KR101346837B1 - Apparatus and Method for Removal of Bubbles on the Substrate - Google Patents

Abstract

The present invention relates to a bubble removing apparatus and a method of removing the substrate, and more particularly, to a bubble removing apparatus and a method for removing a substrate that can increase the plating efficiency by removing the bubbles present in the substrate before performing the electro-copper.
The bubble removal apparatus of the board | substrate of this invention is the plating tank in which the plating liquid is accommodated and the electrode plate is mounted inside; A transfer part disposed on an upper portion of the plating bath to transfer a plate-shaped substrate disposed in the plating bath; The impact member is made of an impact member for impacting the substrate to be transferred, wherein the impact member is mounted inside the plating bath in front of the position where the electrode plate is disposed on the basis of the direction in which the substrate is transferred, and the micro holes formed in the substrate. Bubbles present in the shock member is characterized in that the shock is applied to the substrate is removed to flow out.

Description

Apparatus and Method for Removal of Bubbles on the Substrate}

The present invention relates to a bubble removing apparatus and a method of removing the substrate, and more particularly, to a bubble removing apparatus and a method for removing a substrate that can increase the plating efficiency by removing the bubbles present in the substrate before performing the electro-copper.

Various printed circuit boards are drilled with holes of various sizes to assemble various elements on the substrate.

Such substrates generally have a thickness of about 1 to 9 mm, their sizes vary widely depending on the application, and the sizes of the holes drilled in the substrate vary widely, ranging in diameter from a few mm up to 0.2 mm or less. Do.

The substrate is subjected to copper plating after the perforation to impart conductivity. If the perforated hole in the substrate is microporous or the thickness of the substrate is long, the length of the hole is long, so that the air bubbles in the hole are not easily removed and the copper is not easily removed. Poor substrates are produced by poorly uniform plating.

There have been many attempts to solve this problem.

One of the attempted methods has been to manually impact or vibrate a substrate directly.

However, this method is irregular and sometimes the operator does not perform this operation, making it difficult to manufacture a substrate having good plating properties.

In order to solve this problem, an electric copper plating apparatus as shown in FIG. 1 has been developed (Patent No. 10-2010-0026789).

In the conventional electrolytic copper plating apparatus shown in FIG. 1, an electrolytic solution is filled in the plating bath 1, and a substrate rack 3 having a plurality of substrates assembled therein is immersed therein.

The substrate rack 3 is fixed to a boot bar 2 at the top thereof and moves left and right at a constant speed.

In addition, an air cylinder device 10 having a piston 101 is installed on the side wall of the copper plating plating tank 1 so as to impact the substrate rack 3.

When the substrate rack 3 on which the substrate is mounted is transferred in the plating bath 1, the piston 101 is struck by the air cylinder device 10 and swivels the substrate rack 3 while reciprocating. Bubbles present in the fine holes of the will be removed.

However, such a conventional electroplating apparatus imparts a shock to the substrate during the electroplating process, but bubbles can be removed from the substrate, but plating of a uniform thickness is not performed on both sides of the substrate having a flat plate shape. .

That is, in the electroplating process, the electrode plate and the substrate disposed inside the plating bath 1 move at a constant speed while maintaining a constant gap. During the electroplating process, the air cylinder device 10 causes an impact to the substrate. When the substrate is shaken, the gap between the substrate and the electrode plate is changed to prevent plating of a uniform thickness.

The present invention is to solve the above-described problems, and removes air bubbles present in the substrate before the electroplating is performed in the plating bath facing the electrode plate, between the electrode plate and the substrate during the actual plating process It is an object of the present invention to provide a bubble removing device and a method of removing a substrate that can maintain a constant interval of the plating to have a uniform thickness.

In order to achieve the above object, the bubble removing apparatus of the substrate of the present invention includes a plating bath in which a plating solution is accommodated and an electrode plate is mounted therein; A transfer part disposed on an upper portion of the plating bath to transfer a plate-shaped substrate disposed in the plating bath; The impact member is made of an impact member for impacting the substrate to be transferred, wherein the impact member is mounted inside the plating bath in front of the position where the electrode plate is disposed on the basis of the direction in which the substrate is transferred, and the micro holes formed in the substrate. Bubbles present in the shock member is characterized in that the shock is applied to the substrate is removed to flow out.

The impact member is composed of an ultrasonic generator mounted on the side of the plating bath facing the substrate, the ultrasonic wave generated by the ultrasonic generator strikes the substrate using the plating liquid as a medium.

Alternatively, the transfer part may include a jig that is transported by holding the substrate, and the impact member may include a vibration generator mounted on an inner lower portion of the plating bath, and the lower part of the jig may move with the vibration generator when the substrate is moved. The jig is vibrated by the vibration generated by the vibration generator to remove bubbles from the substrate.

Alternatively, the transfer part is made of a jig to be transported by holding the substrate, the impact member is formed of a plurality of concave-convex protrusions formed on the side of the concave-convex block mounted on the inner bottom of the plating bath, when the substrate is moved The lower side of the jig is in contact with the uneven protrusions, and the moving jig is vibrated while hitting the uneven protrusions intermittently to remove bubbles from the substrate.

At this time, the uneven protrusions are made of a plurality, the jig to move is pushed in the vertical direction of the moving direction in contact with the maximum protrusion of the uneven protrusions, and moved to its original position after passing the maximum protrusions to the neighboring uneven protrusions It collides to generate vibration in the jig.

In addition, a guide groove is formed in an inner lower portion of the plating bath along a moving direction of the substrate, and a lower portion of the jig is inserted into the guide groove to move along the guide groove, and the impact member is the guide groove. Is mounted on.

And, in order to achieve the above object, the bubble removing method of the substrate of the present invention, the bubble removing step of removing the bubbles present in the micro-holes formed in the substrate by impacting the plate-like substrate pre-processed and transferred; In the plating bath in which a plating solution is accommodated and the electrode plate is mounted therein, the plating solution is electroplated. The bubble removing step is performed in the plating bath in which the plating solution is received before the plating step. Characterized in that made.

The impact applied to the substrate in the bubble removing step is made by ultrasonic waves using the plating liquid as a medium, and the bubbles are removed from the substrate by the ultrasonic waves.

Alternatively, the substrate is gripped and transferred by a jig, the impact applied to the substrate in the bubble removing step is made by a vibration generated in the vibration generator in contact with the lower portion of the jig to move, and is applied to the jig The bubbles are removed from the substrate by vibration.

Alternatively, the substrate is gripped and transferred by a jig, the impact applied to the substrate in the bubble removing step is made by the vibration generated when the lower portion of the jig moving bumps and bumps, vibrations applied to the jig The bubbles are removed from the substrate by this.

According to the bubble removing apparatus and the method of removing the substrate of the present invention as described above, before the electroplating is performed by the substrate facing the electrode plate in the plating bath to remove the air bubbles present in the substrate, during the actual plating process Since the distance between the electrode plate and the substrate is kept constant, it is possible to remove the bubbles present in the substrate to increase the plating efficiency and to simultaneously plate the substrate with a uniform thickness.

1 is a perspective view schematically showing a conventional electroplating apparatus,
2 is a configuration diagram of an electroplating line according to an embodiment of the present invention;
3 is a cross-sectional structure diagram of a bubble removing apparatus for a substrate according to an embodiment of the present invention;
4 is a cross-sectional structure diagram of a bubble removing apparatus for a substrate according to another embodiment of the present invention;
5 is a cross-sectional structure diagram of a bubble removing apparatus for a substrate according to another embodiment of the present invention;
6 is an operation process of the impact member and the jig in the bubble removing device of the substrate shown in FIG.

2 is a configuration diagram of an electroplating line according to an embodiment of the present invention, Figure 3 is a cross-sectional structure diagram of the bubble removing apparatus of the substrate according to an embodiment of the present invention, Figure 4 is a substrate according to another embodiment of the present invention 5 is a cross-sectional structural view of the bubble removing device of FIG. 5 is a cross-sectional structural view of the bubble removing device of the substrate according to another embodiment of the present invention, and FIG. It is a working flow chart.

FIG. 2 schematically illustrates an electroplating line on which the bubble removing apparatus of the substrate 160 of the present invention is mounted, and shows a pretreatment unit 110, a plating bath 120, a transfer unit, and an impact member 140.

The pretreatment unit 110 is a place for performing a pretreatment process such as dehydration, degreasing, chemical immersion treatment so that plating is performed on the substrate 160 before electroplating.

A plating solution is accommodated in the plating bath 120, and the electrode plate 121 is mounted therein so that the plating layer may be formed on the surface of the substrate 160.

The plating bath 120 is disposed after the pretreatment unit 110, but is not arranged in a straight line, and the starter is bent in an arc shape, so as to effectively utilize the arrangement space.

That is, if the plating bath 120 is formed in a straight line, the overall length of the plating line is lengthened, whereas the start of the plating bath 120 is curved in an arc shape as shown in FIG. Since the middle portion of the parallel to the pretreatment unit 110, the length of the plating line can be reduced.

Although not shown in the drawings, the transfer part is disposed on an upper portion of the plating line including the pretreatment part 110 and the plating bath 120 to transfer the flat plate-shaped substrate 160.

The transfer unit is made of a rail (not shown) and a hanger 130 moving along the rail while supporting the substrate 160, and the specific structure of the transfer unit is a known structure in a conventional plating apparatus. Is enough.

The impact member 140 serves to remove the air bubbles present in the micro holes formed in the substrate 160 by applying an impact to the transferred substrate 160 to the outside.

The impact member 140 is mounted in the plating bath 120 in front of the position where the electrode plate 121 is disposed based on the direction in which the substrate 160 is transferred as shown in FIG. 2. do.

That is, the impact member 140 is mounted inside the plating bath 120 at a position before the substrate 160 is plated to face the electrode plate 121 among the plating bath 120.

As illustrated in FIG. 3, the impact member 140 may include an ultrasonic wave generator 141 mounted to a side surface of the plating bath 120 facing the substrate 160.

The ultrasonic waves generated by the ultrasonic generator 141 impinge the impact on the substrate 160 by using the plating solution accommodated in the plating bath 120, thereby causing the substrate 160 to be impacted by the ultrasonic waves. By vibrating by the air bubbles existing in the microholes of the substrate 160 flow out to be removed.

In addition, the impact member 140 may be made of a vibration generator 142 mounted on the inner lower portion of the plating bath 120 as shown in FIG.

In this case, the transfer part includes a jig 150 that is transported by holding the substrate 160.

That is, the jig 150 is coupled to the hanger 130 constituting the transfer unit to move together with the hanger 130, the substrate 160 is coupled to the jig 150.

When the substrate 160 moves, the lower part of the jig 150 is in contact with the vibration generator 142, and the jig 150 is vibrated by the vibration generated by the vibration generator 142 itself so that the substrate 160 is moved. Bubbles are removed from the.

That is, when the vibration generator 142 generates vibration by itself, the jig 150, which is in contact with the vibration generator 142 and the lower part, also vibrates, thereby causing vibration to the substrate 160. The bubbles that are delivered and exist in the microholes of the substrate 160 flow out to be removed.

At this time, the inner bottom surface of the plating bath 120 is formed flat and the vibration generator 142 may be mounted here, but preferably, as shown in Figure 4 in the inner lower portion of the plating bath 120 The guide groove 125 is formed to be long in the moving direction of the substrate 160.

The lower part of the jig 150 moves along the guide groove 125, and the vibration generator 142 is mounted on the side of the guide groove 125.

In addition, the impact member 140 may be mounted to the inner lower surface of the plating bath 120, as shown in Figure 5, it may be made of a concave-convex block 143 is formed with a concave-convex protrusion 144 on the side.

In this case, the transfer part includes a jig 150 which is transported by holding the substrate 160, and a roller 151 for reducing friction during movement is mounted on the lower part of the jig 150.

When the substrate 160 moves, the lower side surface of the jig 150 moves while contacting the concave-convex protrusion 144 formed on the side of the concave-convex block 143, and the jig 150 that moves moves the convex-convex protrusion 144. ) Is vibrated while being intermittently hit to remove bubbles from the substrate 160.

At this time, the uneven protrusion 144 is made of a plurality, the jig 150 is moved in contact with the maximum protrusion of the uneven protrusion 144 is pushed in the vertical direction of the movement direction and moved to the original position after passing the maximum protrusion While colliding with the neighboring protrusions and protrusions 144, vibration is generated in the jig 150.

FIG. 6 illustrates the collision process of the uneven block 143 and the jig 150 as viewed from above the plating bath 120.

In FIG. 6, the uneven protrusion 144 is formed like a triangular tooth and continuously disposed therein, and shows a roller 151 mounted below the jig 150.

As shown in FIG. 6A, when the lower side of the jig 150, that is, the roller 151 is in contact with the uneven protrusion 144, the jig 150 moves in the arrow direction. As shown in (b), the roller 151 mounted below the jig 150 is pushed in the vertical direction of the moving direction of the substrate 160, which is a protruding direction of the uneven protrusion 144. It moves to the maximum protrusion of 144).

At this time, only the lower portion of the jig 150 on which the roller 151 is mounted is pushed in the protruding direction of the uneven protrusion 144, and the upper part of the jig 150 does not move.

Then, when the roller 151 passes the maximum protrusion of the uneven protrusion 144, the lower part of the jig 150 is instantaneously by the uneven protrusion 144 in a state of not contacting the uneven block 143. It moves to the original position opposite to the pushed direction.

At this time, while the lower portion of the jig 150 on which the roller 151 is mounted moves to its original position, as shown in FIG. 6 (c), it collides with another neighboring protrusion and protrusion 144, thereby causing the jig ( Vibration is applied to the substrate 160 mounted on the 150 to remove bubbles from the substrate 160.

The inner bottom surface of the plating bath 120 is formed in the guide groove 125, and the uneven block 143 is mounted on the side surface of the guide groove 125.

The bubble removing apparatus of the substrate 160 having the above structure removes the substrate 160 from the substrate 160 by the following method.

The bubble removing method of the substrate 160 of the present invention comprises a bubble removing step and a plating step.

The bubble removing step is performed by the impact member 140 by applying an impact to the plate-shaped substrate 160 which is preprocessed and transported to remove bubbles existing in the micro holes formed in the substrate 160.

The plating step is a step of forming a plating layer by electroplating the surface of the substrate 160 in the plating bath 120 in which the plating solution is accommodated and the electrode plate 121 is mounted therein.

The bubble removing step is performed by the impact member 140 inside the plating bath 120 in which the plating solution is accommodated before the plating step.

For this reason, in the plating step of forming a plating layer on the surface of the substrate 160, the substrate 160 is not shaken so that the interval between the electrode plate 121 and the substrate 160 is kept constant so that the thickness is uniform. The plating layer of can be formed.

The bubble removing step is made using the ultrasonic generator 141, as shown in FIG.

The ultrasonic generator 141 removes the bubbles from the substrate 160 by applying an impact by ultrasonic waves to the substrate 160 using the plating liquid as a medium.

In addition, the bubble removing step is made by the vibration generated in the vibration generator 142 in contact with the lower portion of the jig 150 to move, as shown in Figure 4, the vibration applied to the jig 150 By doing so, the bubbles are removed from the substrate 160.

In addition, the bubble removing step, as shown in Figures 5 and 6, the vibration generated when the lower portion of the jig 150 to move intermittently hits the convex protrusions 144 formed on the side of the concave-convex block 143 The bubbles are removed from the substrate 160 by vibrations applied to the jig 150.

The bubble removal apparatus and the removal method of the board | substrate of this invention are not limited to the above-mentioned embodiment, It can be variously modified and implemented within the range to which the technical idea of this invention is permissible.

110: pretreatment part, 120: plating bath, 121: electrode plate, 125: guide groove, 130: hanger, 140: impact member, 141: ultrasonic generator, 142: vibration generator, 143: uneven block, 144: uneven protrusion, 150 Jig, 151 roller, 160 substrate

Claims (10)

A plating bath in which a plating solution is accommodated and in which an electrode plate is mounted;
A transfer part disposed on an upper portion of the plating bath to transfer a plate-shaped substrate disposed in the plating bath;
Consists of an impact member for impacting the substrate to be transferred,
The transfer unit is carried by holding the substrate, and comprises a jig equipped with a roller at the bottom,
The impact member is mounted to the inside of the plating bath in front of the position in which the electrode plate is disposed on the basis of the direction in which the substrate is transferred, a plurality of uneven protrusions formed on the side of the uneven block mounted on the inner lower portion of the plating bath. Made of
The roller mounted to the lower part of the jig during the movement of the substrate is in contact with the uneven protrusions,
The jig moving is vibrating while hitting the bumps intermittently, thereby bubbles are present in the micro-holes formed in the substrate is discharged to the outside to remove the bubble of the substrate. The method according to claim 1,
The impact member is made of an ultrasonic generator which is mounted on the side of the plating bath facing the substrate,
Ultrasonic waves generated by the ultrasonic generator is a bubble removing device of the substrate, characterized in that the impact on the substrate using the plating liquid as a medium. The method according to claim 1,
The transfer unit is made of a jig to be carried by holding the substrate,
The impact member is made of a vibration generator mounted on the inner lower portion of the plating bath,
The lower part of the jig is in contact with the vibration generator during the movement of the substrate,
And the jig is vibrated by the vibration generated by the vibration generator to remove bubbles from the substrate. delete The method according to claim 1,
The uneven protrusions are made of a plurality,
The jig to be moved is pushed in the vertical direction of the moving direction while being in contact with the maximum protrusion of the uneven protrusion, and moves to its original position when the maximum protrusion is passed to collide with the neighboring uneven protrusion to generate vibration in the jig. The bubble removal apparatus of the board | substrate made into. The method according to claim 3 or 5,
Guide grooves are formed in the inner lower portion of the plating bath along the moving direction of the substrate.
The lower part of the jig is inserted into the guide groove is moved along the guide groove,
The impact member is a bubble removing device of the substrate, characterized in that mounted to the guide groove. A bubble removing step of removing bubbles from the microholes formed on the substrate by applying an impact to the plate-shaped substrate which is pretreated and transferred;
Including a plating step of electroplating the surface of the substrate in a plating bath in which a plating solution is accommodated and an electrode plate is mounted therein,
The substrate is gripped and transferred by a jig,
The bubble removing step is made in the plating bath in which the plating liquid is accommodated before the plating step,
The impact applied to the substrate in the bubble removing step is made by the vibration generated when the lower part of the jig moving against the bumps and protrusions, the bubble is removed from the substrate by the vibration applied to the jig. Method of removing bubbles from the substrate.
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