KR20110101984A - Plating flight bar and plating apparatus - Google Patents

Abstract

Disclosed is a plating flight bar for use in an electroplating operation for manufacturing various thin film circuit boards such as a printed circuit board (PCB).
Such a plating flight bar has a first bar extending to correspond to a saddle spacing disposed with a plating bath therebetween, and at both ends of the first bar so as to be electrically connected to the saddle. A grounding part consisting of grounding holes disposed thereon, a second bar spaced apart from the front or rear surface of the first bar, and configured to hold a plating rack, and a buffer between the first bar and the second bar; It includes a shock-absorbing connecting means consisting of a shock-absorbing connector formed so as to be able to connect and a vibration generating part consisting of a vibration generator attached to the second bar side to generate a vibration.

Description

Plating flight bar and plating apparatus

The present invention relates to a plating flight bar and a plating apparatus for use in electrolytic plating operations.

In general, during the manufacturing process of a printed circuit board (PCB), there is a process of forming a metal thin film on the PCB manufacturing substrate (hereinafter referred to as "thin plated body").

The process of forming such a metal thin film is performed by electrolytic plating (electroplating) operation | work or electroless plating (chemical plating) operation | work mostly.

In particular, the above electrolytic plating operation is to hold the plating rack to enable electricity supply with a mounting device called a flight bar, and then to be statically mounted in a plating bath so that the plating rack does not move. It is characterized by the plating work in the state.

In addition, the flight bar is formed on the saddle (saddle) side is arranged around the plating tank so as to hold the rack for plating in a state capable of plating over both ends.

According to the above-described electrolytic plating method, since the bubbles contained in the electrolytic plating solution adhere to the thin film-type plated body during plating, the plating defects can easily be caused, the plating work is carried out while the plating rack is mounted so that the bubbles do not stick. It is important to do.

However, most of the flight bars described above are limited to the structure and function of simply mounting the rack for plating on the side of the plating bath in a state capable of electroplating.

According to the structure of the conventional flight bars, it is difficult to smoothly separate and remove the bubbles adhering to the thin film-like plated body during the plating operation, so that excessive plating failure may occur.

In particular, it is known that the above plating failure phenomenon is mainly caused by bubbles generated in various hole portions and groove portions formed on the thin film-like plated body side.

In recent years, to force the separation and removal of these bubbles, for example, the operator directly shakes or moves the plating rack across the flight bar side. However, when the plating rack moves, the connection between the saddle and the flight bar is lost. It may break irregularly and cause more serious plating defects.

The present invention has been proposed to solve the above problems,

SUMMARY OF THE INVENTION An object of the present invention is to provide a flight bar and a plating apparatus for plating, which can easily separate and remove bubbles adhering to the thin film-like plated body during an electrolytic plating operation.

In order to achieve the object as described above,

A first bar extending to correspond to saddle spacing disposed between the plating baths;

A grounding part including grounding holes disposed at both ends of the first bar to be electrically connected to the saddle;

A second bar spaced apart from the front or rear surface of the first bar and configured to hold a plating rack;

A buffer connecting means composed of a buffer connector configured to connect the buffer between the first bar and the second bar to enable a buffer;

A vibration generator configured to be attached to the second bar and configured to generate a vibration;

It provides a flight bar for plating comprising a.

And, in order to achieve another object of the present invention,

Plating bath;

Saddles disposed between the plating baths;

First bars and second bars extending to correspond to the saddle spacing and spaced apart from each other;

A grounding part including grounding holes disposed at both ends of the first bar in a state capable of energizing the saddle;

A plating rack connected to the second bar and holding the thin plated body to be plated;

A buffer connecting means composed of a buffer connector configured to connect the buffer between the first bar and the second bar to enable a buffer;

A vibration generator configured to be attached to the second bar and configured to generate a vibration;

It provides a plating apparatus comprising a.

As described above, the present invention connects the first bar and the second bar with a buffer connecting means to allow a shock absorbing action, and installs a vibration generating part on the second bar side for holding the plating rack to prevent vibration generated from the vibration generating part. Since it can be transmitted to the rack for plating through the second bar, bubbles stuck to the thin film-like plated body (for example, a circuit board for PCB manufacturing) during electroplating can be easily separated and removed using vibration. have.

In particular, according to the connecting structure of the first bar and the second bar, since the vibration generated in the vibration generating unit can be appropriately suppressed by the buffering action from being transmitted from the second bar side to the first bar side, for example, When the bubble is removed by vibration, the ground bar and the saddle may be abnormally connected while the first bar is irregularly shaken by the vibration.

1 and 2 are views schematically showing the external and internal structure of the plating apparatus and the plating flight bar according to an embodiment of the present invention.
3 is a view for explaining the detailed structure and operation of the grounding portion of the plating flight bar of FIG.
4 is a view for explaining the detailed structure and operation of the buffer connecting means of the plated flight bar of FIG.
5 and 6 are views for explaining other structures of the buffer connecting means of the plated flight bar of FIG.
7 and 8 are views for explaining the preferred operation of the plating apparatus and the plating flight bar according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

The embodiments of the present invention will be described by those skilled in the art to which the present invention is applicable.

Therefore, since the embodiments of the present invention can be modified in various other forms, the claims of the present invention are not limited to the embodiments described below.

1 and 2 are views schematically showing the external and internal structure of the plating apparatus and the plating flight bar according to an embodiment of the present invention, 2 denotes a first bar, 4 denotes Refers to the second bar.

The first bar 2 and the second bar 2 are formed to extend to a length corresponding to the gap between the saddle (S, saddle) disposed outside the edge with the plating bath (T) in between as shown in FIG. do.

The saddle S is intended to support the first bar 2 in a state in which electricity can be supplied for electroplating, and although not shown in the drawing, the saddle S is connected to an electricity supply device and is set to be supplied with electricity in a conventional manner. do.

The materials of the first bar 2 and the second bar 4 may be used among metals (or synthetic resins) having excellent corrosion resistance and durability.

The first bar 2 and the second bar 4 are arranged in parallel with each other while facing back and forth as shown in FIGS. 1 and 2.

At this time, the first bar (2) and the second bar (4) can be formed as narrow as possible spaced intervals can reduce the total volume, it is possible to further increase the storage and transportability.

The first bar 2 may be formed so as to be easily transported by a transfer device such as a hoist.

For example, as shown in FIG. 1, when the engaging protrusions 2a are formed on both sides of the first bar 2, one side of the engaging protrusions 2a can be easily carried by hooking (or arm) of the hoist. .

And, the second bar 4 is formed to hold the plating rack (R) to enable electroplating.

For example, as shown in FIG. 1, a common cathode bar Q used for electrolytic plating is connected to the second bar 4 side, and the cathode bar Q and the plating rack T are connected and fixed. can do.

Although not shown in the drawing, the cathode bar Q is connected to the ground holes C of the ground part 6 to be described later by an electric line, and is set to receive electricity for electroplating in a conventional manner.

Plating flight bar according to an embodiment of the present invention, the first bar (2) comprises a grounding portion (6) to be connected and supported with the saddle (S) so as to enable electricity.

3 is a view for explaining the detailed structure and operation of the ground (6).

The ground portion 6 is composed of two grounding holes (C), the material of the grounding hole (C) can be used among the metal with excellent electrical conductivity and durability.

The grounding holes C are formed to be supported by the contacting contact on the saddle S side so as to enable energization.

For example, as shown in Figure 3 has a shape and size that can be caught on the groove portion (S1) side of the saddle (S), each protruding outward on both ends of the first bar (2) Can be fixed and installed.

According to the structure of the ground portion 6, both ends of the first bar (2) can be supported in a state that is mounted on the saddle (S) side to enable electroplating.

The plating flight bar according to the embodiment of the present invention includes a buffer connecting means 8 for connecting between the first bar 2 and the second bar 4.

Referring again to FIG. 1, the buffer connecting means 8 is composed of a buffer connector D, which buffers the buffer bar between the first bar 2 and the second bar 4. It is formed to be able to connect elastically.

4 is a view for explaining the detailed structure and operation of the buffer connector (D).

The shock absorbing connector (D) may be composed of two connecting plates (D1), and a buffer member (D2) for enabling a buffering action between the two connecting plates (D1).

The connecting plate D1 may use a metal plate or a synthetic resin plate, and one side connecting plate D1 may be fixed to the first bar 2 side between the first bar 2 and the second bar 4. The other side connecting plate D1 may be connected and fixed to the second bar 4 side.

Although not shown in the drawings, the connecting plates D1 may be connected and fixed to the side of the first bar 2 or the second bar 4 by a method such as bolting or welding.

The shock absorbing member D2 may use a rubber plate, and may be installed in a state in which an approximately “U” shape is connected between sides corresponding to each other among edges of the connecting plates D1.

The buffer member D2, that is, the rubber plate may be formed to have a function (shape memory) that can elastically maintain a specific shape (for example, a "U" shape).

Then, when no external force acts while the first bar 2 and the second bar 4 are connected to each other, the first bar 2 and the second bar (by the elastic force of the shock absorbing member D2). 4) can always return to its original position smoothly.

According to the structure of the above-mentioned buffer connection means 8, for example, the vibration or shock generated on the second bar 4 side is properly cushioned (absorbed) to the vibration or impact on the first bar 2 side. This can be suppressed from being delivered.

5 and 6 are views for explaining another structure of the buffer connection means (8). This embodiment has a difference in using a spring, rather than a rubber plate when compared with the above embodiment.

That is, a leaf spring or a coil spring may be used as the shock absorbing member D2, as shown in FIGS. 5 and 6, and a state of connecting the connecting plates D1 as shown in the drawing. Can be installed as

According to such a structure, it is possible to elastically connect between the two connecting plates (D1) by the elastic force of the spring to the buffer.

Although the shock absorbing member D2 is not shown in the drawings in addition to the rubber plate or the spring, as long as the shock absorbing member D2 can be elastically connected and fixed to the buffer plate between the connecting plates D1 as described above, such a structure can be seen. Naturally, it belongs to the scope of the invention.

In addition, an auxiliary buffering connector D3 may be further provided between the first bar 2 and the second bar 4 to further increase the coupling coupling force.

The auxiliary buffering connector (D3) may use a rubber plate (or springs), for example, as shown in Figure 4 connecting the upper and lower portions between the first bar 2 and the second bar (4), respectively. We can install in state to do.

According to such a structure, durability can be improved by further increasing the coupling force in a state where the buffer between the first bar 2 and the second bar 4 is possible.

Plating flight bar according to an embodiment of the present invention, includes a vibration generating portion 10 for generating a vibration on the second bar (4) side.

The vibration generating unit 10 is set to separate and remove various bubbles (A) stuck to the thin film-like plated body (B) side of the plating rack (R) during the electroplating by vibration.

Referring back to FIGS. 1 and 2, the vibration generator 10 is composed of a vibration generator (V, vibrator) and is attached to one side of the second bar 4.

Although not shown in the figure, the vibration generator (V) may have a general structure that includes a vibration element therein and generates vibration while moving the vibration element in a magnetic driving method or a motor driving method.

Although not shown in the figure, the vibration generator V is connected to an electric supply device and an electric line, and is operated by being supplied with electricity in a conventional manner.

When the vibration generator V is installed on the second bar 4 side, for example, as shown in FIG. 2, the vibration generator V is located between the first bar 2 and the second bar 4. It is good to attach and fix the inner surface of the bar (4).

Then, the vibration generator (V) does not protrude to the outside can reduce the size of the device, it can be protected from various external shocks or contacts.

In order to easily secure a space when installing the vibration generator V between the first bar 2 and the second bar 4 as described above, for example, as shown in FIG. 2, the first bar ( 2) To secure a space to accommodate the protruding outer surface of the vibration generator (V) by drilling one side, the exposed portion may be attached to the cover (V1).

According to the structure of the vibration generating unit 10, the vibration can be smoothly generated by the drive of the vibration generator (V) at the second bar 4 side, the vibration generated in this way is the cathode bar (Q) It can be smoothly transmitted to the plating rack (R) and the thin film to be plated (B) side through the).

In the above description, an example in which the vibration generator V is installed at one point of the second bar 4 is illustrated and described in the drawings. However, in addition, a plurality of vibration bars are provided on the second bar 4 side in accordance with the plating work environment. Dogs can also be spaced apart.

Next, the preferred action of the plating apparatus and the plating flight bar according to an embodiment of the present invention.

7 and 8 are views for explaining the operation of the plating apparatus and the plating flight bar according to an embodiment of the present invention.

That is, the upper part of the plating rack (R) is connected and fixed to the cathode bar (Q) side of the second bar (4), and then placed on the saddle (S) side with the plating tank (T) in between Place the grounding holes (C) of the ground (6).

Then, as shown in FIG. 7, both ends of the first bar 2 are supported in a state spanning the saddle S side, and the plating rack R is contained in the electrolytic plating solution W, and the saddle ( Electricity supplied from the S) side is applied to the electroplating through the grounding hole (C) and the cathode bar (Q).

Therefore, the electrolytic plating operation can be easily performed by a conventional method in the state in which the plating rack R is immersed in the plating tank T side as described above.

Particularly, in the present invention, for example, when the electrolytic plating is performed while the plating rack R is immersed in the plating liquid W of the plating tank T, for example, the bubble W1 generated inside the plating liquid W is Even if it sticks to the thin film type plated body (B) side of the plating rack (R) it can be easily separated and removed by using the vibration generating unit (10).

That is, when vibration is generated by the vibration generator V installed on the second bar 4 side, it is transmitted to the plating rack R side via the cathode bar Q.

Then, as shown in FIG. 8, since the thin film-shaped plated bodies B are in a finely moved state (a shaking state) by the vibration transmitted to the plating rack R side, the thin plate-like plated body B is different from the thin plate-like plated body B side. The attached bubbles B1 can be easily separated and removed.

According to this action, it is possible to easily solve the problems caused by the bubbles (B) stuck to the thin film-like plated body (B) during the electroplating operation it is possible to ensure further improved workability and plating quality.

In addition, since the vibration or shock can be absorbed by the buffer connecting means 8 between the first bar 2 and the second bar 4, the vibration generated in the vibration generator V is controlled. Transmission from the 2 bar 4 side to the first bar 2 side can be suppressed.

Therefore, when separating and removing the bubbles W1 by vibration in electroplating, for example, the connection part 6 is saddle S while the vibration is transmitted from the second bar 4 side to the first bar 2 side. Since abnormal and abnormal connection can be prevented, further improved work safety can be ensured.

2: first bar 4: second bar 6: ground portion
8: shock-absorbing connecting means 10: vibration part R: plating rack

Claims (8)

A first bar extending to correspond to saddle spacing disposed between the plating baths;
A grounding part including grounding holes disposed at both ends of the first bar to be electrically connected to the saddle;
A second bar spaced apart from the front or rear surface of the first bar and configured to hold a plating rack;
A buffer connecting means composed of a buffer connector configured to connect the buffer between the first bar and the second bar to enable a buffer;
A vibration generator configured to be attached to the second bar and configured to generate a vibration;
Plating flight bar comprising a. The method according to claim 1,
The grounding sphere,
A plating flight bar for placing on both ends of the first bar in a connected state that can be placed on the saddle disposed on the edge side of the plating bath to receive electricity from the birds. The method according to claim 1,
The buffer connector,
Two connecting plates spaced apart,
A shock absorbing member for connecting a buffer between the two connecting plates to enable a buffer;
Plating flight bar comprising a. The method according to claim 3,
The two connecting plates,
Any one connecting plate is fixed to the side of the first bar, the other connecting plate is fixed to the second bar side. The method according to claim 3,
The buffer member,
Plating flight bar, characterized in that used in the rubber plate, leaf spring, coil spring. The method according to claim 1,
The buffer connector,
One or a plurality of plating flight bars are installed between the first bar and the second bar. The method according to claim 1,
The vibration generator,
It is provided with a vibrating element for generating vibration by receiving electricity,
One or a plurality of plating flight bar is installed on the second bar side. Plating bath;
Saddles disposed between the plating baths;
First bars and second bars extending to correspond to the saddle spacing and spaced apart from each other;
A grounding part including grounding holes disposed at both ends of the first bar in a state capable of energizing the saddle;
A plating rack connected to the second bar and holding the thin plated body to be plated;
A buffer connecting means composed of a buffer connector configured to connect the buffer between the first bar and the second bar to enable a buffer;
A vibration generator configured to be attached to the second bar and configured to generate a vibration;
Plating apparatus comprising a.

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