JP2006257453A - Immersion processing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an immersion processing device where the variation in the flow velocity of a liquid flow in the surface of the object to be treated is eliminated, and further, the liquid flow in the surface of the object to be treated can be controlled to the desired flow velocity. <P>SOLUTION: The immersion processing device comprises: a plating tank 22 filled with a plating liquid, and to which the material to be plated 10 is dipped; each anode chamber 40 arranged at the side direction of the material to be plated 10, having a cation exchange membrane 42 and filled with an electrolytic solution; each insoluble anode 48 provided at the inside of the anode chamber 40 so as to be separated from the plating liquid and opposed to the material to be plated 10 via the cation exchange membrane 42; and a blowout unit 52 of forming a flow of the plating liquid flowing from the lower part toward the upper part in the plating tank 22 between the material to be plated 10 and each anode chamber 40. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an immersion processing apparatus that performs an immersion process such as a chemical process, a plating process, and a cleaning process on an object to be processed such as a printed circuit board, a band-shaped film, and a band-shaped metal stay.

In the immersion treatment in which the object to be treated is immersed in the treatment liquid and a predetermined treatment such as chemical treatment, plating treatment, or cleaning treatment is performed on the object to be treated, a liquid flow is generally applied to the surface of the object to be treated. Processing is being performed. As a method of generating a liquid flow on the surface of the object to be treated, a method of flowing the treatment liquid by air stirring, pump stirring, propeller stirring, jet flow from a pipe, or the like, a workpiece immersed in the liquid was immersed as it is. A method of moving in a state is used.
JP 2003-147582 A Japanese Patent No. 2510422 Japanese Patent Publication No. 6-73393

  In the above-described method for generating a liquid flow on the surface of the workpiece, a power source for generating the liquid flow is used. However, in the conventional method, the direction in which the flowing liquid returns is not controlled. For this reason, in the position away from the power source of the surface of a to-be-processed object, the backflow of a liquid will generate | occur | produce. As a result, the flow velocity of the liquid flow on the surface of the object to be processed varies depending on the position and is not constant. When variations occur in the flow velocity of the liquid flow on the surface of the object to be processed, problems such as non-uniform processing performed on the surface of the object to be processed occur.

  An object of the present invention is to provide an immersion treatment apparatus capable of eliminating variations in the flow velocity of the liquid flow on the surface of the workpiece and controlling the liquid flow on the surface of the workpiece to a desired flow velocity. It is in.

  The object includes a treatment tank filled with a liquid, and an object disposed in the liquid in the treatment tank at a distance from a surface of an object to be immersed in the liquid in the treatment tank, A power source that generates a liquid flow in the liquid in the processing tank, and a rectification that rectifies the liquid flow generated by the power source into a liquid flow that circulates around the object and flows along the surface of the object to be processed. And a means for treating the surface of the workpiece with a liquid flow flowing along the surface of the workpiece.

  In the above immersion treatment apparatus, the liquid flow circulating around the object is directed from the lower side to the upper side of the processing tank or from the upper side to the lower side of the processing tank along the surface of the object to be processed. You may make it flow in a direction.

  Further, in the above immersion treatment apparatus, the power source may cause a liquid flow that flows along the surface of the treatment object by alternately reversing the circulation direction of the liquid flow that circulates around the object in time. You may make it flow alternately with time in the direction which goes to the upper direction from the downward direction of the said processing tank, and the upper direction of the said processing tank.

  In the above immersion treatment apparatus, the object to be treated may be a strip.

  In the immersion treatment apparatus, the object to be processed may be a printed circuit board.

  In the above immersion treatment apparatus, the object may be an anode for electroplating.

  In the immersion treatment apparatus, the rectifying unit may include a part of the tank wall of the treatment tank.

  According to the present invention, in the immersion treatment in which the object to be treated is immersed in the liquid in the treatment tank and a predetermined treatment is performed on the object to be treated, the liquid in the treatment tank is spaced from the surface of the object to be treated. The liquid is generated in the liquid in the treatment tank by the power source, and the liquid flow generated by the power source is circulated around the object by the rectifying means along the surface of the object to be processed. Since the flow is rectified into the flowing liquid flow, variations in the flow velocity of the liquid flow on the surface of the workpiece can be eliminated. Furthermore, according to the present invention, by controlling the power source, the liquid flow on the surface of the object to be processed can be controlled at a desired flow rate.

[One Embodiment]
An immersion treatment apparatus according to an embodiment of the present invention will be described with reference to FIGS. 1 is a plan view showing the overall configuration of the immersion treatment apparatus according to the present embodiment, FIG. 2 is a plan view showing the structure of a plating tank in the immersion treatment apparatus according to the present embodiment, and FIG. 3 is a plating in the immersion treatment apparatus according to the present embodiment. Sectional drawing which shows the structure of a tank, FIG.4 and FIG.5 is a side view which shows the structure of the plating tank in the immersion treatment apparatus by this embodiment.

  The immersion treatment apparatus according to the present embodiment is a plating apparatus that continuously applies copper plating to a strip-like material to be plated such as a base material of a flexible printed circuit board by an electroplating method.

  First, the overall configuration of the immersion treatment apparatus according to the present embodiment will be described with reference to FIG.

  The immersion treatment apparatus according to the present embodiment includes a plating processing unit 12 that performs a plating process on the strip-shaped material to be plated 10, an unwinding unit 14 that continuously sends the material to be plated 10 to the plating processing unit 12, and a plating processing unit. 14 and a winding unit 16 that continuously collects the material to be plated 10 plated.

  The unwinder 14 is provided with an uncoiler 18 that feeds the strip-shaped material 10 wound in a coil shape in the longitudinal direction with the width direction thereof being substantially vertical and introduces it into the plating processing unit 12.

  Between the unwinding part 14 and the plating process part 12, the electric power feeding part 20 for supplying electric power to the to-be-plated material 10 is provided.

  The plating processing unit 12 includes a plating tank 22 filled with a plating solution and a plating solution storage tank 24 that stores the plating solution supplied to the plating tank 22. Of the opposing side walls of the plating tank 22, a slit-like inlet for introducing the material to be plated 10 into the plating tank 22 is provided on the side wall on the unwinding section 14 side, and the winding section 16 side. A slit-shaped outlet for leading the material to be plated 10 out of the plating tank 22 is provided on the side wall. The strip-shaped workpiece 10 is introduced into the plating tank 22 from the introduction port provided on one side wall with the width direction being substantially vertical. The material to be plated 10 introduced into the plating tank 22 is continuously led out of the plating tank 22 from the outlet provided in the other side wall with the width direction being substantially vertical.

  In the vicinity of the side wall where the introduction port of the plating tank 22 is provided, a liquid receiving part 26 for collecting the plating solution leaking from the introduction port is provided. Further, a liquid receiving portion 28 for collecting the plating solution leaking from the outlet is provided in the vicinity of the side wall where the outlet of the plating tank 22 is provided.

  Between the plating processing unit 12 and the winding unit 16, a cleaning / drying unit 30 for cleaning and drying the material to be plated 10 plated by the plating processing unit 12 is provided.

  Between the cleaning / drying unit 30 and the winding unit 16, a power supply unit 32 for supplying power to the material to be plated 10 is provided.

  The winding unit 16 is provided with a recoiler 34 that is plated by the plating unit 12 and winds up and collects the material to be plated 10 fed from the plating unit 12 with the width direction being substantially vertical.

  As described above, in the immersion treatment apparatus according to the present embodiment, the strip-shaped material 10 fed out from the unwinding unit 14 in the longitudinal direction with the width direction being substantially vertical is sequentially applied to the plating processing unit 12 and the cleaning / drying unit 30. It is configured to pass continuously and be collected by the winding unit 16.

  Next, the plating tank 22 in the immersion treatment apparatus according to the present embodiment will be described in detail with reference to FIGS. 3 is a cross-sectional view taken along the line AA ′ in FIG. 2, and FIGS. 4 and 5 are side views as seen from a direction perpendicular to the longitudinal direction of the material to be plated 10 in FIG.

  The plating tank 22 is filled with a plating solution. The plating solution is, for example, an aqueous copper sulfate solution used for normal copper plating. The composition is, for example, copper sulfate pentahydrate 60-120 g / L, sulfuric acid 170-210 g / L, chlorine ions 30-75 ppm, and caper grease (made by Rohm and Haas Electronic Materials Co., Ltd.) (Registered trademark) HS-201A and HS-201B are 0.2 to 1.0 mL / L and 5 to 50 mL / L, respectively.

  The replenishment of copper to the plating solution is performed by, for example, adding powdered or granular copper oxide (II) as a copper source to the plating solution and dissolving it.

  As shown in FIG. 2, the plating tank 22 is provided with a slit-like introduction port 36 for introducing the material to be plated 10 into the plating tank 22 on the side wall 22 a on the unwinding portion 14 side. A slit-shaped outlet 38 for leading the material to be plated 10 out of the plating tank 22 is provided on the side wall 22b on the side of the take-up portion 16. The inlet port 36 and the outlet port 38 are each provided with a liquid seal mechanism that suppresses leakage of the plating solution from the plating tank 22.

  Into the plating tank 22 filled with the plating solution, the strip-shaped material 10 is introduced from the introduction port 36 in a state where the width direction is substantially vertical. The material to be plated 10 introduced into the plating tank 22 continuously passes through the plating solution in the plating tank 22 with the width direction being substantially vertical, and is led out of the plating tank 22 from the outlet 38. The

  In the plating tank 22 into which the material to be plated 10 is introduced as described above, a pair of anode chambers 40 are arranged on both sides of the material to be plated 10 so as to face both main surfaces of the material to be plated 10, respectively. It is installed.

  As shown in FIG. 3, the anode chamber 40 includes a cation exchange membrane 42 facing the main surface of the material to be plated 10, a back cover 44 substantially parallel to the cation exchange membrane 42, and the cation exchange membrane 42 and the back side. And a partition wall 46 that surrounds the outer periphery of the space between the lid 44. The anode chamber 40 is filled with an electrolytic solution. The electrolytic solution is 80 to 170 g / L sulfuric acid, for example.

  A net-like insoluble anode 48 is provided in the anode chamber 40 so as to face the main surface of the material to be plated 10 with a cation exchange membrane 42 interposed therebetween. The insoluble anode 48 is separated from the plating solution by the cation exchange membrane 48. As the insoluble anode 48, for example, a titanium base having a film mainly composed of iridium oxide is used. As the coating, a mixed oxide coating in which iridium oxide is mixed with tantalum oxide, titanium oxide, tin oxide, or the like is preferable. The insoluble anode 48 is not limited to a net-like one, and for example, a porous or plate-like one can be used. As the cation exchange membrane 42 for separating the plating solution and the insoluble anode 48, for example, a hydrocarbon cation exchange membrane or a perfluorocarbon cation exchange membrane is used. As the hydrocarbon-based cation exchange membrane, Selemion manufactured by Asahi Glass Co., Ltd., Neoceptor (registered trademark) manufactured by Tokuyama Co., Ltd., etc. can be used. As the cation exchange membrane of perfluorocarbon, manufactured by DuPont Co., Ltd. Nafion (registered trademark) or the like can be used.

  The vertical widths of the cation exchange membrane 42 and the insoluble anode 48 are substantially equal to the vertical width of the material to be plated 10.

  The insoluble anode 48 is provided with a bus bar 50 for supplying power to the insoluble anode 48 substantially horizontally. The bus bar 50 is formed by, for example, clad titanium on a core material made of copper.

  As will be described later, the space between the cation exchange membrane 42 of the anode chamber 40 and the material to be plated 10 is such that a flow of the plating solution is stably formed from the bottom to the top of the plating tank 22 therebetween. It is narrow enough. For example, the distance between the cation exchange membrane 42 and the material to be plated 10 is 30 mm.

  Moreover, the space | interval between the back cover 44 of the anode chamber 40 and the side wall 22c of the plating tank 22 facing this is stably plated from the upper side to the lower side of the plating tank 22 between them as will be described later. It is so narrow that a liquid flow is formed. For example, the distance between the back cover 44 and the side wall 22c is 30 mm.

  At the bottom of the plating tank 22, a blowing unit 52 is provided that blows the plating solution and bubbles upward from the bottom of the plating tank 22 to form a circulation in the plating solution in the plating tank 22. Above the blow-out unit 52, the lower end of the strip-shaped workpiece 10 in a state where the width direction is substantially vertical is located.

  The blowing unit 52 was blown out from the plating solution blowing pipe 54 from which the plating solution was blown out, the air blowing pipe 56 from which air was blown out, the plating solution blown out from the plating solution blowing pipe 54, and the air blowing pipe 56. It has a blowing rectifying plate 58 and a lower rectifying plate 60 for rectifying the flow of bubbles. The plating solution blowing pipe 54 and the air blowing pipe 56 are power sources for generating a liquid flow in the plating solution in the plating solution tank 22.

  As shown in FIGS. 3 and 4, the plating solution blowing pipe 54 is disposed below the strip-shaped material to be plated 10 so as to extend along the longitudinal direction of the material to be plated 10. The plating solution blowing pipe 54 is provided with a plurality of plating solution blowing holes 62. The plating solution blowing holes 62 are provided symmetrically on both sides of the material to be plated 10, and sets of the plating solution blowing holes 62 provided symmetrically are equally provided in the longitudinal direction of the material to be plated 10.

  As shown in FIG. 4, a pump (not shown) for supplying the plating solution to the plating solution blowing pipe 54 is connected to the plating solution outlet pipe 54 via a plating solution supply pipe 64. The plating solution stored in the plating solution storage tank 24 is supplied to the plating solution blowing pipe 54 by the pump. The plating solution supplied to the plating solution blowing pipe 54 is blown out from the plating solution blowing hole 62.

  The air blowing pipe 56 is disposed on the plating solution blowing pipe 54 so as to extend along the plating solution blowing pipe 54. A plurality of air blowing holes 66 are provided in the air blowing pipe 56. The air blowing holes 66 are provided symmetrically on both sides of the material to be plated 10, and the sets of air blowing holes 66 provided symmetrically are equally provided in the longitudinal direction of the material to be plated 10.

  An air supply device (not shown) for supplying air to the air blowing pipe 56 is connected to the air blowing pipe 56. The air supplied to the air blowing pipe 56 is blown out as bubbles from the air blowing hole 66 into the plating solution.

  As shown in FIGS. 3 and 5, a pair of blowing rectifying plates 58 are provided on both sides in the extending direction of the plating solution blowing pipe 54 and the air blowing pipe 56 so as to extend along both the pipes 54 and 56. Is arranged. Each of the set of blow-off rectifying plates 58 has a vertical portion 58a that is substantially vertical from the lower end to the vicinity of the upper end, and an upper end portion 58b that is inclined toward the material to be plated 10 side. In addition, an opening 58 c serving as a plating solution suction port is provided at the lower end of the blowout rectifying plate 58.

  Further, a lower rectifying plate 60 is disposed between the air blowing pipe 56 and the lower end of the material to be plated 10 so as to extend along the longitudinal direction of the material to be plated 10 and the air blowing pipe 56. . The lower rectifying plate 60 has a vertical portion 60a that is substantially vertical from the lower end to the vicinity of the upper end, and an upper end portion 60b that is slightly inclined toward the two anode chambers 40 and bifurcated. The upper end portion 60 b of the lower rectifying plate 60 is located near the lower end of the material to be plated 10. The lower end of the lower rectifying plate 60 is fixed to the air blowing pipe 56.

  Thus, the blowing unit 52 is configured.

  In the vicinity of the upper end of the material to be plated 10 and the anode chambers 40 on both sides thereof, an upper rectifying plate 68 is disposed so as to extend along the longitudinal direction of the material to be plated 10 and the anode chamber 40. The upper rectifying plate 68 includes a substantially horizontal horizontal plate portion 68a having a width substantially equal to the width from the back cover 44 of one anode chamber 40 to the back cover 44 of the other anode chamber 40, and a substantially center of the horizontal plate portion 68a. And a substantially vertical vertical plate portion 68b for partitioning from the substrate 10 to the vicinity of the upper end thereof. An inclination having an inclined surface that inclines upward at the corner between the horizontal plate portion 68a and the vertical plate portion 68b on both sides of the vertical plate portion 68b as it goes from the plated material 10 side toward the anode chamber 40 side. Each part 68c is provided.

  The plating tank 22 is filled with the plating solution up to the upper rectifying plate 68, and the material to be plated 10 and the anode chambers 40 disposed on both sides thereof are immersed in the plating solution. On the side wall 22c of the plating tank 22, a plating solution discharge port (not shown) is provided at a position higher than the upper rectifying plate 68 so that the height of the plating solution level is kept substantially constant. ing. The plating solution overflowing from the discharge port is collected in the plating solution storage tank 24.

  The upper opening of the plating tank 22 thus filled with the plating solution is double-covered by the inner lid 70 and the upper lid 72.

  On the inner side of the side wall 22 c of the plating tank 22 facing the back cover 44 of the anode chamber 40, the downstream rectifying plate 74 extends in the vicinity of the lower end of the anode chamber 40 along the longitudinal direction of the material to be plated 10. Are projected. The downstream rectifying plate 74 has an inclined surface that inclines downward from the side wall 22 c side of the plating tank 22 toward the back cover 44 side of the anode chamber 22.

  In the immersion treatment apparatus according to the present embodiment, copper plating is performed on the material to be plated 10 as follows.

  After introducing the material to be plated 10 into the plating tank 22, prior to the plating process for the material to be plated 10, as described below, the blowing solution 52 contains a plating solution filled in the plating tank 22. And a flow of bubbles.

  First, by supplying a plating solution to the plating solution blowing pipe 54, the plating solution is blown out from the plating solution blowing hole 62 of the plating solution blowing pipe 54 into the plating solution filled in the plating tank 22. At the same time, by supplying air to the air blowing pipe 56, bubbles are blown out from the air blowing hole 66 of the air blowing pipe 56 into the plating solution filled in the plating tank 22.

  The plating solution blown out from the plating solution blowing pipe 54 and the bubbles blown out from the air blowing pipe 56 are directed upward from the gaps between the lower rectifying plate 60 and the upper ends of the blowing rectifying plates 58 on both sides thereof. And blow out.

  Thus, the plating solution and the bubbles blown out from the blowing unit 52 flow from the lower side of the plating tank 22 to the upper side between the material to be plated 10 and the anode chambers 40 on both sides thereof. At this time, the upper end portion 60b of the lower rectifying plate 60 located in the vicinity of the lower end of the material to be plated 10 is slightly inclined toward the both anode chambers 40 and branches into two branches. By such an upper end portion 60b, the plating solution and the bubbles blown out from the blowing unit 52 do not directly collide with the lower end of the material to be plated 10, and the flow of the plating solution and the flow of bubbles avoid the lower end of the material to be plated 10. Formed as follows. As a result, it is possible to suppress the lower end of the material to be plated 10 from being scratched by the flow of the plating solution and the flow of bubbles, and the material to be plated 10 can be plated stably.

  In this way, a flow of plating solution and a flow of bubbles are formed between the material to be plated 10 and the anode chambers 40 on both sides thereof from the lower side of the plating tank 22 to the upper side.

  Bubbles flowing upward from below the plating tank 22 between the material to be plated 10 and the anode chambers 40 on both sides thereof collide with the upper rectifying plate 68 and then reach the liquid surface of the plating solution. Disappear.

  On the other hand, the flow of the plating solution flowing between the material to be plated 10 and the anode chambers 40 on both sides thereof from the lower side to the upper side of the plating tank 22 is caused near the upper end of the anode chamber 40 by the upper rectifying plate 68. It is bent so as to go around between the back cover 44 of 40 and the side wall 22c of the plating tank 22.

  In this way, a flow of the plating solution flowing from the upper side to the lower side of the plating tank 22 is formed between the back cover 44 of the anode chamber 40 and the side wall 22c of the plating tank 22.

  The flow of the plating solution flowing from the upper side of the plating tank 22 to the lower side between the back cover 44 of the anode chamber 40 and the side wall 22c of the plating tank 22 is detected by the downstream rectifying plate 74 near the lower end of the anode chamber 40. The plating material 10 is bent so as to wrap around the anode chamber 40. The plating solution that has entered between the material to be plated 10 and the anode chamber 40 merges with the plating solution blown from the blowing unit 52, and again between the material to be plated 10 and the anode chamber 40 from below the plating tank 22. It becomes a part of the flow of the plating solution flowing upward.

  Thus, the plating solution filled in the plating tank 22 flows between the material to be plated 10 and the anode chamber 40 from the lower side to the upper side of the plating tank 22, and the back cover 44 of the anode chamber 40 and the plating tank 22. A revolving current of the plating solution flowing from the upper side to the lower side of the plating tank 22 is formed between the side walls 22c of the plating tank 22c. In addition, a flow of bubbles that flows from the lower side to the upper side of the plating tank 22 is formed between the material to be plated 10 and the anode chamber 40.

  As described above, in the immersion treatment apparatus according to the present embodiment, the flow of the plating solution formed by the plating solution blown from the plating solution blowing pipe 54 and the bubbles blown from the air blowing pipe 56 is the rectifying means, that is, the blowing. The current is rectified by the rectifying plate 58, the lower rectifying plate 60, the upper rectifying plate 68, the side wall 22 c of the plating tank 22, and the downstream rectifying plate 74, circulates around the anode chamber 40, and vertically along the surface of the material to be plated 10. A revolving current of the plating solution flowing through is formed. For this reason, the plating solution does not flow backward at a position away from the blowing unit 52 or the like. Therefore, the flow rate of the plating solution on the surface of the material to be plated 10 flowing from the lower side to the upper side of the plating tank 22 can be made uniform in flow rate.

  Furthermore, the flow rate of the circulating flow of the plating solution in the vertical direction of the plating tank 22 is controlled by controlling the supply rate of the plating solution supplied to the plating solution blowing pipe 54 and the supply rate of air supplied to the air blowing pipe 56. Can be controlled. For example, the flow rate of the circulating flow of the plating solution in the vertical direction of the plating tank 22 can be controlled in the range of 10 to 100 cm / second. The plating process for the material to be plated 10 is performed with the flow rate of the circulating flow of the plating solution being substantially constant.

  Further, the plating solution blowing holes 62 and the air blowing holes 66 are provided uniformly in the longitudinal direction of the material to be plated 10. Therefore, in the longitudinal direction of the material to be plated 10, the flow rate of the plating solution is substantially uniform.

  As described above, the plating apparatus according to the present embodiment can control the flow rate of the plating solution flow on the surface of the material to be plated 10 without variation. Plating can be applied.

In conventional plating equipment, when plating is performed at a high current density, the flow rate of the plating solution on the surface of the material to be plated is increased by spraying a plating solution onto the surface of the material to be the cathode. It was. For this reason, when the material to be plated is easily deformed such as a film, it is difficult to perform plating at a high current density. It is also difficult to increase the flow rate of the plating solution without variation over the entire surface of the material to be plated. For this reason, in the conventional plating apparatus, plating at a current density of 5 to 6 A / dm ² was the limit.

On the other hand, according to the plating apparatus according to the present embodiment, the flow rate of the plating solution on the surface of the material to be plated 10 can be increased without variation. For example, at a high current density of 7 A / dm ² or more, Plating can be performed on the material to be plated 10.

  During the plating process, the plating solution is supplied from the plating solution storage layer 24 into the plating tank 22, and the height of the plating solution in the plating tank 22 is set at the side wall 22 c of the plating tank 22. When the plating solution overflows from the discharge port provided at a position above the upper rectifying plate 68, it is always kept substantially constant.

  As described above, in the state in which the circulation of the plating solution and the flow of bubbles are formed, the power supply units 20 and 32 supply power to the material to be plated 10 as the cathode, and in the plating solution through the bus bar 50. Power is supplied to the insoluble anode 48.

  Thus, a copper plating layer is formed on both main surfaces of the material to be plated 10 by an electrolytic reaction. During the plating process, the material to be plated 10 is sent out by the uncoiler 18 and the material to be plated 10 is taken up by the recoiler 34 so that the belt-shaped material 10 is passed through the plating tank 22 at a predetermined speed. The plating material 10 is continuously plated. Moreover, according to the formation amount of the plating layer, powdered or granular copper oxide is introduced into the plating solution and dissolved, and the copper is appropriately supplied to the plating solution.

  As described above, according to the present embodiment, since the circulation of the plating solution that circulates around the anode chamber 40 is formed, the plating solution does not flow backward, and the flow of the plating solution on the surface of the material to be plated 10. The flow rate can be made uniform. Further, the flow rate of the plating solution on the surface of the material to be plated 10 can be controlled by controlling the blowing solution and bubble blowing from the blowing unit 52. The plating material 10 is plated while flowing the plating solution at a uniform flow rate on the surface of the material 10 to be plated, so that a high-quality copper plating layer is uniformly formed on both main surfaces of the material 10 to be plated. Can be formed.

[Modified Embodiment]
The present invention is not limited to the above embodiment, and various modifications can be made.

  For example, in the above-described embodiment, the case where the plating solution and the bubbles are blown out from the blowing unit 52 has been described as an example. However, only one of the plating solution and the bubbles may be blown out from the blowing unit 52 to perform the plating process. In this case, either the plating solution blowing pipe 54 or the air blowing pipe 56 of the blowing unit 52 may be omitted.

  Even when only the bubbles are blown out from the blowing unit 58, the plating solution is pushed up by the buoyancy of the bubbles and flows between the material to be plated 10 and the anode chamber 40 upward from below the plating tank 22 in the same manner as described above. A circulating flow of the plating solution flowing from the upper side of the plating tank 22 to the lower side between the back cover 44 of the anode chamber 40 and the side wall 22c of the plating tank 22 can be formed.

  Moreover, in the said embodiment, although the case where a plating solution was made to flow toward the upper direction from the downward direction of the plating tank 22 along the surface of the to-be-plated material 10 was demonstrated to an example, the circulation direction of a plating solution is different from the said embodiment. May be in the opposite direction, and the plating solution may flow from the upper side to the lower side of the plating tank 22 along the surface of the material to be plated 10. In this case, for example, the blowing unit 52 blows the plating solution and bubbles toward the space between the anode chamber 40 and the side wall 22c of the plating tank 22, and the recirculation of the plating solution in the direction opposite to that in the above embodiment What is necessary is just to make it form around.

  Moreover, in the said embodiment, although the case where a plating solution circulates the circumference | surroundings of the anode chamber 40 in a fixed direction was demonstrated to the example, by reversing the circulation direction of a plating solution alternately in time, The flow of the plating solution flowing along the surface may alternately flow in the direction from the lower side of the plating tank 22 to the upper side and the direction from the upper side of the plating tank 22 to the lower side. In this case, for example, the reversal of the circulating direction of the plating solution is performed when the blowing unit 52 blows the plating solution or bubbles that are directed between the material to be plated 10 and the anode chamber 40, and the anode chamber 40 and the plating tank 22. It can be realized by a configuration in which the plating solution directed to the side wall 22c and the blowing of bubbles can be switched.

  Moreover, in the said embodiment, although the anode chamber 40 was arrange | positioned on both sides of the to-be-plated material 10, and the case where the plating layer was formed in both the main surfaces of the to-be-plated material 10, the one side of the to-be-plated material 10 was demonstrated. Alternatively, the anode chamber 40 may be provided only on one side, and the plating layer may be formed only on one main surface of the material to be plated 10.

  Moreover, although the case where copper plating was performed was demonstrated to the example in the said embodiment, this invention can be applied not only to copper plating but when performing various metal plating using an insoluble anode.

  Moreover, in the said embodiment, although the case where it plated on the main surface of the strip-shaped to-be-plated material 10 was demonstrated to the example, this invention has various shapes, such as a strip material and a plate-shaped to-be-plated material, for example. It can be applied when plating a material to be plated.

  Moreover, in the said embodiment, although the case where this invention was applied to a plating apparatus was demonstrated to the example, the application range of this invention is not limited to this. The present invention can be widely applied to a case where a treatment object immersed in a liquid is subjected to a liquid treatment such as a chemical treatment or a cleaning treatment.

  For example, in the case where the surface of the object to be processed is dissolved using a chemical solution such as soft etching, in order to change the dissolution amount of the surface of the object to be processed, conventionally, the chemical solution composition, the immersion time, the chemical temperature, etc. There was a need to change. On the other hand, according to the present invention, the amount of dissolution on the surface of the object to be processed is changed by changing the flow rate of the flow of the chemical on the surface of the object to be processed without changing the chemical composition or the like. be able to.

It is a top view which shows the whole structure of the immersion treatment apparatus by one Embodiment of this invention. It is a top view which shows the structure of the plating tank in the immersion treatment apparatus by one Embodiment of this invention. It is sectional drawing which shows the structure of the plating tank in the immersion treatment apparatus by one Embodiment of this invention. It is a side view (the 1) which shows the structure of the plating tank in the immersion treatment apparatus by one Embodiment of this invention. It is a side view (the 2) which shows the structure of the plating tank in the immersion treatment apparatus by one Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... To-be-plated material 12 ... Plating process part 14 ... Unwinding part 16 ... Winding-up part 18 ... Uncoiler 20 ... Power feeding part 22 ... Plating tank 22a, 22b, 22c ... Plating tank side wall 24 ... Plating solution storage tank 26, 28 ... Liquid receiver 30 ... Washing and drying part 32 ... Power feeding part 34 ... Recoiler 36 ... Inlet port 38 ... Outlet port 40 ... Anode chamber 42 ... Cation exchange membrane 44 ... Back cover 46 ... Partition 48 ... Insoluble anode 50 ... Busbar 52 ... Blow unit 54 ... Plating solution blow pipe 56 ... Air blow pipe 58 ... Blow rectifier plate 58a ... Blow rectifier vertical portion 58b ... Blow rectifier upper end portion 60 ... Lower rectifier plate 60a ... Lower rectifier plate vertical portion 60b ... Lower portion Upper end portion 62 of the current plate ... Plating solution blowing hole 64 ... Plating solution supply pipe 66 ... Air blowing hole 68 ... Upper current plate 70 ... Inner lid 72 The upper lid 74 ... downstream straightening plate

Claims (7)

A treatment tank filled with a liquid;
An object disposed in the liquid in the processing tank at an interval with respect to the surface of the object to be immersed in the liquid in the processing tank;
A power source for generating a liquid flow in the liquid in the treatment tank;
Rectifying means for rectifying the liquid flow generated by the power source into a liquid flow that circulates around the object and flows along the surface of the object;
An immersion treatment apparatus characterized in that the surface of the object to be treated is treated by a liquid flow flowing along the surface of the object to be treated. The immersion treatment apparatus according to claim 1, wherein
The liquid flow that circulates around the object flows along the surface of the object to be processed in a direction from the lower side to the upper side of the processing tank or a direction from the upper side to the lower side of the processing tank. Processing equipment. In the immersion treatment apparatus according to claim 2,
The power source causes the liquid flow flowing along the surface of the processing object to be directed upward from below the processing tank by alternately reversing the circulation direction of the liquid flow circulating around the object in terms of time. An immersion treatment apparatus characterized by causing the flow to alternately flow in the direction and in the direction from the top to the bottom of the treatment tank. In the immersion treatment apparatus according to any one of claims 1 to 3,
The said to-be-processed object is a strip, The immersion processing apparatus characterized by the above-mentioned. In the immersion treatment apparatus according to any one of claims 1 to 4,
The object to be processed is a printed circuit board. In the immersion treatment apparatus according to any one of claims 1 to 5,
The immersion treatment apparatus, wherein the object is an anode for electroplating. In the immersion treatment apparatus according to any one of claims 1 to 6,
The said rectification | straightening means contains a part of tank wall of the said processing tank. The immersion processing apparatus characterized by the above-mentioned.

Images