JP2009016873A - Conductive ball mounting apparatus and conductive ball mounting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a conductive ball mounting apparatus and method which shortens a processing time required for steps to mount conductive balls on a plurality of pads and to remove excessive conductive balls, improves productivity, and accurately mounts the conductive balls on the pads. <P>SOLUTION: The conductive ball mounting apparatus includes: a conductive ball container 13 for containing a plurality of conductive balls 14 therein and having an opening 13A to supply the plurality of conductive balls 14; a substrate holder 15 disposed over the conductive ball container 13 to face the opening 13A, and holding the substrate 18 in such a manner that the plurality of conductive balls 14 and a plurality of pads 35 face each other; and a vibrator 12 as a conductive ball supplying unit for supplying the plurality of conductive balls 14 to the plurality of pads 15 by floating the plurality of conductive balls 14. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a conductive ball mounting device and a method for mounting a conductive ball, and more particularly, a conductive material for mounting a conductive ball on a substrate such as a wiring board or wafer having a plurality of pads on which an adhesive material is formed. The present invention relates to a ball mounting device and a conductive ball mounting method.

  1 to 6 are process diagrams for explaining a conventional method for placing a conductive ball.

  A conventional method for placing a conductive ball will be described with reference to FIGS. First, in the process shown in FIG. 1, the flux 102 is formed on the plurality of pads 101 provided on the substrate 100, and the resist film 103 is formed on a portion of the substrate 100 positioned between the plurality of pads 101.

  Next, in a step shown in FIG. 2, the mask 106 having a plurality of openings 106 </ b> A is fixed on the resist film 103. The opening 106A is formed so as to expose the pad 101.

  Next, in the step shown in FIG. 3, a plurality of conductive balls 108 are placed on the mask 106. Next, in the process shown in FIG. 4, the substrate 100 is vibrated to place one conductive ball 108 on each pad 101 on which the flux 102 is formed.

  Next, in the step shown in FIG. 5, the upper surface of the mask 106 is rubbed with the squeegee 110 to remove excess conductive balls 108 that have not been placed on the pad 101. Next, in the step shown in FIG. 6, the mask 106 is removed. As a result, the substrate 100 including the conductive balls 108 on the pad 101 is manufactured (see, for example, Patent Document 1).

  FIG. 7 is a diagram for explaining another method for placing a conventional conductive ball.

Referring to FIG. 7, in another conventional mounting method of conductive balls, a penetrating portion 123 </ b> A (for pad 127) that allows conductive balls 121 to pass over a ball container 122 that stores a plurality of conductive balls 121. A mask 123 having holes for mounting conductive balls 121 is disposed, a spacer 124 is disposed on the outer periphery of the mask 123, and a pad 127 and a flux layer 128 that covers the pad 127 are provided. 125 is arranged on the spacer 124 so that the flux layer 128 and the mask 123 are opposed to each other, and the ball container 122, the mask 123, the spacer 124, and the substrate 125 are vigorously rocked integrally to form a conductive ball. 121 is placed on a pad 127 (see, for example, Patent Document 2).
JP-A-11-297886 Japanese Patent Laid-Open No. 02-102538

  However, in the conventional conductive ball mounting method (see FIGS. 1 to 6), the step of mounting one conductive ball 108 on each pad 101 on which the flux 102 is formed and the upper surface of the mask 106 are formed. Since the process of removing the excess conductive ball 108 by rubbing with the squeegee 110 is performed separately, the production process in the process of placing the conductive ball 108 on the pad 101 and the process of removing the excess conductive ball 108 are performed. There is a problem that it is difficult to improve the performance.

  Further, in another conventional mounting method of the conductive ball (see FIG. 7), the ball 127, the mask 123, the spacer 124, and the substrate 125 are vigorously rocked integrally to make the pad 127 conductive. Since the ball 121 is placed, a positional deviation is likely to occur between the substrate 125 and the mask 123. For this reason, the relative positional relationship between the penetrating part 123A and the pad 127 is likely to be shifted, and there is a problem that the conductive ball 121 cannot be placed on the pad 127 with high accuracy.

  Accordingly, the present invention has been made in view of the above-described problems, and reduces the processing time in the process of placing the conductive balls on the plurality of pads and the process of removing the excess conductive balls, thereby improving productivity. It is an object of the present invention to provide a conductive ball mounting device and a method for mounting a conductive ball that can be improved and can accurately mount a conductive ball on a pad.

  According to one aspect of the present invention, a plurality of pads, a solder resist having an adhesive material forming opening that exposes the pad, and a portion of the pad exposed in the adhesive material forming opening are formed. A conductive ball placing device for placing one conductive ball on each of the plurality of pads on which the adhesive material of the substrate having the adhesive material is formed, wherein the plurality of conductive balls A conductive ball container having an opening through which the plurality of conductive balls pass; and a conductive ball container disposed above the conductive ball container so as to face the opening; A substrate holding device for holding the substrate so that the balls and the plurality of pads are opposed to each other, and a conductive ball container that is disposed below the conductive ball container to vibrate the opening. And a vibration device for levitating the plurality of conductive balls, the substrate holding device and the vibration device are separated, and the substrate and the conductive ball held by the substrate holding device A conductive ball mounting device is provided in which a container and the vibration device are spaced apart from each other.

  According to the present invention, a conductive ball container having an opening for receiving a plurality of conductive balls and allowing the plurality of conductive balls to pass therethrough, and an upper portion of the conductive ball container so as to face the opening. The substrate holding device that holds the substrate so that the plurality of conductive balls and the plurality of pads face each other, and the conductive ball container is arranged below and vibrates the conductive ball container, And a vibration device for levitating a plurality of conductive balls through the opening. The substrate holding device and the vibration device are separated, and the substrate held by the substrate holding device, the conductive ball container, and By arranging the vibration device apart from the vibrating device, an excess of the conductive balls that have not been placed on the pad on which the adhesive material is formed fall to the conductive ball container. For, It is possible to perform the step of placing the conductive ball into a plurality of pads, and removing excess conductive balls at the same time. Thereby, since it becomes possible to shorten the processing time in the process of mounting the conductive ball on the plurality of pads and the process of removing the extra conductive ball, productivity can be improved.

  Further, by forming the adhesive material only on the plurality of pads, a mask having a penetrating portion for placing conductive balls on the pads becomes unnecessary. As a result, no displacement between the substrate and the mask occurs, so that the conductive ball can be placed on the pad with high accuracy.

  According to another aspect of the present invention, a plurality of pads, a solder resist having an opening for forming an adhesive material that exposes the pad, and a portion of the pad exposed in the opening for forming an adhesive material are formed. A conductive ball mounting method in which one conductive ball is mounted on each of the plurality of pads on which the adhesive material of the substrate having the formed adhesive material is formed, the plurality of the conductive materials After disposing the substrate above the plurality of conductive balls so that the balls and the plurality of pads face each other, the plurality of conductive balls are vibrated to float the plurality of conductive balls. Thus, there is provided a method for placing conductive balls, wherein one conductive ball is placed on each of the plurality of pads.

  According to the present invention, after arranging the substrate above the plurality of conductive balls so that the plurality of conductive balls and the plurality of pads face each other, the plurality of conductive balls are vibrated to thereby generate a plurality of conductive balls. By placing one conductive ball on each of the plurality of pads, the conductive ball is placed on the pad on which the adhesive material is formed. Since the extra conductive balls that have not been dropped fall into the conductive ball container, the step of placing the conductive balls on the plurality of pads and the step of removing the extra conductive balls can be performed simultaneously. . Thereby, since it becomes possible to shorten the processing time in the process of mounting the conductive ball on the plurality of pads and the process of removing the extra conductive ball, productivity can be improved.

  According to the present invention, it is possible to shorten the processing time in the process of placing the conductive balls on the plurality of pads and the process of removing the extra conductive balls, thereby improving the productivity and making the pads conductive. The ball can be placed with high accuracy.

  Next, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 8 is a cross-sectional view of the conductive ball mounting apparatus according to the first embodiment of the present invention. FIG. 8 illustrates a state in which a plurality of conductive balls 14 are levitated from below the substrate 18 held by the substrate holding device 15. In FIG. 8, Z and Z directions indicate vertical directions, and X and X directions indicate directions orthogonal to the Z and Z directions.

  Referring to FIG. 8, the conductive ball mounting device 10 of the first embodiment includes a stage 11, a vibration device 12 that is a conductive ball supply device, a conductive ball container 13, and a plurality of conductive materials. And a substrate holding device 15 for holding the substrate 18.

  First, for convenience of explanation, the configuration of the substrate 18 held by the substrate holding device 15 will be described. The board | substrate 18 is set as the structure by which the some board | substrate 25 was formed in the board | substrate body 26 made into plate shape. That is, the substrate 18 is an aggregate of a plurality of substrates 25 before being singulated. As the substrate body 26, for example, a glass epoxy resin can be used.

  The substrate 25 includes a substrate body 26, a through via 28, an upper wiring 29, pads 31 and 35, solder resists 32 and 37, a lower wiring 34, and an adhesive material 38. The through via 28 is provided so as to penetrate the substrate body 26. The upper end portion of the through via 28 is connected to the pad 31, and the lower end portion of the through via 28 is connected to the pad 35.

  The upper wiring 29 is provided on the upper surface 26 </ b> A of the substrate body 26. The upper wiring 29 is connected to the pad 31. The pad 31 is provided on the upper surface 26 </ b> A of the substrate body 26 corresponding to the position where the through via 26 is formed. The pad 31 is connected to the through via 28. The pad 31 is for mounting an electronic component (for example, a passive component). The solder resist 32 is provided on the upper surface 26 </ b> A of the substrate body 26 so as to cover the upper wiring 29. The solder resist 32 has an opening 32 </ b> A that exposes the pad 31.

  The lower wiring 34 is provided on the lower surface 26 </ b> B of the substrate body 26. The lower wiring 34 is connected to the pad 35. The pad 35 is provided on the lower surface 26 </ b> B of the substrate body 26 corresponding to the position where the through via 26 is formed. The pad 35 is connected to the through via 28. The pad 35 is electrically connected to the pad 31 through the through via 28. One conductive ball 14 serving as an external connection terminal of the substrate 25 is disposed on the pad 35 via an adhesive material 38.

  The solder resist 37 is provided on the lower surface 26 </ b> B of the substrate body 26 so as to cover the lower wiring 34. The solder resist 37 has an opening 37 </ b> A that exposes the pad 35. The adhesive material 38 is provided on the pad 35 so as to fill the opening 37A. The adhesive material 38 is for temporarily fixing the conductive ball 14 that floats when the vibration device 12 vibrates the conductive ball container 13. As the adhesive material 38, for example, flux, solder paste, or the like can be used.

  The substrate 18 configured as described above is held by the substrate holding device 15 so that the plurality of pads 35 on which the adhesive material 38 is formed face the plurality of conductive balls 14 exposed from the opening 13A.

  The stage 11 is for supporting the conductive ball container 13 via the vibration device 12. The vibration device 12 is provided on the stage 11. The vibration device 12 is disposed between the conductive ball container 13 and the stage 11. The vibration device 12 vibrates the conductive ball container 13 containing the plurality of conductive balls 14 to float the plurality of conductive balls 14 and is disposed above the conductive ball container 13. 18 for supplying a plurality of conductive balls 14.

  Such a vibration device 12 is provided, and a plurality of conductive balls 14 are levitated from the lower side of the substrate 18, so that among the plurality of levitated conductive balls 14, the vibration device 12 is mounted on the pad 35 on which the adhesive material 38 is formed. Since the extra conductive balls 14 that have not been placed fall on the conductive ball container 13, a process of placing the conductive balls 14 on the plurality of pads 35 and a process of removing the extra conductive balls 14 are performed. It can be performed simultaneously. Thereby, since it becomes possible to shorten the processing time in the process of mounting the conductive ball 14 on the plurality of pads 35 and the process of removing the excess conductive ball 14, productivity can be improved.

  The conductive ball container 13 is for housing a plurality of conductive balls 14. At the upper end of the conductive ball container 13, an opening 13 </ b> A for allowing the plurality of conductive balls 14 levitated by the vibration device 12 to pass therethrough is formed. The plurality of conductive balls 14 that have passed through the opening 13A reach the substrate 18 and are placed on the pads 35 on which the adhesive material 38 is formed. As a material of the conductive ball container 13, for example, a metal can be used.

  The plurality of conductive balls 14 are accommodated in the conductive ball container 13. The conductive ball 14 becomes an external connection terminal of the substrate 25. For example, a solder ball can be used as the conductive ball 14. Further, when a solder ball is used as the conductive ball 14, the diameter of the conductive ball 14 can be set to, for example, 10 μm to 100 μm.

  The substrate holding device 15 is separate from the vibration device 12 and is disposed above the conductive ball container 13. The substrate holding device 15 includes a substrate holding unit 21 and a support body 22. The substrate holding portion 21 is disposed so that the lower surface 21 </ b> A faces the opening 13 </ b> A of the conductive ball container 13. The substrate holding part 21 is plate-shaped. The substrate holding part 21 is for holding the substrate 18 on its lower surface 21A. As a method for holding the substrate 18, for example, suction, mechanical holding (for example, a clamp) or the like can be used. The distance D1 between the adhesive material 38 of the substrate 18 held by the substrate holding part 21 and the plurality of conductive balls 14 stored in the conductive ball container 13 can be set to 1 mm, for example. The support 22 is for supporting the substrate holder 21.

  The substrate 18 held by the substrate holding device 15 having the above-described configuration is disposed above the vibration device 12 and the conductive ball container 13 while being separated from the vibration device 12 and the conductive ball container 13.

  According to the conductive ball mounting apparatus of the present embodiment, the conductive ball container 13 having the opening 13A for receiving the plurality of conductive balls 14 and supplying the plurality of conductive balls 14, and the opening A substrate holding device 15 that is disposed above the conductive ball container 13 so as to face the portion 13A and holds the substrate 18 so that the plurality of conductive balls 14 and the plurality of pads 35 face each other; By providing the vibration device 12 for levitating the conductive ball 14, among the plurality of levitated conductive balls 14, the extra conductive balls 14 that are not placed on the pads 35 on which the adhesive material 38 is formed are electrically conductive. Since the conductive ball 14 is dropped into the conductive ball container 13, the step of placing the conductive ball 14 on the plurality of pads 35 and the step of removing the excess conductive ball 14 can be performed simultaneously. Thereby, since it becomes possible to shorten the processing time in the process of mounting the conductive ball 14 on the plurality of pads 35 and the process of removing the excess conductive ball 14, productivity can be improved.

  In addition, by providing the adhesive material 38 only on the plurality of pads 35, a mask having a penetrating portion for placing the conductive balls 14 on the pads 35 becomes unnecessary, so that the position between the substrate 18 and the mask is reduced. Since no deviation occurs, the conductive ball 14 can be placed on the pad 35 with high accuracy.

  9 to 15 are process diagrams for explaining a conductive ball placing method using the conductive ball placing apparatus according to the first embodiment of the present invention. 9-15, the same code | symbol is attached | subjected to the same structure part as the structure shown in FIG. 8 demonstrated previously. 9, 14, and 15, A indicates a position (hereinafter referred to as “cutting position A”) at which the substrate 18 is cut into pieces.

  With reference to FIGS. 9-15, the mounting method of the conductive ball | bowl 14 using the conductive ball mounting apparatus 10 based on the 1st Embodiment of this invention is demonstrated.

  First, in the step shown in FIG. 9, the substrate 18 in which the adhesive material 38 is provided on the plurality of pads 35 is formed by a known method. Next, in a step shown in FIG. 10, the conductive ball container 13 is filled with a plurality of conductive balls 14.

  Next, in the step shown in FIG. 11, the plurality of conductive balls 14 and the plurality of pads 35 provided with the adhesive material 38 are opposed to each other, and the substrate holding unit 21 causes the vibration device to be placed above the plurality of conductive balls 14. The substrate 18 is held so as to be separated from the conductive ball container 13 and the conductive ball container 13.

  Next, in the step shown in FIG. 12, the conductive ball container 13 is vibrated by the vibration device 12 to float the plurality of conductive balls 14 housed in the conductive ball container 13, thereby The balls 14 are supplied to the plurality of pads 35.

  As a result, among the plurality of conductive balls 14 that have been levitated, excess conductive balls 14 that have not been placed on the pads 35 on which the adhesive material 38 is formed fall to the conductive ball container 13, so that the conductive The step of placing the balls 14 on the plurality of pads 35 and the step of removing excess conductive balls 14 can be performed simultaneously. For this reason, since it becomes possible to shorten the processing time in the process of mounting the conductive ball 14 on the plurality of pads 35 and the process of removing the excess conductive ball 14, productivity can be improved.

  Note that the vibration of the conductive ball container 13 by the vibration device 12 is performed until the conductive balls 14 are placed on all the pads 35.

  Next, in the step shown in FIG. 13, after the conductive balls 14 are placed on all the pads 35, the vibration of the conductive ball container 13 by the vibration device 12 is stopped.

  Next, in the step shown in FIG. 14, the substrate 18 on which the conductive balls 14 are placed is removed from the substrate holding portion 21. Thereafter, the structure shown in FIG. 14 is heated to bond the conductive ball 14 and the pad 35, and the adhesive 38 is cleaned.

  Next, in the step shown in FIG. 15, the structure shown in FIG. 14 is cut along the cutting position A. As a result, a plurality of substrates 25 including the conductive balls 14 are manufactured.

  According to the conductive ball mounting method of the present embodiment, a plurality of conductive balls 14 and a plurality of pads 35 provided with the adhesive material 38 are held from the lower side of the substrate 18 held so as to face each other. Of the plurality of conductive balls 14 that have been levitated, an extra conductive ball 14 that was not placed on the pad 35 on which the adhesive material 38 is formed becomes a conductive ball container. 13, the step of placing the conductive balls 14 on the plurality of pads 35 and the step of removing the excess conductive balls 14 can be performed simultaneously. As a result, the processing time in the process of placing the conductive balls 14 on the plurality of pads 35 and the process of removing the excess conductive balls 14 can be shortened, so that productivity can be improved.

  In addition, by providing the adhesive material 38 only on the plurality of pads 35, a mask having a penetrating portion for placing the conductive balls 14 on the pads 35 becomes unnecessary, so that the position between the substrate 18 and the mask is reduced. Since no deviation occurs, the conductive ball 14 can be placed on the pad 35 with high accuracy.

  In this embodiment, the case where the vibration device 12 is used as the conductive ball supply device has been described as an example. However, the conductive ball supply device can float a plurality of conductive balls 14. Any means may be used. For example, an air supply device that floats the plurality of conductive balls 14 by supplying air instead of the vibration device 12 may be used.

(Second Embodiment)
FIG. 16 is a cross-sectional view of a conductive ball mounting apparatus according to the second embodiment of the present invention. FIG. 16 illustrates a state in which a plurality of conductive balls 14 are levitated from below the substrate 18 held by the substrate holding device 15. Moreover, in FIG. 16, the same code | symbol is attached | subjected to the same component as the conductive ball mounting apparatus 10 of 1st Embodiment.

  Referring to FIG. 16, the conductive ball mounting device 45 of the second embodiment is conductive except that a mask 46 is provided in the configuration of the conductive ball mounting device 10 of the first embodiment. The configuration is the same as that of the ball mounting device 10.

  The mask 46 is fixed to the substrate 18 through a resist film 47 formed on the solder resist 37. The mask 46 is disposed at a position separated from the conductive ball container 13. The mask 46 has a through portion 46A. A plurality of through portions 46 </ b> A are formed so as to penetrate through a portion of the mask 46 corresponding to the formation position of each pad 35. The through portion 46A exposes the pad 35. The diameter R1 of the through portion 46A is set to a size that allows only one conductive ball 14 to pass (a size slightly larger than the diameter of the conductive ball 14). Specifically, when the diameter of the conductive ball 14 is 100 μm, the diameter R1 of the through portion 46A of the mask 46 can be set to 120 μm, for example. Moreover, as a material of the mask 46, a metal can be used, for example.

  According to the conductive ball mounting apparatus of the present embodiment, the mask 46 having a plurality of through portions 46A at portions corresponding to the positions where the plurality of pads 35 are formed is fixed to the substrate 18 and the diameter of the through portion 46A is fixed. By setting R1 to a size that allows only one conductive ball 14 to pass therethrough, it is possible to prevent a plurality of conductive balls 14 from being placed on one pad 35 on which the adhesive material 38 is formed.

  When the conductive ball mounting device 45 of the present embodiment is used, the conductive balls 14 are placed on the plurality of pads 35 by the same method as the conductive ball 14 mounting method described in the first embodiment. Can be placed.

  According to the conductive ball mounting method of the present embodiment, the mask 46 having the plurality of through portions 46A at the portions corresponding to the positions where the plurality of pads 35 are formed is fixed to the substrate 18, and then the plurality of conductive layers. Since the diameter R1 of the penetrating portion 46A is large enough to allow only one conductive ball 14 to pass by floating the conductive ball 14, a plurality of conductive balls are formed on one pad 35 on which the adhesive material 38 is formed. 14 can be prevented from being placed.

  In addition, since the plurality of conductive balls 14 do not collide with the portion of the substrate 18 where the adhesive material 38 is not formed by using the mask 46, the substrate 18 is damaged due to the collision of the conductive balls 14. Can be prevented.

  Further, the substrate holding device 15 and the vibration device 12 are separated from each other, the plurality of conductive balls 14 and the plurality of pads 35 are opposed to each other, and the vibration device 12 and the conductive balls are disposed above the plurality of conductive balls 14. By disposing the substrate 18 so as to be separated from the container 13, positional displacement between the substrate 18 and the mask 46 due to driving (vibration) of the vibration device 12 does not occur. The ball 14 can be placed with high accuracy.

(Third embodiment)
FIG. 17 is a cross-sectional view of a conductive ball mounting apparatus according to the third embodiment of the present invention. FIG. 17 illustrates a state in which a plurality of conductive balls 14 are levitated from below the substrate 18 held by the substrate holding device 15. Moreover, in FIG. 17, the same code | symbol is attached | subjected to the same component as the conductive ball mounting apparatus 45 of 2nd Embodiment.

  Referring to FIG. 17, the conductive ball mounting device 50 according to the third embodiment is different from the conductive ball mounting device 45 according to the second embodiment in that the potential difference generating device 51 and the insulating member 52A are used. , 52B are provided in the same manner as the conductive ball mounting device 45.

  The potential difference generator 51 is configured to include a power source 54 and wirings 56 to 58. The power supply 54 has a plus terminal 54A and a minus terminal 54B. The plus terminal 54 </ b> A is electrically connected to the substrate 18 through the wiring 56. As a result, the substrate 18 is set to a positive potential. The minus terminal 54 </ b> B is connected to the ground via the wiring 57. Thereby, the minus terminal 54B is set to the ground potential.

  The wiring 56 has one end connected to the substrate 18 and the other end connected to the plus terminal 54A. The wiring 57 has one end connected to the minus terminal 54B and the other end connected to the ground. One end of the wiring 58 is connected to the wiring 57 and the other end is connected to the conductive ball container 13. As a result, the conductive ball container 13 and the plurality of conductive balls 14 accommodated in the conductive ball container 13 are set to the ground potential.

  The potential difference generator 51 configured as described above is for generating a potential difference between the plurality of conductive balls 14 accommodated in the conductive ball container 13 and the substrate 18. The potential difference generated between the plurality of conductive balls 14 and the substrate 18 exceeds the gravitational force applied to the conductive balls 14 by the electric attractive force generated between the plurality of conductive balls 14 and the substrate 18 due to the potential difference. It is good to set so that there is no. Specifically, the potential difference generated between the plurality of conductive balls 14 and the substrate 18 can be several hundred volts to several tens of thousands volts, for example.

  Thus, by providing the potential difference generating device 51 that generates a potential difference between the plurality of conductive balls 14 accommodated in the conductive ball container 13 and the substrate 18, the plurality of floating conductive balls 14 are electrically connected. Since the attractive force attracts the substrate 18, the processing time in the process of placing the conductive balls 14 on the plurality of pads 35 can be shortened.

  The insulating member 52 </ b> A is provided between the vibration device 12 and the conductive ball container 13. The insulating member 52 </ b> A is for facilitating charging of the plurality of conductive balls 14 accommodated in the conductive ball container 13. The insulating member 52 </ b> B is provided between the substrate holding part 21 and the support body 22. The insulating member 52B is for insulating the substrate holding part 21 and the support 22 from each other.

  According to the conductive ball mounting device of the present embodiment, by providing the potential difference generator 51 that generates a potential difference between the plurality of conductive balls 14 accommodated in the conductive ball container 13 and the substrate 18. Since the plurality of conductive balls 14 that have floated are attracted to the substrate 18 by electrical attraction, the processing time in the process of placing the conductive balls 14 on the plurality of pads 35 can be shortened.

  When the conductive ball mounting apparatus 50 of the present embodiment is used, a plurality of conductive materials accommodated in the conductive ball container 13 in the steps shown in FIGS. 11 and 12 described in the first embodiment. The conductive ball 14 is placed on the plurality of pads 35 by the same method as the method for placing the conductive ball 14 of the first embodiment except that a potential difference is generated between the ball 14 and the substrate 18. be able to.

  According to the conductive ball mounting method of the present embodiment, after a potential difference is generated between the plurality of conductive balls 14 accommodated in the conductive ball container 13 and the substrate 18, the plurality of conductive By levitating the ball 14, the plurality of levitated conductive balls 14 are attracted to the substrate 18 by electrical attraction, so that the processing time in the process of placing the conductive balls 14 on the plural pads 35 is shortened. Can do.

  In the present embodiment, the case where the plurality of conductive balls 14 accommodated in the conductive ball container 13 are set to the ground potential and the substrate 18 is set to the positive potential has been described as an example. May be set to a ground potential, and the plurality of conductive balls 14 may be set to a positive potential.

(Fourth embodiment)
FIG. 18 is a cross-sectional view of a conductive ball mounting apparatus according to the fourth embodiment of the present invention. FIG. 18 illustrates a state in which a plurality of conductive balls 14 are levitated from below the substrate 18 held by the substrate holding device 15. Moreover, in FIG. 18, the same code | symbol is attached | subjected to the same component as the conductive ball mounting apparatus 50 of 3rd Embodiment.

  Referring to FIG. 18, the conductive ball mounting device 60 according to the fourth embodiment is different from the configuration of the conductive ball mounting device 50 according to the third embodiment except that a charging member 61 is further provided. Is configured in the same manner as the conductive ball mounting device 50. In the present embodiment, the following description will be given by taking as an example the case where a wiring is used as the charging member 61.

  The charging member 61 has one end connected to the wiring 57 and the other end connected to the mask 46. Thereby, the mask 46 is set to a ground potential substantially equal to the potentials of the plurality of conductive balls 14 accommodated in the conductive ball container 13.

  According to the conductive ball mounting apparatus of the present embodiment, the potential difference generator 51 that generates a potential difference between the plurality of conductive balls 14 accommodated in the conductive ball container 13 and the substrate 18, and the mask 46. Is provided with a charging member 61 that substantially equals the potential of the plurality of conductive balls 14 accommodated in the conductive ball container 13, so that the plurality of floating conductive balls 14 are padded by an electric attractive force. Therefore, the processing time in the process of placing the conductive balls 14 on the plurality of pads 35 can be further shortened.

  When the conductive ball mounting device 60 of the present embodiment is used, a plurality of conductive materials accommodated in the conductive ball container 13 in the steps shown in FIGS. 11 and 12 described in the first embodiment. One embodiment except that a potential difference is generated between the ball 14 and the substrate 18 and the potential of the mask 46 is made substantially equal to the potential of the plurality of conductive balls 14 accommodated in the conductive ball container 13. The conductive ball 14 can be placed on the plurality of pads 35 by the same method as the method for placing the conductive ball 14.

  According to the conductive ball mounting method of the present embodiment, a potential difference is generated between the plurality of conductive balls 14 accommodated in the conductive ball container 13 and the substrate 18, and the potential of the mask 46 is set. After making the potentials of the plurality of conductive balls 14 accommodated in the conductive ball container 13 substantially equal to each other, the plurality of conductive balls 14 are levitated, so that the plurality of conductive balls 14 are brought into the pads 35 by electric attraction. Therefore, the processing time in the process of placing the conductive balls 14 on the plurality of pads 35 can be further shortened.

(Fifth embodiment)
FIG. 19 is a cross-sectional view of a conductive ball mounting apparatus according to the fifth embodiment of the present invention. FIG. 19 illustrates a state in which a plurality of conductive balls 14 are sprayed from a direction orthogonal to the vertical direction (Z, Z direction) on the substrate 18 provided with the mask 46. Moreover, in FIG. 19, the same code | symbol is attached | subjected to the same component as the conductive ball mounting apparatus 45 of 2nd Embodiment.

  Referring to FIG. 19, the conductive ball mounting device 70 according to the fifth embodiment includes a stage 11, a vibration device 12, and a conductive device provided in the conductive ball mounting device 45 according to the second embodiment. Instead of the conductive ball container 13, a support base 71, a conductive ball container 72, an air supply device 73 as a conductive ball supply device, and a conductive ball collection container 74 are provided, and the vertical direction (Z, Z direction). Except that the substrate 18 is held by the substrate holding device 15 so that the opening 76A of the conductive ball container 72 and the pad 35 face each other in the direction orthogonal to the conductive ball mounting device 45. The

  The support base 71 is for supporting the conductive ball container 72 and the air supply device 73. The conductive ball container 72 has a front plate 76 and a back plate 77. The conductive ball container 72 is disposed on the support base 71 so that the front plate 76 faces the plurality of pads 35. The front plate 76 has a plurality of openings 76A. The opening 76 </ b> A is formed so as to penetrate the portion of the front plate 76 facing the pad 35. When the diameter of the conductive ball 14 is 100 μm, the diameter R2 of the opening 76A can be set to 150 μm, for example. Moreover, the distance D2 between the front plate 76 and the adhesive material 38 can be set to 1 mm, for example.

  The back plate 77 has a plurality of air introduction ports 77A. The air introduction port 77A is formed so as to penetrate the portion of the back plate 77 facing the opening 76A. The plurality of air introduction ports 77 </ b> A are for introducing the air supplied from the air supply device 73 into the conductive ball container 72.

  The air supply device 73 is provided on the support base 71 and is in contact with the back plate 77 of the conductive ball container 72. The air supply device 73 is a device for supplying air into the conductive ball container 72 through the air introduction port 77A. The air supply device 73 supplies a plurality of air to the conductive ball container 72 through the opening 76 </ b> A so that the substrate 18 (specifically, the plurality of pads 35) provided with the mask 46 has a plurality of air supply devices 73. The conductive balls 14 are sprayed to place one conductive ball 14 on each of the plurality of pads 35.

  Of the plurality of conductive balls 14 sprayed on the substrate 18, the extra conductive balls 14 that are not placed on the pads 35 on which the adhesive material 38 is formed fall in the vertical direction due to gravity. It is possible to simultaneously perform the step of placing on the plurality of pads 35 and the step of removing excess conductive balls 14. Thereby, since it becomes possible to shorten the processing time in the process of mounting the conductive ball 14 on the plurality of pads 35 and the process of removing the excess conductive ball 14, productivity can be improved.

  The conductive ball collection container 74 is disposed below the substrate 18. The upper end portion of the conductive ball collection container 74 is open. The conductive ball collection container 74 is for collecting excess conductive balls 14 that are not placed on the pads 35 that fall in the vertical direction due to gravity. By providing such a conductive ball collection container 74, the collected conductive balls 14 can be reused.

  According to the conductive ball mounting apparatus of the present embodiment, a conductive ball container 72 having a plurality of openings 76A for receiving a plurality of conductive balls 14 and supplying a plurality of conductive balls 14; In the direction orthogonal to the vertical direction (Z, Z direction), the substrate holding device 15 that holds the substrate 18 so that the opening 76A of the conductive ball container 72 and the pad 35 face each other, and the plurality of pads 35 By providing the air supply device 73 for spraying the plurality of conductive balls 14, of the plurality of conductive balls 14 sprayed on the substrate 18, excess conductivity that is not placed on the pad 35 on which the adhesive material 38 is formed. Since the ball 14 falls in the vertical direction due to gravity, the step of placing the conductive ball 14 on the plurality of pads 35 and the step of removing the excess conductive ball 14 are simultaneously performed. Theft is possible.

  As a result, the processing time in the process of placing the conductive balls 14 on the plurality of pads 35 and the process of removing the excess conductive balls 14 can be shortened, so that productivity can be improved.

  When the conductive ball mounting device 70 of the present embodiment is used, a plurality of conductive properties are applied to the substrate 18 by the air supplied from the air supply device 73 in the step shown in FIG. 12 described in the first embodiment. Except for supplying the balls 14, the conductive balls 14 can be placed on the plurality of pads 35 by the same method as the method for placing the conductive balls 14 described in the first embodiment.

  According to the mounting method of the conductive ball of the present embodiment, the substrate 18 is held so that the opening 76A and the pad 35 face each other in the direction orthogonal to the vertical direction (Z, Z direction). By spraying the plurality of conductive balls 14 onto the plurality of pads 35 by the air supply device 73, among the plurality of conductive balls 14 sprayed on the substrate 18, excess conductive balls 14 that are not placed on the pads 35 are gravity-induced. Therefore, the step of placing the conductive balls 14 on the plurality of pads 35 and the step of removing the excess conductive balls 14 can be performed simultaneously.

  As a result, the time required for the step of placing the conductive ball 14 on the plurality of pads 35 and the step of removing the extra conductive ball 14 can be shortened as compared with the prior art. The productivity in the step of placing on the pad 35 and the step of removing excess conductive balls 14 can be improved.

  Note that the conductive ball mounting device 70 of the present embodiment may be provided with the potential difference generating device 51 (see FIG. 17) described in the third embodiment. In this case, the same effect as that of the conductive ball mounting apparatus 50 according to the third embodiment can be obtained.

  Further, the conductive ball mounting device 70 of the present embodiment includes the potential difference generator 51 (see FIG. 17) described in the third embodiment and the charging member 61 (described in the fourth embodiment). 18) may be provided. In this case, the same effect as that of the conductive ball mounting device 60 of the fourth embodiment can be obtained.

(Sixth embodiment)
FIG. 20 is a cross-sectional view of a conductive ball mounting apparatus according to the sixth embodiment of the present invention. FIG. 20 illustrates a state where a plurality of conductive balls 14 are levitated from below the substrate 18 held by the substrate holding device 15. In FIG. 20, the same components as those of the conductive ball mounting device 45 of the second embodiment are denoted by the same reference numerals.

  Referring to FIG. 20, the conductive ball mounting device 80 of the sixth embodiment is a plate instead of the mask 46 and the stage 11 provided in the conductive ball mounting device 45 of the second embodiment. The structure is the same as that of the conductive ball mounting device 45 except that the body 81 and the accommodation stage 82 are provided and the resist film 47 provided on the conductive ball mounting device 45 is removed from the constituent elements.

  The housing stage 82 includes a housing portion 82 </ b> A that houses the vibration device 12 and the conductive ball housing 13. The accommodation stage 82 is in contact with the lower end portion of the vibration device 12. The housing stage 82 supports the conductive ball container 13 via the vibration device 12.

  The plate body 81 is provided on the housing stage 82 and is disposed above the conductive ball housing body 13. The plate body 81 has a plurality of through portions 81A. The penetrating portion 81A is formed so as to penetrate the portion of the plate 81 facing the pad 35. The plate body 81 having a plurality of penetrating portions 81 </ b> A is a mask for discharging the conductive balls 14 toward the adhesive material 38 formed on the pad 35. When the diameter of the conductive ball 14 is 100 μm, the diameter of the through portion 81A can be set to 120 μm, for example. Moreover, as a material of the plate 81, for example, a metal can be used.

  According to the conductive ball mounting apparatus of the present embodiment, the storage stage 82 for storing the vibration device 12 and the conductive ball container 13 is provided, and the conductive ball is directed toward the adhesive material 38 formed on the pad 35. 14 is provided on the accommodation stage 82 by providing a plate body 81 having a penetrating portion 81A that discharges 14 to a pad where a mask 46 is attached to each substrate 18 using a resist film 47 and the conductive ball 14 is formed with an adhesive material 38. Compared with the case where it mounts on 35, while being able to mount the conductive ball | bowl 14, it can improve the productivity in a conductive ball mounting process.

  The mounting method of the conductive ball 14 of the present embodiment can be performed by the same method as the mounting method of the conductive ball 14 of the second embodiment. The mounting method of the conductive ball of the present embodiment can obtain the same effect as the mounting method of the conductive ball 14 of the second embodiment.

  The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to such specific embodiments, and within the scope of the present invention described in the claims, Various modifications and changes are possible.

  INDUSTRIAL APPLICABILITY The present invention can be applied to a conductive ball mounting device and a conductive ball mounting method for mounting a conductive ball on a substrate having a plurality of pads on which an adhesive material is formed.

It is process drawing (the 1) for demonstrating the mounting method of the conventional conductive ball | bowl. It is process drawing (the 2) for demonstrating the mounting method of the conventional conductive ball | bowl. It is process drawing (the 3) for demonstrating the mounting method of the conventional conductive ball | bowl. It is process drawing (the 4) for demonstrating the mounting method of the conventional conductive ball | bowl. It is process drawing (the 5) for demonstrating the mounting method of the conventional conductive ball | bowl. It is process drawing (the 6) for demonstrating the mounting method of the conventional conductive ball | bowl. It is a figure for demonstrating the other mounting method of the conventional conductive ball. It is sectional drawing of the conductive ball mounting apparatus which concerns on the 1st Embodiment of this invention. It is process drawing (the 1) for demonstrating the mounting method of the conductive ball using the conductive ball mounting apparatus which concerns on the 1st Embodiment of this invention. It is process drawing (the 2) for demonstrating the mounting method of the conductive ball using the conductive ball mounting apparatus which concerns on the 1st Embodiment of this invention. It is process drawing (the 3) for demonstrating the mounting method of the conductive ball using the conductive ball mounting apparatus which concerns on the 1st Embodiment of this invention. It is process drawing (the 4) for demonstrating the mounting method of the conductive ball using the conductive ball mounting apparatus which concerns on the 1st Embodiment of this invention. It is process drawing (the 5) for demonstrating the mounting method of the conductive ball using the conductive ball mounting apparatus which concerns on the 1st Embodiment of this invention. It is process drawing (the 6) for demonstrating the mounting method of the conductive ball using the conductive ball mounting apparatus which concerns on the 1st Embodiment of this invention. It is process drawing (the 7) for demonstrating the mounting method of the conductive ball using the conductive ball mounting apparatus which concerns on the 1st Embodiment of this invention. It is sectional drawing of the conductive ball mounting apparatus which concerns on the 2nd Embodiment of this invention. It is sectional drawing of the conductive ball mounting apparatus which concerns on the 3rd Embodiment of this invention. It is sectional drawing of the conductive ball mounting apparatus which concerns on the 4th Embodiment of this invention. It is sectional drawing of the conductive ball mounting apparatus which concerns on the 5th Embodiment of this invention. It is sectional drawing of the conductive ball mounting apparatus which concerns on the 6th Embodiment of this invention.

Explanation of symbols

10, 45, 50, 60, 70, 80 Conductive ball placing device 11 Stage 12 Vibrating device 13, 72 Conductive ball container 13A, 76A, 32A, 37A Opening 14 Conductive ball 15 Substrate holding device 18, 25 Substrate 21 Substrate holding portion 21A, 26B Lower surface 22 Support body 26 Substrate body 26A Upper surface 28 Through via 29 Upper wiring 31, 35 Pad 32, 37 Solder resist 34 Lower wiring 38 Adhesive material 46 Mask 46A, 81A Through portion 47 Resist film 51 Potential difference Generators 52A, 52B Insulating member 54 Power supply 54A Positive terminal 54B Negative terminal 56-58 Wiring 61 Charging member 71 Support base 73 Air supply device 74 Conductive ball collection container 76 Front plate 77 Rear plate 77A Air inlet port 81 Plate body 82 Accommodation stage 82A Accommodation section A Cutting position D1, D2 Distance R1, R2 Diameter

Claims (2)

The substrate having a plurality of pads, a solder resist having an opening for forming an adhesive material exposing the pad, and an adhesive formed on the pad in a portion exposed to the opening for forming the adhesive material A conductive ball mounting device for mounting one conductive ball on each of the plurality of pads on which an adhesive material is formed,
A conductive ball container that contains the plurality of conductive balls and has an opening through which the plurality of conductive balls pass;
A substrate holding device that is disposed above the conductive ball container so as to face the opening, and holds the substrate so that the plurality of conductive balls and the plurality of pads face each other;
A vibration device that is disposed below the conductive ball container and causes the plurality of conductive balls to float through the openings by vibrating the conductive ball container;
The substrate holding device and the vibration device are separated, and the substrate held by the substrate holding device, the conductive ball container, and the vibration device are arranged separately from each other. Ball mounting device. The substrate having a plurality of pads, a solder resist having an opening for forming an adhesive material exposing the pad, and an adhesive formed on the pad in a portion exposed to the opening for forming the adhesive material A conductive ball mounting method for mounting one conductive ball on each of the plurality of pads on which an adhesive material is formed,
After arranging the substrate above the plurality of conductive balls so that the plurality of conductive balls and the plurality of pads face each other, the plurality of conductive balls are vibrated to thereby oscillate the plurality of conductive balls. A conductive ball mounting method, wherein one conductive ball is mounted on each of the plurality of pads by floating the conductive ball.

Images