JP2010278069A - Arranging method of connection terminal - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an arranging method of a connection terminal for arranging the connection terminals in all pads installed on a substrate. <P>SOLUTION: An electroless plating film 32 covering surfaces of first connection parts 36 installed in a plurality of connection terminal bodies 31 are formed by an electroless plating method. An electrolytic plating film 33 covering surfaces of second connection parts 37 arranged in the plurality of the connection terminal bodies 31 is formed by an electrolytic plating method. Thus, the plurality of the connection terminals 13 having the connection terminal bodies 31, the electroless plating films 32 and the electrolytic plating films 33 are formed. An alignment jig 41 provided with an alignment jig body 43 having a plurality of openings 46 where the connection terminals 13 are disposed and a magnet 44 installed on the face 43B of the alignment jig body 43 positioned at the opposite side of a face 43A where the openings 46 are formed is prepared. The connection terminals 13 are thrown into the plurality of the openings 46. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for arranging connection terminals, and more particularly to a method for arranging connection terminals in which connection terminals are arranged on a plurality of pads provided on a substrate.

  As a semiconductor device under examination by the inventors of the present application, a semiconductor device including an electronic component, a substrate having an external connection pad and a pad on which the electronic component is mounted, and a connection terminal disposed on the external connection pad. Yes (see FIG. 1).

  FIG. 1 is a cross-sectional view of a semiconductor device under investigation by the inventors of the present application.

  Referring to FIG. 1, a conventional semiconductor device 200 includes a substrate 201, an electronic component 202, and connection terminals 203. The substrate 201 includes a substrate body 205, pads 207, external connection pads 208, and solder 209.

  The substrate body 205 has a plurality of stacked insulating layers (not shown) and a wiring pattern (including vias and wiring) (not shown) formed in the stacked plurality of insulating layers.

  The pad 207 is provided on the upper surface 205A of the substrate body 205. The pad 207 is a pad for mounting the electronic component 202.

  The external connection pad 208 is provided on the lower surface 205 </ b> B of the substrate body 205. The external connection pad 208 is electrically connected to the pad 207 via a wiring pattern (not shown) formed on the substrate body 205. Solder 209 is provided on the connection surface 208 </ b> A of the external connection pad 208. The external connection pad 208 is electrically connected to the connection terminal 203 via the solder 209.

  The electronic component 202 is mounted on a pad 207 provided on the substrate 201. Thereby, the electronic component 202 is electrically connected to the substrate 201.

  The connection terminal 203 is a terminal having a spring property. One end 203 </ b> A of the connection terminal 203 is connected to the external connection pad 208 via the solder 209. The other end 203 </ b> B of the connection terminal 203 is pressed against the pad 215 provided on the mounting substrate 204 with a substantially constant pressure. Thereby, the substrate 201 is electrically connected to the mounting substrate 204 via the connection terminals 203.

  In this manner, by using the connection terminal 203 having spring properties, the semiconductor device 200 and the mounting substrate 204 can be easily attached and detached.

  2-5 is a figure which shows the arrangement | positioning process of the connecting terminal shown in FIG. 2 to 5, the same components as those of the semiconductor device 200 shown in FIG.

  With reference to FIG. 2 to FIG. 5, a method for arranging the connection terminals 203 under investigation by the inventors of the present application will be described. First, in the step shown in FIG. 2, a plurality of openings 222 are arranged from above the plurality of openings 222 with the vibration device 224 vibrating the terminal alignment member 221 having a plurality of openings 222 in which the connection terminals 203 are received. The connection terminal 203 is dropped. As a result, the connection terminals 203 are aligned in a predetermined direction (specifically, the direction of the connection terminals 203 accommodated in the openings 222 shown in FIG. 2) in the plurality of openings 222, and then the vibration device 224 is stopped.

  Next, in the process shown in FIG. 3, the substrate 201 including the substrate body 205, the pads 207, the plurality of external connection pads 208, and the solder 209 is formed by a known method.

  Next, in the step shown in FIG. 4, the solder 209 provided on the substrate 201 shown in FIG. 3 is melted, and the solder 209 and the end 203 </ b> A of the connection terminal 203 aligned with the terminal alignment member 221 are brought into contact with each other. As a result, the connection terminals 203 are disposed on the plurality of external connection pads 208.

  Next, in the step shown in FIG. 5, after the solder 209 is cured, the substrate 201 is pulled up above the terminal alignment member 221. As a result, a substrate 201 having a plurality of connection terminals 203 is formed (see, for example, Patent Document 1).

  Note that Patent Document 1 does not disclose the semiconductor device 200 configured as described above. Patent Document 1 is a prior art document cited as an example of a terminal having springiness.

US Pat. No. 7,264,486

  FIG. 6 is a diagram for explaining problems of the connection terminal arrangement method under investigation by the inventors of the present application. In FIG. 6, the same components as those in the structure shown in FIG.

  However, in the arrangement method of the connection terminal 203 under examination by the inventors of the present application, the connection terminal 203 is dropped from above the plurality of openings 222 in a state where the terminal alignment member 221 is vibrated, and the plurality of openings The connection terminal 203 is aligned with 222.

  Therefore, the orientation of the connection terminal 203 accommodated in the opening 222 may be different from a predetermined orientation (the orientation of the connection terminal 203 accommodated in the opening 222 shown in FIG. 2).

  In this case, as shown in FIG. 6, it is possible to connect the end portion 203A of the connection terminal 203 accommodated in the opening 222 and the solder 209 formed on the external connection pad 208 in a direction different from the predetermined direction. There is a problem that the connection terminals 203 cannot be provided for all the external connection pads 208 on which the solder 209 is formed.

  A similar problem occurs when a pin terminal (terminal having no spring property) applied to a PGA (Pin Grid Array) is used instead of the connection terminal 203.

  Accordingly, the present invention has been made in view of the above-described problems, and an object of the present invention is to provide a connection terminal disposing method capable of disposing connection terminals with respect to all pads provided on a substrate. And

  According to one aspect of the present invention, a substrate forming step of forming a substrate having a plurality of pads having connection surfaces, a first connection portion electrically connected to the pads, and another substrate electrically A plurality of connection terminal bodies formed with a plurality of connection terminal bodies provided with a second connection section connected to the first connection sections provided on the plurality of connection terminal bodies by an electroless plating method. An electroless plating film is formed, and an electroplating film that covers the second connection portions provided on the plurality of connection terminal bodies is formed by an electroplating method. A connection terminal forming step of forming a plurality of connection terminals provided with a plating film and the electrolytic plating film, an alignment jig main body having a plurality of openings for accommodating the one connection terminal, and the openings are formed. The first of the alignment jig body An alignment jig preparing step of preparing an alignment jig comprising: a magnet disposed on the second surface of the alignment jig main body located on the opposite side of the magnet so as to face the plurality of openings; A connection terminal transfer step of transferring the connection terminals into the plurality of openings, and a conductive paste connecting the first connection portion on which the electroless plating film is formed and the pad of the substrate after the connection terminal transfer step A contact terminal disposing step of disposing the connection terminals on the plurality of pads; and after the connection terminal disposing step, the conductive paste is cured by melting the conductive paste. And a substrate removal step of removing the substrate on which the plurality of connection terminals are disposed from the alignment jig.

  According to the present invention, the electrolytic plating film is magnetized by forming the electrolytic plating film covering the second connection portions provided on the plurality of connection terminal bodies by the electrolytic plating method. The magnetic force of the magnet arranged on the surface of 2 makes it possible to attract the second connection part in which the electrolytic plating film is formed in the opening. In addition, since the electroless plating film is not magnetized by forming the electroless plating film covering the first connection portions provided on the plurality of connection terminal bodies by the electroless plating method, the second of the alignment jig body Due to the magnetic force of the magnet disposed on the surface, the first connection part in which the electroless plating film is formed in the opening is not attracted.

  Thereby, a plurality of connection terminals including the above-described electrolytic plating film and electroless plating film and a connection terminal body are formed, and then an alignment jig body having a plurality of openings for accommodating one connection terminal; A magnet disposed on the second surface of the alignment jig body located opposite to the first surface of the alignment jig body in which the openings are formed, so as to face the plurality of openings. By preparing the alignment jig provided, and then swinging the connection terminals into a plurality of openings, it becomes possible to swing one connection terminal into each of the openings so as to have a predetermined orientation, Connection terminals can be provided for all pads provided on the substrate.

  Further, in the connection terminal transfer step, when the connection terminals are not transferred in a predetermined direction with respect to all the openings, the alignment repair is performed between the connection terminal transfer step and the connection terminal arrangement step. The connecting terminal removing step of removing the connecting terminal that has not been transferred in the predetermined direction with respect to the opening and the connecting terminal transferring step may be repeated by turning the tool upside down.

  In this way, the alignment jig is turned upside down, and the connection terminal removal step for removing the connection terminal that has not been transferred in the predetermined direction with respect to the opening and the connection terminal transfer step are repeatedly performed, Since the connection terminals can be arranged in the opening so as to have a predetermined orientation, the connection terminals can be reliably arranged for all the pads provided on the substrate.

  The electroless plating film may contain phosphorus. This can prevent the electroless plating film from being magnetized.

  Furthermore, the phosphorus concentration of the electroless plating film may be 12 wt% or more. Thereby, it can prevent reliably that an electroless plating film is magnetized.

  According to the present invention, connection terminals can be provided for all pads provided on a substrate.

It is sectional drawing of the semiconductor device under inventor examination of this application. FIG. 3 is a diagram (No. 1) illustrating an arrangement process of the connection terminal illustrated in FIG. 1. FIG. 8 is a diagram (part 2) illustrating an arrangement process of the connection terminal illustrated in FIG. 1. FIG. 4 is a diagram (part 3) illustrating an arrangement process of the connection terminal illustrated in FIG. 1. FIG. 8 is a diagram (No. 4) illustrating the disposing step of the connection terminal illustrated in FIG. 1. It is a figure for demonstrating the problem of the arrangement | positioning method of the connecting terminal shown in FIG. It is sectional drawing of the semiconductor device provided with the connection terminal arrange | positioned by the arrangement | positioning method of the connection terminal which concerns on embodiment of this invention. It is FIG. (1) which shows the arrangement | positioning process of the connecting terminal which concerns on embodiment of this invention. It is FIG. (2) which shows the arrangement | positioning process of the connecting terminal which concerns on embodiment of this invention. It is FIG. (3) which shows the arrangement | positioning process of the connecting terminal which concerns on embodiment of this invention. It is FIG. (4) which shows the arrangement | positioning process of the connecting terminal which concerns on embodiment of this invention. It is FIG. (5) which shows the arrangement | positioning process of the connecting terminal which concerns on embodiment of this invention. It is FIG. (6) which shows the arrangement | positioning process of the connecting terminal which concerns on embodiment of this invention. It is FIG. (The 7) which shows the arrangement | positioning process of the connecting terminal which concerns on embodiment of this invention. It is a figure (the 1) which shows the arrangement | positioning process of the connecting terminal which concerns on the modification of embodiment of this invention. It is FIG. (2) which shows the arrangement | positioning process of the connecting terminal which concerns on the modification of embodiment of this invention. It is a figure (the 3) which shows the arrangement | positioning process of the connecting terminal which concerns on the modification of embodiment of this invention. It is sectional drawing which shows the other alignment jig | tool with which the other connection terminal was aligned.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment)
FIG. 7 is a cross-sectional view of a semiconductor device provided with connection terminals arranged by the connection terminal arrangement method according to the embodiment of the present invention.

  Here, before explaining the arrangement method of the connection terminals 13 of the present embodiment, the configuration of the semiconductor device 10 including the connection terminals 13 arranged by the arrangement method of the connection terminals 13 of the present embodiment. explain.

  Referring to FIG. 7, the semiconductor device 10 includes a substrate 11, an electronic component 12, and a connection terminal 13.

  The substrate 11 includes a substrate body 21, a plurality of electronic component mounting pads 23, solder resist layers 24 and 26, a plurality of pads 25 that are external connection pads, and a conductive paste 28.

  As the substrate body 21, for example, a plurality of laminated insulating layers (not shown), and a wiring pattern (not shown) formed on the plurality of laminated insulating layers (including vias, wirings, pads, etc.) A multilayer wiring structure having The board body 21 has a wiring pattern (not shown) for electrically connecting the electronic component mounting pads 23 and the pads 25.

  The electronic component mounting pad 23 is provided on the surface 21 </ b> A of the substrate body 21. The electronic component mounting pad 23 is a pad on which the electronic component 12 is mounted. The electronic component mounting pad 23 has a connection surface 23 </ b> A connected to the bump 16 electrically connected to the electronic component 12. As a material of the electronic component mounting pad 23, for example, Cu can be used.

  The solder resist layer 24 is provided so as to cover the surface 21 </ b> A of the substrate body 21. The solder resist layer 24 has an opening 24 </ b> A that exposes the connection surface 23 </ b> A of the electronic component mounting pad 23.

  The pad 25 is provided on the surface 21B of the substrate body 21 (the surface of the substrate body 21 located on the opposite side of the surface 21A of the substrate body 21). The pad 25 has a connection surface 25A on which the conductive paste 28 is formed. The pad 25 is electrically connected to the electronic component 12 via a wiring pattern (not shown) formed on the substrate body 21 and the electronic component mounting pad 23. As a material of the pad 25, for example, Cu can be used.

  The solder resist layer 26 is provided so as to cover the surface 21 </ b> B of the substrate body 21. The solder resist layer 26 has an opening 26 </ b> A that exposes the connection surface 25 </ b> A of the pad 25.

  The conductive paste 28 is provided on the connection surface 25A of the pad 25 exposed from the opening 26A. The conductive paste 28 is connected to the connection terminal 13. Thus, the conductive paste 28 electrically connects the pad 25 and the connection terminal 13. As the conductive paste 28, for example, an epoxy resin containing solder or metal powder can be used.

  The electronic component 12 is flip-chip mounted on the electronic component mounting pad 23. In other words, the electronic component 12 is electrically connected to the electronic component mounting pad 23 via the bump 16. For example, a semiconductor chip can be used as the electronic component 12. In this case, as the electronic component 12, for example, a semiconductor chip for CPU can be used.

  The connection terminal 13 is a terminal having a spring property, and includes a connection terminal main body 31, an electroless plating film 32, and an electrolytic plating film 33.

  The connection terminal main body 31 includes a support portion 35, a first connection portion 36, and a second connection portion 37. The support part 35 is a part for supporting the first and second connection parts 36 and 37. The support part 35 is plate-shaped and has a spring property.

  The first connection part 36 is provided at one end of the support part 35. The first connection portion 36 and the support portion 35 are integrally configured. The first connection portion 36 is a portion that is electrically connected to the pad 25 provided on the substrate 11 via the conductive paste 28 and the electroless plating film 32.

  The second connection part 37 is provided at the other end of the support part 35. The 2nd connection part 37 and the support part 35 are comprised integrally. The second connecting portion 37 is pressed against the pad 17 provided on the mounting board 15 (for example, a mother board) which is another board (in practice, pressed by a jig provided on the mounting board 15. Thus, it is a portion that contacts the pad 17 through the electrolytic plating film 33.

  As a material of the connection terminal body 31 having the above-described configuration, for example, a copper-based alloy (for example, phosphor bronze, beryllium copper, or the like) can be used.

  The electroless plating film 32 is formed so as to cover the surface of the first connection portion 36. The electroless plating film 32 is a metal film formed by an electroless plating method. The electroless plating film 32 is a metal film containing phosphorus and is a film that is difficult to magnetize. The concentration of phosphorus contained in the electroless plating film 32 is preferably 12 wt% or more, for example.

  Thus, by setting the concentration of phosphorus contained in the electroless plating film 32 to 12 wt% or more, it is possible to reliably prevent the electroless plating film 32 from being magnetized.

  As the electroless plating film 32, for example, an electroless Ni plating film (for example, a thickness of 3 to 5 μm) and an electroless Au plating film (for example, a thickness of 0.1 mm) are formed on the surface of the first connection portion 36. An electroless Ni / Au plating film in which 01 to 0.05 μm) are sequentially laminated can be used.

  The electrolytic plating film 33 is formed so as to cover the surface of the second connection portion 37. The electrolytic plating film 33 is a metal film formed by an electrolytic plating method. The electrolytic plating film 33 is a metal film that is easily magnetized. In other words, the electrolytic plating film 33 is a metal film that is attracted to the magnet.

  As the electrolytic plating film 33, for example, an electrolytic Ni plating film (for example, a thickness of 3 to 5 μm) and an electrolytic Au plating film (for example, a thickness of 0.01 to 0) are formed on the surface of the second connection portion 37. .05 μm) can be used, and an electrolytic Ni / Au plated film can be used.

  The connection terminal 13 configured as described above is a terminal for electrically connecting the substrate 11 on which the electronic component 12 is mounted and the mounting substrate 15.

  8-14 is a figure which shows the arrangement | positioning process of the connection terminal which concerns on embodiment of this invention. 8 to 14, the same components as those of the semiconductor device 10 shown in FIG.

  With reference to FIGS. 8 to 14, the connection terminal disposing method according to the present embodiment is exemplified by the case where the connection terminals 13 are disposed on the plurality of pads 25 provided on the substrate 11 illustrated in FIG. 7. Will be described.

  First, in the process shown in FIG. 8, the substrate body 21, a plurality of electronic component mounting pads 23, solder resist layers 24 and 26, a plurality of pads 25 that are external connection pads, The substrate 11 having the conductive paste 28 provided on the connection surfaces 25A of the plurality of pads 25 is formed (substrate forming step).

  As the substrate body 21, for example, a plurality of laminated insulating layers (not shown), and a wiring pattern (not shown) formed on the plurality of laminated insulating layers (including vias, wirings, pads, etc.) A multilayer wiring structure having

  The electronic component mounting pad 23 and the pad 25 can be formed by, for example, a plating method. As a material for the electronic component mounting pad 23 and the pad 25, for example, Cu can be used.

  As the conductive paste 28, for example, an epoxy resin containing solder or metal powder can be used.

  Next, in the process illustrated in FIG. 9, the support portion 35, the first connection portion 36 electrically connected to the pad 25 provided on the substrate 11, and the pad 17 provided on the mounting substrate 15 are electrically connected. A plurality of connection terminal main bodies 31 having the second connection portions 37 to be connected are formed (connection terminal main body forming step).

  Specifically, for example, the connecting terminal body 31 is formed by pressing a conductive plate material (not shown) and then bending the pressed plate material. As the material of the conductive plate material, for example, a copper-based alloy (for example, phosphor bronze, beryllium copper, or the like) can be used.

  Next, in the step shown in FIG. 10, while forming the electroless plating film 32 covering the surfaces of the first connection portions 36 provided on the plurality of connection terminal bodies 31 by electroless plating, A connection provided with the connection terminal body 31, the electroless plating film 32, and the electrolytic plating film 33 by forming the electrolytic plating film 33 covering the surface of the second connection portion 37 provided on the plurality of connection terminal bodies 31. A plurality of terminals 13 are formed (connection terminal forming step).

  Specifically, the electroless plating film 32 is formed, for example, by forming a plating resist film (not shown) that covers the surface of the connection terminal body 31 corresponding to the non-formation region of the electroless plating film 32. The electroless plating film 32 is formed on the surface of the first connection portion 36 exposed from the plating resist film, and then the plating resist film is removed.

  Since the electroless plating film 32 formed by such a method contains phosphorus, it is difficult to magnetize. For this reason, in the process (connection terminal transfer process) shown in FIG. 12 described later, the first connection portion 36 on which the electroless plating film 32 is formed is aligned by the magnetic force of the magnet 44 provided on the alignment jig 41. It is not sucked into the opening 46 formed in the tool body 43.

  As the electroless plating film 32, for example, an electroless Ni plating film (for example, a thickness of 3 to 5 μm) and an electroless Au plating film (for example, a thickness of 0.1 mm) are formed on the surface of the first connection portion 36. An electroless Ni / Au plating film in which 01 to 0.05 μm) are sequentially laminated can be used.

  The electroless plating film 32 may be formed on the entire surface of the connection terminal main body 31 except for the area where the electrolytic plating film 33 is formed.

  Further, the electrolytic plating film 33 is formed, for example, by forming a resist film for plating (not shown) that covers the surface of the connection terminal body 31 corresponding to the non-formation region of the electrolytic plating film 33, and then the plating resist film The electrolytic plating film 33 is formed on the surface of the second connection portion 37 exposed from the substrate, and then the plating resist film is removed. The electrolytic plating film 33 formed by such a method is easily magnetized and is attracted to the magnet.

  As the electrolytic plating film 33, for example, an electrolytic Ni plating film (for example, a thickness of 3 to 5 μm) and an electrolytic Au plating film (for example, a thickness of 0.01 to 0) are formed on the surface of the second connection portion 37. .05 μm) can be used, and an electrolytic Ni / Au plated film can be used.

  Instead of the steps shown in FIGS. 9 and 10, for example, a conductive plate material (not shown) is pressed, and then the base material of the pressed connection terminal body 31 is electroless plated. After forming the film 32 and the electroplating film 33, the base material of the connection terminal body 31 on which the electroless plating film 32 and the electroplating film 33 are formed is bent, so that the connection terminal body 31 and the electroless plating film are formed. 32 and the connection terminal 13 provided with the electrolytic plating film 33 may be formed.

  Next, in the process shown in FIG. 11, the alignment jig body 43 having a plurality of openings 46 for accommodating the connection terminals 13, and the surface 43 </ b> A of the alignment jig body 43 in which the plurality of openings 46 are formed (first A magnet 44 disposed on the surface 43B (second surface) of the alignment jig main body 43 located on the opposite side to the surface) so as to face the plurality of openings 46, and fixed to the magnet 44. An alignment jig 41 including a vibration device 45 that vibrates the alignment jig main body 43 is prepared (alignment jig preparation step).

  Next, in the process shown in FIG. 12, the vibration device 45 vibrates the alignment jig body 43 having a plurality of openings 46 for receiving the connection terminals 13 from above the alignment jig body 43 (in other words, For example, from above the surface 43A of the alignment jig main body 43, the plurality of connection terminals 13 are dropped, the connection terminals 13 are transferred to the plurality of openings 46, and then the vibration device 45 is stopped (connection terminal transfer process). .

  At this time, the magnet 44 provided in the alignment jig 41 attracts the second connection portion 37 in which the electrolytic plating film 33 is formed to the opening 46 formed in the alignment jig main body 43. The connection terminals 13 can be aligned with the opening 46 so that the opening 46 has a predetermined orientation A. Thereby, in the process shown in FIG. 13 to be described later, one connection terminal 31 can be reliably arranged for all the pads 25 provided on the substrate 11.

  Note that the predetermined direction A in the present embodiment is the direction of the connection terminal 13 that is transferred to the opening 46 shown in FIG. Specifically, the predetermined direction A means that the electrolytic plating film 33 is in contact with the bottom surface 46A of the opening 46 and a part of the electroless plating film 32 is located on the right side of the opening 46. The direction of the connection terminal 13 is such that it faces the surface 43A (see FIG. 12).

  Next, in the step shown in FIG. 13, the electroless paste of the connection terminals 13 transferred (aligned) to the conductive paste 28 and the alignment jig 41 in a state where the conductive paste 28 provided on the substrate 11 is melted. The first connection part 36 on which the plating film 32 is formed is brought into contact.

  Next, in the step shown in FIG. 14, after the conductive paste 28 is cured, the substrate 11 to which the plurality of connection terminals 13 are connected is pulled upward. As a result, one connection terminal 13 is disposed on each of the pads 25 of the substrate 11 via the conductive paste 28.

  According to the connection terminal arrangement method of the present embodiment, the electroless plating film 32 that covers the surfaces of the first connection portions 36 provided on the plurality of connection terminal bodies 31 is formed by electroless plating. By forming an electrolytic plating film 33 that covers the surfaces of the second connection portions 37 provided on the plurality of connection terminal bodies 31 by an electrolytic plating method, the connection terminal body 31, the electroless plating film 32, and the electrolytic plating A plurality of connection terminals 13 having a film 33 are formed, and then an alignment jig body 43 having a plurality of openings 46 for accommodating the connection terminals 13, and a magnet 44 disposed on a surface 43 </ b> B of the alignment jig body 43, Are prepared, and then the connection terminals 13 are swung into the plurality of openings 46, whereby the electroplating film 33 is formed by the magnet 44 provided on the alignment jig 41. Connection part 37 , Because it is sucked into the opening 46 formed in the arranging jig body 43, it is possible to align the connection terminal 13 to a predetermined direction A to all openings 46.

  Thereby, after the connection terminal transfer step, the first connection portion 36 on which the electroless plating film 32 is formed and the conductive paste 28 provided on the substrate 11 are brought into contact, and the conductive paste 28 is melted. By providing the connection terminals 13 on the plurality of pads 25 provided on the substrate 11, one connection terminal 31 can be provided on all the pads 25 provided on the substrate 11.

  In the arrangement method of the connection terminals 13 of the present embodiment (see the steps shown in FIGS. 8 to 14), all the openings 46 formed in the alignment jig main body 43 in the connection terminal transfer step shown in FIG. In the connection terminal transfer process shown in FIG. 12, the connection terminals 13 are arranged so as to be in a predetermined direction A. There are also cases where the terminals 13 are not aligned.

  Accordingly, referring to FIGS. 15 to 17, in the connection terminal transfer step shown in FIG. 12, the connection terminals 13 were not aligned in all the openings 46 so as to be in a predetermined direction with respect to the openings 46. Taking the case as an example, a method for arranging connection terminals according to a modification of the present embodiment will be described.

  15-17 is a figure which shows the arrangement | positioning process of the connection terminal which concerns on the modification of embodiment of this invention. In FIG.15 and FIG.17, the same code | symbol is attached | subjected to the same component as the structure shown in FIG. In FIG. 16, the same components as those in the structure shown in FIG.

  First, the same process as that shown in FIGS. 8 to 11 described above is performed. Next, in the process shown in FIG. 15 (first connection terminal transfer process), the same process as the process shown in FIG. 12 (connection terminal transfer process) described above is performed, so that the connection terminals are connected to the plurality of openings 46. 13 is transferred, and then the vibration device 45 is stopped. At this stage, as shown in FIG. 15, the connection terminals 13 are not aligned so as to have a predetermined orientation A with respect to all the openings 46. Specifically, the connection terminal 13 is transferred into the two openings 46 located at the center of the alignment jig main body 43 shown in FIG. 15 so as to be in a predetermined direction A, and the opening 46 at the left end in FIG. The connection terminal 13 is not transferred, and the connection terminal 13 is transferred in a direction different from the predetermined direction A in the opening 46 at the right end of FIG.

  In addition, since the electroplating film 33 that is easily magnetized is formed on the surface of the second connection portion 37, the two openings 46 located at the center of the alignment jig body 43 shown in FIG. The connection terminal 13 arranged so as to be A is attracted to the magnet 44.

  Further, the connection terminal 13 arranged in the opening 46 at the right end shown in FIG. 15 has the first connection portion 36 on which the non-magnetized electroless plating film 32 is formed facing the magnet 44. Not adsorbed.

  Next, in the process shown in FIG. 16, the alignment jig 41 into which the connection terminal 13 of the opening 46 shown in FIG. 15 is turned upside down (inverted upside down) is different from the predetermined direction A. The arranged connection terminal 13 is removed from the opening 46 (connection terminal removal step).

  Next, in the process shown in FIG. 17, the connection terminal transfer process (see FIG. 15) and the connection terminal removal process (FIG. 16) until the direction of the connection terminal 13 transferred to all the openings 46 becomes a predetermined direction A. Step).

  Thereafter, by performing the same process as the process shown in FIGS. 13 and 14 described above, one connection terminal 13 is connected to all the pads 25 of the substrate 11 via the conductive paste 28. Arranged.

  According to the arrangement method of the connection terminals according to the modification of the present embodiment, the alignment jig 41 is turned upside down when the connection terminals 13 are not aligned so as to have the predetermined orientation A in all the openings 46. (Upside down), the connection terminal removing step of removing the connection terminal 13 arranged in a direction different from the predetermined direction A from the opening 46, and the opening 46 where the connection terminal 13 is not transferred By repeatedly performing the connection terminal transfer step of transferring the connection terminals 13 so as to be oriented, the connection terminals 13 can be arranged in all the openings 46 so as to have a predetermined orientation A. The connection terminals 13 can be reliably arranged for all the pads 25 provided in the.

  The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to such specific embodiments, and within the scope of the present invention described in the claims, Various modifications and changes are possible.

  For example, in the present embodiment, the case where the alignment jig 41 in which the concave opening 46 is formed in the alignment jig main body 43 is used as an example, but the alignment jig main body 43 is used instead of the opening 46. You may use the alignment jig | tool which has the opening part which penetrates 43 (The bottom face of this opening part is obstruct | occluded with the magnet 44).

  FIG. 18 is a cross-sectional view showing another alignment jig in which other connection terminals are aligned. In FIG. 18, the same components as those in the structure shown in FIG.

  In the connection terminal disposing method according to the present embodiment and the connecting terminal disposing method according to the modification of the present embodiment, a connection having a plate-like support portion 35 on the pad 25 of the substrate 11. Although the case where the terminal 13 is provided has been described as an example, the shape of the connection terminal 13 is not limited thereto.

  For example, the connection terminal disposition method according to the present embodiment and the connection terminal disposition method according to the modification of the present embodiment are arranged with the connection terminals 51 shown in FIG. It can also be applied to the installation.

  The connection terminal 51 is configured in the same manner as the connection terminal 13 except that a connection terminal main body 52 is provided instead of the connection terminal main body 31 constituting the connection terminal 13. The connection terminal main body 52 is configured in the same manner as the connection terminal main body 31 except that the connection terminal main body 52 is V-shaped instead of the support portion 35 provided in the connection terminal main body 31, and a support portion 53 having spring properties is provided. .

  When the connection terminal 51 having the above-described configuration is disposed on the substrate 11, an alignment jig 61 shown in FIG. 18 is used. The alignment jig 61 is provided with an alignment jig main body 62 having a plurality of openings 64 corresponding to the shape of the connection terminals 51 instead of the alignment jig main body 43 provided in the alignment jig 41 described in FIG. Other than that, the configuration is the same as that of the alignment jig 41.

  The connection terminal arrangement method according to the present embodiment and the connection terminal arrangement method according to the modification of the present embodiment include, for example, a pin terminal (spring property is applied to a PGA (Pin Grid Array). It is also applicable to alignment of connection terminals that do not have.

  Further, in the connection terminal arrangement method according to the present embodiment and the connection terminal arrangement method according to the modification of the present embodiment, the connection terminals 13 and 51 are arranged on the semiconductor device 10 connected to the mounting substrate 15. In the above description, the connection terminal arranging method according to the present embodiment and the connecting terminal arranging method according to the modification of the present embodiment are electrical components (semiconductor package, wiring board). The present invention is also applicable when providing connection terminals such as an interposer and a socket for connecting the mounting substrate 15 and the semiconductor chip.

  Furthermore, the method for arranging the connection terminals according to the present embodiment and the method for arranging the connection terminals according to the modification of the present embodiment are used for electrical testing of electrical components (semiconductor packages, wiring boards, semiconductor chips, etc.). It is applicable also to arrangement | positioning of the connection terminal of the contact probe for this.

DESCRIPTION OF SYMBOLS 10 Semiconductor device 11 Board | substrate 12 Electronic component 13,51 Connection terminal 15 Mounting board 16 Bump 17, 25 Pad 21 Board | substrate body 21A, 21B, 43A, 43B surface 23 Electronic component mounting pad 23A, 25A Connection surface 24, 26 Solder resist layer 24A, 26A Opening 28 Conductive paste 31, 52 Connection terminal body 32 Electroless plating film 33 Electrolytic plating film 35, 53 Supporting part 36 First connection part 37 Second connection part 41, 61 Alignment jigs 43, 62 Alignment jig body 44 Magnet 45 Vibration device 46, 64 Opening 46A Bottom

Claims (5)

A substrate forming step of forming a substrate having a plurality of pads with connection surfaces;
A connection terminal body forming step of forming a plurality of connection terminal bodies including a first connection portion electrically connected to the pad and a second connection portion electrically connected to another substrate;
An electroless plating film that covers the first connection portions provided on the plurality of connection terminal bodies is formed by an electroless plating method, and the first portions provided on the plurality of connection terminal bodies are formed by an electrolytic plating method. A connection terminal forming step of forming a plurality of connection terminals including the connection terminal main body, the electroless plating film, and the electrolytic plating film by forming an electrolytic plating film that covers two connection portions;
An alignment jig body having a plurality of openings for accommodating one connection terminal; and an alignment jig body positioned on the opposite side of the first surface of the alignment jig body in which the openings are formed. An alignment jig preparing step of preparing an alignment jig provided with a magnet disposed on the second surface so as to face the plurality of openings;
A connection terminal transfer step of transferring the connection terminal to the plurality of openings;
After the connection terminal transfer step, the first connection part on which the electroless plating film is formed and the pad of the substrate are brought into contact with each other through a conductive paste, and the conductive paste is melted, so that a plurality of A connection terminal disposing step of disposing the connection terminal on the pad;
A board removing step of curing the conductive paste after the connecting terminal arranging step and removing the substrate on which the plurality of connecting terminals are arranged from the alignment jig. Terminal arrangement method.   In the connection terminal transfer step, the second connection part in which the electrolytic plating film is formed is sucked into the opening part of the alignment jig body by the magnetic force of the magnet, and the connection terminal is inserted into the opening part. 2. The connection terminal arranging method according to claim 1, wherein the connecting terminal is transferred. In the connection terminal transfer step, when the connection terminal is not transferred in a predetermined direction for all the openings,
Between the connection terminal transfer step and the connection terminal placement step, the alignment jig is turned upside down to remove the connection terminal that has not been transferred in the predetermined direction with respect to the opening. The method for arranging connection terminals according to claim 1, wherein the removal step and the connection terminal transfer step are repeated.   The method for arranging connection terminals according to any one of claims 1 to 3, wherein the electroless plating film contains phosphorus.   The method for arranging connection terminals according to claim 4, wherein the electroless plating film has a phosphorus concentration of 12 wt% or more.

Images