KR101804457B1 - Vibration generating device for plating for Degassing - Google Patents

Vibration generating device for plating for Degassing Download PDF

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Publication number
KR101804457B1
KR101804457B1 KR1020160024958A KR20160024958A KR101804457B1 KR 101804457 B1 KR101804457 B1 KR 101804457B1 KR 1020160024958 A KR1020160024958 A KR 1020160024958A KR 20160024958 A KR20160024958 A KR 20160024958A KR 101804457 B1 KR101804457 B1 KR 101804457B1
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KR
South Korea
Prior art keywords
panel
vibration
plating
vibrator
vibrating
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Application number
KR1020160024958A
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Korean (ko)
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KR20170102631A (en
Inventor
배민수
이대원
Original Assignee
(주)네오피엠씨
배민수
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Priority to KR1020160024958A priority Critical patent/KR101804457B1/en
Publication of KR20170102631A publication Critical patent/KR20170102631A/en
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Publication of KR101804457B1 publication Critical patent/KR101804457B1/en

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonics, vibrations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/32—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor using vibratory energy applied to the bath or substrate
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

More particularly, the present invention relates to a vibration generating apparatus for vibrating a plating liquid on a fixed frame disposed on an upper portion of a plating tank filled with a plating liquid, A vibration spring installed on an upper portion of the base panel; an angle panel member disposed on an upper portion of the support spring; a vibrator installed on an upper portion of the angle panel member; A vibration panel fixed to the panel, a bracket fixed to the fixing frame at a lower portion thereof, and a support spring connecting the support panel and the angle panel member of the bracket to the angle panel member provided with the vibrator, By forming the vibration panel in a rectangular plate shape, Copper is transmitted has the effect of being able to improve the removal efficiency of the air pocket is disposed on a substrate.

Description

[0001] The present invention relates to a vibration generating device for plating,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a vibrating device for plating for removing bubbles, and more particularly, to a vibrating panel provided on an angle panel member provided with a vibrator in a rectangular plate shape, And more particularly, to a vibrating device for plating for removing air bubbles which can improve the removal efficiency of air pockets disposed in the air pocket.

Generally, a printed circuit board having a large thickness is formed with a plurality of holes, and a plating layer having a uniform and uniform thickness should be formed on the surface and the hole of the printed circuit board.

In addition, a uniform plating layer can be obtained by removing the air pockets disposed on the surface or the hole of the printed circuit board having the plating bath.

The production of such printed circuit boards is a collection of numerous processes, and the steps are also very complex. Among them, a plating process, that is, a metallization process, plays a key role in providing current and voltage to electronic devices. In recent years, the size of the via-hole connecting the metal wiring and the electronic device with the tendency of light-weight and small size has been getting smaller in recent years, and more uniform plating is required. Further, in order to form a circuit in a plating process of a printed circuit board or to plate vias, a method of forming a seed layer by using an electroless chemical plating method and then forming a metal layer by electrolytic plating is generally used.

A conventional plating board for forming a plating layer having a uniform thickness on a conventional substrate is disclosed in Korean Patent Application No. 10-2011-0050579, in which vibration generated by a vibrator is applied to a printed circuit board through a flight bar So that air pockets of the printed circuit board are removed, and a plating layer of uniform thickness is formed on the surface and the hole.

However, in the related art, vibrations of the vibrator are directly transmitted to the printed circuit board, causing the printed circuit board to vibrate. Therefore, there is a problem that the substrate portion jigged is damaged or contaminated by friction due to vibration. There is a problem that the vibration is not transmitted to the entire printed circuit board in the case of the circuit board.

The above-mentioned invention means the background art of the technical field to which the present invention belongs, and does not mean the prior art.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a vibration panel mounted on an angle panel member provided with a vibrator in the form of a rectangular plate so that vibration is transmitted to the plating liquid over a wide area, And it is an object of the present invention to provide a vibration generating device for plating for removing bubbles which can improve the removal efficiency of air pockets disposed on a substrate.

A vibration generating device installed to vibrate the plating liquid on a fixing frame disposed on an upper part of a plating tank filled with a plating liquid, the vibration generating device comprising: a base panel disposed on an upper portion of the fixing frame; A vibrating panel fixed to the front panel of the angle panel member and being drawn into the plating tank; a vibration panel fixed to the front panel of the angle panel member; A bracket having a lower portion fixed to the frame, and a support spring connecting the support panel and the angle panel member of the bracket.

In addition, a shielding panel is further provided on the back surface of the vibration panel to prevent the plating liquid from splashing by the vibrator due to vibration, and the shielding panel is formed to be inclined downward in the free end direction.

The vibrating panel further includes a vibrating housing having a receiving space having a structure penetrating through the front surface of the vibrating panel to receive the substrate. The vibrating housing includes a side wall portion fixed to both sides of the front portion, And a curved guiding groove is formed on the inner surface of the front surface portion and the back surface panel at predetermined intervals along the longitudinal direction.

The vibration module further includes a wave module, the wave module having a vacuum space therein, the vacuum pad being fixed to the reaction panel, a vibration spring disposed in the vacuum space, And a panel vibrator provided on an upper portion of the housing.

The swinging panel is further provided with a slit portion, and a swinging vibrator is further provided on the swinging panel.

A vibrating device for plating for removing bubbles according to the present invention has a vibrating panel provided on an angle panel member provided with a vibrator in the form of a quadrilateral plate so that vibrations are transmitted to the plating liquid over a large area to remove the air pockets Can be improved.

FIG. 1 is a view showing a vibration generator for plating for removing bubbles according to a first embodiment of the present invention.
2 is an enlarged view showing a vibration generating apparatus for plating for removing bubbles according to a first embodiment of the present invention.
FIG. 3 is a conceptual view showing a state in which a vibration panel of a vibration generating device for plating for bubble removal according to the first embodiment of the present invention is inserted into a plating vessel.
FIG. 4 is a conceptual view showing an operation state of a vibration generator for plating for removing bubbles according to the first embodiment of the present invention.
5 is a view showing a vibration generator for plating for bubble removal according to a second embodiment of the present invention.
6 is a view showing a vibration generator for plating for removing bubbles according to a third embodiment of the present invention.
7 is a view showing a vibration generator for plating for removing bubbles according to a fourth embodiment of the present invention.
8 is a view showing a vibration generator for plating for bubble removal according to a fifth embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. In this process, the thicknesses of the lines and the sizes of the components shown in the drawings may be exaggerated for clarity and convenience of explanation. In addition, the terms described below are defined in consideration of the functions of the present invention, which may vary depending on the intention or custom of the user, the operator. Therefore, definitions of these terms should be made based on the contents throughout this specification.

In addition, the following embodiments are not intended to limit the scope of the present invention, but merely as an example, and various embodiments may be implemented through the present invention.

FIG. 1 is a view showing a vibration generating device for plating for removing bubbles according to a first embodiment of the present invention, FIG. 2 is a perspective view of a vibration generating device for plating for removing bubbles according to a first embodiment of the present invention FIG. 3 is a view showing a state in which a vibration panel of a vibration generating device for plating for removing bubbles according to the first embodiment of the present invention is inserted into a plating vessel, and FIG. 4 is a cross- FIG. 5 is a view showing a vibration generating device for plating for removing bubbles according to a second embodiment of the present invention, and FIG. 6 is a view showing a third example of the vibration generating device for plating, FIG. 7 is a view showing a vibration generating apparatus for plating for removing bubbles according to a fourth embodiment of the present invention, and FIG. 8 is a perspective view of a vibration generating apparatus for plating according to a fourth embodiment of the present invention. Fifth Implementation A diagram illustrating a plating device for generating vibration according to the bubble removal.

As shown in the drawing, the vibration generating apparatus 10 for plating (hereinafter, referred to as a vibration generating apparatus) for removing bubbles according to the present invention comprises a fixed frame disposed on an upper portion of a plating tank filled with a plating liquid, (Bubbles) disposed on the surface of the substrate S or placed on the surface of the substrate S, and a uniform plating layer is formed on the substrate S. The vibration generator A vibrating panel 60, a bracket 70, and a support spring 80. The vibrating panel 60 includes a base panel 20, a buffer spring 30, an angle panel member 40, a vibrator 50,

The fixed frame F is welded or bolted to a conventional structure formed in a frame structure and is disposed on the plating tank T. [ The fixed frame F is made of a metal material and can be fixed to a wall surface of a building.

The base panel 20 is made of a metal material and fixed to the upper portion of the fixed frame F by welding or screwing.

The buffer spring 30 is welded to the upper portion of the base panel 20 by welding.

The buffer springs 30 may be formed on the upper portion of the base panel 20.

The angle panel member 40 is made of a metal material and is formed in a shape of a letter "A" as shown in FIG. 5, and is supported to be supported by the buffer spring 30, Is welded and fixed to the lower portion of the panel member (40).

At this time, the buffer spring 30 may be fixed to the base panel 20 and the angle panel member 40 by inserting the bolts into the bolts.

The front panel of the angle panel member 40 is screwed and fixed to the vibration panel 60.

The vibrator 50 is welded or screwed to an upper portion of the angle panel member. The vibrator 50 generates vibrations, and vibrations generated sequentially are transmitted to the vibration panel 60 through the angle panel member 40, The vibration generated in the vibration panel 60 causes the plating liquid in the plating bath T to vibrate so that the bubbles formed on the surface of the substrate S or holes are removed by the vibration of the plating liquid.

The vibration panel 60 is a rectangular panel made of a synthetic resin material or a metal material and is screwed and fixed to the front panel 41 of the angle panel member 40.

Here, the vibration panel 60 is formed in a rectangular plate shape, so that the vibrating area of the vibrating panel 60 is wider than that of the rod or bar-shaped vibrating member, so that the bubble removing efficiency can be improved.

The lower bracket 70 is welded or screwed to the fixed frame F and the upper bracket 70 is disposed on the upper side of the angle panel member 40 .

The support spring 80 is fixed by connecting the support bar of the bracket 70 and the angle panel member 40 to support and fix the upper portion of the angle panel member 40, ).

The lower portion of the support spring 80 is welded to the upper portion of the angle panel member 40, and the upper portion is welded to the bracket 70.

Alternatively, the support spring 80 may be inserted into and fixed to the bolt connecting the angle panel member 40 and the bracket 70.

As described above, the angle panel member 40 is disposed at a predetermined distance from the base panel 20 and is supported by the buffer spring 30. The upper portion of the angle panel member 40 is connected to the bracket 70 by the support spring 80, The vibration of the vibrator 50 is buffered by the buffer spring 30 and the support spring 80 to be transmitted to the fixed frame F so that noise is reduced and vibration is transmitted to the vibration panel 60 .

A shield panel 61 is further provided on the back surface of the vibration panel 60 to prevent the plating liquid from splashing with the vibrator 50 due to the vibrations. The shield panel 61 has a free end inclined downward , The vibration of the vibration panel (60) prevents the plating liquid from splashing into the vibrator (50), and the splattering liquid is guided in the free end direction and falls into the plating tank (T).

The vibration housing 63 is further provided with a synthetic resin material having a receiving space having a structure penetrated to receive the substrate S in the front portion 62 of the vibration panel 60, A side wall part 631 welded to both sides of the front part 62 and a reaction panel 632 fused and fixed to the side wall part 631. The side wall part 631 is provided with a water hole The curved guiding grooves 62a and 632a are formed on the inner surface of the front part 62 and the back surface panel 632 at regular intervals along the longitudinal direction.

That is, while the vibration panel 60 and the vibration housing 63 are vibrated, the plating liquid disposed in the accommodation space is vibrated, so that the bubbles disposed on both sides of the substrate S can be removed, The interval can be reduced and the efficiency of bubble removal can be improved.

Further, the plating solution vibrated in the guide transfer grooves 62a and 632a is guided, and the area to be vibrated is widened as compared with the plane.

The vibration module 90 is further provided with a vacuum space 911 inside the wave module 632 and is adhered to the outer surface of the reaction panel 632. [ And a panel vibrator 93 disposed in the vacuum space 911 and fused or screwed to the upper portion of the vacuum pad 91.

The vibration of the panel vibrator 50 is sequentially transmitted to the reaction panel 632 through the vacuum pad 91 to vibrate the plating liquid.

A vacuum space 911 and a vibration spring 92 are formed inside the vacuum pad 91 to buffer shocks caused by vibration transmitted to the reaction panel 632.

Preferably, the vibrating space is formed with coupling grooves formed at the upper and lower portions thereof to allow the vibration spring to be inserted therein. Further, a support panel is further formed in the reaction panel 632 to support the vibration pad and the panel vibrator 93 .

A slit 633a is further formed in the swinging panel 633 so that the slit 633a is formed in the swinging panel 633. The slit 633a is formed in the upper part of the vibration housing 63, The substrate S is drawn into or drawn out of the vibrating housing 63 through the slider 633 and the swinging vibrator 100 is further screwed to the upper portion of the swinging panel 633, The plating liquid in the accommodation space is vibrated and transferred to the substrate S, whereby the removal efficiency of the bubbles can be improved.

The oscillating panel 633 is preferably made of a synthetic resin material having elasticity so as to buffer vibration of the oscillating vibrator 100.

10: Vibration generator 20: Base panel
30: buffer spring 40: angle panel member
50: Vibrator 60: Vibrating panel
70: Bracket 80: Support spring
90: wave module 100: oscillating vibrator
41: front panel
61: blocking panel 62: front panel
62a: guide delivery groove
63: vibration housing 631:
631a: water hole 632: recoil panel
632a: guide passage groove 633: oscillating panel
633a:
91: Vacuum pad 911: Vacuum space
92: Vacuum spring 93: Vibrator
F: fixed frame S: substrate
T: Plating tank

Claims (5)

A vibration generating device installed to vibrate the plating liquid on a fixed frame disposed on an upper part of a plating tank filled with a plating liquid, the vibration generating device comprising: a base panel disposed on an upper portion of the fixed frame; A vibrating panel fixed to the front panel of the angle panel member and being drawn into the plating vessel; and a vibration plate mounted on the lower frame, And a support spring for connecting the support panel and the angle panel member of the bracket to each other,
Wherein the vibrating panel is further provided with a shielding panel for preventing the plating liquid from splashing by the vibrator due to vibration, and the shielding panel is inclined downwardly in the free end direction. Generating device.
delete The method according to claim 1,
The vibrating panel further includes a vibration housing having a receiving space having a structure penetrating the front surface of the vibration panel to receive the substrate,
The vibration housing includes a side wall portion fixed to both sides of the front portion,
And a reaction panel connecting the side wall part,
Wherein a guide hole is formed in the side wall portion and a curved guiding groove is formed at an inner side surface of the front surface portion and the back surface panel at regular intervals along the longitudinal direction. Generating device.
The method of claim 3,
The vibration module further includes a wave module,
The wave module includes a vacuum pad having a vacuum space therein and fixed to the reaction panel,
A vibration spring disposed in the vacuum space,
And a panel vibrator provided on the upper portion of the vacuum pad.
The method of claim 3,
Wherein the vibrating housing is further provided with a swinging panel for closing an upper portion of the accommodating space, a slit portion is further formed on the swinging panel, and a swinging vibrator is further provided on the swinging panel. .

KR1020160024958A 2016-03-02 2016-03-02 Vibration generating device for plating for Degassing KR101804457B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020160024958A KR101804457B1 (en) 2016-03-02 2016-03-02 Vibration generating device for plating for Degassing

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Application Number Priority Date Filing Date Title
KR1020160024958A KR101804457B1 (en) 2016-03-02 2016-03-02 Vibration generating device for plating for Degassing

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KR20170102631A KR20170102631A (en) 2017-09-12
KR101804457B1 true KR101804457B1 (en) 2018-01-10

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