CN212688218U - Array plating tool capable of replacing and assembling multiple plating parts - Google Patents

Abstract

The utility model discloses an array plating tool capable of changing and installing a plurality of plating pieces in the field of electronic packaging and electroplating, which comprises a lifting hook, and also comprises at least one group of positioning liquid leaking plates, a conductive net and an insulating support frame which are arranged in parallel from top to bottom and are fixedly connected, wherein the conductive net is connected with the bottom end of a conductive lifting rope, and the top end of the conductive lifting rope is fixed on the lifting hook; the positioning leakage plate comprises an upper plated part positioning leakage plate and a lower plated part positioning leakage plate, the upper plated part positioning leakage plate and the lower plated part positioning leakage plate are fixedly connected through supporting columns, and leakage through holes are uniformly distributed on the surface of the upper plated part positioning leakage plate in an array mode. The utility model discloses whole small in size, occupation space is little, and the product dress frame is taken out after plating conveniently, but the electroplating technique field in the wide application electronic packaging.

Description

Array plating tool capable of replacing and assembling multiple plating parts

Technical Field

The utility model relates to an electronic packaging electroplates the field, specifically is a multiple array of plating of piece of interchangeable dress plates utensil.

Background

In the field of integrated circuit packaging technology, in order to meet the welding requirements between parts and components and simultaneously meet the requirements of corrosion resistance (such as salt spray resistance), telecommunication performance and air tightness, the nickel and gold pre-electroplating and the gold electroplating are required to be carried out on various packaged parts such as a cover plate, a heat sink plate and a metalized ceramic substrate. The cover plate used for sealing the integrated circuit package shell is thin and light, and the size of some cover plates is only 9mm multiplied by 0.1mm, so that the integrated circuit package shell is extremely light, thin and small.

The traditional electroplating scheme is generally divided into three types, one is roller electroplating, the second is vibration electroplating, and the third is butterfly clamp type hanger rack plating. However, the existing electroplating solution has certain problems, such as: 1. the roller electroplating has the defects of easy deformation, uneven coating thickness, difficult corrosion resistance meeting the requirement, low yield, large carrying-out amount of the plating solution during electroplating and unnecessary waste of the plating solution. In addition, the production requirements of multiple varieties and small batches are frequently existed in the field of electronic packaging, when a single batch of products is less, more conductive fillers are needed to enable the interior of the roller to meet the filling requirement required by electroplating, and unnecessary consumption of plating solution is caused; and the roller is heavy, and the labor intensity of workers is high. 2. The vibration electroplating technology has poor electroplating effect on a sheet-shaped plated part with the diameter of more than 5mm, special equipment is needed for vibration electroplating, the cost is high, the price of a set of vibration machine head is multiple times of that of a roller, domestic equipment manufacturers start late, the performance stability is poor, and the appearance is rough. 3. The butterfly card type hanging tool is time-consuming to mount, the cover plate is easy to fall off from the hanging tool when being thin in the electroplating process, and the product is easy to deform in the mounting process. In addition, the cover plates with special shapes such as circles and polygons are difficult to mount, and meanwhile, the hanging tool is large in size and needs to occupy more fields for storage.

In view of the shortcomings of the electroplating scheme, the applicant provides an array plating tool capable of replacing a plurality of plating parts, and the problems can be solved.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an array plating utensil of a plurality of plating pieces of removable adorns to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

an array plating tool capable of being replaced and provided with a plurality of plated parts comprises a lifting hook, and further comprises at least one group of positioning liquid leakage plates, a conductive net and an insulating support frame which are arranged in parallel from top to bottom and are fixedly connected, wherein the conductive net is connected with the bottom end of a conductive lifting rope, and the top end of the conductive lifting rope is fixed on the lifting hook; the positioning leakage plate comprises an upper plated part positioning leakage plate and a lower plated part positioning leakage plate, the upper plated part positioning leakage plate and the lower plated part positioning leakage plate are fixedly connected through a support, and leakage through holes are uniformly distributed on the surfaces of the upper plated part positioning leakage plate and the lower plated part positioning leakage plate in an array mode.

As an improved scheme of the utility model, in order to prevent the wall sticking sultriness of the plating piece in the electroplating process, the aperture of the liquid leakage through hole is larger than the width of the product by 1-5 mm.

As the utility model discloses an improvement scheme, for the convenience of installation electrically conductive net, electrically conductive net includes frame and metal mesh, the metal mesh sets up inside the frame, frame limit portion has seted up electrically conductive net mounting hole.

As the improvement scheme of the utility model, the meshes of the metal net are 40-200 meshes.

As the utility model discloses an improvement scheme, in order to prevent to plate a card and go into the metal mesh gap, insulating support frame surface corresponds electrically conductive net mounting hole has been seted up and has been held in the palm the frame mounting hole, just insulating inside integral type of holding in the palm the frame distributes and has even muscle.

As the utility model discloses a modified scheme, for the convenience of the electrically conductive net of installation, insulating support frame below is equipped with insulating clamp plate, the installation through-hole has been seted up on insulating clamp plate surface, insulating clamp plate and insulating support frame, electrically conductive link firmly through insulating locking screw between the net.

As the utility model discloses a modified scheme, for the convenience of evenly electrically conducting, electrically conductive lifting rope bottom is connected with the connecting wire that frame type distributes, correspond on the connecting wire electrically conductive net mounting hole is equipped with the clamping ring, it is fixed that the clamping ring passes through insulating locking screw connection.

As the improvement scheme of the utility model, in order to improve the safety performance when electroplating and the service life of the plating tool, the surface coating of the conductive lifting rope is provided with insulating glue or insulating paint.

Has the advantages that: the utility model discloses to plate the piece and load on location weeping board, because the location weeping board is for plating a location weeping board and plating a location weeping board's built on stilts design down, consequently the plating bath is abundant smooth not blockking up, plate when plating on plating a location weeping through-hole of weeping board, electrically conductive lifting rope can have the swing of certain range to discharge the bubble, effectively prevents contact failure. Through the conductive net in the middle part, the probability of dropping and scratching can be reduced when the plating piece is subjected to ultrasonic cleaning in the electroplating process. The utility model discloses whole small in size, occupation space is little, and the product dress frame is taken out after plating conveniently, but the electroplating technique field in the wide application electronic packaging.

Drawings

Fig. 1 is a schematic perspective view of the present invention;

figure 2 is a front view of the present invention in figure 1;

fig. 3 is a left side view of fig. 1 of the present invention;

fig. 4 is a cross-sectional view of fig. 1 of the present invention;

FIG. 5 is a schematic view of the three-dimensional structure of the positioning leakage plate of the present invention;

FIG. 6 is a diagram showing the working state of the plated part of the present invention;

fig. 7 is a schematic perspective view of the insulating support frame of the present invention;

fig. 8 is a schematic perspective view of the conductive net of the present invention;

fig. 9 is a schematic view of a three-dimensional structure of the conductive grading ring of the present invention;

fig. 10 is a schematic perspective view of the hook of the present invention;

fig. 11 is a schematic perspective view of the insulating pressing plate of the present invention;

fig. 12 is a schematic perspective view of the insulating locking screw of the present invention;

FIG. 13 is a schematic view of a plated part.

In the figure: 1-positioning a liquid leakage plate; 11-plating a positioning leakage plate of a piece; 12-lower plating part positioning leakage plate; 13-liquid leakage through holes; 14-a pillar; 2-insulating support frame; 21-a mounting hole of the supporting frame; 22-connecting ribs; 3-a conductive mesh; 31-conductive mesh mounting holes; 32-a frame; 4-a conductive grading ring; 41-a pressure ring; 42-connecting wires; 43-conductive lifting rope; 5-a hook; 6-insulating locking screw; 61-insulating screw; 62-an insulating nut; 7-an insulating platen; 8-plating the piece.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Embodiment 1, refer to fig. 1-5, an array plating tool capable of exchanging multiple plated parts includes a hook 5, and further includes at least one set of positioning weep plates 1, a conductive mesh 3 and an insulating support frame 2, which are arranged in parallel and fixedly connected up and down, the conductive mesh 3 is connected with the bottom end of a conductive lifting rope 43, and the top end of the conductive lifting rope 43 is fixed on the hook 5; the positioning leakage plate 1 comprises an upper plated part positioning leakage plate 11 and a lower plated part positioning leakage plate 12, the upper plated part positioning leakage plate 11 and the lower plated part positioning leakage plate 12 are fixedly connected through a support column 14, and leakage through holes 13 are uniformly distributed on the surfaces of the upper plated part positioning leakage plate 11 and the lower plated part positioning leakage plate 12 in an array mode.

The positioning leakage plate 1, the insulating support frame 2 and the conductive net 3 are jointly combined into a group, the conductive lifting ropes 43 can be connected with a plurality of groups, and the groups are distributed up and down. This embodiment is exemplified by a group.

In this embodiment, the positioning leakage plate 1 is of an integrated structure, the pillars 14 are fixedly arranged between the upper plating positioning leakage plate 11 and the lower plating positioning leakage plate 12 in a rectangular array, so that the positioning leakage plate 1 is overhead, plating solution can enter from the side, circulation of the plating solution is ensured, the height of the pillars 14 can be adjusted according to the size of the plated part 8, and the plated part 8 is as shown in fig. 13.

The shapes of the weep through holes 13 on the upper plating part positioning weep plate 11 and the lower plating part positioning weep plate 12 are not particularly limited, and can be circular holes, square holes or holes with other shapes, and the specific shapes are designed according to the size of the plating part 8. However, the weep through holes 13 are preferably circular holes with the diameter of 1-5mm larger than the width of the product, so that the plating piece 8 can be prevented from being attached to the surface of the positioning weep plate 1 and being prevented from being stuffy in the electroplating process. In this embodiment, the positioning leakage plate 1 can be replaced according to the size of the plated part.

As shown in fig. 6, in the implementation of this embodiment, the hook 5 is hung on the cathode rod, the hook 5 is shown in fig. 10, the plated part 8 is loaded in the plated part positioning leakage plate 1, then the hanger of this embodiment is pretreated and put into the plating solution, and then the plating solution is put into the hanger, and then the hanger is electrified, the conductive mesh 3 deposits metal ions on the surface of the plated part 8, and the conductive hanging rope 43 swings with the cathode rod to remove air bubbles, so that the plating solution can fully wrap the plated part 8, thereby preventing poor contact. And after the plating is finished, the plating solution remained on the surface of the plated part 8 is sufficiently replaced and cleaned by ultrasonic water washing, and then the plated part after the completion is poured out on a tray by an operator and placed in a drying furnace for drying.

Referring to fig. 8, the conductive mesh 3 includes a frame 32 and a metal mesh, the metal mesh is disposed inside the frame 32, and the edge of the frame 32 is provided with a conductive mesh mounting hole 31. The meshes of the metal net are 40-200 meshes. Usually, the frame 32 and the metal mesh are made of brass for conducting electricity, and the conductive mesh mounting holes 31 are used for mounting the conductive mesh 3.

Referring to fig. 7, a support frame mounting hole 21 is formed on the surface of the insulating support frame 2 corresponding to the conductive mesh mounting hole 31, and connecting ribs 22 are integrally distributed in the insulating support frame 2. The insulating support frame 2 is used for compacting the conductive net 3 on the surface of the lower plating part positioning leakage plate 12, and prevents the plating part 8 from being clamped into the gap of the conductive net 3 to cause poor appearance.

As shown in fig. 11-12, an insulating pressing plate 7 is arranged below the insulating support frame 2, a mounting through hole is formed in the surface of the insulating pressing plate 7, and the insulating pressing plate 7 is fixedly connected with the insulating support frame 2 and the conductive net 3 through an insulating locking screw 6. The insulating pressing plate 7 is of a sheet structure, the insulating pressing plates 7 are matched with the insulating locking screws 6 together to be fixed, each insulating locking screw 6 comprises an insulating screw rod 61 and an insulating nut 62, and the insulating screw rods 61 are locked and fixed with the insulating nuts 62 after penetrating through the mounting through holes, the support frame mounting holes 21 and the conductive net mounting holes 31.

As shown in fig. 9, the bottom end of the conductive lifting rope 43 is connected with the connection wires 42 distributed in a frame shape, the connection wires 42 are provided with the pressing rings 41 corresponding to the conductive net mounting holes 31, and the pressing rings 41 are fixedly connected by the insulating locking screws 6. The pressure ring 41 and the conductive lifting rope 43 are usually made of stainless steel, red copper or brass, and the surface of the conductive lifting rope 43 is coated with insulating glue or insulating paint for enhancing the safety performance and prolonging the service life. The conductive lifting rope 43, the connecting wire 42 and the pressure ring 41 together form a conductive grading ring 4 for uniform conduction. The insulating screw 61 also penetrates the pressure ring 41 and is used for fixing the conductive grading ring 4.

The utility model discloses whole small in size, occupation space is little, and the product dress frame is taken out after plating conveniently, but the electroplating technique field in the wide application electronic packaging.

Although the present description is described in terms of embodiments, not every embodiment includes only a single embodiment, and such description is for clarity only, and those skilled in the art should be able to integrate the description as a whole, and the embodiments can be appropriately combined to form other embodiments as will be understood by those skilled in the art.

In the description of the present invention, it is noted that relational terms such as first and second, and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

In the description of the present invention, it should be further noted that the terms "upper", "lower", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the products of the present invention are used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Therefore, the above description is only a preferred embodiment of the present application, and is not intended to limit the scope of the present application; all changes which come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims (8)

1. The array plating tool capable of being used for replacing and assembling various plated parts comprises a lifting hook (5), and is characterized by further comprising at least one group of positioning liquid leakage plates (1), a conductive net (3) and an insulating support frame (2), wherein the positioning liquid leakage plates are vertically arranged in parallel and fixedly connected, the conductive net (3) is connected with the bottom end of a conductive lifting rope (43), and the top end of the conductive lifting rope (43) is fixed on the lifting hook (5); the positioning leakage plate (1) comprises an upper plated part positioning leakage plate (11) and a lower plated part positioning leakage plate (12), the upper plated part positioning leakage plate (11) and the lower plated part positioning leakage plate (12) are fixedly connected through a support column (14), and leakage through holes (13) are uniformly distributed on the surfaces of the upper plated part positioning leakage plate (11) and the lower plated part positioning leakage plate (12) in an array mode.

2. An array plating tool capable of exchanging multiple plating pieces according to claim 1, wherein the diameter of the liquid leaking through hole (13) is 1-5mm larger than the width of the product.

3. The plating tool capable of exchanging multiple plated parts according to claim 1 or 2, wherein the conductive mesh (3) comprises a frame (32) and a metal mesh, the metal mesh is arranged inside the frame (32), and the edge of the frame (32) is provided with a conductive mesh mounting hole (31).

4. An array plating tool capable of exchanging multiple plated parts according to claim 3, wherein the meshes of the metal mesh are 40-200 meshes.

5. The array plating tool capable of exchanging multiple plated parts according to claim 3, wherein a support frame mounting hole (21) is formed in the surface of the insulating support frame (2) corresponding to the conductive mesh mounting hole (31), and connecting ribs (22) are integrally distributed in the insulating support frame (2).

6. The array plating tool capable of exchanging multiple plated parts according to claim 5, wherein an insulating pressing plate (7) is arranged below the insulating supporting frame (2), a mounting through hole is formed in the surface of the insulating pressing plate (7), and the insulating pressing plate (7) is fixedly connected with the insulating supporting frame (2) and the conductive net (3) through an insulating locking screw (6).

7. The array plating tool capable of being replaced and plated with multiple plated parts according to claim 6, wherein the bottom ends of the conductive lifting ropes (43) are connected with connecting wires (42) distributed in a frame shape, a pressing ring (41) is arranged on each connecting wire (42) corresponding to the conductive net mounting holes (31), and the pressing rings (41) are fixedly connected through insulating locking screws (6).

8. An array plating tool capable of being reloaded with multiple plating parts according to claim 1 or 7, wherein the surface of the conductive lifting rope (43) is coated with insulating glue or insulating paint.

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