CN108396363A - A kind of electroplanting device - Google Patents
A kind of electroplanting device Download PDFInfo
- Publication number
- CN108396363A CN108396363A CN201810442874.0A CN201810442874A CN108396363A CN 108396363 A CN108396363 A CN 108396363A CN 201810442874 A CN201810442874 A CN 201810442874A CN 108396363 A CN108396363 A CN 108396363A
- Authority
- CN
- China
- Prior art keywords
- supersonic generator
- bath trough
- mechanical vibrator
- hole
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/04—Removal of gases or vapours ; Gas or pressure control
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The embodiment of the present invention provides a kind of electroplanting device, is related to electroplating technology.Wherein, which includes：Bath trough, supersonic generator and mechanical vibrator, wherein, supersonic generator and mechanical vibrator are set to the cell wall of bath trough, and supersonic generator is located at from bath trough into plate in the range of 1/2, and mechanical vibrator is located at from bath trough into plate in the range of 2/3.By the mechanical vibrator for installing the supersonic generator and low frequency of high frequency in electroplating bath, and it is shaken during printed circuit board base board is in copper facing, it can be with the bubble in the hole of shatter printed circuit board base board, promote the affinity of copper electrolyte and hole wall, the perforation for enhancing copper electrolyte device to hole, to obtain uniform coating.Further, it is also possible to improve the covering power in hole.
Description
Technical field
The invention belongs to electroplating technology more particularly to a kind of electroplanting devices.
Background technology
Electroplating technology is a kind of most common surface treatment method, and the coating that the vertical electroplating technologies of wherein VCP obtain is uniform
Property it is good, covering power is strong, and identical hole plate thickness in the case of can save phosphorous copper balls, be suitable for fine galvanizer
Skill is widely used in printed circuit board copper-plating technique.
But the hole wall coating roughness that printed circuit board is obtained through VCP electroplating technologies is uneven so that printed circuit board
Quality level it is relatively low.
Invention content
The present invention provides a kind of electroplanting device, it is intended to which the hole wall coating roughness for solving printed circuit board is uneven so that
The low problem of the quality level of printed circuit board.
A kind of electroplanting device provided by the invention, described device include：Bath trough, supersonic generator and mechanical oscillation
Device；Wherein,
The supersonic generator and the mechanical vibrator are set to the cell wall of the bath trough；
The supersonic generator is located at from the bath trough into plate to intermediate range；
The mechanical vibrator is located at from the bath trough into plate in the range of 2/3.
A kind of electroplanting device provided by the invention, the machine of supersonic generator and low frequency by installing high frequency in electroplating bath
Tool vibrator, and shaken during printed circuit board base board is in copper facing, it can be in the hole of shatter printed circuit board base board
Bubble, promote copper electrolyte and hole wall affinity, the perforation of copper electrolyte device to hole is enhanced, to obtain uniform coating.This
Outside, the covering power in hole can also be improved.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention.
Fig. 1 is a kind of structural schematic diagram of electroplanting device provided in an embodiment of the present invention；
Fig. 2 is a kind of side view of electroplanting device provided in an embodiment of the present invention；
Fig. 3 is the front view of mechanical vibrator in a kind of electroplanting device provided in an embodiment of the present invention；
Fig. 4 is the side view of mechanical vibrator in a kind of electroplanting device provided in an embodiment of the present invention.
Specific implementation mode
In order to make the invention's purpose, features and advantages of the invention more obvious and easy to understand, below in conjunction with the present invention
Attached drawing in embodiment, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described reality
It is only a part of the embodiment of the present invention to apply example, and not all embodiments.Based on the embodiments of the present invention, people in the art
The every other embodiment that member is obtained without making creative work, shall fall within the protection scope of the present invention.
Referring to Fig. 1, Fig. 1 is the structural schematic diagram for the electroplanting device that first embodiment of the invention provides, it as described in Figure, should
Device includes：Bath trough 101, supersonic generator 102 and mechanical vibrator 103；Wherein,
Supersonic generator 102 and mechanical vibrator 103 are set to the cell wall of bath trough 101；
Supersonic generator 102 is located at from bath trough 101 into plate in the range of 1/2；
Mechanical vibrator 103 is located at from bath trough 101 into plate in the range of 2/3.
Specifically, it is contained with plating solution, such as copper plating bath in bath trough 101, has and enters bath trough into plate direction shown in Fig. 1
In 101.As shown in Fig. 2, Fig. 2 shows supersonic generators 102 to be arranged at the cell wall of bath trough 101, when ultrasonic wave occurs
After device 102 sends out ultrasonic wave, the printed circuit board base board immersed in the plating solution is shaken in electroplating process by ultrasonic wave, can
With in the hole of shatter substrate bubble or be allowed to be discharged out of hole, to make plating solution not stay the infiltration at dead angle to each in hole
Place ultimately forms fine and close coating.
Preferably, supersonic generator 102 is located at the centre of bath trough 101.
Specifically, the vibration frequency of supersonic generator 102 be 20~8000HZ, it is preferable that vibration frequency be 200~
8000HZ.Its power is not construed as limiting, and can be adjusted in the range of 0~3.5KW.It should be noted that supersonic generator 102
Model is not construed as limiting, as long as the ultrasonic wave of frequencies above can be generated.
Further, referring to Fig. 3, Fig. 3 is the structural schematic diagram of mechanical vibrator 103, wherein mechanical vibrator 103
Including：Vibration machine 113, conductive bar 123, vibrating reed 133, damping spring 143 and fixed substrate 153；
Vibration machine 113 is fixed with conductive bar 123.
Vibrating reed 133 is multiple, is distributed in all directions of conductive bar 123.
Damping spring 143 is fixed on the both ends of conductive bar 123.
Cell wall of the fixed substrate 153 respectively with damping spring 143 and bath trough 101 is fixed.
Specifically, it is at 2/3 length originated that mechanical vibrator 113, which is located at from bath trough 103 into plate,.Vibration hair
The vibration frequency of raw device 113 is 0~8000HZ, it is preferable that vibration frequency is 20~800HZ.Utilize the mechanical vibration wave of low frequency
Plating solution can be made to generate vibration, promote the circulation of plating solution, so that plating solution is infiltrated the coarse position of hole wall, while aspect ratio is high
Hole have better perforation, and then obtain smooth, fine and close coating.
A kind of electroplanting device provided by the invention, the machine of supersonic generator and low frequency by installing high frequency in electroplating bath
Tool vibrator, and shaken during printed circuit board base board is in copper facing, it can be in the hole of shatter printed circuit board base board
Bubble, promote copper electrolyte and hole wall affinity, the perforation of copper electrolyte device to hole is enhanced, to obtain uniform coating.This
Outside, the covering power in hole can also be improved.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement etc., should all be included in the protection scope of the present invention made by within refreshing and principle.
Claims (6)
1. a kind of electroplanting device, which is characterized in that described device includes：Bath trough, supersonic generator and mechanical vibrator；Its
In,
The supersonic generator and the mechanical vibrator are set to the cell wall of the bath trough；
The supersonic generator is located at from the bath trough into plate in the range of 1/2；
The mechanical vibrator is located at from the bath trough into plate in the range of 2/3.
2. the apparatus according to claim 1, which is characterized in that the mechanical vibrator includes：Vibration machine, conduction
Bar, vibrating reed, damping spring and fixed substrate；
The vibration machine is fixed with conductive bar；
The vibrating reed is multiple, is distributed in all directions of the conductive bar；
The damping spring is fixed on the both ends of the conductive bar；
Cell wall of the fixed substrate respectively with the damping spring and the bath trough is fixed.
3. the apparatus of claim 2, which is characterized in that the vibration frequency of the vibration machine is 0~8000HZ.
4. the apparatus according to claim 1, which is characterized in that the vibration frequency of the supersonic generator be 20~
8000HZ。
5. the apparatus according to claim 1, which is characterized in that the supersonic generator is located in the bath trough
Between.
6. the apparatus according to claim 1, which is characterized in that the mechanical vibrator is located at from the bath trough into plate
At 2/3 length of the place for starting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810442874.0A CN108396363A (en) | 2018-05-10 | 2018-05-10 | A kind of electroplanting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810442874.0A CN108396363A (en) | 2018-05-10 | 2018-05-10 | A kind of electroplanting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108396363A true CN108396363A (en) | 2018-08-14 |
Family
ID=63101910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810442874.0A Pending CN108396363A (en) | 2018-05-10 | 2018-05-10 | A kind of electroplanting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108396363A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11189880A (en) * | 1997-10-21 | 1999-07-13 | Nippon Techno Kk | Plating method |
| CN1321612A (en) * | 2000-05-02 | 2001-11-14 | 日本科技股份有限公司 | Vibration stirring device for sterilizing, sterilizing device and method |
| CN201261805Y (en) * | 2008-08-14 | 2009-06-24 | 惠州中京电子科技有限公司 | Copper precipitation unit of printed circuit board |
| CN201753368U (en) * | 2010-06-07 | 2011-03-02 | 深圳市华大电路科技有限公司 | Micro-via electroplating device for multilayer rigid-flex printed circuit boards |
| CN102409377A (en) * | 2011-11-23 | 2012-04-11 | 江苏大学 | Method and device for manufacturing copper/aluminum compound conductive bar by plating |
| CN202610367U (en) * | 2012-05-09 | 2012-12-19 | 博罗县精汇电子科技有限公司 | Ultrasonic vibration electroplating device |
| CN105040075A (en) * | 2015-07-07 | 2015-11-11 | 苏州华日金菱机械有限公司 | Electroplating equipment |
-
2018
- 2018-05-10 CN CN201810442874.0A patent/CN108396363A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11189880A (en) * | 1997-10-21 | 1999-07-13 | Nippon Techno Kk | Plating method |
| TW415977B (en) * | 1997-10-21 | 2000-12-21 | Nippon Techno Kk | Plating method |
| CN1321612A (en) * | 2000-05-02 | 2001-11-14 | 日本科技股份有限公司 | Vibration stirring device for sterilizing, sterilizing device and method |
| CN201261805Y (en) * | 2008-08-14 | 2009-06-24 | 惠州中京电子科技有限公司 | Copper precipitation unit of printed circuit board |
| CN201753368U (en) * | 2010-06-07 | 2011-03-02 | 深圳市华大电路科技有限公司 | Micro-via electroplating device for multilayer rigid-flex printed circuit boards |
| CN102409377A (en) * | 2011-11-23 | 2012-04-11 | 江苏大学 | Method and device for manufacturing copper/aluminum compound conductive bar by plating |
| CN202610367U (en) * | 2012-05-09 | 2012-12-19 | 博罗县精汇电子科技有限公司 | Ultrasonic vibration electroplating device |
| CN105040075A (en) * | 2015-07-07 | 2015-11-11 | 苏州华日金菱机械有限公司 | Electroplating equipment |
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