KR101688004B1 - A Jig Device for Multistage Plated of Printed Circuit Boards - Google Patents

A Jig Device for Multistage Plated of Printed Circuit Boards Download PDF

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Publication number
KR101688004B1
KR101688004B1 KR1020150093149A KR20150093149A KR101688004B1 KR 101688004 B1 KR101688004 B1 KR 101688004B1 KR 1020150093149 A KR1020150093149 A KR 1020150093149A KR 20150093149 A KR20150093149 A KR 20150093149A KR 101688004 B1 KR101688004 B1 KR 101688004B1
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South Korea
Prior art keywords
ground pin
vertical member
vertical
rotation
ground
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KR1020150093149A
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Korean (ko)
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김원영
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김원영
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Priority to KR1020150093149A priority Critical patent/KR101688004B1/en
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Publication of KR101688004B1 publication Critical patent/KR101688004B1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The present invention relates to a jig device for multistage plating of a printed circuit board. The present invention includes: a jig frame (10) installed toward the front of a first ground fin (11a); a rotation bar (20); a rotation arm (30) configured to be elastically combined with a hook unit (12a); and a rotation frame. The present invention excessively deforms a separation vertical member.

Description

[0001] The present invention relates to a jig for a multi-

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig apparatus for plating a printed circuit board for electroplating by immersing the surface of a printed circuit board (PCB substrate) in a plating bath, To a jig frame so that a plating operation can be performed at the same time.

Generally, a PCB is a copper wire which is coated with an insulator after being wired on both sides or an end face of an insulating board to form a board by mounting an IC or electronic parts.

PCB boards are classified as single-sided boards, double-sided boards, and multi-layer boards depending on the number of wiring circuit surfaces. The higher the number of layers, the better the mounting force of parts.

Here, the single-sided PCB is mainly used for a product having a relatively complicated circuit configuration such as a radio, a telephone, and a simple instrument using a phenol disc as a substrate, and a double-sided PCB substrate is mainly used for a color TV, a VTR , Facsimile machines and other relatively complex circuits.

In addition, multilayer PCBs are used in high-precision equipment such as computers, electronic exchanges, and high-performance communication equipment.

Recently, various devices have been used for electroplating a PCB substrate with copper (Cu), and most of them use a PCB substrate jig device.

A conventional PCB substrate jig device comprises a frame and a rotation bar hinged to the frame.

The general process of electroplating through such a conventional jig device proceeds in the order of dewatering, polishing, degreasing, dipping, electroplating, post-treatment, and drying.

At this time, the immersion process is carried out by placing the PCB substrate on the jig device and immersing it in a plating bath containing the plating solution.

However, in such a conventional jig device, since the electric power is connected only to the frame, the electric conductivity is extremely unstable.

In addition, when a very thin PCB substrate or a thick PCB substrate is fixed, a rotating bar pushing the PCB substrate does not distribute a uniform force. Therefore, when the PCB substrate is immersed in a plating bath, there is a problem that the PCB substrate swings to the left and right.

As a result, there is a disadvantage in that defective plating due to plating deviation is often caused by shaking of the PCB substrate.

The applicant of the present invention has filed and filed a "Jig device for PCB substrate plating" (Korean Utility Model Registration No. 20-0408105, Patent Document 1) in order to solve the problems of the conventional techniques.

The above-described Patent Document 1 is configured such that a uniform pressing force is transmitted to the pivot bar and the pressing force is varied according to the weight of the PCB through the pivot arm connected to the pivot bar so that the PCB substrate can be more stably fixed. This enables simultaneous energization of the circuit board and the frame, so that it is possible to prevent plating thicknesses and plating deviations from appearing on the PCB substrate due to poor conductivity.

On the other hand, the applicant of the present invention has proposed a jig for multi-stage plating of printed circuit boards (Korean Registered Patent No. 10-0994878, Patent Document 2) by improving the technique of Patent Document 1 to fix the printed circuit board in multiple stages, To increase productivity.

The technical structure thereof is the same as that of Patent Document 1, and a grounding bar is provided adjacent to the turning bar and rotated in the same manner as the turning bar, so that PCB boards are provided in multiple stages at the front and rear of the grounding bar.

However, since the ground bar between the pivot bar and the jig frame restricts the space for positioning the PCB substrate in the PCB substrate installation, it is difficult to install the PCB substrate.

In addition, when the substrate is twisted due to a foreign matter or the like on the surface of the PCB substrate or a problem in processing and storage, the contact point is not uniformly formed.

KR 20-0408105 (2006.02.01) KR 10-0994878 (November 10, 2010)

The present invention provides a jig for multi-stage printing of printed circuit boards, which solves the above-mentioned problems of the prior art, and can improve the productivity of the plating operation by installing PCB boards in multiple stages, The rotation frame is rotatably connected to the upper side of the vertical member of the jig frame so as to be rotatable up and down so that the multi-stages can be easily stacked so that the multistage installation operation can be facilitated.

In addition, the spacing vertical member having the grounding pin is made of a plate-shaped metal plate which is easy to deform, and even when the foreign substance is positioned on the substrate or the substrate is twisted, the grounding pin is partially deformed easily by the pressure through the extending member, So that uniform energization of the entire substrate can be achieved.

In addition, a through hole for guiding the ground pin is formed in the rotation vertical member located apart from the vertical vertical member, so that the position of the ground pin is prevented from being displaced by the deformation of the vertical member, I want to.

In this case, since the bending portion is formed in the rotation vertical member, deformation of the vertical member is not performed more reliably than that of the vertical member, so that guiding of the through hole can be performed more accurately.

In the alignment of the PCB substrate, the parallel protrusion of the vertical member and the vertical member of the jig frame are respectively formed with insertion protrusions, the protrusion through holes are formed in the rotation vertical member, And the insertion protrusion of the jig frame is inserted into the insertion groove of the parallel portion while penetrating the projection through hole of the rotation vertical member having relatively little deformation and is located on the front side relative to the deformation of the vertical member So that the positioning accuracy of the PCB substrate can be enhanced.

In addition, the lower vertical ends of the vertical members and the vertical vertical members are kept connected to each other by the spacing members so that excessive deformation of the vertical vertical members can be prevented.

In order to solve the above problems, a jig device for multi-stage printing of a printed circuit board of the present invention comprises two vertical members (11) arranged in parallel to each other in the vertical direction, And includes an inner space 10a surrounded by a vertical member 11 and a horizontal member 12 in the form of a lattice to support the PCB substrate 1 And a hanger bar 13 is connected to both sides of the upper part of the hanger bar 13. The hanger bar 13 is provided with a clamp 13a formed of a metal material having an end energizable and connected to a power source, A jig frame 10 having a hook 12a on the upper horizontal member 12 and a first ground pin 11a on the vertical member 11; An extension member (21) is installed on the outside of the vertical members (11) on both sides of the jig frame (10) so as to be rotatable with respect to the axis and connected with a second ground pin (22) The second ground pin 22 is disposed in correspondence with the position of the first ground pin 11a so that when the extension member 21 rotates toward the inner space 10a according to the rotation, the second ground pin 22 is identical to the first ground pin 11a A turning bar 20 forming a line; A pivotal arm 30 which is detachably connected to one side of the pivotal bar 20 so as to rotate the pivotal bar 20 and the other side is connected to the hook 12a in a resilient manner; The first ground pin 11a and the second ground pin 22 are hinged to the upper ends of the two vertical members 11 of the jig frame 10 so as to rotate in the forward and backward directions. A third ground pin 64 and a fourth ground pin 65a, which are disposed on both sides of the PCB, so that the ground pins of the PCB are electrically connected to the ground plane of the PCB substrate .

The rotary frame is hinged to the upper ends of two vertical members 11 of the jig frame 10 so as to rotate in the forward and backward directions. Two vertical rotating members 40 provided with through holes 41; A rotation connecting member (50) connecting the lower ends of the two rotation vertical members (40); A connecting portion 61 connected to the upper portion of the rotary vertical member 40, a bent portion 62 formed at the lower portion of the connecting portion 61 and bent forward, and a bent portion 62 connected to the lower end of the bent portion 62 A parallel portion 63 formed of a plate-like metal material having elasticity and being parallel to the rotation vertical member 40; and a parallel portion 63 formed of a plate- A third ground pin (64) protruded toward the front and electrically connected to the ground plane of the single-stage PCB substrate sandwiched between the second ground pin (22) and the second ground pin (22) And a fourth ground pin 65a is provided at an end of the second ground pin 63 so as to protrude from the rear of the third ground pin 64 and penetrate through the through hole 41, And a fourth ground pin 65a and a first ground pin 11a are brought into contact with the ground plane of the two-stage PCB substrate sandwiched between the first ground pin 11a and the second ground pin 11a, And a vertical spaced-apart vertical member (60).

In addition, the rotation vertical member 40 is formed of a plate-shaped metal material, and is formed with a bent portion 42 bent at the side along the longitudinal direction to prevent deformation.

The first insertion protrusions 70 and the second insertion protrusions 70 are inserted into the alignment holes formed in the PCB substrate so as to align the positions of the PCBs on the parallel portion 63 of the spacing vertical member 60 and the vertical member 11, And the rotation vertical member 40 is formed with a protrusion through hole 43 in a straight line so that the second insertion protrusion 71 can be inserted into the rotation vertical member 40, 60 is provided with a groove forming part 72 having an insertion groove 72a into which the end of the second insertion projection 71 is inserted.

In addition, one side is connected to the lower part of the rotation vertical member 40 and the other side is connected to the lower part of the parallel part 63 of the vertical vertical member 60, .

According to the present invention, since the PCB frame is installed in multiple stages to increase the productivity of the plating operation, the rotary frame, which allows the PCB board to be installed in multiple stages, is vertically rotatably connected to the upper side of the vertical member of the jig frame, The lamination can be easily performed, and the multistage installation work can be made easier.

In addition, the spacing vertical member having the grounding pin is made of a plate-shaped metal plate which is easy to deform, and even when the foreign substance is positioned on the substrate or the substrate is twisted, the grounding pin is partially deformed easily by the pressure through the extending member, Uniform energization of the entire substrate can be achieved.

In addition, a through hole for guiding the ground pin is formed in the rotation vertical member located apart from the vertical vertical member, so that the position of the ground pin is prevented from being displaced by the deformation of the vertical member, do.

At this time, since the bending portion is formed in the rotation vertical member, deformation of the vertical member is not performed more reliably than that of the vertical member, so guiding of the through hole can be more accurately performed.

In the alignment of the PCB substrate, the parallel protrusion of the vertical member and the vertical member of the jig frame are respectively formed with insertion protrusions, the protrusion through holes are formed in the rotation vertical member, And the insertion protrusion of the jig frame is inserted into the insertion groove of the parallel portion while penetrating the projection through hole of the rotation vertical member having relatively little deformation and is located on the front side relative to the deformation of the vertical member The alignment accuracy of the PCB substrate can be increased.

In addition, since the separated vertical members and the lower one side of the rotation vertical members are kept connected to each other by the gap holding members, excessive deformation of the vertical vertical members can be prevented.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view showing a jig for multi-stage plating of a printed circuit board of the present invention.
2 is a perspective view showing a state in which the rotating frame rotates upward in the present invention;
3 is a perspective view showing a state in which the rotating frame is rotated downward in the present invention.
4 is a cross-sectional view showing a state in which a rotating frame is positioned between a vertical member and a rotating bar in the present invention.
FIG. 5 is a cross-sectional view illustrating a state in which a PCB substrate is installed before and after the rotary frame in FIG. 4;
6 is a perspective view enlargedly showing a mounting state of a rotating frame in the present invention;
7 is a photograph showing the state before and after the deformation of the parallel portion in the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a jig for multi-stage printing of printed circuit boards according to the present invention will be described in detail with reference to the accompanying drawings.

A jig device for multi-stage printing of a printed circuit board of the present invention comprises a jig frame (10), a rotating bar (20), a rotating piece (30) and a rotating frame.

The jig frame 10 includes two vertical members 11 arranged in parallel to each other in the vertical direction as shown in Fig. 1 and two horizontal members 12 connecting the upper and lower ends of the two vertical members 11 And is formed in a lattice shape to support the PCB substrate 1.

In addition, the vertical space 11 and the inner space 10a surrounded by the horizontal member 12 are provided by the lattice-shaped vertical member 11 in this configuration.

A hanger bar 13 is connected to both sides of the upper portion of the jig frame 10. The hanger bar 13 is provided with a clamp 13a which is made of a metal material having an end energizable and is connected to a power source.

The upper horizontal member 12 of the two horizontal members 12 constituting the jig frame 10 is provided with a hook portion 12a so as to be rotatable as shown in FIG. And when the rotary arm 30 rotates toward the inner space 10a, the rotary arm 30 is engaged with the groove of the end portion of the rotary arm 30 so that the rotary arm 30 is pressed and fixed.

In addition, a plurality of first ground pins (11a) are installed forward in the vertical member (11) constituting the jig frame (10).

As shown in Fig. 1, the pivoting bar 20 is vertically installed outside the vertical members 11 on both sides of the jig frame 10. As shown in Fig.

In addition, as is disclosed in the prior art, it is rotatable about the axis.

An extension member 21 connected to the second ground pin 22 is provided at an end portion of the first ground pin 11a. The second ground pin 11a corresponds to the first ground pin 11a.

Specifically, as shown in FIGS. 2 and 3, when the extension member 21 rotates toward the inner space 10a, the second ground pin 22 is formed to be in line with the first ground pin 11a have.

In addition, the pivoting bar 20 is connected to the vertical member 11 and the guide member 11c to maintain the position thereof.

One end of the rotary arm 30 is detachably connected to the upper portion of the rotary bar 20 to rotate the rotary bar 20 and the other side is elastically coupled to the hook 12a.

The rotary frame is hinged to the upper ends of two vertical members 11 of the jig frame 10 as shown in Fig. 1 as a main component of the present invention, And is rotated downward.

In addition, the rotating frame is provided with a third ground pin 64 and a fourth ground pin 65a, which are arranged in parallel to the first ground pin 11a and the second ground pin 22 on the front and rear sides, respectively.

As a result, as shown in FIG. 5, the ground pins are brought into contact with the ground plane of the PCB substrate while the PCB substrate is positioned in multiple stages before and after the rotation frame.

More specifically, the rotating frame includes a rotating vertical member 40, a rotating connecting member 50, and a vertical member 60 spaced apart from each other.

The rotation vertical member 40 is hinged to the upper end of the two vertical members 11 of the jig frame 10 or the horizontal member 12 at the corresponding position to rotate in the forward and backward directions.

As shown in FIG. 1, two brackets 44 are formed on both sides of the rotation vertical member 40 and have holes for inserting the rotation pins. A plate portion 46 is formed in the middle of the rotation pin 45 and the plate portion 46 is bolted to the rotation vertical member 40 to rotate The pin 45 can be rotated to be rotated.

In addition, the rotation vertical member 40 is provided with a through hole 41 on the same line as the position of the first ground pin 11a.

At this time, the rotation vertical member 40 is made of a plate-like metal material as shown in the figure, and it is preferable that the deformation is minimized unlike the parallel portion 63 of the vertical member 60.

For this purpose, as shown in FIG. 1, a bent portion 42 bent at the side along the longitudinal direction of the rotation vertical member 40 is formed to prevent deformation.

The rotary connecting member 50 is configured to connect the lower ends of the two rotary vertical members 40 as shown.

The spacing vertical member 60 includes a connecting portion 61, a bent portion 62, a parallel portion 63, a third grounding pin 64, and a penetrating portion 65.

1, the connection portion 691 is connected to the upper portion of the rotation vertical member 40. The bending portion 62 is integrally formed at the lower portion of the connection portion 61 and is bent downward toward the front have.

In addition, the parallel portion 63 is integrally connected to the lower end of the bent portion 62 and is parallel to the rotation vertical member 40.

At this time, the parallel portion 63 is made of a plate-like metal material having an elastic force. When the force is received, the parallel portion 63 takes a shape that is temporarily bent and returns to the original position when the applied force is released.

The third ground pin 64 protrudes forward from the parallel portion 63 to correspond to the position of the second ground pin 22 as shown in FIGS. 1 and 5, 22 and the second ground pin 22 to the ground plane of the single-stage PCB substrate 1 sandwiched between the first ground pin 22 and the second ground pin 22.

The penetrating portion 65 protrudes from the parallel portion 63 to the rear of the third grounding pin 64 and penetrates the penetrating hole 41.

The fourth ground pin 65a is provided on the end of the penetrating portion 65 and the fourth ground pin 65a is formed on the ground plane of the two-stage PCB substrate 2 sandwiched between the fourth ground pin 65a and the first ground pin 11a. The first ground pin 11a is brought into contact with and energized.

In the above-described configuration, it is preferable that alignment holes are formed on the PCB substrate for alignment when the PCB substrate is installed, and protrusions for aligning the PCB substrate are provided.

The basic protrusions may be provided with protrusions passing through the PCB substrate which is installed in multiple stages in the vertical member 11.

However, since the single-stage PCB substrate located on the front side is provided in the parallel portion 63 which can be deformed by an external force, it is difficult to accurately align the ground pin in the conventional method.

In order to solve this problem, as shown in FIG. 1, the vertical part 11 and the parallel part 63 of the vertical vertical member 60 are arranged in alignment holes provided in the PCB substrate, 1 insertion protrusions 70 and second insertion protrusions 71 are provided on the rotation vertical member 40. The rotation vertical member 40 is provided with a protrusion through hole 43 on a straight line so that the second insertion protrusion 71 can be inserted therein And a groove forming part 72 having an insertion groove 72a into which the end of the second insertion protrusion 71 is inserted may be provided on the rear surface of the vertical vertical member 60. [

When the foreign matter is present on the PCB substrate or is twisted as described above, the parallel portion 63 is not disposed in parallel with the vertical member 11 in the unpressurized state before the rotation of the rotary arm 30, The second insertion projection 71 penetrates the projection through hole 43 provided in the rotation vertical member 40 which is prevented from being deformed as compared with the parallel portion 63 and then naturally forms the groove forming portion 72 So that alignment before fixing can be performed smoothly.

1, one side is connected to a lower portion of the rotation vertical member 40 and the other side is connected to a lower portion of a parallel portion 63 of the vertical vertical member 60, It is preferable that the holding member 80 is provided to prevent the excessive deformation of the parallel portion 63.

2 and 3, the rotary disk 30 rotates to the outside of the internal space 10a, and the rotary bar 20 is also rotated The extension member 21 rotates to the outside and rotates to the outside of the inner space 10a and the rotary frame rotates upward in a state that the hook portion 12a rotates upward. In this state, And the second insertion protrusions 71 are fitted and aligned in the holes.

In this state, the rotating frame rotates downward, and the first-stage PCB substrate is aligned by inserting the first insertion protrusions 70 into the alignment holes.

The rotary bar 30 rotates together with the rotary bar 30 rotating toward the inner space 10a and the hook 12a is rotated downward to be fixed to the rotary bar 30 in this state.

The mounting state of the PCB substrate according to this state is shown in FIG. 5 in the state of FIG.

The PCB substrate 2 of the two stages is in contact with the first ground pin 11a and the fourth ground pin 65a at one side and the other side, One side surface and the other side surface are in contact with the second grounding pin 22 and the third grounding pin 64, and continuous energization is performed.

In FIG. 5, the second insertion protrusion 71 is shown as being inserted into the insertion groove 72a, but it is naturally inserted while being inserted in a narrowed portion due to twisting or the like.

As described above, since alignment and operation of the PCB substrate are continuously aligned and fixed, there is no obstacle different from the case of Patent Document 2 when the PCB substrate of the first stage is installed after aligning the PCB substrate of the two stages.

7, the third ground pin 64 and the fourth ground pin 65a connected to the front and rear sides of the parallel portion 63 are formed such that the parallel portion 63 is deformable as shown in the drawing It is possible to make a proper contact by uniformly distributing the load by the self-deforming without forcing the PCB substrate in a place where the PCB substrate is twisted or foreign matter is not easily connected.

In addition, since the contact portion 65 is fitted to the through hole 41 provided in the rotation vertical member 40, which is relatively less deformed, the contact is made to prevent the ground pins from coming off, .

1, 2: PCB substrate 10: jig frame
10a: inner space 11: vertical member
11a: first ground pin
11c: guide member 12: horizontal member
12a: hook part 13: hanger bar
13a: clamp 20: pivot bar
21: extension member 22: second ground pin
30: Rotating arm 40: Rotating vertical member
41: through hole 42:
43: projection through hole 44: bracket
45: rotation pin 46: plate portion
50: rotation connecting member 60: spacing vertical member
61: connecting portion 62: bent portion
63: parallel portion 64: third ground pin
65: penetrating portion 65a: fourth ground pin
70: first insertion projection 71: second insertion projection
72: groove forming part 72a: insertion groove
80:

Claims (5)

1. A jig for multi-stage plating of a printed circuit board,
And two horizontal members 12 connecting the upper and lower ends of the two vertical members 11 so as to support the PCB substrate 1 in a grid shape And a hanger bar 13 is connected to both sides of the upper part of the hanger bar 13, and the hanger bar 13 is connected to the upper part of the hanger bar 13 The horizontal member 12 is provided with a hook 12a on the upper part of the two horizontal members 12, A jig frame (10) having a first ground pin (11a) installed forward in the vertical member (11);
An extension member (21) is installed on the outside of the vertical members (11) on both sides of the jig frame (10) so as to be rotatable with respect to the axis and connected with a second ground pin (22) The second ground pin 22 is disposed in correspondence with the position of the first ground pin 11a so that when the extension member 21 rotates toward the inner space 10a according to the rotation, the second ground pin 22 is identical to the first ground pin 11a A turning bar 20 forming a line;
A pivotal arm 30 which is detachably connected to one side of the pivotal bar 20 so as to rotate the pivotal bar 20 and the other side is connected to the hook 12a in a resilient manner;
The first ground pin 11a and the second ground pin 22 are hinged to the upper ends of the two vertical members 11 of the jig frame 10 so as to rotate in the forward and backward directions. A third ground pin 64 and a fourth ground pin 65a, which are disposed on both sides of the PCB, so that the ground pins of the PCB are electrically connected to the ground plane of the PCB substrate In addition,
Jig device for printed circuit board multi - stage plating.
The method according to claim 1,
The rotating frame includes:
And two through holes 41 are provided on the same line as the positions of the first ground pins 11a so as to be hinged to the upper ends of the two vertical members 11 of the jig frame 10, A plurality of rotation vertical members 40;
A rotation connecting member (50) connecting the lower ends of the two rotation vertical members (40);
A connecting portion 61 connected to the upper portion of the rotary vertical member 40, a bent portion 62 formed at the lower portion of the connecting portion 61 and bent forward, and a bent portion 62 connected to the lower end of the bent portion 62 A parallel portion 63 formed of a plate-like metal material having elasticity and being parallel to the rotation vertical member 40; and a parallel portion 63 formed of a plate- A third ground pin (64) protruded toward the front and electrically connected to the ground plane of the single-stage PCB substrate sandwiched between the second ground pin (22) and the second ground pin (22) And a fourth ground pin 65a is provided at an end of the second ground pin 63 so as to protrude from the rear of the third ground pin 64 and penetrate through the through hole 41, And a fourth ground pin 65a and a first ground pin 11a are brought into contact with the ground plane of the two-stage PCB substrate sandwiched between the first ground pin 11a and the second ground pin 11a, Characterized in that the spaced-apart vertical member (60)
Jig device for printed circuit board multi - stage plating.
3. The method of claim 2,
The rotation vertical member 40 is made of a plate-like metal material, and is formed with a bent portion 42 bent to the side along the longitudinal direction to prevent deformation.
Jig device for printed circuit board multi - stage plating.
The method of claim 3,
A first insertion protrusion 70 and a second insertion protrusion 70 are formed in the parallel portion 63 of the vertical vertical member 60 and the vertical member 11, Respectively,
The rotation vertical member 40 has a through-hole 43 formed in a straight line so that the second insertion protrusion 71 can be inserted therein,
And a groove forming part (72) having an insertion groove (72a) into which the end of the second insertion protrusion (71) is inserted is provided on the back surface of the vertical vertical member (60)
Jig device for printed circuit board multi - stage plating.
5. The method of claim 4,
And a gap holding member 80 connected to the lower portion of the rotation vertical member 40 at one side and the lower side of the parallel portion 63 of the vertical vertical member 60 at the other side, As a result,
Jig device for printed circuit board multi - stage plating.
KR1020150093149A 2015-06-30 2015-06-30 A Jig Device for Multistage Plated of Printed Circuit Boards KR101688004B1 (en)

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KR1020150093149A KR101688004B1 (en) 2015-06-30 2015-06-30 A Jig Device for Multistage Plated of Printed Circuit Boards

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112087881A (en) * 2020-09-16 2020-12-15 奥士康科技股份有限公司 Floating frame for electroplating processing in PCB production
KR102317544B1 (en) * 2020-05-06 2021-10-26 김원영 A Jig Device for Multistage Plated of Printed Circuit Boards)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200408105Y1 (en) 2005-11-16 2006-02-07 김원영 A Fixing Jig Device For Use In Electroplating Of Printed Circuit Boards
KR20090062047A (en) * 2007-12-12 2009-06-17 박경이 Plating rack assembly
KR100994878B1 (en) 2008-08-28 2010-11-17 김원영 A Jig Device for Multistage Plated of Printed Circuit Boards

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200408105Y1 (en) 2005-11-16 2006-02-07 김원영 A Fixing Jig Device For Use In Electroplating Of Printed Circuit Boards
KR20090062047A (en) * 2007-12-12 2009-06-17 박경이 Plating rack assembly
KR100994878B1 (en) 2008-08-28 2010-11-17 김원영 A Jig Device for Multistage Plated of Printed Circuit Boards

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102317544B1 (en) * 2020-05-06 2021-10-26 김원영 A Jig Device for Multistage Plated of Printed Circuit Boards)
CN112087881A (en) * 2020-09-16 2020-12-15 奥士康科技股份有限公司 Floating frame for electroplating processing in PCB production

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