CN217895785U - Clamp, lead hanging plating device, lead electroplating system and gold-plated lead - Google Patents

Abstract

The utility model relates to the technical field of electroplating, and discloses a clamp, a lead wire hanging and plating device, a lead wire electroplating system and a gold-plating lead wire, wherein the clamp is provided with a through hole for passing through the lead wire, the through hole is in interference fit with the lead wire, the clamp has elasticity, and the through hole is used for clamping the lead wire and exposing the electroplating parts at the two ends of the lead wire; the lead rack plating device comprises a support and a clamp, wherein the support is used for supporting the clamp; the lead electroplating system comprises a lead barrel-plating device and a lead rack-plating device, wherein the lead barrel-plating device is used for barrel-plating a lead, and the lead rack-plating device is used for rack-plating one end of the lead subjected to barrel-plating by the lead barrel-plating device; the gold plating thickness at both ends of the gold plating lead is different. The utility model discloses do not adopt the tin pot replacement to remove gold, just can obtain the different gilding lead wire of both ends thickness through barrel plating and rack plating, gilding thickness is accurate controllable, has guaranteed the uniformity and the coplanarity of lead wire line footpath.

Description

Clamp, lead hanging plating device, lead electroplating system and gold-plated lead

Technical Field

The utility model relates to an electroplate technical field, more specifically relates to anchor clamps, lead wire rack plating device, lead wire electroplating system, gilding lead wire.

Background

One end of a gold-plated lead (plated with Au at two ends of the lead) of the electronic component is arranged inside the electronic component (called an inner end for short), the other end of the gold-plated lead is arranged outside the electronic component (called an outer end for short), the inner end of the gold-plated lead and the electronic component adopt a gold wire bonding process of micro assembly, the gold-plated thickness of the gold-plated lead is 1.3-2 mu m during gold wire bonding, otherwise, the problem that a cleaver slips (the gold is soft, if the thickness of the gold is not enough, the sliding is unstable because the surface of the lead is too hard when the cleaver of a gold wire bonder presses and bonds on the lead), a bonding point is not firm, and the bonding tension does not meet the requirement can occur; the outer end of the gold-plated lead wire is usually welded by tin-lead welding, the gold-plating thickness of the gold-plated lead wire needs to be controlled within 0.3-0.6 μm during tin-lead welding, otherwise the welding spot is easy to have the problems of environmental adaptation phase difference, jin Cui cracking and the like.

The electroplating has two modes, namely rack plating and barrel plating, wherein the rack plating is to hang parts on a lifting hook for plating layer deposition, the lifting hook can not accurately position the parts, especially when a plurality of parts are rack plated simultaneously, the positions of the parts can not be ensured to be completely the same, and the parts are easy to fall off in the rack plating process, so that the rack plating is suitable for parts (such as a rim) with low precision requirements and large sizes, the small parts adopt the barrel plating, the barrel plating is to place the small parts in a roller, and the small parts are subjected to surface deposition plating in an indirect conductive discharge mode in a rolling state. The preparation method of the gold-plated lead wire in the prior art comprises the following steps: firstly, uniformly plating thick gold on the lead in a barrel plating mode, wherein the gold plating thickness is 1.3-2 mu m, and then removing the thick gold at the outer end of the gold-plated lead by a tin pot replacement gold removing method to ensure that the gold plating thickness at the outer end of the gold-plated lead reaches 0.3-0.6 mu m. The tin pot displacement gold-removing method is used for obtaining the tin-lead welding quality of the external end of the gold-plated lead wire, and specifically, the tin pot displacement gold-removing method comprises the following steps: welding spots directly welded by thick gold are easy to crack; the lead wire diameter after gold removal is inconsistent, the coplanarity is poor, and the gold removal thickness is also uncontrollable, so that the problems of difficult assembly and easy insufficient soldering are brought to the subsequent tin-lead soldering of electronic components; the cost increases: calculated according to the price of the current electroplating gold industry, the unit cost of 0.3 mu m Au plating is 85 yuan, the unit cost of 0.5 mu m Au plating is 120 yuan, the unit cost of 1 mu m Au plating is 240 yuan, the unit cost of 1.3 mu m Au plating is 300 yuan, the unit cost of 2 mu m Au plating is 380 yuan, and the cost of thick gold plating is increased by 3 to 4 times.

The prior art adopts a process of protecting a lead wire from being plated with thin and thick gold by gluing, and specifically comprises the following steps: masking the non-glued part by using masking tape, dipping insulating paint by a small-size pennisetum pen, coating the unprotected part of the masking tape, baking for 4h, coating glue again, baking again, coating glue and baking repeatedly → washing glue → drying, wherein the process has the following defects:

firstly, the labor costs increase, the operating time is long: the protection comprises wire winding, hanging, brushing 2-4 layers of insulating paint, drying, the whole process is 14h, the cleaning is carried out one by one, and then the drying is carried out, the whole process is 1h, the more the number is, the longer the time is;

secondly, the lead is easy to deform in the protection and deprotection processes (the insulating paint for protection is protected by the insulating paint and is removed), and the lead after gold electroplating is not easy to straighten, otherwise, the plating layer is damaged.

SUMMERY OF THE UTILITY MODEL

To one or more among the prior art problem, the utility model provides an anchor clamps, be provided with the through-hole that passes the lead wire on the anchor clamps, through-hole and lead wire interference fit, anchor clamps have elasticity, the through-hole is used for the centre gripping lead wire and exposes the electroplating part at lead wire both ends.

According to an aspect of the utility model, be provided with a plurality of through-holes on the anchor clamps.

According to an aspect of the present invention, the clamp is a rubber plate.

According to an aspect of the utility model, anchor clamps are 50 degrees silicon rubber boards.

According to the utility model discloses a second aspect provides a lead wire rack plating device, including support and above-mentioned anchor clamps, the support is used for supporting anchor clamps.

According to the second aspect of the utility model, the support is stainless steel support or aluminium support.

According to the utility model discloses a second aspect, the support includes two vertical poles and a horizontal pole, the horizontal pole supports carry on spacingly to the lead wire of inserting in the anchor clamps when two vertical poles.

According to the utility model discloses a second aspect, the vertical pole up-and-down motion of both sides can be followed to the horizontal pole.

According to the utility model discloses a second aspect, the vertical pole bottom is provided with the boss, the boss is used for placing the one end of anchor clamps for support anchor clamps still are used for carrying on spacingly to the plating solution in the plating bath, and the liquid level of plating solution is less than the boss.

According to the utility model discloses a second aspect, lead wire rack plating device still includes the plating bath, the plating bath opening end is provided with the border, the vertical pole top is the L type, the vertical pole top is hung the border of plating bath.

According to the utility model discloses a third aspect provides a lead wire electroplating system, including lead wire barrel plating device and lead wire rack plating device, the lead wire barrel plating device is used for carrying out the barrel plating to the lead wire, the lead wire rack plating device is used for carrying out the rack plating to the one end of the lead wire after the barrel plating of lead wire barrel plating device.

According to the utility model discloses a third aspect, the lead wire rack plating device is above-mentioned lead wire rack plating device.

According to the fourth aspect of the present invention, there is provided a gold plating lead wire manufactured by the lead plating system, wherein the gold plating thickness at both ends of the gold plating lead wire is different.

According to a fourth aspect of the present invention, the gold plating thickness of the one end of the gold plating lead is 0.3 μm to 0.6 μm, and the gold plating thickness of the other end of the gold plating lead is 1.3 μm to 2 μm.

Anchor clamps have elasticity and through-hole and lead wire interference fit for the through-hole presss from both sides tight lead wire, prevents coming off of electroplating in-process lead wire, does not destroy the surface of lead wire.

Lead wire rack plating device passes through anchor clamps and presss from both sides tight lead wire, prevents to hang coming off of plating in-process lead wire, is applicable to the rack plating of little part such as lead wire.

Lead wire electroplating system does not adopt the tin pot replacement to remove gold, just can obtain the different gilding lead wire of both ends thickness through barrel-plating and rack plating, and thin gold and thick gold are plated to the lead wire both ends high efficiency respectively, and the gilding thickness at lead wire both ends is accurate controllable, has guaranteed the uniformity and the coplanarity of lead wire footpath, makes things convenient for gilding lead wire and electronic components's equipment, ensures gold wire bonding and tin lead welded reliability, is difficult to appear rosin joint.

Drawings

Other objects and results of the present invention will be more apparent and readily appreciated by reference to the following detailed description taken in conjunction with the accompanying drawings. In the drawings:

fig. 1 is a schematic view of the clamp of the present invention;

FIG. 2 is a schematic view of an embodiment of the lead rack plating apparatus of the present invention;

FIG. 3 is a schematic view of the position relationship between the lead wire rack plating device and the lead wire according to the present invention;

FIG. 4 is a schematic view of another embodiment of the lead rack plating device of the present invention;

FIG. 5 is a schematic diagram of a block diagram of a lead electroplating system according to the present invention;

wherein: 1-lead, 2-conductive wire, 100-lead rack plating device, 10-clamp, 11-through hole, 20-support, 21-longitudinal rod, 22-cross rod, 23-boss, 30-plating bath, and 200-lead barrel plating device.

Detailed Description

In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It may be evident, however, that such embodiment(s) may be practiced without these specific details.

Various embodiments according to the present invention will be described in detail below with reference to the accompanying drawings.

Fig. 1 is the schematic diagram of the fixture, as shown in fig. 1, the fixture 10 is used for holding the pre-plated lead 1, the fixture 10 is provided with a through hole 11 for passing the lead 1, the through hole 11 is in interference fit with the lead 1, the fixture 10 has elasticity, and the through hole 11 is used for holding the lead 1 and exposing the plating parts at two ends of the lead 1.

The clamp 10 has elasticity, and the through hole 11 is in interference fit with the lead 1, so that the through hole 11 clamps the lead 1, the lead 1 is prevented from falling off in the electroplating process, and the outer surface of the lead 1 is not damaged.

Preferably, a plurality of through holes 11 are formed in the fixture 10, and the plurality of leads 1 are inserted into the plurality of through holes 11, so that the plurality of leads 1 can be accurately positioned, and the difference of the plurality of leads 1 after electroplating is reduced.

Preferably, the clamp 10 is a rubber plate, which has good chemical corrosion resistance, and other materials cannot meet multiple requirements of corrosion resistance, elasticity, low cost and the like.

Preferably, the clamp 10 is a 50-degree silicon rubber plate, the rubber elasticity of the rubber plate is 50 degrees, the hardness is most suitable, the soft condition affects the uniformity of the plating height of the whole batch of leads 1, and the hard condition damages the leads 1.

In one embodiment, the fixture 10 is used for rack plating, as shown in fig. 2, the lead rack plating device 100 of the present invention includes a support 20 and the fixture 10, wherein the support 20 is used for supporting the fixture 10.

The lead rack plating device 100 clamps the lead 1 through the clamp 10, prevents the lead 1 from falling off in the rack plating process, and is suitable for rack plating of small parts such as the lead 1.

Preferably, the bracket 20 is a stainless steel bracket 20 or an aluminum bracket 20, and the stainless steel bracket 20 or the aluminum bracket 20 is rust-proof and corrosion-resistant, but the stainless steel bracket 20 has low cost, and further preferably, the bracket 20 is a stainless steel bracket 20.

In one embodiment, as shown in fig. 3, the bracket 20 includes two longitudinal bars 21 and a cross bar 22, the cross bar 22 supports the two longitudinal bars 21 and limits the lead 1 inserted into the jig 10, and the lead 1 is inserted from the lower end of the through hole 11 of the jig 10 until contacting the cross bar 22, so that the exposed ends of the plurality of leads 1 having the same size after being inserted into the jig 10 have the same size.

Preferably, the cross bar 22 can move up and down along the longitudinal bars 21 on both sides.

In one embodiment, a boss 23 is disposed at the bottom of the vertical rod 21, the boss 23 is used for placing one end of the clamp 10, and is used for supporting the clamp 10 and limiting the electroplating solution in the electroplating tank 30, and the liquid level of the electroplating solution is lower than the boss 23.

In one embodiment, as shown in fig. 4, the lead rack plating device 100 includes a plating tank 30, an edge is provided at an open end of the plating tank 30, a top of the vertical rod 21 is L-shaped, and the top of the vertical rod 21 is hung at the edge of the plating tank 30.

As shown in fig. 2-4, the leads 1 are inserted from the bottom of the fixture 10, and are inserted and limited by the cross bar 22 of the bracket 20, so that the lengths of the leads 1 extending from the fixture 10 are the same, the conductive wire 2 is wound around one end of the lead 1 close to the cross bar 22, the fixture 10 is positioned above the electroplating solution of the electroplating bath 30, and the other end of the lead 1 clamped in the through hole 11 of the fixture 10 is inserted into the electroplating solution of the electroplating bath 30, so that the rack plating of the lead 1 is performed.

In one embodiment, as shown in fig. 5, the lead electroplating system comprises a lead barrel plating device 200 for barrel plating the lead 1 and a lead rack plating device 100 for rack plating one end of the lead 1 barrel plated by the lead barrel plating device.

The electroplating part of the lead 1 comprises an inner end and an outer end of the lead 1, the inner end is used for being connected with the inside of the electronic component, the outer end is used for extending out of the electronic component, after the lead 1 is barrel-plated by the lead barrel-plating device, the gold plating thickness of the inner end and the outer end of the lead 1 is 0.3-0.6 mu m, the lead barrel-plating device 100 is used for barrel-plating the inner end of the lead 1 after barrel-plating, the gold plating thickness of the inner end after barrel-plating is 1.3-2 mu m, jin Jiuneng is not replaced by a tin pot to obtain gold-plated leads with different thicknesses at two ends, the two ends of the lead 1 are respectively plated with thin gold and thick gold efficiently, the gold plating thickness at two ends of the lead 1 is accurately controllable, the consistency and coplanarity of the wire diameter of the lead 1 are ensured, the lead and the gold-plated electronic component are convenient to be equipped, the reliability of gold wire bonding and tin-lead welding is ensured, and false welding is not easy to occur.

In one embodiment, the lead rack plating device 100 is the lead rack plating device 100 shown in fig. 2 to 4, and the lead 1 is clamped by the clamp 10, so that the thin gold plating layer is not damaged, and the lead 1 is prevented from being deformed in the rack plating process.

The lead barrel plating apparatus 200 may be a barrel plating apparatus of the related art, for example, a barrel plating apparatus that plates a thin gold layer of 0.5 μm on the entire lead 1, and then clamps the plurality of leads 1 into the jig 10 (as shown in fig. 3), and one person may clamp 50 to 60 leads 1 into the jig 10 in one minute, and perform positioning using the crossbar 22, thereby ensuring the uniform height of the leads 1. The outer end of the exposed lead 1 is wound with silver-plated copper wires (conductive wires) to make each lead 1 conductive, and then the lead rack plating device 100 rack plates the leads 1, as shown in fig. 4, after the rack plating, the silver-plated copper wires are taken away, the gold-plated leads are taken out from the fixture 10, and one person can take 60 to 70 leads 1 in one minute.

The lead electroplating system of the utility model reduces the production cost, and the cost is reduced from the original 20 yuan/piece to 5.5 yuan/piece; the production efficiency is improved from 100 to 1000 per day.

Lead electroplating system passes through anchor clamps 10 protection lead 1, has improved electroplating efficiency greatly to save the cost of labor, ensured gold wire bonding and tin lead welded reliability simultaneously.

In one embodiment, the present invention also provides a gold-plated lead wire having different gold-plating thicknesses at both ends thereof.

Preferably, one end (outer end) of the gold-plated lead is plated with gold with a thickness of 0.3 to 0.6 μm, and the other end (inner end) of the gold-plated lead is plated with gold with a thickness of 1.3 to 2 μm.

While the foregoing disclosure shows illustrative embodiments of the invention, it should be noted that various changes and modifications could be made herein without departing from the scope of the invention as defined by the appended claims. Furthermore, although elements of the invention may be described or claimed in the singular, the plural is contemplated unless limitation to a single element is explicitly stated.

Claims (13)

1. The clamp is characterized in that a through hole penetrating through a lead is formed in the clamp, the through hole is in interference fit with the lead, the clamp is elastic, and the through hole is used for clamping the lead and exposing electroplating parts at two ends of the lead.

2. The clamp of claim 1, wherein a plurality of through holes are provided in the clamp.

3. The clamp of claim 1, wherein the clamp is a rubber sheet.

4. The clamp of claim 3, wherein the clamp is a 50 degree silicone rubber plate.

5. A rack plating apparatus for lead wires, comprising a holder for supporting the holder and the holder according to any one of claims 1 to 4.

6. The wire rack plating device of claim 5, wherein the bracket is a stainless steel bracket or an aluminum bracket.

7. The lead rack plating device of claim 5, wherein the support comprises two longitudinal rods and a cross rod, and the cross rod supports the two longitudinal rods and limits the lead inserted into the clamp.

8. The rack plating apparatus for lead wires according to claim 7, wherein the cross bar is capable of moving up and down along the longitudinal bars on both sides.

9. The lead rack plating device of claim 7, wherein a boss is arranged at the bottom of the vertical rod, the boss is used for placing one end of the clamp, supporting the clamp and limiting the electroplating solution in the electroplating bath, and the liquid level of the electroplating solution is lower than that of the boss.

10. The lead rack plating device according to claim 7, further comprising a plating bath, wherein an edge is arranged at an open end of the plating bath, the top of the longitudinal rod is L-shaped, and the top of the longitudinal rod is hung on the edge of the plating bath.

11. A lead plating system comprising a lead barrel plating device for barrel plating a lead and a lead rack plating device according to any one of claims 5 to 10 for rack plating one end of the lead barrel-plated by the lead barrel plating device.

12. A gold-plated lead prepared by the lead plating system of claim 11, wherein the gold-plated lead has different gold-plating thicknesses at both ends.

13. The gold-plated lead according to claim 12, wherein the gold-plated lead has a gold-plating thickness of 0.3 to 0.6 μm at one end and 1.3 to 2 μm at the other end.

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