CN211339722U - Electroplating line and tool and hanger thereof - Google Patents

Abstract

The utility model relates to an electric plate wire and tool and hanger thereof. A plating line (40) for plating a polyhedral device (10) with blind holes, the plating line (40) comprising: a jig (20) for a rinsing bath, which includes a plurality of clamping plates (21) with meshes (22), and a clip (23) for clipping an edge of the clamping plates (21), and is configured to hold the polyhedral device (10) between the two clamping plates (21); and a hanger (30) for the plating bath, which includes a device hook (35), the device hook (35) being configured to removably hang-fix the polyhedral device (10) to the hanger (30) in an inclined posture.

Description

Electroplating line and tool and hanger thereof

Technical Field

The utility model relates to an electroplate the field, specifically relate to a plating line that is used for carrying out the electroplating to the small-size polyhedron device that has the blind hole, especially hang and plate the production line to and contain tool and hanger in this plating line.

Background

The microwave dielectric ceramic has high dielectric constant, high quality factor (Q value) and good temperature stability, and is widely applied to the fields of wireless communication, aerospace, military radars and the like, and is made into various passive microwave elements, such as dielectric capacitors, microwave filters, dielectric antennas and the like. Particularly, with the rapid development and large-scale commercial use of 5G technology, the integration requirements of radio frequency devices such as filters are accelerated, the performance requirements are further improved, and higher quality factors are required.

The Q value of the ceramic filter is mainly determined by the dielectric loss of the substrate and the conductance loss of the metal film. The applicant has already disclosed the application of ion implantation technology to the metallization of insulating materials such as polymer resins, ceramics, etc. and to the metallization of 3D microwave devices, etc. The technology can realize copper coating of a polyhedral device, solve the problem that a copper layer is easy to blister and strip due to heating after copper coating welding, reduce the conductivity loss of the copper coating layer, and meet the requirements of high reliability, heat resistance, low insertion loss, low cost and the like of the device.

The problem faced at present is that the copper-clad thickness of the device material is too thin (generally less than 2 μm) by ion implantation technology for cost, and then surface treatment (generally less than 1 μm) such as copper electroplating (generally thicker than 10 μm) and silver plating must be carried out. In the case of copper electroplating of a large number (e.g., millions per month) of small block-shaped polyhedral devices, the conventional process is barrel plating, i.e., electroplating of large and small parts in a barrel container. The main advantages of barrel plating are: hundreds of devices can be filled at one time, the electroplating efficiency is high, the automation degree is high, and the cost is lower. However, the barrel needs to be rolled in the barrel plating process, and small devices are easy to collide to generate gaps and scratches; the small devices are stacked and conduct electricity with each other, so that local conduction is abnormal, and the fluctuation of current density is large; stacking also results in poor local exchange of liquid medicine, and appearance problems such as copper burn are likely to occur. More importantly, the small devices are designed with blind holes with high thickness-diameter ratio according to the requirements of electrical performance debugging and assembling of subsequent devices. Due to the inherent defect of insufficient liquid medicine exchange in the barrel plating process, the deep plating capability of the blind holes is poor, and the thickness of electroplated copper at the bottoms of the deep blind holes is easy to be insufficient. Moreover, when plating solution enters deep blind holes of small devices, bubbles are easily hidden in the blind holes, and how to drive the bubbles and avoid plating leakage at the bottoms of the blind holes is a troublesome problem to be solved urgently.

Another copper electroplating process is rack plating, one of which is plate-type rack plating performed by a fixture, such as common gantry copper plating, which is commonly used for circuit board copper electroplating in the PCB industry. The process has mature PCB blind hole electro-coppering liquid medicine, has good copper plating uniformity and blind hole deep plating capability, and can ensure the copper thickness performance at the bottom of the blind hole. In addition, the clamp is directly contacted with the cathode plate for conducting electricity, so that the current density is stable, the application range is wide, and the problems of copper burning or scratching and other appearance defects caused by collision are not easy to occur. However, the plate-type rack plating has a plurality of disadvantages, for example, many small block-shaped polyhedral devices are easy to fall into the bottom of the tank due to weak clamping in the electroplating process; the manual feeding time is too long, the space utilization rate of the electroplating bath is too low, and the productivity and efficiency of electroplating production are low.

SUMMERY OF THE UTILITY MODEL

In order to solve the above problem, the utility model discloses on the basis of present board-like hanging plating longmen copper-plating line and PCB blind hole copper-plating liquid medicine, through the tool of optimizing the wash bowl and the hanger of plating bath, optimize high-pressure water washing and spray the mode, and optimize the angle etc. that hangs of hanger couple and device, design a plating line that is suitable for the numerous fritter polyhedron device of quantity, it not only can satisfy this kind of device thick to the copper-plating on dark blind hole and polyhedron surface, the requirement of outward appearance and performance etc., can also improve the production productivity and the efficiency of plating line by a wide margin.

The utility model provides an electroplating line for electroplate the polyhedron device that has the blind hole, above-mentioned electroplating line includes: a jig for a rinsing bath, which includes a plurality of clamping plates with a mesh, and a clip for clamping an edge of the clamping plates, and is configured to hold the polyhedral device between two clamping plates; and a hanger for a plating bath, including a device hanger configured to removably hang and fix the polyhedral device to the hanger in an inclined posture.

The hanger of the electroplating line is simple in design, simple and quick in manual operation, capable of firmly fixing the small polyhedron device to be electroplated and capable of improving the space utilization rate of the electroplating bath. Because the device hook is used for hanging and fixing the polyhedral device in an inclined posture, the device hook can be prevented from contacting the inner side surface of the polyhedral device, and the problems of uneven thickness or poor appearance of a deep blind hole coating and the like can be avoided.

Optionally, the surface of the polyhedral device, on which the blind holes are formed, is rectangular, circular, triangular or polygonal, and the thickness-diameter ratio of the blind holes is 2:1 or less and the diameter is 0.5-5 mm.

Optionally, the size of the longest side of the polyhedral device is 100mm or less, and the polyhedral device further has a through-groove or a through-hole having a groove width or a diameter of 1 to 4mm, through which the device hook passes to protrude out of the surface of the polyhedral device.

Alternatively, the polyhedral device is made by metallizing a surface and a hole wall of an insulating substrate by an ion implantation technique, the insulating substrate includes a polymer resin and a ceramic, and the metallized surface and the hole wall are electrically connected to the device hook.

Optionally, the clip holds the polyhedral device between two of the plurality of clamping plates, and the grid edges of the clamping plates avoid the blind holes of the polyhedral device.

Optionally, the surface of the polyhedral device and the grid of the clamping plate are both rectangular, one side of the grid is 1-2 mm smaller than the short side of the surface, the other side of the grid avoids the blind hole of the polyhedral device, and two grids are matched with one polyhedral device.

Through the above-mentioned structure of the grid, numerous polyhedral devices can be arranged between two adjacent clamping plates side by side, and simultaneously, the grid edges of the clamping plates can not block the openings of the blind holes of the polyhedral devices, and the material consumption of the grid is reduced to the maximum extent.

Optionally, the clip is pivotally connected to an edge of at least one of the plurality of splints, and the mesh is woven by a stainless steel material with a diameter of 0.7-1.4 mm or a plastic material with high temperature resistance of 100 ℃.

Optionally, the plating line further comprises: a guide rail; a slider that can slide on the guide rail; and a pulley liftably connected to the slider by a rope and configured to be able to engage at least one of the jig and the hanger.

The polyhedral device blocks can be conveniently and easily transferred between the processing tanks for processing by means of guide rails, sliders, pulleys and the like in the plating line. Therefore, the production capacity and efficiency of the whole electroplating line can be greatly improved.

Optionally, the hanger further comprises: the copper bar hook is used for hanging the copper bar on the electroplating bath; a metal bracket electrically connected to the copper bar hooks, one or more rows of the device hooks being fixed to the metal bracket by fasteners at predetermined intervals; and an insulating encapsulating layer which at least covers a part of the metal bracket immersed in the plating solution of the plating tank.

Optionally, when the polyhedral device is immersed in the plating solution, the blind hole faces an outer side of the device hook, and wherein the device hook forms an angle of 10 to 30 ° with a vertical direction, and a height of a top end of the device hook exceeding the polyhedral device is 1 to 3 mm.

Through the above-mentioned structure of device couple, can firmly and conveniently fix the polyhedron device, avoid the device couple in the outside to plug up the drill way of blind hole simultaneously and lead to the problem that the blind hole leaks to plate because of electroplating liquid medicine exchange is insufficient.

Drawings

The above-described and other features, aspects, and advantages of the present invention will become more readily apparent to those of ordinary skill in the art after reading the following detailed description in view of the accompanying drawings. For purposes of clarity, the drawings are not necessarily to scale, and certain parts may be exaggerated to show details. The same reference numbers will be used throughout the drawings to refer to the same or like parts, wherein:

FIGS. 1(a) to 1(e) show schematic top views of various polyhedral devices to be plated;

fig. 2(a) to 2(b) show schematic sectional views obtained by cutting the polyhedral device shown in fig. 1(c) along a line a-a, in which fig. 2(a) shows the polyhedral device formed with an ion implantation layer, and fig. 2(b) shows the polyhedral device formed with the ion implantation layer and a metal primer layer;

FIG. 3 is a schematic view showing the structure of a jig for a rinsing bath;

FIG. 4 is a schematic view of a polyhedral device being washed with high-pressure water by using the jig of the present invention;

FIG. 5(a) shows a schematic front view of a hanger for a plating bath, and FIG. 5(b) shows a schematic side view of the hanger;

FIG. 6 shows a schematic view of a polyhedral device being electroplated using a hanger according to the present invention;

FIG. 7 shows an enlarged partial side view of the hanger with the polyhedral device secured thereto;

FIG. 8 is a schematic view showing the structure of a plating line according to the present invention.

Reference numerals:

10: polyhedral device

11: insulating base material

12: blind hole

13: through groove

14: through hole

15: ion-implanted layer

16: metal primer layer

20: jig tool

21: clamping plate

22: grid mesh

23: clip button

25: high-pressure water

30: hanging tool

31: copper bar hook

32: metal support

33: insulating rubber coating

34: fastening piece

35: device hook

36: copper bar

37: electroplating bath

38: electroplating solution

θ: angle formed by device hook and vertical direction

h: the top end of the device hook exceeds the height of the polyhedron device

40: plating line

41: guide rail

42: sliding block

43: pulley wheel

44: treatment tank

45: a grid tray.

Detailed Description

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Those skilled in the art will readily appreciate that this description is only illustrative of exemplary embodiments of the invention and is in no way intended to limit its scope. For example, elements or features described in one figure or embodiment may be combined with other elements or features described in other figures or embodiments. In addition, for convenience of describing the positional relationship between the respective members, spatially relative terms such as "above" and "below", "left" and "right", and "inner" and "outer" and the like are used herein. These terms are used based on the drawings only for convenience of description. For example, if the device in the figures is turned upside down, a component described as being on the "left" side of a component would be oriented on the "right" side of the component.

Referring now to the drawings, FIGS. 1(a) to 1(e) show schematic top views of various polyhedral devices 10 to be plated. These polyhedral devices 10 have three or more surfaces, and the size of the longest side is 100mm or less, for example, 80mm, 50mm, or the like. As shown in the drawing, the polyhedral device 10 is formed with a blind hole 12 on one surface, and the opening shape of the blind hole 12 may be circular, rectangular, square, or the like. In one embodiment, the diameter of the blind hole is 0.5-5 mm, such as 1mm, 2mm, 3mm, 4mm, and the thickness-to-diameter ratio of the blind hole can be 2:1 or less, such as 1.5:1, 1:1, and the like. The polyhedral device 10 further comprises through slots 13 or through holes 14, and the width or diameter of the through slots 13 or through holes 14 may be 1-4 mm, such as 2mm, 3mm, etc.

The surface of the polyhedral device 10 on which the blind holes 12 are formed can take various shapes. For example, in the embodiment shown in fig. 1(a), the surface of the polyhedral device 10 is rectangular, wherein one through groove 13 is distributed in the approximate center of the rectangle, and two blind holes 12 are uniformly distributed above the through groove 13. In the embodiment shown in fig. 1(b), the surface of the polyhedral device 10 is circular, wherein one through hole 14 is distributed in the center of the circle, and three blind holes 12 are uniformly distributed at equal intervals around the through hole 14. In the embodiment shown in fig. 1(c), the surface of the polyhedral device 10 has a triangular shape, wherein one through hole 14 is distributed in the center of the triangular shape, and three blind holes 12 are uniformly distributed at equal intervals around the through hole 14. In the embodiment shown in fig. 1(d), the surface of the polyhedral device 10 is pentagonal, wherein one through groove 13 is distributed in the approximate center of the pentagonal, and three blind holes 12 are distributed on the left side, the upper side and the right side of the through groove 13 respectively. In the embodiment shown in fig. 1(e), the surface of the polyhedral device 10 is an irregular polygon formed by overlapping two rectangles, wherein one through groove 13 is distributed in the approximate center of the polygon, and two blind holes 12 are respectively distributed above and below the through groove 13. It is to be readily understood that the surface shapes shown in fig. 1(a) to 1(e), and the distribution and number of the blind holes 12, the through-grooves 13, and the through-holes 14 are merely exemplary. For example, the through-groove 13 and the through-hole 14 may be provided near the edge of the surface of the polyhedral device 10, and the blind hole 12 may be provided at the substantial center of the surface. Further, in the case where a plurality of blind holes 12 are formed, the depth and the hole diameter of each blind hole 12 may be the same or may be different from each other.

The polyhedral device 10 can employ a variety of insulating substrates 11 depending on its ultimate use and performance requirements. For example, for high frequency communication devices, a polymeric resin material may be used as the substrate 11, such as an LCP substrate,A PP substrate, a PEEK substrate, a BT substrate, an epoxy resin substrate, a CE substrate, a PPE substrate, a PTFE substrate, or a modified substrate thereof, and the like. For the ceramic filter, a dielectric ceramic material having low loss, high dielectric constant, temperature coefficient of frequency and small thermal expansion coefficient, such as BaO-Ln, can be used₂O₃-TiO₂(BLT) series, CaTiO₃Modified series, modified lead-based perovskite series, BaTi₄O₉、Ba₂Ti₉O₂₀And (Zr, Sn) TiO₄Series, and composite perovskite structure type materials, and the like.

In order to perform the subsequent electroplating of the polyhedral device 10, it is first necessary to metalize the surface and the hole walls of the insulating base material 11 of polymer resin, ceramic, or the like, including the hole walls of the through-grooves 13 and the through-holes 14, and the groove bottoms and the side walls of the blind holes 12, so as to be electrically conductive. Taking the polyhedral device 10 shown in fig. 1(c) as an example, fig. 2(a) to 2(b) show schematic sectional views obtained by cutting the polyhedral device 10 along a line a-a.

In one embodiment, as shown in fig. 2(a), the ion-implanted layer 15 is formed by implanting a conductive material onto the surface of the insulating substrate 11 and under the hole walls by an ion implantation technique. In the ion implantation process, a conductive material is used as a target material, for example, Cr, Ni, Ti, Mo, W, Sn, or an alloy thereof, the conductive material in the target material is ionized by an arc action in a vacuum environment to generate ions, and then the ions are accelerated in a high-voltage electric field to obtain high energy; the energetic conductive material ions impinge at high velocity onto the surfaces and pore walls of the substrate and are implanted beneath these surfaces and pore walls. The ion-implanted layer 15 thus formed has a certain conductivity, and can be directly plated thereon. Furthermore, stable chemical bonds, such as ionic bonds or covalent bonds, may be formed between the implanted conductive material and material molecules of the insulating substrate, which chemical bonds help to enhance the bonding force between the ion implanted layer and the substrate, so that the plated layer subsequently attached to the substrate is not easily peeled off from the substrate.

In another embodiment, as shown in fig. 2(b), after the ion implantation layer 15 is formed on the surface of the insulating substrate and under the hole wall by the ion implantation technique, a metal primer layer 16 is deposited on the ion implantation layer 15 by plasma deposition or multi-arc ion plating, so as to further reduce the surface sheet resistance of the substrate 11, thereby facilitating the subsequent electroplating process. The metal base layer 16 may be formed using the same material as the target material used in ion implantation, for example, Cr, Ni, Ti, Mo, W, Sn, or an alloy thereof, or the metal base layer 16 may be formed using a material (for example, Cu) used in subsequent plating. In this case, the metal primer layer 16 and the ion-implanted layer 15 or the plating layer have similar lattice composition and physical properties, and have strong bonding force therebetween, so that the plating layer is not easily peeled off from the insulating base material 11.

When the polyhedron device 10 with the ion injection layer 15 or the metal bottom layer 16 is electroplated, the overall process flow comprises the steps of high-pressure water washing, feeding, electroplating, secondary immersion water washing, chemical silver/tin/OSP (organic solderability preservative), and other anti-oxidation surface treatments, secondary immersion water washing, blanking, tray charging and washing, baking and the like. Among these steps, the present invention focuses mainly on jigs used in the high-pressure water washing step and hangers used in the electroplating step, and will be described in detail below.

Fig. 3 shows a schematic view of the jig 20 for a rinsing bath, and fig. 4 shows a schematic view when the jig 20 is used to perform high-pressure rinsing on the polyhedral device 10. As shown, the jig 20 includes a clamping plate 21 with a plurality of cells 22, and a clamping buckle 23, wherein each cell 22 has the same size and shape. When one or more polyhedral devices 10 are placed between two adjacent clamping plates 21, the clamping buckles 23 serve to clamp the edges of the two clamping plates 21 together, thereby securely holding the polyhedral devices 10 between the two clamping plates 21. In one embodiment, three or more clamping plates 21 are stacked together, a plurality of polyhedral devices 10 are placed between each two adjacent clamping plates 21, and several clamping clasps 23 clamp the edges of the clamping plates 21 together. For example, a plurality of devices may be provided between the first and second laminates, while a plurality of devices are provided between the second and third laminates, and the outer surfaces of the first and third laminates are clamped with clips.

The clips 23 may be provided separately from the clamping plates 21, and the edges of the plurality of clamping plates 21 are clamped by the operator's pinching operation when loading the polyhedral device 10. The clip 23 may also be pivotally provided near one edge of the clamping plates 21, and is rotationally operated by an operator to clamp the edge of the other clamping plate 21 when loading the polyhedral device 10, thereby securely holding the polyhedral device 10 between two adjacent clamping plates 21.

The grid 22 of the clamping plate 21 is configured such that each edge thereof avoids the blind hole 12 of the corresponding polyhedral device 10, thereby enabling the bottom of the blind hole 12 to be washed and wetted when high-pressure water washing is performed, and avoiding the generation of air bubbles in the blind hole 12. In one embodiment, the clamping plate 21 is designed for the polyhedral device 10 with a rectangular surface, wherein the size of one side of the grid 22 is 1-2 mm smaller than that of the short side of the rectangle, the other side of the grid is based on the position avoiding the blind hole, and finally two grids 22 are matched with one polyhedral device 10. In this way, a large number of polyhedral devices 10 can be arranged side by side between two adjacent clamping plates 21, while ensuring that none of the edges of the cells 22 of the clamping plates 21 obstruct the openings of the blind holes 12 of the polyhedral devices 10 and minimizing the amount of material used for the cells 22. The size and shape of the grid 22 in the clamping plate 21 can also be similarly designed for polyhedral devices 10 having other surface shapes, so as to simultaneously meet the requirements that the polyhedral devices 10 are closely stacked and the edges of the grid 22 do not obstruct the blind holes 12.

The mesh 22 may be woven from various materials which can withstand high pressure water washing without being easily deformed, such as stainless steel materials with a diameter of 0.7-1.4 mm, or plastic materials which can withstand high temperatures of about 100 ℃. When high-pressure water washing is performed, the polyhedral device 10 is firmly held between the adjacent two clamping plates 21, and the surface formed with the blind holes 12 faces the jetting direction of high-pressure water 25. For example, the jig 20 may be horizontally placed in a rinsing bath such that the surface of the polyhedral device 10 on which the blind holes 12 are formed faces upward, and then the blind holes 12 are rinsed from top to bottom with a high-pressure water gun to remove impurities existing in the blind holes, the through holes, and the through grooves, and to prevent the generation of bubbles. The jig 20 may be vertically placed in a rinsing bath so that the surface of the polyhedral device 10 on which the blind holes 12 are formed faces a high-pressure water gun, and then the blind holes 12 are rinsed from the side by the high-pressure water gun.

Fig. 5(a) shows a schematic front view of the hanger 30 for the plating tank, and fig. 5(b) shows a schematic side view of the hanger 30. As shown, the hanger 30 includes: a copper bar hook 31; the metal bracket 32 is electrically and mechanically connected with the copper bar hook 31; an insulating encapsulating layer 33 encapsulating the outer surface of the lower portion of the metal holder 32; and a device hanger 35 for hanging the fixed polyhedral device 10 in an inclined posture. The metal bracket 32 may be made of a copper bar or stainless steel, and includes left and right longitudinal beams each having a copper bar hook 31 formed at the top end thereof, and one or more cross beams spanning between the two longitudinal beams. The device hook 35 may be made of stainless steel or copper wire, or may be made of other conductive metal materials. One or more rows of device hooks 35 are respectively fixed to one or more beams of the metal bracket 32 by fasteners 34 at predetermined intervals. The length of each device hook 35 may be the same or different. In the case where the lengths of the device hooks 35 in the same row are the same as each other, the predetermined interval between the adjacent hooks 35 needs to be larger than the lateral dimension of the polyhedral device 10. In the case where the device hooks 35 in the same row are different in length from each other and the difference in length is larger than the longitudinal dimension of the polyhedral device 10, the adjacent polyhedral devices 10 may be hung and fixed on the device hooks 35 in a vertically staggered manner, and the predetermined interval between the adjacent hooks 35 may be larger than half the transverse dimension of the polyhedral device 10.

As shown in a schematic side view in fig. 5(b), the device hook 35 is fixed to the beam of the metal bracket 32 in an inclined posture via the fixing piece 34. That is, the main body portion or straight portion of the device hook 35 is angled with respect to the surface of the metal bracket 32. The fasteners 34 may be conventional screws, nuts and bolts, snap-fit fittings, and the like. In one embodiment, the fixture 34 may not be used, and the device hook 35 may be integrally provided on the cross beam of the metal bracket 32 by welding or the like.

In the case of plating, as shown in fig. 6, a large number of polyhedral devices 10 are suspended and fixed to respective device hooks 35 of a hanger 30, the hanger 30 is placed in a plating tank 37, the copper bar hooks 31 of the hanger 30 are hooked on the copper bars 36 of the plating tank 37, and all the polyhedral devices 10 are immersed in a plating solution 38 in the plating tank 37. During the plating process, the blind holes of the polyhedral device 10 face the outside of the hooks 35, i.e. towards the plating solution 38, and the copper bars 36 are connected to the rectifier cathodes. Thus, the current flows into the metallized surfaces and hole walls of the polyhedral device 10, such as the ion implantation layer 15 and the metal primer layer 16 shown in fig. 2(a) to 2(b), via the copper rods 36, the copper rod hooks 31, the metal supports 32, and the device hooks 35 in succession, so that copper in the plating solution is deposited on these surfaces and hole walls. The thickness of the electroplated copper layer can be conveniently and easily adjusted by adjusting the current magnitude, the working time and the like in the electroplating process. The insulating encapsulating layer 33 is made of an insulating material and covers at least the portions of the metal holder 32 immersed in the plating solution 38, thereby avoiding copper deposition on these portions during the plating process. In one embodiment, the insulating encapsulating layer 33 may also encapsulate the anchor 34, as well as portions of the device hooks 35 that do not contact the polyhedral device 10, to minimize the deposition and consumption of copper on unnecessary portions.

Fig. 7 is an enlarged partial side view of the hanger 30 to which the polyhedral device 10 is fixed, and is a side view of one device hook 35 and the polyhedral device 10 shown in fig. 6. As shown in the drawing, the bent portions of the device hooks 35 pass through the through-grooves 13 or the through-holes 14 of the polyhedral device 10 to hang and fix the polyhedral device 10 on the metal brackets 32 of the hanger 30. The device hook 35 is fixed to the metal bracket 32 in an inclined posture by the fastener 34, and a straight portion of the device hook 35 forms an angle θ with the vertical direction, or the surface of the metal bracket 32. In one embodiment, the angle θ is in the range of 10-30 °, such as 15 °, 20 °, and so on. Thus, the device hook 35 can be prevented from contacting the inner surface of the polyhedral device 10, and the problems such as poor thickness and appearance of the surface plating layer can be avoided. Further, the curved portion of the device hook 35 protrudes beyond the surface of the polyhedral device 10 by a height h beyond the polyhedral device 10. In one embodiment, the height h is in the range of 1-3 mm, for example, 1.5mm, 2mm, etc. Therefore, the polyhedral device 10 can be firmly and conveniently fixed by using the device hook 35, and the problems that the hole opening of the blind hole 12 is blocked by the device hook 35 on the outer side and the plating leakage of the blind hole is caused due to insufficient exchange of electroplating liquid medicine are solved.

It will be readily understood that when the polyhedral device 10 in each of the figures is suspended in the up-down direction as shown in fig. 1(a) to 1(e), the two blind holes 12 shown in fig. 1(a) will be located on both sides of the curved portion of the device hook 35 protruding out of the surface of the device through the through-groove 13, respectively. At this time, the bent portion of the device hook 35 does not block the opening of the blind via 12, and does not prevent the sufficient exchange of the plating liquid in the blind via 12. In contrast, in the polyhedral device 10 shown in fig. 1(b) to 1(e), one blind hole 12 located above may be blocked by the curved portion of the device hook 35 protruding outside the surface of the device through the through-hole 13 or the through-hole 14. At this time, it is necessary to take care that the height h of the bent portion beyond the polyhedral device 10 is smaller than the vertical distance between the blind hole 12 and the through-groove 13 or the through-hole 14 so as not to hinder the sufficient exchange of the plating liquid medicine in the blind hole 12.

Fig. 8 shows a schematic view of the structure of the plating line 40 according to the present invention. As shown in the drawing, the plating line 40 includes the jig 20 for a rinsing bath shown in fig. 3 and the hanger 30 for a plating bath shown in fig. 5. Further, the plating line 40 further includes: a guide rail 41; a slider 42 slidable in the horizontal direction on the guide rail 41; a pulley 43 liftably connected to the slider 42 by a rope; and a processing bath 44 for performing various processes on the polyhedral device 10. The pulley 43 may engage a portion of the jig 20 and the hanger 30 by means of, for example, a clamp or the like, e.g., may engage an upper edge of the clamp plate 21 of the jig 20, or an uppermost beam of the hanger 30, or the like.

In the above-described plating line 40, the polyhedral device 10 can be moved in the horizontal direction and the vertical direction into the respective processing tanks 44, and subjected to the oxidation-preventing surface treatment such as the high-pressure water washing, the charging, the plating, the secondary immersion water washing, the chemical silver/tin/OSP deposition, the tray charging and the washing, which are described above. Only four of these steps are schematically shown in fig. 8. For example, the polyhedral device 10 is first held in a jig 20 and put into a water washing tank to be subjected to high-pressure water washing; the cleaned polyhedral device 10 is then suspended and fixed on the hanger 30 in an inclined manner in the feeding process; the hanger 30 is then placed in an electroplating bath, and the polyhedral device 10 is subjected to copper electroplating using an electroplating solution; and, taking out the polyhedron device 10 after completion of the plating, putting it in the lattice tray 45 to be washed with water, followed by baking and the like. The grid tray 45 allows water to enter therein to wash the respective polyhedral devices 10 while preventing the polyhedral devices 10 from leaking out of the grid.

The above-described hanger 30 in the plating line 40 is simple in design and easy and quick in manual operation, and can hang about 200 polyhedral device blocks 10 per hanger, and can accommodate two or more hangers 30 per plating tank. Further, the polyhedral device block 10 can be easily and conveniently transferred between the processing tanks 44 by means of the guide rail 41, the slider 42, the pulley 43, and the like, to be processed. Therefore, the production capacity and efficiency of the whole electroplating line can be greatly improved, and the requirements of the deep blind holes of the device and the thickness and the appearance performance of the electroplated copper layer can be better met. In fact, the above-described plating line 40 can be applied to the copper electroplating process for 30 ten thousand or even millions of polyhedral device blocks 10 per month.

In one embodiment, instead of the above-mentioned components such as the guide rail 41, the slide block 42 and the pulley 43, a multi-person operation platform may be provided on a production line, and each worker may be responsible for one or more specific steps in the plating line.

The foregoing description has been directed to only specific embodiments of this invention. However, the present invention is not limited to these specific embodiments. Those skilled in the art will readily appreciate that various obvious modifications, adaptations, and alternatives can be made to the embodiments to adapt them to other situations without departing from the spirit of the present invention. Indeed, the scope of the invention is defined by the claims and may include other examples that may be envisioned by those skilled in the art.

Claims (10)

1. A plating line for plating a polyhedral device having blind holes, the plating line comprising:

a jig for a rinsing bath, which includes a plurality of clamping plates with a mesh, and a clip for clamping an edge of the clamping plates, and is configured to hold the polyhedral device between two clamping plates; and

a hanger for a plating bath comprising an implement hanger configured to removably hang secure the polyhedral implement to the hanger in an inclined position.

2. The plating line according to claim 1, wherein the surface of the polyhedral device on which the blind holes are formed is rectangular, circular or triangular, and the blind holes have a thickness-diameter ratio of 2:1 or less and a diameter of 0.5-5 mm.

3. The plating line according to claim 2, wherein the polyhedral device has a longest side dimension of 100mm or less, and further has a through groove or a through hole having a groove width or a diameter of 1 to 4mm, through which the device hook protrudes out of the surface of the polyhedral device.

4. The plating line according to claim 2 or 3, wherein the polyhedral device is made by metallizing a surface and a hole wall of an insulating substrate by an ion implantation technique, the insulating substrate comprises a polymer resin and a ceramic, and the metallized surface and the hole wall are electrically connected to the device hook.

5. The plating line according to claim 2 or 3, wherein the clip holds the polyhedral device between two of the plurality of clamping plates, and wherein the grid edges of the clamping plates avoid the blind holes of the polyhedral device.

6. The plating line according to claim 5, wherein the surface of the polyhedral device and the mesh of the jig are each rectangular, one side of the mesh is smaller than the short side of the surface by 1 to 2mm, the other side of the mesh avoids the blind holes of the polyhedral device, and one polyhedral device is matched with two meshes.

7. The plating line according to claim 1, wherein the clip is pivotably connected to an edge of at least one of the plurality of clamping plates, and the mesh is woven from a stainless steel material having a diameter of 0.7-1.4 mm or a plastic material resistant to high temperatures of 100 ℃.

8. The plating line of claim 1, further comprising:

a guide rail;

a slider that is slidable on the guide rail; and

a pulley liftably connected to the slider by a rope and configured to be able to engage at least one of the jig and the hanger.

9. The plating line of claim 1, wherein the hanger further comprises:

the copper bar hook is used for hanging the copper bar on the electroplating bath;

a metal support electrically connected to the copper bar hooks, one or more rows of the device hooks being fixed to the metal support by fasteners at predetermined intervals; and

and the insulating encapsulating layer at least coats the part of the metal bracket, which is immersed in the electroplating solution of the electroplating bath.

10. The plating line according to claim 1 or 9, wherein the blind hole faces an outer side of the device hook when the polyhedral device is immersed in the plating solution of the plating bath, and wherein the device hook makes an angle of 10 to 30 ° with a vertical direction, and a height of a tip of the device hook beyond the polyhedral device is 1 to 3 mm.

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