided.

The flexible printed circuit board manufacturing apparatus is a chamber 1000 in which upper and lower deposition of the substrate 1 is simultaneously performed and a chamber so that the substrate 1 is continuously moved in the chamber 1000 in a roll to roll method. It includes rolling parts 40 and 80 installed to correspond to both sides of 1000 . A substrate 1 having a via hole 1a formed thereon is wound around the rolling portions 40 and 80 . The rolling parts 40 and 80 include two rolling parts, the rolling part 40 disposed on the upstream side serves as a roll feeder, and the rolling part 80 disposed on the downstream side is a rewinder. ) plays a role. In addition, the substrate 1 wound around the rolling parts 40 and 80 may be grounded.

Here, when the rolling parts 40 and 80 are disposed on the same horizontal line inside the chamber 1000 , partition walls may be installed to delimit the first, second, and third process parts 50 , 60 , and 70 . However, the present invention is not limited thereto, and in another embodiment, each process may include a separate chamber without a partition wall.

The flexible printed circuit board manufacturing apparatus includes a tension adjusting unit 91 for keeping the substrate 1 passing through the first, second, and third process units 50 , 60 , and 70 flat. The tension control unit 91 is disposed at the rear end and the front end of the rolling units 40 and 80, respectively, so that the substrate 1 is moved in the chamber 1000 while being kept flat.

The first process units 50 and 50' deposit the seed layer 2 on the upper and lower surfaces of the wall surface of the via hole 1a and the upper surface of the substrate 1 on the substrate 1 in which the via hole 1a is formed.

Next, the second process unit 60 forms the photosensitive layer 3 on the seed layer 2 and forms the engraved pattern 4 on the photosensitive layer 3 .

Next, the third process unit 70 forms the metal layer 20 on the upper and lower sides of the seed layer 2 and the intaglio pattern 4 disposed inside the via hole 1a.

The first processing units 50 and 50 ′ and/or the third processing units 70 and 70 ′ for simultaneously depositing the upper and lower portions of the substrate 1 are respectively disposed on the upper and lower portions of the substrate 1 to generate plasma. It includes a plurality of plasma generators, and at least one plasma generator is disposed on the same vertical line on at least one of the remaining plasma generators.

As shown in FIG. 3 , the plasma generating unit of the first processing units 50 and 50 ′ and/or the third processing units 70 and 70 ′ is a first electrode 51 disposed on the substrate 1 . and a first gas supply unit 54 for supplying gas to the lower portion of the first electrode 51 , a first power supply unit 53 for supplying electric power to the first electrode 51 , and a base material 1 disposed under the base 1 . It may include a second electrode 52 , a second gas supply unit 56 for supplying gas to the upper portion of the second electrode 52 , and a second power supply unit 55 for supplying power to the second electrode 52 . have.

The first and second electrodes 51 and 52 are respectively horizontally disposed and disposed to face each other.

When gas and power are supplied to the first and second electrodes 51 and 52 , plasma is formed between the first electrode 51 and the upper portion of the substrate 1 and the second electrode 52 and the lower portion of the substrate 1 .

The substrate 1 can be moved in a non-contact manner with the first and second electrodes 51 and 52 so that the substrate 1 is not scratched. Alternatively, the substrate 1 may move in contact with any one electrode.

As the substrate 1 passes between the first electrode 51 and the second electrode 52 , the upper portion of the substrate 1 is deposited by plasma formed on the upper portion of the substrate 1 , and the lower portion of the substrate 1 . is deposited by plasma formed on the lower portion of the substrate 1 , so that the upper and lower portions of the substrate 1 are simultaneously deposited.

In addition, when depositing only on the upper or lower surface of the substrate 1, the control unit (not shown) is configured to stop supplying gas or power to the second electrode 52 or the first electrode 51 so that only one side is deposited, not both sides. can be controlled

The first and second power supply units 53 may be supplied with RF power.

In addition, a vacuum pump 57 for evacuating the inside of the chamber 1000 may be provided.

Unlike the above, as shown in FIG. 4 , the plasma generating unit includes a first electrode 51 disposed on the substrate 1 and a first gas supply unit supplying a gas to a lower portion of the first electrode 51 . 54, a first power supply unit 53 for supplying power to the first electrode 51, a second electrode 52' disposed under the first electrode 51, and the second electrode ( 52') a second gas supply unit 56' for supplying gas to the lower portion, a second power supply unit 55 for supplying electric power to the second electrode 52', and a second gas supply unit 55 for supplying electric power to the second electrode 52'; It includes three electrodes (58), and includes a direction changing part (59) for changing the direction so that the upper and lower parts of the substrate (1) passing through the first electrode (51) are reversed, and the second electrode (52') ) and the third electrode 58 may be disposed on a downstream side of the direction changing part 59 , and the second electrode 52 ′ may be disposed between the substrate 1 .

A description of the same configuration as in the above-described embodiment will be omitted.

The direction changing part 59 may be provided as a roller disposed on the downstream side of the first electrode 51 . The substrate 1 on which the upper portion is deposited due to the direction changer 59 is rotated 180 degrees and transferred. Accordingly, in the substrate 1, the first deposited portion faces downward, and the non-deposited portion faces upward.

The second electrode 52 ′ may be disposed downstream of the direction change unit 59 , so that deposition may be performed on a non-deposited portion of the substrate 1 .

The second electrode 52 ′ and the third electrode 58 are arranged horizontally and parallel to the substrate 1 .

The second electrode 52 ′ has an upper surface opposite to the first electrode 51 , and a lower surface opposite to the third electrode 58 . That is, the second electrode 52 ′ is disposed under the first electrode 51 , and the third electrode 58 is disposed under the second electrode 52 ′. The third electrode 58 faces the second electrode 52'. In addition, the substrate 1 is respectively disposed between the respective electrodes. Accordingly, the first, second, and third electrodes 51 , 52 ′ and 58 are all arranged on one vertical line.

The second gas supply unit 56' supplies gas to the second electrode 52' so that plasma is generated under the second electrode 52'.

An RF bias may be supplied to the third electrode 58 . Due to the sheath area by the RF bios, there is little difference between the contact or non-contact thin film deposition.

When the seed layer 2 and the metal layer 20 are formed on the substrate 1 through the manufacturing apparatus as described above, the photosensitive layer 1 is removed. In addition, when a portion not covered with the metal layer 20 is removed from the seed layer 2 , the base metal layers 10a and 10b are formed. This subsequent process may be formed by adding a separate device or process unit.

The flexible printed circuit board manufactured by the apparatus for manufacturing the flexible printed circuit board as described above includes a substrate 1 having a via hole 1a formed therein, a base metal layer 10b formed on a wall surface of the via hole 1a, and the base and a metal layer 20 formed on the metal layer 10b.

The substrate 1 is formed in a sheet shape, and the via holes 1a penetrating in the vertical direction are formed in the substrate 1 .

The base metal layers 10a and 10b are formed on a portion of the upper surface of the substrate 1 and upper and lower portions of the wall surface of the via hole 1a.

The base metal layer 10b formed on the wall surface of the via hole 1a is continuously formed with the same material above and below the via hole 1a.

The base metal layers 10a and 10b may include a metal such as copper, silver, gold, nickel, chromium, tungsten, molybdenum, or aluminum, or a mixture of at least two of copper, silver, gold, nickel, chromium, tungsten, molybdenum, and aluminum. It is preferably an alloy.

The base metal layers 10a and 10b are formed through the manufacturing apparatus as described above, and preferably have a black-based color.

The base metal layers 10a and 10b have a black color to remove light reflection and reduce diffuse reflection of light, thereby improving visibility.

The metal layer 20 is formed on the base metal layers 10a and 10b.

The metal layer 20 includes first and second metal layers 20b and 20a disposed on the same surface as the top or bottom surface of the substrate 1 , and a third metal layer 20c disposed inside the via hole 1a . The first metal layer 20b is disposed above or below the via hole 1a, and the second metal layer 20a is disposed farther from the via hole 1a than the first metal layer 20b. That is, the first metal layer 20b is disposed closer to the via hole 1a than the second metal layer 20a.

The base metal layers 10a and 10b and the metal layer 20 are formed to correspond to each other.

The third metal layer 20c is continuously formed of the same material above and below the base metal layer 10b formed on the wall surface of the via hole 1a.

The circuit pattern 1c includes a base metal layer 10a and a second metal layer 20a formed on the surface of the base metal layer 10a.

The via hole metal layer 1d includes a base metal layer 10b and first and third metal layers 20b and 20c formed on the base metal layer 10b.

As an example, the metal layer 20 is made of any one of gold (Au), silver (Ag), and copper (Cu).

The metal layer 20 serves to lower the resistance value of the base metal layers 10a and 10b, and adjusts the resistance value of the circuit pattern 1c including the base metal layer 10a and the second metal layer 20a according to the plated thickness. can

In addition, it is preferable that the flexible printed circuit board according to the present embodiment further includes a protective layer 30 covering the surface of the substrate 1 .

As an example, the protective layer 30 is a coating layer coated by applying PI or PAI and drying it.

The protective layer 30 is coated on the surface of the base material 1 in an area that can cover the base metal layers 10a and 10b and the first and second metal layers 20b and 20a and the via hole 1a to form a circuit pattern 1c. to protect, prevent the circuit pattern 1c from peeling from the base material 1, prevent deformation or peeling of the shape of the circuit pattern 1c due to bending, and ensure sufficient durability against repeated bending. make it possible

The circuit pattern 1c is a circuit designed when designing a flexible printed circuit board, and may be an antenna or a circuit for mounting electronic components, and is a circuit preset at the time of design.

As described above, although described with reference to preferred embodiments of the present invention, those skilled in the art can variously modify or modify the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. can be carried out.

** DESCRIPTION OF SYMBOLS FOR MAJOR PARTS OF THE DRAWING **
1: base material 2: seed layer
3: photosensitive layer 4: engraved pattern
6: Mask
10a, 10b: base metal layer 20: metal layer
30: protective layer
40, 80: rolling part 50, 50': first process part
51: first electrode 52, 52': second electrode
53: first power supply unit 54: first gas supply unit
55: second power supply unit 56, 56': second gas supply unit
57: vacuum pump 58: third electrode
59: direction change unit
60: second process part 70, 70': third process part
91: tension control unit

Claims (6)

delete Rolling parts installed on both sides of the chamber; and
and a first process part, a second process part and a third process part arranged so that the substrate having the via hole wound around the rolling part moves continuously;
The first process part deposits a seed layer on the wall surface of the via hole and the surface of the substrate,
The second process unit forms a photosensitive layer on the seed layer, and removes the via hole portion and a portion where the circuit pattern is to be formed from the photosensitive layer to form an intaglio pattern,
The third process part deposits a metal layer on the surface of the seed layer exposed by the intaglio pattern,
The first processing unit or the third processing unit includes a plurality of plasma generating units respectively disposed on the upper and lower portions of the substrate to generate plasma,
At least one plasma generating unit is an apparatus for manufacturing a flexible printed circuit board, characterized in that it is disposed on at least one of the remaining plasma generating units.
delete 3. The method of claim 2,
At least two of the plasma generating units are arranged on the same vertical line, the flexible printed circuit board manufacturing apparatus, characterized in that the deposition on both sides at the same time.
5. The method of claim 4,
The plasma generator includes a first electrode disposed above the substrate, a first gas supply unit supplying gas to a lower portion of the first electrode, a first power supply unit supplying power to the first electrode, and a lower portion of the substrate An apparatus for manufacturing a flexible printed circuit board, comprising: a second electrode to be used; a second gas supply unit for supplying gas to the upper part of the second electrode;
5. The method of claim 4,
The plasma generating unit includes a first electrode disposed on the substrate, a first gas supply unit supplying gas to a lower portion of the first electrode, a first power supply unit supplying power to the first electrode, and a lower portion of the first electrode A second electrode disposed on the, a second gas supply unit for supplying a gas to the lower portion of the second electrode, a second power supply unit for supplying power to the second electrode, and a third electrode disposed under the base material, ,
and a direction changing unit for changing the direction so that the upper and lower portions of the substrate passing through the first electrode are reversed,
The second electrode and the third electrode are disposed on a downstream side of the direction changing part, and the second electrode is disposed between the substrate.

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