KR102548735B1 - Electro-copper plating apparatus for PCB - Google Patents

Abstract

An electro-copper plating device for a printed circuit board according to the present invention comprises: a bus bar on which one or more printed circuit boards are mounted; and a vibration unit coupled to the bus bar assembly to apply vibration to a printed circuit board mounted on the bus bar assembly, wherein the bus bar assembly includes a main bus bar extending in a horizontal direction, and a plurality of downward bus bars extending downward from the main bus bar, and wherein the printed circuit board has both widthwise sides coupled to the two adjacent downward bus bars in a detachable structure, respectively. Using the electro-copper plating device for a printed circuit board according to the present invention, vibration can be applied to a printed circuit board to improve the defoaming and water washing properties of minute holes formed on the printed circuit board, thereby minimizing a copper plating defect rate, vibration can be transmitted evenly as a whole to printed circuit boards of various specifications, thereby significantly reducing a copper plating defect rate, and a vibration attenuating rate in the process that vibration generated from an electromotive unit is transmitted to a printed circuit board can be lowered, thereby improving the quality of copper plating.

Description

Printed circuit board electro-copper plating apparatus {Electro-copper plating apparatus for PCB}

The present invention relates to an apparatus for copper plating the surface of a printed circuit board, and more particularly, to apply vibration to the printed circuit board so that the inside of the fine holes formed in the printed circuit board can be normally copper-plated. It relates to copper plating equipment.

There are many types of printed circuit boards (PCBs) used in electronic devices. For example, the printed circuit board is a single-sided printed circuit board used by printing a circuit on only one side of a flat inner layer raw material (Core CCL) according to circuit printing, and double-sided printing used by printing a circuit on both sides. It can be divided into circuit boards, and according to the number of layers, it can be divided into a single printed circuit board using only one printed circuit board, and a laminated printed circuit board using a plurality of stacked printed circuit boards.

Manufacturing of such a printed circuit board is completed through a process of copper plating on the outer surface, a process of forming a pattern on the copper-plated surface, and a process of mounting various electronic components.

When copper plating the printed circuit board, put the printed circuit board in a cleaner tank or a hot water washing tank to clean it, pass through an immersion tank filled with 10% sulfuric acid, and then put it into an electrolytic copper plating tank so that copper plating is performed. At this time, a plurality of fine holes are machined in the printed circuit board on which copper plating is performed. When air remains in the fine holes, there is a problem in that water washability is reduced and the plating defect rate is increased and normal copper plating is not performed.

In particular, in the case of a thick printed circuit board having a thickness of 4.8t or 6.0t, there has been a serious problem that the copper plating defect rate of the fine holes is further increased.

A method such as spraying high-pressure water has been proposed to degas the air in the microholes, but when the high-pressure water is sprayed on the printed circuit board, not only the printed circuit board is damaged, but also a lot of energy is consumed to generate the high-pressure water. In addition, since a plurality of separate high-pressure water injection nozzles must be installed, there is a disadvantage in that the manufacturing cost of the copper plating device increases.

In addition, when the size of the fine holes formed in the printed circuit board is very small, there is also a problem that the effect of degassing air and improving water detergency is very insignificant even when high-pressure water is sprayed.

KR 10-0952885 B1

The present invention has been proposed to solve the above problems, and by applying vibration to the printed circuit board, it is possible to improve the defoaming and water washability of the microholes formed on the printed circuit board, thereby minimizing the copper plating defect rate, and various An object of the present invention is to provide a printed circuit board electrolytic copper plating device capable of significantly lowering the copper plating defect rate by evenly transmitting vibration to a standard printed circuit board as a whole.

A printed circuit board electroplating copper plating apparatus according to the present invention for achieving the above object includes a busbar assembly to which one or more printed circuit boards are mounted; and a vibration unit that is coupled to the busbar assembly and applies vibration to the printed circuit board mounted on the busbar assembly.

The busbar assembly is composed of a main busbar extending in the horizontal direction and a plurality of downward busbars extending downward from the main busbar, and the printed circuit board is detachable from two adjacent downward busbars on both sides in the width direction, respectively. combined into a possible structure.

A plurality of fixing clips for clamping ends of the printed circuit board in the width direction are provided on the downward busbar.

A ground busbar is connected to the main busbar and the printed circuit board and transfers vibration generated from the vibration unit to the printed circuit board.

Further comprising a fixed frame including a pair of vertical bars extending downward from both ends of the main busbar in the longitudinal direction and a horizontal bar arranged in parallel with the main busbar to connect the ends of the pair of vertical bars, The lower end of the bar is coupled to the horizontal bar.

The upper end of the downward busbar is coupled to the main busbar in a structure capable of sliding in the longitudinal direction of the main busbar, and the lower end of the downward busbar is coupled to the crossbar in a structure capable of sliding in the longitudinal direction of the crossbar.

The main busbar has an upper slide groove extending in an arrangement direction of the plurality of downward busbars, and the horizontal bar has a lower slide groove extending in an arrangement direction of the plurality of downward busbars, and the downward booth At both ends of the bar in the longitudinal direction, upper slide blocks and lower slide blocks are provided that are slidably coupled to the upper slide grooves and the lower slide grooves.

The lower end of the lower busbar may further include a winding roll wound therein, and the horizontal bar may have an insertion hole into which the winding roll wound with the downward busbar may be inserted.

A fixing means for fixing rotation of the winding roll inserted into the insertion hole may be further included.

The vertical bar is composed of a structure capable of adjusting its length.

The downward busbar is formed in a strap shape having ductility and elasticity greater than a standard value.

The vibration unit includes a vibration motor coupled to the main busbar, a vibrator coupled to the rotating shaft, and a secondary battery mounted on one side of the vibration motor in a lateral direction to supply current to the vibration motor. do.

Using the printed circuit board electrolytic copper plating apparatus according to the present invention, it is possible to improve the defoaming and water washability of the fine holes formed on the printed circuit board by applying vibration to the printed circuit board, so the copper plating defect rate can be minimized, and various standard Vibration can be evenly transmitted to the printed circuit board as a whole, so the copper plating defect rate can be significantly reduced, and the vibration damping rate in the process of transmitting the vibration generated from the electric unit to the printed circuit board can be lowered, which can improve the copper plating quality. .

1 is a perspective view of a printed circuit board copper plating apparatus according to the present invention.
2 is a front view of a busbar assembly included in a printed circuit board copper plating apparatus according to the present invention.
3 is a front view of a busbar assembly included in a second embodiment of a printed circuit board copper plating apparatus according to the present invention.
4 is a side cross-sectional view of a busbar assembly included in a second embodiment of a printed circuit board copper plating apparatus according to the present invention.
5 shows a coupling structure of a downward busbar and a horizontal bar included in a third embodiment of a printed circuit board copper plating apparatus according to the present invention.
6 shows a vertical bar included in a fourth embodiment of a printed circuit board copper plating apparatus according to the present invention.
7 is a plan view showing the internal structure of the vibration unit mounted on the main busbar.

Hereinafter, an embodiment of a printed circuit board copper plating apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view of a printed circuit board copper plating apparatus according to the present invention, and FIG. 2 is a front view of a busbar assembly included in the printed circuit board copper plating apparatus according to the present invention.

An apparatus for electroplating copper on a printed circuit board according to the present invention is an apparatus for electroplating a printed circuit board on which a plurality of fine holes are formed, and has a function of applying vibration to the printed circuit board so that copper plating can be normally performed on the inside of the fine holes. Its biggest feature is that it is equipped.

That is, the printed circuit board copper plating apparatus according to the present invention is coupled to the busbar assembly 500 on which one or more printed circuit boards 20 are mounted, and the busbar assembly 500 to It consists of a vibration unit 600 for applying vibration to the mounted printed circuit board 20 as a basic component. So that the busbar assembly 500 can be selectively immersed in any one of the plurality of tank tanks 10, that is, so that the busbar assembly 500 can move in the horizontal direction and move up and down, the tank On both sides of the jaw 10 in the width direction, fixed frames 550 and 100 made of posts 110 and connecting beams 120 are provided, respectively, and one moving bar 200 is provided on two different connecting beams 120. ) Is mounted, the moving bar 200 is configured to be reciprocally transferred in the longitudinal direction of the connecting beam 120 by a pair of longitudinal transfer units 210, and the moving bar 200 includes the moving bar A transverse transfer unit 300 capable of being transferred in the longitudinal direction of 200 is mounted, and the busbar assembly 500 is mounted on the transverse transfer unit 300 by a lifting unit 400.

Therefore, the user controls the operation of the longitudinal transfer unit 210 and the transverse transfer unit 300 to position the busbar assembly 500 above any one of the plurality of tank tanks 10 And, by operating the longitudinal transfer unit 210 by manipulating the controller 310, the busbar assembly 500 can be immersed into the tank 10. In this way, the components for transporting the busbar assembly 500 in the horizontal and vertical directions and immersing it into the tank tank 10 are substantially equally applied to the conventional copper plating apparatus, and the busbar assembly 500 A detailed description of each component for transferring is omitted. In addition, the vibration unit 600 is a component that generates vibration by itself, and the internal structure and operating principle of the vibration unit 600 will be described in detail with reference to FIG. 7 below.

The busbar assembly 500 is typically made of a metal having excellent conductivity. When the vibration unit 600 operates in a state where the printed circuit board 20 is coupled to the busbar assembly 500, the vibration Vibration generated in the unit 600 is transmitted to the printed circuit board 20 via the busbar assembly 500. When vibration is applied to the printed circuit board 20 in a state where the printed circuit board 20 is immersed in the tank 10 containing liquid such as washing water or chemical liquid, the microholes of the printed circuit board 20 are filled with Since air bubbles are discharged to the outside, air defoaming and water washing properties are enhanced, so that copper plating can be performed more effectively, that is, the copper plating defect rate can be significantly reduced.

At this time, the busbar assembly 500 includes a main busbar 510 extending in a horizontal direction and downward from the main busbar 510 so that a plurality of printed circuit boards 20 can be mounted at once. It is composed of a plurality of extending downward busbars 520. In this way, when the busbar assembly 500 is composed of the main busbar 510 and the downstream busbar 520, the printed circuit board 20 is connected to the two adjacent downstream busbars 520 on both sides in the width direction. Since each is coupled in a detachable structure, as shown in FIG. 2, there is an advantage in that a plurality of printed circuit boards 20 can be copper-plated at once.

In addition, the busbar assembly 500 to which the printed circuit board 20 is mounted is immersed in the tank 10 while moving in vertical and horizontal directions by the longitudinal transfer unit 210 and the lifting unit 400, To prevent the printed circuit board 20 from being separated from the lower busbar 520 while the busbar assembly 500 is moving, the lower busbar 520 has the widthwise end of the printed circuit board 20 It is preferable that a plurality of fixing clips 530 for clamping are provided.

In this way, when the fixing clip 530 is provided on the lower busbar 520, there is no fear of the printed circuit board 20 being removed even if the lower busbar 520 moves or shakes, and the printed circuit board Since the work of fixing (20) to the downward busbar 520 becomes very simple, there is an effect that the time required for the copper plating process can be shortened. In addition, since a plurality of fixing clips 530 are provided on one downward busbar 520, a user can simultaneously mount a plurality of printed circuit boards 20 on a pair of downward busbars 520, This also has the advantage of increasing productivity. At this time, the fixing clip 530 can be replaced with any type of clip as long as it is fixed to the downward busbar 520 and can clamp the end of the printed circuit board 20 in the width direction.

Meanwhile, a grounding busbar 540 is connected to the printed circuit board 20 to ground the applied current. At this time, the grounding busbar 540 is connected to the main busbar 510 and the printed circuit board 20. ) is installed to connect In this way, when the main busbar 510 and the printed circuit board 20 are configured to be connected by a plurality of grounding busbars 540, the vibration generated in the vibration unit 600 does not pass through the downward busbar 520. Since it can be transferred to the printed circuit board 20 via the ground busbar 540, the effect of further improving the vibration transmission efficiency of the printed circuit board 20 can be obtained.

3 is a front view of a busbar assembly 500 included in a second embodiment of a copper plating apparatus for a printed circuit board according to the present invention, and FIG. 4 is a front view of a busbar included in a second embodiment of a copper plating apparatus for a printed circuit board according to the present invention. A cross-sectional side view of assembly 500.

In general, since the amount of attenuation of vibration is reduced when it is transmitted along a thin medium, the efficiency of transmitting vibration to the printed circuit board 20 increases as the thickness of the downstream busbar 520 decreases. However, when the thickness of the downstream bus bar 520 is thin, it can be easily shaken even by a small external force, causing a problem in that the fixing force of the printed circuit board 20 is lowered.

The printed circuit board copper plating apparatus according to the present invention is a separate method for fixing the downstream busbar 520 so that it is not easily shaken by external force even if the thickness of the downstream busbar 520 is thin to solve the above problems. A fixing frame 550 of may be additionally provided.

As shown in FIG. 3, the fixing frame 550 includes a pair of vertical bars 552 extending downward from both ends in the longitudinal direction of the main bus bar 510 and the ends of the pair of vertical bars 552. It consists of a horizontal bar 554 arranged parallel to the main bus bar 510 to connect. At this time, since the lower end of the downward busbar 520 is coupled to the horizontal bar 554, even if the downward busbar 520 is made of a thin metal strap having ductility and elasticity higher than the standard value, it is not shaken by an external force. Accordingly, it is possible to obtain an effect of improving both the vibration transmission efficiency to the printed circuit board 20 and the fixing force of the printed circuit board 20 .

On the other hand, if the plurality of downward busbars 520 are fixedly coupled to the main busbar 510, the standard of the printed circuit board 20 that can be coupled to the two neighboring downward busbars 520 may be limited. Since there is only one, there is a disadvantage that the printed circuit board 20 of various standards cannot be copper-plated.

Therefore, in the printed circuit board copper plating apparatus according to the present invention, the downward busbar 520 is connected between the main busbar 510 and the horizontal bar 554 so that printed circuit boards 20 of various standards can be mounted. It can be combined into a movable structure while maintaining. That is, the upper end of the downward busbar 520 is coupled to the main busbar 510 in a structure capable of sliding in the longitudinal direction of the main busbar 510, and the lower end of the downward busbar 520 is the horizontal It may be coupled to the horizontal bar 554 in a structure capable of sliding in the longitudinal direction of the bar 554 .

In this way, when the downward busbar 520 is connected to the main busbar 510 and the crossbar 554 in a sliding structure, the user can install two downward busbars according to the width of the printed circuit board 20 to be mounted. Since the interval between the bars 520 can be adjusted, it is possible to copper-plate printed circuit boards 20 of various standards.

Furthermore, as shown in FIG. 4, the main busbar 510 has an upper slide extending in the arrangement direction of the plurality of downward busbars 520 so that the sliding of the downward busbar 520 can be performed more stably. A groove 512 is provided, and the horizontal bar 554 is provided with a lower slide groove 555 extending in the arrangement direction of the plurality of downward busbars 520, and both ends of the downward busbar 520 in the longitudinal direction. An upper slide block 522 and a lower slide block 524 coupled to the upper slide groove 512 and the lower slide groove 555 in a sliding structure may be provided.

In this way, when the upper slide block 522 and the lower slide block 524 are provided at both ends of the downward busbar 520 in the longitudinal direction, the downward busbar 520 is the main busbar 510 and the horizontal bar 554 ) has the advantage of being able to stably slide in a direction perfectly parallel to the longitudinal direction. In addition, when the upper slide block 522 and the lower slide block 524 are provided at both ends of the downward busbar 520 in the longitudinal direction, the downward busbar 520 is directly connected to the main busbar 510 or the horizontal bar 554. ), so that when the downward busbar 520 moves in a sliding manner, wear and damage due to friction do not occur, that is, the effect of increasing the lifespan of the downward busbar 520 can be obtained. there will be

5 shows a coupling structure of a downward bus bar 520 and a horizontal bar 554 included in a third embodiment of a printed circuit board copper plating apparatus according to the present invention.

In the printed circuit board copper plating apparatus according to the present invention, the vibration generated by the vibration unit 600 is transmitted to the printed circuit board 20 through the main busbar 510 and the downstream busbar 520, the downstream busbar ( 520) may cause a problem in that vibration is not normally transmitted if it is not pulled tight when formed in a strap shape having a thin thickness. In particular, when the downlink busbar 520 is made of a thin metal strap, it is stretched over a period of use, so that the downlink busbar 520 is not tight and loosens frequently.

To solve this problem, the printed circuit board copper plating apparatus according to the present invention further includes a winding roll 526 on which the lower end of the lower bus bar 520 is wound, and the horizontal bar 554 is a lower bus bar 554. An insertion hole 556 into which the winding roll 526 on which the bar 520 is wound can be inserted may be formed. If the winding roll 526 on which the downward busbar 520 is wound is configured to be inserted into the horizontal bar 554 as described above, when the downward busbar 520 is stretched and loosened, the user may use the winding roll 526 Since the downward busbar 520 can be tightly tensioned by winding, the vibration generated in the vibration unit 600 can be smoothly transmitted to the printed circuit board 20 side along the downward busbar 520.

At this time, if the take-up roll 526 rotates arbitrarily within the insertion hole 556 of the cross bar 554, the downward bus bar 520 becomes loose and vibration may not be normally transmitted. Therefore, the printed circuit board copper plating apparatus according to the present invention may include a fixing means for fixing the rotation of the winding roll 526 inserted into the insertion hole 556. At this time, the fixing means is a fixing pin 558 inserted into the fastening hole 527 of the winding roll 526 after passing through the through hole 557 formed on the side wall of the horizontal bar 554 as shown in this embodiment. It may be applied as, or may be applied as a clamper (not shown) for holding and fixing the winding roll 526. That is, the fixing means may be configured in any structure as long as the winding roll 526 can be fixed so as not to rotate arbitrarily.

6 shows the vertical bar 552 included in the fourth embodiment of the printed circuit board copper plating apparatus according to the present invention, and FIG. 7 shows the internal configuration of the vibration unit 600 mounted on the main bus bar 510. It is a plan view shown.

When the downward busbar 520 connected between the main busbar 510 and the horizontal bar 554 is tensed, it is difficult to move in a sliding manner. In the printed circuit board copper plating apparatus according to the present invention, the length of the vertical bar 552 can be adjusted as shown in FIG. 6 so that the downward bus bar 520 can be loosened. At this time, the structure of the vertical bar 552 configured to be able to adjust the length is substantially equally applied to various products such as conventional hangers or rolling mop, detailed description of the length changing structure of the vertical bar 552 omit

When the length of the vertical bar 552 is configured to be adjustable in this way, the user loosens the downward busbar 520 by reducing the length of the vertical bar 552 so that the downward busbar 520 can be more easily installed. It can also be slidable, and when the downlink busbar 520 is stretched, the user can tighten the downlink busbar 520 by increasing the length of the vertical bar 552.

In addition, as shown in FIG. 7, the vibration unit 600 generating vibration includes a vibration motor 610 coupled to the main bus bar 510 and a vibrator 630 coupled to the rotation shaft 612. ), a secondary battery 620 mounted on one lateral side of the vibration motor 610 and supplying current to the vibration motor 610, the vibration motor 610, the vibrator 630, and the secondary battery 620 ) It may be configured to include a case 640 covering the. The vibrator 630 is coupled so that the center of gravity is biased toward one side of the rotation shaft 612, and vibration is generated when the rotation shaft 612 of the vibration motor 610 is rotated.

On the other hand, the vibrator 630 causing vibration generates strong vibration as it is farther away from the body of the vibration motor 610. As shown in the present embodiment, the arrangement of the vibration motor 610 and the secondary battery 620 When the direction and the longitudinal direction of the rotating shaft 612 are arranged to form a right angle, there is an advantage in that the rotating shaft 612 can be made long without fear of interference with the secondary battery 620, thereby generating stronger vibration. . In this way, when the size of the vibration generated by the vibration unit 600 increases, the printed circuit board 20 also vibrates more strongly, so that air defoaming and washing performance in the microholes are improved.

In the above, the present invention has been described in detail using preferred embodiments, but the scope of the present invention is not limited to specific embodiments, and should be interpreted according to the appended claims. In addition, those skilled in the art should understand that many modifications and variations are possible without departing from the scope of the present invention.

10: tank tank 20: printed circuit board
100: fixed frame 110: post
120: connecting rod 200: moving bar
210: longitudinal transfer unit 300: transverse transfer unit
310: controller 400: lifting unit
500: busbar assembly 510: main busbar
512: upper slide groove 520: lower bus bar
522: upper slide block 524: lower slide block
526: winding roll 530: fixing clip
540: grounding bus bar 550: fixed frame
552: vertical bar 554: horizontal bar
555: lower slide groove 556: insertion hole
600: vibration unit 610: vibration motor
612: rotating shaft 620: secondary battery
630: vibrator 640: case

Claims (5)

A busbar assembly to which one or more printed circuit boards are mounted; and
a vibration unit coupled to the busbar assembly and applying vibration to the printed circuit board mounted on the busbar assembly;
It consists of including,
The busbar assembly,
Main busbar extending in the horizontal direction;
Consisting of a plurality of downward busbars extending downward from the main busbar and having their ends wound to form winding rolls,
The printed circuit board is coupled to two adjacent downward busbars on both sides in the width direction in a detachable structure,
In the downward busbar,
A plurality of fixing clips clamping ends of the printed circuit board in the width direction are provided,
Further comprising a ground busbar connected to the main busbar and the printed circuit board to transmit vibration generated by the vibration unit to the printed circuit board,
a pair of vertical bars extending downward from both ends of the main busbar in the longitudinal direction; and
A fixing frame including a horizontal bar arranged parallel to the main bus bar to connect the ends of a pair of vertical bars and including an insertion hole into which the winding roll is inserted and a through hole formed in a side wall,
Further comprising a fixing means for fixing the rotation of the winding roll inserted into the insertion hole,
The fixing means is
A printed circuit board electrolytic copper plating apparatus comprising a fixing pin inserted through the fastening hole formed in the winding roll after passing through the through hole.


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