JP4657407B2 - Plating apparatus and plating method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a plating apparatus and a plating method. More specifically, the present invention relates to a plating apparatus and a plating method that can perform plating so that pits are not generated on the surface of an object to be plated.
[0002]
[Prior art]
Conventionally, formation of a conductor layer in a wiring board has been cited as an example of utilizing plating. This is done as follows. That is, first, the surface of the substrate formed of an insulator such as a resin is roughened to have an uneven shape. Then, after applying a catalyst to the surface of the substrate, electroless plating is performed. Then, an electroless plating layer is formed on the surface of the substrate. Further, electroplating is performed thereon. Thus, a conductor layer is formed. In the wiring board manufactured in this way, the surface of the substrate formed in a concavo-convex shape serves as an anchor, and thus the formed conductor layer is difficult to peel off.
[0003]
[Problems to be solved by the invention]
However, the conventional plating has the following problems. That is, when plating is performed, pits are generated on the surface of the wiring board. This is because when the wiring board is immersed in the plating solution, air bubbles are attached to the surface of the wiring board, so that the plating solution is not completely in contact with the surface of the wiring board. That is, as shown in FIG. 6, since the surface of the object to be plated 21 is roughened, when the object to be plated 21 is dipped in the plating solution, air becomes a bubble 24 and the surface of the object to be plated 21 has deep irregularities. It will be in the state confined in the part (it calls the hollow 25). In this part, a plating layer is not generated, so that it becomes a pit. Further, in the case of electroplating, hydrogen is generated on the surface of the uneven article 21 to be plated, so that the hydrogen forms bubbles 24 and similarly causes pits.
[0004]
The present invention has been made to solve the above problems. That is, the problem is to provide a plating apparatus and a plating method capable of plating an object to be plated without generating pits on the surface.
[0005]
[Means for Solving the Problems]
The plating apparatus of the present invention obtained to solve this problem is a plating apparatus for plating by plating a plate-shaped object having an uneven surface in a plating solution, and a plating tank for containing a plating solution; A frame for setting the object to be plated in the plating tank; a frame support part provided on the upper edge of the plating tank for supporting the frame; and a hammer for applying shock swing to the object to be plated by hitting the frame ; And a lifting device for lifting and lowering the hammer . This frame has a support bar that has an upper side and is set on the frame support part, and an object support part that is provided on the lower side of the frame and supports the object to be plated. The object to be plated is supported vertically between the object support part. The hammer strikes the support bar from the top to the bottom.
[0006]
In this plating apparatus, shock swing is applied to the object to be plated through the frame by the swinging means. Then, the bubbles adhering to the object to be plated are released by the shock swing. As a result, the plating solution comes into contact with the entire surface of the substrate. Accordingly, plating can be performed without generating pits on the surface of the object to be plated.
[0007]
Further, the plating method of the present invention is a plating method in which a plate-like object having an uneven surface is immersed in a plating solution, and a support rod set on the frame support portion at the upper edge of the plating tank is used as the upper side. Using a frame that has a support part to be plated to support the object to be plated on the lower side, and supports the object to be plated vertically between the support rod and the support part to be plated. When the object to be plated is immersed in the plating solution in the tank and the substrate is immersed in the plating solution , a hammer is applied to the object to be plated by hitting the support rod downward from the top . This is a method for removing bubbles adhering to the recess.
[0008]
In this method, when the object to be plated is immersed in the plating solution, shock swing is applied to the object to be plated. Then, due to the impact, the bubbles attached to the surface of the object to be plated are detached from the object to be plated. Accordingly, since the plating solution comes into contact with the entire object to be plated, the surface of the object to be plated is plated every corner. Accordingly, plating can be performed without generating pits on the surface of the object to be plated.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. First, the structure of the plating apparatus of this embodiment is demonstrated. That is, as shown in FIG. 1, the plating apparatus 1 includes a bathtub-shaped plating tank 2, a frame support 3 attached to both sides of the upper edge, and a frame 4 set on the frame support 3. have. The frame 4 has a substantially rectangular shape, and a Y-shaped support portion 7 is attached to the lower side of the frame 4 so as to face upward. A support bar 6 is provided on the upper side of the frame 4 so as to be set on the frame support 3. In the plating tank 2, two electrodes 8 are mounted in parallel with and sandwiching the frame 4.
[0010]
A lifting device 9 using an electromagnet is attached to the plating tank 2, and a hammer 10 for applying a shock swing to the frame 4 is attached to the tip of the lifting device 9. That is, the hammer 10 is hit against the frame 4 by the elevating device 9 to apply shock swing to the frame 4. Accordingly, in the present embodiment, the lifting device 9 and the hammer 10 function as swinging means.
[0011]
When the wiring board 5 is plated by the plating apparatus 1 having the above configuration, a plating solution is put into the plating tank 2. Then, the wiring board 5 is placed in the frame 4 and set on the support portion 7. Then, the frame 4 is set on the frame support 3 with the support rod 6, and the wiring board 5 is placed in the plating tank 2. At this time, the wiring board 5 and the electrode 8 face each other. Further, the circuit board 5 is energized through the frame support 3.
[0012]
Next, a method of plating by the plating apparatus 1 having the above configuration will be described. First, the configuration of the wiring board 5 before plating will be briefly described with reference to FIG. In the wiring board 5, the surface of the insulating layer 11 is roughened to form an uneven shape. Then, the surface of the uneven insulating layer 11 is subjected to electroless plating, and the electroless plated layer 12 has an uneven shape along the insulating layer 11.
[0013]
Next, a process of plating the wiring board 5 having the above-described configuration with the plating apparatus 1 of the present embodiment will be described. First, a plating solution is put into the plating tank 2 first. Then, the wiring board 5 having the above configuration is hung above the frame 4 and the wiring board 5 is set on the support portion 7. Then, the wiring board 5 is placed in the plating tank 2 by setting the support rod 6 on the frame support portion 3. At this time, the hammer 10 is raised. A voltage is applied between the wiring board 5 and the electrode 8. However, at this time, air bubbles 14 are confined in a deep portion (depression 15) on the surface of the uneven electroless plating layer 12 (FIG. 3). Therefore, at this time, the hammer 10 is hit against the frame 4 by the lifting device 9. Then, shock oscillation is transmitted to the wiring board 5 through the frame 4. Therefore, the air bubbles 14 trapped in the depression 15 are detached from the depression 15 by shock swinging. Then, the plating solution comes into contact with the recess 14 (FIG. 4). Plating is performed in this state.
Then, the hammer 10 is raised by the lifting device 9.
[0014]
However, if plating is continued as it is, bubbles 14 are generated and confined in the recesses 15 again as shown in FIG. This is because hydrogen is generated on the surface by electroplating, and this hydrogen is trapped in the recess 15 as bubbles 14. Thus, if plating is continued in this state, pits are formed in that portion. Therefore, at this time, the hammer 10 is again struck to the frame 4 by the elevating device 9 and a shock swing is applied to the wiring board 5. Then, the bubble 14 confined in the depression 15 is detached from the depression 15 by shock swinging (FIG. 4). Therefore, since the plating solution comes into contact with the recess 15, the surface of the electroless plating layer 12 comes into contact with the plating solution all over again. Then, the hammer 10 is raised by the lifting device 9. This operation is repeated several times during plating. When the wiring board 5 is sufficiently plated, the frame 4 is removed from the frame support portion 3 and the wiring board 5 is taken out of the plating tank 2.
[0015]
According to the plating method described above, the shock wave is applied to the wiring board 5 so that the bubbles 14 are detached from the surface of the electroless plating layer 12, so that the surface of the electroless plating layer 12 is in contact with the plating solution throughout. To do. As a result, as shown in FIG. 5, the surface of the electroless plating layer 12 is electroplated throughout without forming pits, and the conductor layer 13 is formed.
[0016]
As described above in detail, in this embodiment, the shock wave is applied to the wiring board 4 so that the bubbles 14 trapped in the depressions 15 on the surface of the electroless plating layer 12 are released, so that pits are formed. It can be plated without being done.
Thereby, a plating apparatus and a plating method capable of forming a plating layer without pits are realized.
[0017]
In addition, this embodiment is only a mere illustration and does not limit this invention at all. Accordingly, the present invention can be variously modified and improved without departing from the scope of the invention. For example, the present invention is not limited to electroplating, but can be applied to electroless plating, displacement plating, and the like. Further, the present invention can be applied not only to a wiring board as an object to be plated.
[0018]
【The invention's effect】
As is apparent from the above description, a plating apparatus and a plating method capable of plating an object to be plated without generating pits on the surface are provided.
[Brief description of the drawings]
FIG. 1 is a perspective view of a plating apparatus according to an embodiment.
FIG. 2 is a diagram showing a wiring board before plating in the present embodiment.
FIG. 3 is a diagram showing a state before a shock swing is applied to a wiring board in the middle of plating.
FIG. 4 is a diagram showing a state immediately after a shock swing is applied to a wiring board in the middle of plating.
FIG. 5 is a view showing a wiring board plated by the plating apparatus of the present embodiment.
FIG. 6 is a view showing a state when an object to be plated is immersed in a plating solution by a conventional plating method.
[Explanation of symbols]
2 Plating tank 4 Frame 5 Wiring board 6 Support rod 7 Support portion 9 Lifting device 10 Hammer 11 Insulating layer 12 Electroless plating layer 13 Conductive layer 14 Air bubbles

Claims (2)

In a plating apparatus for plating by immersing a plate-shaped object having an uneven surface in a plating solution,
A plating tank for the plating solution,
A frame for setting an object to be plated in the plating tank;
A frame support provided on an upper edge of the plating tank and supporting the frame;
A hammer that applies shock swing to the object to be plated by hitting the frame ;
A lifting device for lifting and lowering the hammer ,
The frame is
A support bar that forms an upper side thereof and is set on the frame support portion;
It is provided on the lower side facing upward, and has an object support part for supporting an object to be plated,
All SANYO for supporting the object to be plated vertically between the support rod and the object to be plated supported portion,
The hammer, the plating apparatus according to claim der Rukoto those beats down from above the support rods. In a plating method in which a plate-shaped object having an uneven surface is immersed in a plating solution,
Using a frame having a support bar set on the upper frame support portion of the plating tank on the upper side and having an object support portion for supporting an object to be plated facing upward on the lower side, the support rod and the Support the object to be plated vertically between the object support part and immerse it in the plating solution in the plating tank.
When the object to be plated is immersed in the plating solution, a shock is applied to the object to be plated by hitting the support rod downward from above with a hammer .
A plating method characterized in that bubbles adhering to a concave portion on a surface of an object to be plated are released.

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