JPH0241873Y2 - - Google Patents
Info
- Publication number
- JPH0241873Y2 JPH0241873Y2 JP1985142941U JP14294185U JPH0241873Y2 JP H0241873 Y2 JPH0241873 Y2 JP H0241873Y2 JP 1985142941 U JP1985142941 U JP 1985142941U JP 14294185 U JP14294185 U JP 14294185U JP H0241873 Y2 JPH0241873 Y2 JP H0241873Y2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- printed circuit
- circuit board
- flow
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 86
- 238000009713 electroplating Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229910021645 metal ion Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000005587 bubbling Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003411 electrode reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Description
【考案の詳細な説明】
〔考案の利用分野〕
本考案はプリント基板のメツキ装置に係り、特
に、多数のスルーホールを有するプリント基板に
適用するのに好適なプリント基板のメツキ装置に
関する。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a printed circuit board plating device, and particularly to a printed circuit board plating device suitable for application to a printed circuit board having a large number of through holes.
電子機器等に用いられるプリント基板は、両面
又は多層にプリント基板を設けた場合、両面又は
多層間の回路はスルーホールを用いて接続される
のが、このスルーホール内のメツキは、電子回路
の誤動作や不動作を防止するためには確実且つ十
分に行なわれていることが要求される。特に、ス
ルーホールのメツキ不良は外部から識別すること
が難しく、部品等を装着した後ではチエツクの方
法が無いため、充分なメツキを事前に施すことは
極めて重要である。
When printed circuit boards used in electronic devices are provided on both sides or in multiple layers, the circuits between both sides or between the layers are connected using through holes, but the plating in these through holes is In order to prevent malfunctions and non-operations, it is required that these operations be carried out reliably and sufficiently. In particular, it is difficult to identify poor plating of through holes from the outside, and there is no way to check them after parts have been installed, so it is extremely important to perform sufficient plating in advance.
近年、プリント基板に対する需要が広範囲にな
り、且つ経済性、信頼性に優れた高密度で高精度
のプリント基板が要求されている。例えば、高密
度化に対しては、アスペクト比（プリント基板の
厚さ／スルーホール径）が従来の１〜２に対し、
５或いは10程度の高アスペクト比を有する基板が
要求されている。このように極めて小径のスルー
ホール内部をメツキする方法としては、無電解に
よる化学メツキがある。かかる、化学メツキで
は、数10μｍのメツキ厚を得るためには長時間を
要することから、最初にスルーホール内部の絶縁
部に無電解メツキによつて約0.5μｍの厚さにし、
その後に電気メツキで約35μｍの厚さにする処理
が施されている。しかし、スルーホールの径が極
めて小さいため、メツキ液の供給が不十分とな
り、メツキ厚が不均一になるという問題がある。 In recent years, demand for printed circuit boards has become widespread, and high-density, high-precision printed circuit boards that are economical and reliable are required. For example, for higher density, the aspect ratio (printed circuit board thickness/through hole diameter) is 1 to 2, whereas
A substrate with a high aspect ratio of about 5 or 10 is required. Electroless chemical plating is a method for plating the inside of such extremely small diameter through holes. In such chemical plating, it takes a long time to obtain a plating thickness of several tens of μm, so first, the insulating part inside the through hole is electroless plated to a thickness of about 0.5 μm.
After that, it is electroplated to a thickness of approximately 35 μm. However, since the diameter of the through-hole is extremely small, there is a problem in that the plating liquid is insufficiently supplied and the plating thickness becomes uneven.
また、電気メツキを高速化し、量産性を高める
ためには、電流密度を大きくすることによつて達
成されるが、メツキ反応（電極反応）においては
限界電流密度があるため、この値以上に大きくす
ることができない。この限界電流密度は電解条件
によつて変わることから、最適電解条件を選定
し、限界電流密度を大きくしてやることにより、
高速化を図ることができる。電気メツキ反応にお
ける限界電流密度idは、金属イオンの拡散に基づ
く濃度分布によつて決り、次式で表わされる。 In addition, speeding up electroplating and increasing mass productivity can be achieved by increasing the current density, but since there is a limiting current density in the plating reaction (electrode reaction), it is necessary to increase the current density beyond this value. Can not do it. Since this critical current density changes depending on the electrolytic conditions, by selecting the optimal electrolytic conditions and increasing the critical current density,
It is possible to increase the speed. The critical current density id in the electroplating reaction is determined by the concentration distribution based on the diffusion of metal ions, and is expressed by the following equation.
id＝nFDＣ／δ
但し、
ｎ：金属イオンの荷電数（equiv／mol）
Ｆ：フアラデー定数（Coul／equiv）
Ｄ：金属イオンの拡散係数（cm2／sec）
Ｃ：バルクの金属イオン濃度（mol／cm3）
δ：拡散層の厚さ（cm）
前記の式より明らかなように、限界電流密度id
を大きくするためには、Ｃを大きくするか、もし
くはδを小さくすることによつて実現できる。Ｃ
はメツキ液中の金属イオンが上限に設定されてい
るので、変えることはできず、δのみを小さくす
ることが可能である。このδはメツキ液を撹拌す
ることによつて実現できる。 id=nFDC/δ However, n: Number of charges of metal ion (equiv/mol) F: Faraday constant (Coul/equiv) D: Diffusion coefficient of metal ion (cm 2 /sec) C: Bulk metal ion concentration (mol) /cm 3 ) δ: Thickness of the diffusion layer (cm) As is clear from the above formula, the critical current density id
This can be achieved by increasing C or decreasing δ. C
Since the metal ion in the plating solution is set as the upper limit, it cannot be changed, and only δ can be reduced. This δ can be achieved by stirring the plating solution.
この問題及び前記メツキ厚の不均一の問題を解
決するため、従来、バブリング装置を設けたプリ
ント基板のメツキ装置が用いられる。第５図は従
来のメツキ装置で、図に示すようにメツキ電解槽
１０には調整した酸性硫酸銅液（CuSO475ｇ／
、H2SO4を190ｇ／、その他の添加剤）等に
よるメツキ液１２が満され、電解槽１０の中央に
プリント基板１４がメツキ液１２に浸され、クラ
ンプ治具１６によつて係止される。又、基板１４
はクランプ治具１６を介して電源１８の陰極に接
続される。一方、槽１０内の両側面の付近にチタ
ンバスケツトで形成され銅ボールが挿入される陽
極板２０が設けられ、電源１８に接続される。こ
れにより、電流が陽極板２０からプリント基板１
４に流れ、プリント基板１４が電気メツキされ
る。又、この時に槽１０の底面に設けたバブリン
グ撹拌装置２２によつてメツキ液は撹拌される。 In order to solve this problem and the problem of uneven plating thickness, a printed circuit board plating device equipped with a bubbling device has conventionally been used. Figure 5 shows a conventional plating device, and as shown in the figure, the plating electrolytic cell 10 contains a prepared acidic copper sulfate solution (CuSO 4 75g/
, 190 g of H 2 SO 4 / other additives), etc., and a printed circuit board 14 is immersed in the plating solution 12 in the center of the electrolytic cell 10 and secured by a clamp jig 16 . Ru. Also, the substrate 14
is connected to the cathode of a power source 18 via a clamp jig 16. On the other hand, an anode plate 20 formed of a titanium basket into which a copper ball is inserted is provided near both sides of the tank 10 and is connected to a power source 18. This causes the current to flow from the anode plate 20 to the printed circuit board 1.
4, the printed circuit board 14 is electroplated. Further, at this time, the plating liquid is stirred by a bubbling stirring device 22 provided at the bottom of the tank 10.
又、プリント基板１４は、第６図に示すよう
に、エポキシ樹脂等を用いた絶縁板２４（内部に
銅箔２６が多層に形成されている）にスルーホー
ル２８が形成され、その外表面及びスルーホール
２８内には化学銅メツキ層３０が施され、更に、
該メツキ層３０の表面に電気銅メツキ層３２が施
される。 Further, as shown in FIG. 6, the printed circuit board 14 has a through hole 28 formed in an insulating plate 24 (inside of which copper foil 26 is formed in multiple layers) using an epoxy resin or the like. A chemical copper plating layer 30 is applied inside the through hole 28, and further,
An electrolytic copper plating layer 32 is applied to the surface of the plating layer 30.
しかしながら、前記装置による場合には、スル
ーホール２８内のメツキ厚は、化学銅メツキ層３
０が一定であるのに対し、電気銅メツキ層３２
は、メツキ液の移動が無いためにスルーホール２
８のエツジ部にメツキが集中し、厚みが不均一に
なる。又、プリント基板に垂直あるいは斜め方向
から高速水流を噴射したり、プリント基板に機械
的振動を加え、槽内でプリント基板を揺動させた
り、槽内で超音波振動を発生させ、プリント基板
の表面の液を振動させたりしても不具合は解消さ
れない。 However, in the case of the above device, the plating thickness in the through hole 28 is the same as that of the chemical copper plating layer 3.
0 is constant, while the electrolytic copper plating layer 32
is through hole 2 because there is no movement of the plating liquid.
The plating concentrates on the edge part 8, making the thickness uneven. In addition, high-speed water jets are jetted vertically or diagonally onto the printed circuit board, mechanical vibrations are applied to the printed circuit board to make it swing in the tank, and ultrasonic vibrations are generated in the tank to cause the printed circuit board to move. Even if you vibrate the liquid on the surface, the problem will not be resolved.
本考案は、このような事情に鑑みてなされたも
ので、スルーホール内のメツキを均一に且つ高速
に行なうことのできるプリント基板のメツキ装置
を提案することを目的としている。
The present invention has been developed in view of the above circumstances, and an object of the present invention is to propose a printed circuit board plating device that can perform plating in through holes uniformly and at high speed.
本考案は前記目的を達成する為に、メツキ槽の
メツキ液中に下層メツキ層の施されたスルーホー
ルを有するプリント基板を浸し、槽内に配設され
た電極と前記プリント基板のメツキ層間に直流電
圧を印加して電気メツキを施すプリント基板のメ
ツキ装置において、前記メツキ槽内にメツキ液流
を生じさせる複数の回転部材をプリント基板の両
側に対向して２列に配列し、列方向に沿つて隣接
する回転部材同士が相互に反対方向に回転される
と共にプリント基板を挾んで対向する回転部材同
士が同方向に回転され、プリント基板若しくは対
向する回転部材列を列方向に移動させることを特
徴とする。
In order to achieve the above object, the present invention immerses a printed circuit board having through-holes with a lower plating layer in the plating liquid of a plating tank, and connects an electrode disposed in the tank and the plating layer of the printed circuit board. In a printed circuit board plating device that performs electroplating by applying a DC voltage, a plurality of rotating members that generate a plating liquid flow in the plating tank are arranged in two rows facing each other on both sides of the printed circuit board, and the rotating members are arranged in two rows facing each other on both sides of the printed circuit board. Rotating members adjacent to each other along the line are rotated in opposite directions, and rotating members facing each other with the printed circuit board in between are rotated in the same direction, thereby moving the printed circuit board or the row of opposing rotating members in the row direction. Features.
以下、添付図面に従つて本考案に係るプリント
基板のメツキ装置の好ましい実施例を詳説する。
Hereinafter, preferred embodiments of the printed circuit board plating apparatus according to the present invention will be described in detail with reference to the accompanying drawings.
第１図は本考案に係るプリント基板のメツキ装
置の説明図である。第１図で示す実施例は第５図
で示すメツキ装置の同一部材若しくは類似の部材
には同一の符号を付し、その詳しい説明は省略す
る。第１図及び第２図に示すように、プリント基
板１４を挟んで両側には第３図で示す回転羽根３
８が設けられ、第２図に示すように回転羽根３８
は複数横列に配列され、これ等の横列回転羽根３
８によつて回転撹拌機４０が構成される。各回転
羽根３８の上部にはギヤ４２が設けられ、隣接す
る回転羽根３８のギヤ４２同士は噛み合わせられ
る。又、横列された回転羽根３８の終端のギヤ４
２は図示しない回転駆動源に連結され、この駆動
源により各回転羽根３８が回転させられる。 FIG. 1 is an explanatory diagram of a printed circuit board plating device according to the present invention. In the embodiment shown in FIG. 1, the same or similar members of the plating device shown in FIG. 5 are given the same reference numerals, and detailed explanation thereof will be omitted. As shown in FIGS. 1 and 2, rotating blades 3 shown in FIG. 3 are located on both sides of the printed circuit board 14.
8 is provided, and as shown in FIG.
are arranged in multiple rows, and these row rotating blades 3
8 constitutes a rotary agitator 40. A gear 42 is provided above each rotating blade 38, and the gears 42 of adjacent rotating blades 38 are meshed with each other. Also, the gear 4 at the end of the row of rotating blades 38
2 is connected to a rotational drive source (not shown), and each rotating blade 38 is rotated by this drive source.
回転羽根３８は第３図に示すように回転軸３６
と複数枚の羽根３７とから構成され、メツキ槽１
２内で回転羽根３８が回転されるとメツキ液流が
発生する。横列された隣接回転羽根３８同士はギ
ヤ４２が噛み合つており、相互に反対方向に回転
され、回転羽根３８の離間部４４には交互にメツ
キ液１２の吹出し流と吸い込み流とが生じる。例
えば、回転羽根３８Ａと３８Ｂとの離間部４４Ａ
にはプリント基板１４に向けて吹出し流が生じ、
回転羽根３８Ｂと３８Ｃとの離間部４４Ｂには、
プリント基板１４方向からの吸込み流が生じる。
又、プリント基板１４を挟んで対向する反対側の
回転羽根３８同士は第２図に示すように同方向に
回転され、基板１４を挟んで対向する離間部同士
には吹出し流と吸い込みは流とが常に対向して発
生する。これにより、第２図に示すように矢印Ａ
の方向と矢印Ｂの方向のメツキ液流が交互にメツ
キ槽１０で発生し、メツキ液１２は対向する２列
の回転羽根３８…の間のプリント基板１４のスル
ーホール２８内を貫流する。 The rotating blade 38 is connected to the rotating shaft 36 as shown in FIG.
and a plurality of blades 37, the plating tank 1
When the rotary blade 38 is rotated within the plating liquid flow, a plating liquid flow is generated. The adjacent rotary blades 38 arranged horizontally are engaged with each other by gears 42, and are rotated in opposite directions, so that a blowout flow and a suction flow of the plating liquid 12 are alternately generated in the spaced apart portions 44 of the rotary blades 38. For example, a separating part 44A between rotating blades 38A and 38B
A blowout flow is generated toward the printed circuit board 14,
In the separating part 44B between the rotating blades 38B and 38C,
A suction flow is generated from the printed circuit board 14 direction.
Further, the rotating blades 38 on opposite sides facing each other with the printed circuit board 14 in between are rotated in the same direction as shown in FIG. always occur opposite each other. As a result, as shown in FIG.
Plating liquid flows in the direction of and in the direction of arrow B are generated alternately in the plating tank 10, and the plating liquid 12 flows through the through holes 28 of the printed circuit board 14 between the two opposing rows of rotating blades 38.
メツキ槽１０の左側には移動装置４８が設けら
れ、移動装置４８は支持材５０を介してプリント
基板１４を挟持しているクランプ１６に接続され
ている。プリント基板１４は移動装置４８によつ
て基板１４の長手方向に沿つて、即ち、矢印Ａ及
び矢印Ｂのメツキ液流の方向に対して垂直方向に
周期的に往復移動される。この往復移動によつて
プリント基板１４のスルーホール２８は周期的に
槽１０内の矢印Ａの方向のメツキ液流の流域と矢
印Ｂの方向のメツキ液流に流域とを交互に往復移
動し、メツキ槽１０のメツキ液１２はスルーホー
ル２８内で液流が周期的に反転通流される。 A moving device 48 is provided on the left side of the plating tank 10, and the moving device 48 is connected via a support member 50 to the clamp 16 that clamps the printed circuit board 14. The printed circuit board 14 is periodically reciprocated by a moving device 48 along the longitudinal direction of the substrate 14, that is, in a direction perpendicular to the direction of plating liquid flow indicated by arrows A and B. By this reciprocating movement, the through hole 28 of the printed circuit board 14 periodically reciprocates between the plating liquid flow area in the direction of arrow A and the plating liquid flow area in the direction of arrow B in the tank 10. The plating liquid 12 in the plating tank 10 is periodically reversed in flow through the through hole 28 .
尚、メツキ槽１０内の所定の位置には複数のチ
タンバスケツト２０が設けられ、バスケツト２０
は電源１８の陽極に接続される。クランプ治具１
６には電源１８の陰極が接続されており、プリン
ト基板１４は電気メツキされる。 Incidentally, a plurality of titanium baskets 20 are provided at predetermined positions within the plating tank 10.
is connected to the anode of power supply 18. Clamp jig 1
6 is connected to the cathode of a power source 18, and the printed circuit board 14 is electroplated.
前記の如く構成された本考案に係る実施例に於
いて、並設される回転撹拌機４０によつてメツキ
槽１０内には矢印Ａ及び矢印Ｂの方向のメツキ液
流が発生し、メツキ液流はスルーホール２８内を
貫流する。プリント基板１４は移動装置４８によ
つて往復移動され、基板１４のスルーホール２８
は槽１０内の矢印Ａの方向のメツキ液流の流域と
を周期的に往復することになり、メツキ液１２は
第４図に示すようにスルーホール２８内を周期的
に反転されて往復流通される。このようなメキ液
１２の周期的往復流れは、スルーホール２８内の
拡散層δを減少させ、電気メツキを均一、且つ高
速に行うことができる。 In the embodiment of the present invention configured as described above, plating liquid flows in the directions of arrows A and B are generated in the plating tank 10 by the rotary agitators 40 installed in parallel, and the plating liquid flows in the directions of arrows A and B. The flow passes through the through hole 28. The printed circuit board 14 is reciprocated by a moving device 48, and the through hole 28 of the circuit board 14 is moved back and forth by a moving device 48.
The plating liquid 12 periodically reciprocates with the flow area of the plating liquid in the direction of arrow A in the tank 10, and the plating liquid 12 is periodically reversed and circulates in the through hole 28 as shown in FIG. be done. Such periodic reciprocating flow of the plating liquid 12 reduces the diffusion layer δ in the through hole 28, allowing electroplating to be performed uniformly and at high speed.
例えばアスペクト比２のプリント基板１４を用
いスルーホール２８内のメツキ液流速を0.25m／
sec、通流方向反転周期を15sec、電流密度10A／
ｄm2、メツキ時間を20分として電気メツキを行な
うと、約35μｍ厚の均一の電気メツキ層がスルー
ホール内２８に形成され、従来の装置に比べて３
倍以上の高速化が図れる。 For example, using a printed circuit board 14 with an aspect ratio of 2, the plating liquid flow rate in the through hole 28 is set to 0.25 m/
sec, flow direction reversal period 15 sec, current density 10 A/
When electroplating is performed with a plating time of 20 minutes and a plating time of 20 minutes, a uniform electroplated layer with a thickness of about 35 μm is formed in the through hole 28, which is 3 times faster than with conventional equipment.
The speed can be more than doubled.
前記実施例に於いて、プリント基板１４をメツ
キ槽内で周期的に移動させたが、複数の回転羽根
の全体を横列方向に沿つて周期的に移動させても
よい。 In the embodiment described above, the printed circuit board 14 was moved periodically within the plating tank, but the entire plurality of rotating blades may be moved periodically along the row direction.
以上においては、プリント基板のスルーホール
にメツキする場合を例に説明したが、スルーホー
ル以外の物、例えば、金属板、プラスチツク板等
に対するメツキにも適用可能である。 In the above description, the case of plating through-holes in a printed circuit board has been described as an example, but the present invention can also be applied to plating objects other than through-holes, such as metal plates, plastic plates, etc.
以上説明したように本考案に係るプリント基板
のメツキ装置によれば、プリント基板のスルーホ
ール内にメツキ液を強制的に流通させ、メツキ液
のホール内での流れを周囲的に反転させたので、
プリント基板のスルーホール内に均一な厚みのメ
ツキを施すことができる。
As explained above, according to the printed circuit board plating device according to the present invention, the plating liquid is forced to flow into the through-holes of the printed circuit board, and the flow of the plating liquid in the holes is reversed circumferentially. ,
It is possible to apply plating to a uniform thickness inside the through holes of a printed circuit board.
第１図及び第２図は本考案に係るメツキ装置の
説明図、第３図は回転羽根の斜視図、第４図は第
１図の実施例によるメツキ処理の説明図、第５図
は従来のメツキ装置の説明図、第６図は第５図の
従来例によるメツキ処理の説明図である。
１０……メツキ槽、１２……メツキ液、１４…
…プリント基板、１８……電圧装置、２０……陽
極板、２８……スルーホール、３８……回転羽
根、４０……回転撹拌機、４８……移動装置。
1 and 2 are explanatory diagrams of the plating device according to the present invention, FIG. 3 is a perspective view of the rotating blade, FIG. 4 is an explanatory diagram of the plating process according to the embodiment of FIG. 1, and FIG. 5 is the conventional FIG. 6 is an explanatory diagram of the plating process according to the conventional example of FIG. 5. 10... plating tank, 12... plating liquid, 14...
... Printed circuit board, 18 ... Voltage device, 20 ... Anode plate, 28 ... Through hole, 38 ... Rotating blade, 40 ... Rotating stirrer, 48 ... Moving device.
Claims (1)
たスルーホールを有するプリント基板を浸し、槽
内に配設された電極と前記プリント基板のメツキ
層間に直流電圧を印加して電気メツキを施すプリ
ント基板のメツキ装置において、 前記メツキ槽内で前記プリント基板をスルーホ
ールの方向と直交する方向に移動する駆動装置を
設け、 前記プリント基板の移動方向に沿つてメツキ流
の吹出し流発生部と吸い込み流発生部とを交互に
複数個配置し、 前記プリント基板を駆動装置により移動するこ
とにより、メツキ流の吹出し発生部と吸い込み流
発生部とからのメツキ流の吹出し流と吸込み流と
をプリント基板のスルーホール内に交互に流すこ
とを特徴とするプリント基板のメツキ装置。[Claim for Utility Model Registration] A printed circuit board having through-holes with a lower plating layer is immersed in a plating solution in a plating tank, and a DC voltage is applied between the electrodes disposed in the tank and the plating layer of the printed circuit board. A plating device for a printed circuit board that performs electroplating by applying an electric current, further comprising a drive device that moves the printed circuit board in a direction perpendicular to the direction of the through hole in the plating tank, and the plating flow is applied along the moving direction of the printed circuit board. By alternately arranging a plurality of blowout flow generation parts and suction flow generation parts, and moving the printed circuit board by a drive device, the blowout flow of the plating flow from the blowout generation part of the plating flow and the suction flow generation part is generated. A printed circuit board plating device characterized by flowing a suction flow and a suction flow alternately into a through hole of a printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985142941U JPH0241873Y2 (en) | 1985-09-19 | 1985-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985142941U JPH0241873Y2 (en) | 1985-09-19 | 1985-09-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62118479U JPS62118479U (en) | 1987-07-28 |
| JPH0241873Y2 true JPH0241873Y2 (en) | 1990-11-08 |
Family
ID=31052153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985142941U Expired JPH0241873Y2 (en) | 1985-09-19 | 1985-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0241873Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102007026635B4 (en) * | 2007-06-06 | 2010-07-29 | Atotech Deutschland Gmbh | Apparatus for wet-chemical treatment of goods, use of a flow organ, method for installing a flow organ in the device and method for producing a wet-chemical treated goods |
| JPWO2021210150A1 (en) * | 2020-04-17 | 2021-10-21 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5079439A (en) * | 1973-11-16 | 1975-06-27 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59117678U (en) * | 1983-01-31 | 1984-08-08 | 松下電工株式会社 | Composite plating device |
-
1985
- 1985-09-19 JP JP1985142941U patent/JPH0241873Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5079439A (en) * | 1973-11-16 | 1975-06-27 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62118479U (en) | 1987-07-28 |
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