CN102732938A - Electroplating device for dynamically adjusting anode power-supply area and method thereof - Google Patents
Electroplating device for dynamically adjusting anode power-supply area and method thereof Download PDFInfo
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- CN102732938A CN102732938A CN2011100879091A CN201110087909A CN102732938A CN 102732938 A CN102732938 A CN 102732938A CN 2011100879091 A CN2011100879091 A CN 2011100879091A CN 201110087909 A CN201110087909 A CN 201110087909A CN 102732938 A CN102732938 A CN 102732938A
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Abstract
Disclosed are an electroplating device for dynamically adjusting anode power-supply area and a method thereof. The electroplating device comprises a plating bath with plating solution therein; a fixing device for fixing one end of a plated object so as to immerse the plated object into the plating solution, wherein the plated object is connected with a cathode power; first anode metal plates connected with one anode power, wherein the first anode metal plates are located in the plating bath and are parallel with the plated object, one side of each first anode metal plate is completely corresponded to one side of the plated object, and the anode power connected to the first anode metal plates can continuously supply power to the first anode metal plates; and second anode metal plates connected with the other anode power, wherein the first anode metal plates are located in the plating bath and are parallel with the plated object, one side of each second anode metal plate is partially corresponded to the position near the other end of one side of the plated object, and the other anode power connected to the second anode metal plates can intermittencely supply power to the second anode metal plates.
Description
Technical field
The invention relates to a kind of electroplanting device and method thereof; Mainly be that a first anode metal sheet and a second anode metal sheet are set in a plating tank; And said anode metal plate is to be positioned at the different degree of depth; And be parallel to each other with a plated body, wherein this second anode metal sheet is corresponding to the position of the contiguous bottom of a side of this plated body, and is connected to the plate supply of this second anode metal sheet; Can be intermittently to this second anode metal sheet power supply; Mode with by said anode metal plate power supply area of dynamic adjustment and electric weight forms a uniform electrolytic coating on this plated body, and effectively avoids too much metals ion to be attached to the surface of the contiguous bottom of a side of this plated body.
Background technology
Press, electroplating technology is a kind of quite common film technique, and galvanized purpose mainly is to prevent to get rusty, increase attractive in appearance or form circuit substrate layer.Galvanized elemental operation flow process comprises polishing, polishing, goes up extension, degreasing degreasing, washing, electropolishing (or chemical rightenning), acid-wash activation, preplating, plating, washing and other post-treating and other steps.All process steps before the plating is commonly referred to as pre-treatment, and main purpose is to repair the surface of plated body, to remove the surperficial grease of plated body, scale, sull etc.According to statistics, 60% poor plating article are to cause because of pre-treatment is bad, the importance of pre-treatment that hence one can see that.In addition, in work flow, polishing is for visible defects such as the corrosion of removing the plated body surface, scratches, and polishing is the roughness that further reduces the plated body surface, to obtain the outward appearance of light.Again, the purpose of pickling is to remove the surface rust and the sull of plated body, and pickling comprises two kinds of chemical pickling and electrochemistry pickling.On the electroplating activity of some article; The dealer may be according to the material behavior or the actual demand of plated body; Carry out appropriateness adjustment to aforementioned elemental operation flow process, or suitably omit or increase aforementioned elemental operation flow process, to reach best electroplating effect or product demand.
Electroplating mainly is to utilize electrolysis principle, supplies electric energy with the mode of external dc power supply, the solution metal ion is reduced to metal, and makes the surface of metal deposition in plated body.Though electroplating technology has been the suitable proven technique of development, still has the problem of many technological sides to have to be solved at present.For example in the electroplating process of circuit card (Printed circuit board, be called for short PCB), there is electrolytic coating (or claiming circuit substrate layer) problem in uneven thickness in regular meeting, to the electrolytic coating origin cause of formation in uneven thickness and the shortcoming that is produced, describes as follows:
See also shown in Figure 1ly, it is known electroplanting device 1, the past dealer when carrying out the electroplating activity of circuit card B, splendid attire electroplate liquid 11 a plating tank 10 in earlier, present dealer often adopts copper-bath as electroplate liquid 11, copper sulfate (CuSO
4) can dissociate cupric ion (Cu after water-soluble
2+) and sulfate ion (SO
4 2-), and form copper-bath.In galvanized process, after cupric ion and electronics carry out reduction reaction, just can be combined into copper atom (Cu), this is the composition of electrolytic coating.See also shown in Figure 1 again; This electroplanting device 1 still comprises two anode metal plate 12 and anchor clamps 13 except aforementioned electric coating bath 10, wherein said anode metal plate 12 is positioned at plating tank 10; And be immersed in the electroplate liquid 11, respectively this anode metal plate 12 is connected with plate supply P respectively.
In addition, see also shown in Figure 1ly again, these anchor clamps 13 are the tops of circuit card B of being clamped, and circuit card B is immersed in the electroplate liquid 11.This circuit card B is connected with a cathode power N, and when plate supply P antianode metal sheet 12 power supply, and cathode power N is also under the situation to circuit card B power supply; Potential difference between this anode metal plate 12 and this circuit card B, the cupric ion (to call metal ions M in the following text) that can order about in the electroplate liquid moves towards the direction of circuit card B, and owing to circuit card B is connected with cathode power N; So the surface of circuit card B will be covered with electronics (electron); Move to the surface of circuit card B when metal ions M after, metal ions M can be carried out reduction reaction with electronics, and metal ions M is combined with the lip-deep electronics of this circuit card B; So; Please participate in shown in Figure 2ly, metal ions M just can be reduced into metal, and on circuit card B, forms an electrolytic coating E.At this moment, see also Fig. 1 and shown in Figure 2 again, if the length of circuit card B (promptly; Circuit card B is immersed in the degree of depth in the electroplate liquid 11) during less than the length (that is, anode metal plate 12 is immersed in the degree of depth in the electroplate liquid 11) of anode metal plate 12, the position D that surpasses circuit card B length on the anode metal plate 12 still can carry out electroplating activity to circuit card B surface; And the metal ions M in the electroplate liquid that exceeds on the anode metal plate 12 between position D and circuit card B 11 are moved towards the direction of circuit card B, and combine with electronics on the contiguous bottom end surface of this circuit card B, cause after electroplating activity is accomplished; By the section structure sight of this electrolytic coating E, the part of electrolytic coating E proximate circuitry plate B bottom, thickness will be greater than other part; In other words, the integral body of electrolytic coating E can't demonstrate single and uniform thickness, and the thickness of its bottom is much larger than the thickness of other part; Cause the problem of electrolytic coating E surface irregularity, make that it is inhomogeneous that this electric wiring will impedance take place when utilizing etching technique on the electrolytic coating E of circuit card B, to form required electric wiring in the future; Or the problem of uncontrollable this electric wiring impedance magnitude takes place, this problem will be to circuit card B (promptly; Accomplished the etched circuit card of electric wiring) the piece electrical performance cause serious negative impact, therefore, accomplish galvanized circuit card B and will become the flaw defective products; And eliminated, cause yield too low, not only cause the resource unnecessary waste; Also cause electroplating cost significantly to reduce, obviously do not meet the benefit of expection.In addition, though the dealer possibly wait processing operation by again this electrolytic coating E being carried out follow-up polishing, surperficial in the hope of obtaining smooth electrolytic coating E; Only, this measure has increased the operation and the complexity of operation undoubtedly, significantly improves the cost of electroplating activity; More cause unnecessary time consumption, quite undesirable.
See also shown in Figure 3; Though the dealer is arranged for addressing the above problem at present, in electroplanting device 1, sets up baffler 14, to cover the position D that exceeds circuit card B on the anode metal plate 12; Make exceeding position D and can't carry out electroplating activity on the anode metal plate 12 to circuit card B surface; Effectively to avoid the facts such as aforementioned electric coating E surface irregularity to take place, wherein, two bafflers 14 lay respectively at the position of contiguous each anode metal plate 12; This two baffler 14 can completely cut off to live in the position D that exceeds circuit card B on the anode metal plate 12, makes this exceed position D and can't carry out electroplating activity to circuit card B surface.Thus; When plate supply P antianode metal sheet 12 power supply, and cathode power N is also under the situation to circuit card B power supply, the electroplate liquid 11 between between anode metal plate 12 and circuit card B corresponding position; Because of not receiving the isolated of baffler 14; Metal ions M in it can move towards circuit card B, and carries out reduction reaction, on circuit card B, to form a uniform electrolytic coating.Again, the exceeding between position D and circuit card B because of receiving the isolated of baffler 14 of this anode metal plate 12, then the metals ion in the electroplate liquid 11 promptly can't be towards this circuit card B therebetween, and can not form uneven electrolytic coating at the position of the contiguous bottom of this circuit card B.So, can effectively avoid too much metals ion to move to the position of the contiguous bottom of circuit card B, and prevent that problems such as electrolytic coating is in uneven thickness from taking place.Yet for baffler 14 is set in electroplanting device 1, the dealer removes and must extraly set up up-down baffler 14 required automatic mechanism and anchor clamps (omitting among the figure); Not only significantly improve outside the design and manufacturing cost of electroplanting device 1, more significantly increased mechanism's complexity of electroplanting device 1, moreover; In order to hold baffler 14, the dealer still must reserve the exceptional space that holds baffler 14 in plating tank 10 when design plating tank 10; Obviously will significantly increase the width and the volume of plating tank 10, not only cause the unnecessary waste of electroplate liquid 11, more strengthen because of the distance between anode metal plate 12 and circuit card B; Cause the required voltage of electroplating activity to heighten, make power consumption significantly increase, make the dealer must pay higher cost of manufacture; Seriously compressed dealer's profit space, remained to be improved immediately in fact.
Therefore; How to design a kind of electroplanting device of novelty,, make the dealer need not to set up baffler with effective aforementioned problems of improving the known electric plating appts; And need not to increase under the prerequisite of plating tank width and volume; Can on circuit card B, form a uniform electrolytic coating, and avoid circuit card B to go up the irregular problem of generation electrolytic coating fully, in the hope of effectively reducing the width and the volume of plating tank 10; The electric power that significantly reduces electroplating activity expends and cost, promptly becomes the present invention and desires most ardently an important topic of discussion at this.
Summary of the invention
Because before take off problems; The contriver is through the permanent research and experiment of making great efforts; Finally development and Design goes out the electroplanting device and the method thereof of dynamic adjustment anode supply area of the present invention; Phase prevents that problems such as electrolytic coating is in uneven thickness from taking place, and further simplifies the mechanism design of electroplanting device, and saves the power consumption when electroplating.
A purpose of the present invention provides a kind of electroplanting device of dynamic adjustment anode supply area, and this electroplanting device comprises a plating tank, a stationary installation, a first anode metal sheet and a second anode metal sheet, wherein is loaded with electroplate liquid in this plating tank; This stationary installation is to fix an end of a plated body; And this plated body is connected with a cathode power, and respectively this anode metal plate is connected with a plate supply respectively, and wherein a side of this first anode metal sheet corresponds to a side of this plated body fully; And be connected to the plate supply of this first anode metal sheet; Can first metals ion of this first anode metal sheet of vicinity in this electroplate liquid can be moved on this plated body, and accomplish reduction reaction continuously to this first anode metal sheet power supply; In addition; Sidepiece part of this second anode metal sheet is close to the position of the other end corresponding to a side of this plated body, and is connected to the plate supply of this second anode metal sheet, can be intermittently to this second anode metal sheet power supply; Second metals ion in this electroplate liquid between between this second anode metal sheet and this plated body can intermittently be dissociated and move on this plated body, and accomplish reduction reaction.Because this second anode metal sheet only can receive intermittent input power supply; Therefore, can effectively avoid too much metals ion to be attached to the surface of the contiguous the other end of a side of this plated body by the mode of dynamic adjustment anode metal plate power supply area and electric weight; Prevent that effectively problems such as electrolytic coating is in uneven thickness from taking place; And,, avoid causing the unnecessary waste of electroplate liquid so can significantly reduce the width and the volume of plating tank because the present invention need not use baffler to cover the position that exceeds plated body on the anode metal plate; Simplify the mechanism design of electroplanting device, and significantly save power consumption.
Another object of the present invention is that this electroplanting device still comprises a power supply unit and a programmable logic controller, wherein is provided with said plate supply and cathode power in this power supply unit; This power supply unit is connected with an external power source; Obtaining electric power, and this power supply unit is connected with this programmable logic controller, and this programmable logic controller can be controlled this power supply unit; Make the plate supply that is connected to this second anode metal sheet, can be intermittently to this second anode metal sheet power supply.
Another purpose of the present invention provides a kind of electro-plating method of dynamic adjustment anode supply area, is to be applied on the electroplanting device; This electroplanting device comprises a plating tank, a first anode metal sheet and a second anode metal sheet; Be loaded with electroplate liquid in this plating tank and be equipped with a plated body, this plated body is connected with a cathode power, and a side of this first anode metal sheet corresponds to a side of this plated body fully; And sidepiece part of this second anode metal sheet is corresponding to the position of the contiguous the other end of a side of this plated body; This method comprises: make the plate supply that is connected to this first anode metal sheet, continuously to this first anode metal sheet power supply, and make the plate supply that is connected to this second anode metal sheet; Intermittently to this second anode metal sheet power supply; With mode by the said anode metal plate of dynamic adjustment power supply area and electric weight, form the uniform electrolytic coating of thickness in a side of this plated body, prevent that effectively problems such as electrolytic coating is in uneven thickness from taking place.
Description of drawings
For making the inspector do further understanding and understanding to the object of the invention, structure and effect thereof, below enumerate the embodiment conjunction with figs., specify as follows, wherein:
Fig. 1 is the synoptic diagram of known electric plating appts;
Fig. 2 is another synoptic diagram of known electric plating appts;
Fig. 3 is the synoptic diagram that the known electric plating appts adds baffler;
Fig. 4 is the synoptic diagram of first preferred embodiment of the present invention;
Fig. 5 is the block schematic diagram of first preferred embodiment of the present invention; And
Fig. 6 is the synoptic diagram of second preferred embodiment of the present invention.
Embodiment
The contriver is in the research and development of being engaged in association area such as plating for a long time and design; Find that present electroplating activity regular meeting has the facts such as electrolytic coating is in uneven thickness to take place, though there is the part dealer to utilize baffler to cover the position that exceeds plated body on the anode metal plate, in the hope of improving the problems referred to above; Yet set up the width that baffler but significantly increases plating tank; More cause problems such as power consumption increase,, do not obtain perfect terms of settlement as yet though the dealer desires further to seek the improvement scheme of the problems referred to above.In view of this, the contriver is a structure of thinking and improve electroplanting device, and utilizes the dynamically mode of adjustment anode supply area, effectively solves electrolytic coating problem in uneven thickness.
The present invention is a kind of electroplanting device and method thereof of dynamic adjustment anode supply area, see also shown in Figure 4, in first preferred embodiment of the present invention; This electroplanting device 4 comprises a plating tank 40, a stationary installation 43 and a plurality of anode metal plate 41a, 41b, wherein is loaded with electroplate liquid 400 in this plating tank 40, in first preferred embodiment; Be to adopt copper-bath as electroplate liquid 400, on a plated body 42, plating the layer of copper metal, yet; The present invention is not as limit, and the dealer also can be according to the actual requirements when carrying out electroplating activity according to the present invention; Substitute copper-bath with other electrolyte solution; Reaching galvanized effect, all those skilled in the art scholars think easily and variation, all do not break away from the technical scope of institute of the present invention desire protection.In this preferred embodiment, this plated body 42 is circuit cards, and this stationary installation 43 is anchor clamps; The lower end of this stationary installation 43 grasps the top of this plated body 42, and the top of this stationary installation 43 is to be connected with a lead agency (omitting among the figure), and this lead agency can drive this stationary installation 43; This stationary installation 43 is moved, and then this plated body 42 can be immersed in this electroplate liquid 400, what need special were carried is; This preferred embodiment is to be that example describes with anchor clamps as this stationary installation 43, and only, the present invention is not as limit; This stationary installation 43 also can be other mechanism or the device that can fix plated body 42 1 ends, explanation in advance.
Hold; See also shown in Figure 4 again; This plated body 42 is connected with a cathode power N1; Said anode metal plate 41a, 41b comprise two first anode metal sheet 41a and two second anode metal sheet 41b, and wherein first anode metal sheet 41a is connected with plate supply Pa respectively, and second anode metal sheet 41b is connected with plate supply Pb.This first anode metal sheet 41a and this second anode metal sheet 42b all are positioned at this plating tank 40, and are soaked in the electroplate liquid 400.The length of this plated body 42 (being that plated body 42 is immersed in the degree of depth in the electroplate liquid 400) is greater than the length (being that first anode metal sheet 41a is immersed in the degree of depth in the electroplate liquid 400) of this first anode metal sheet 41a; In addition; With first anode metal sheet 41a in comparison; This second anode metal sheet 41b is positioned at this darker position of plating tank 40 degree of depth; And this second anode metal sheet 41b bottom is immersed in the degree of depth in the electroplate liquid 400, is immersed in the degree of depth in the electroplate liquid 400 greater than these plated body 42 bottoms.This first anode metal sheet 41a and this second anode metal sheet 41b respectively with these plated body 42 keeping parallelisms, and keep a predetermined distance with this plated body 42, this predetermined distance need be looked width or the other factors of this plating tank 40 and decide prior explanation.
In Fig. 4; Respectively the left and right sides with this plated body 42 is corresponding fully respectively in the side of this first anode metal sheet 41a; On the other hand; Respectively in the side of this second anode metal sheet 41b, only there be wherein a part of (near vertical part) corresponding with the left and right sides of this plated body 42 respectively, and corresponding to the position that is close to the bottom on this plated body 42.In addition, in the side of this second anode metal sheet 41b respectively, not corresponding with this plated body 42 near the part of bottom.When the dealer makes this electroplanting device 4 in actual production, also can and respectively between this second anode metal sheet 41b an isolator be set respectively, to connect adjoining first anode metal sheet 41a and second anode metal sheet 41b respectively at this first anode metal sheet 41a respectively.In addition, in this preferred embodiment, be as a most preferred embodiment with two first anode metal sheet 41a and two second anode metal sheet 41b; Two corresponding side surface with to plated body 42 are electroplated; But the present invention is not as limit, and the dealer also can be according to the actual requirements when manufacturing and designing this electroplanting device 4 according to the present invention; Or according to the material behavior or the kenel of plated body 42; Electroplate with a slice first anode metal sheet 41a and a slice second anode metal sheet 41b, on a wherein side of plated body 42, to produce an electrolytic coating, explanation in advance.
See also shown in Figure 5; This electroplanting device still comprises a power supply unit 50 and a programmable logic controller 52; Wherein be provided with aforesaid anode power supply Pa, Pb and cathode power N1 in this power supply unit 50, this power supply unit 50 is to be connected with an external power source 51, to obtain the electric power that this external power source 51 is supplied; This power supply unit 50 is connected with this programmable logic controller 52 (Programmable Logic Controller is called for short PLC).So-called programmable logic controller is meant a kind of digital electronic device with MPU, is used for the programmable logic controller of robotization control, can steering order be written at any time to store in the storer and carry out.Programmable logic controller is made up of unit institute modularizations such as central interior treater, data-carrier store, input-output unit, digital simulations, is applied in the industrial control field widely.This programmable logic controller 52 can be controlled this power supply unit 50; Make the plate supply Pa that is connected to this first anode metal sheet 41a; Can see also Fig. 4, shown in Figure 5, so continuously to this first anode metal sheet 41a power supply; First metal ions M 1 (cupric ion) in this electroplate liquid 400 of 42 of this first anode metal sheet 41a and this plated bodies can be dissociated and moved towards this plated body 42; And combine, and after accomplishing reduction reaction, firmly attached on this plated body 42 with these plated body 42 lip-deep electronics.On the other hand, the side of this second anode metal sheet 41b is the position of part corresponding to the contiguous the other end of a side (bottom) of this plated body 42, and this programmable logic controller 52 can be controlled this power supply unit 50; Make the plate supply Pb that is connected to this second anode metal sheet 41b; Can be intermittently to this second anode metal sheet 41b power supply, so, just can make second metal ions M 2 in this electroplate liquid 400 of 42 of this second anode metal sheet 41b and this plated bodies; Can intermittently move towards this plated body 42; And after accomplishing reduction reaction,, form electrolytic coating with side at this plated body 42 firmly attached on this plated body 42.
By technical characterictic of the present invention, the said second anode metal sheet 41b owing to be close to the other end corresponding to the left and right sides of this plated body 42 only can receive intermittent input power supply; Therefore, the present invention can effectively avoid the second too much metal ions M 2 to be attached to the surface of the contiguous the other end in the left and right sides (bottom) of this plated body 42 by the mode of the said anode metal plate 41a of dynamic adjustment, 41b power supply area and electric weight; And then prevent that effectively problems such as electrolytic coating is in uneven thickness from taking place, thus, when the dealer utilizes etching technique on electrolytic coating, to form electric wiring in the future; Can be according to the product design demand; Control this electric wiring impedance magnitude easily, need not worry fully the uneven problem of known impedance can take place, not only significantly promote the product yield; More effectively reduce electroplating cost, and avoid the wasting of resources.Moreover, this second anode metal sheet 41b goes up the position that surpasses plated body 42 length because the present invention need not use isolated plate to cover respectively, so need not reserve the exceptional space that holds baffler in the plating tank 40; Can not only significantly reduce the width and the volume of plating tank 40, more can save the consumption of electroplate liquid 400, moreover; More can exempt required automatic mechanism of up-down baffler and anchor clamps, significantly simplify the mechanism design of electroplanting device 4, in addition; More because the width and the reduction in bulk of plating tank 40; So can significantly reduce the distance between plated body 42 and said anode metal plate 41a, 41b, effectively reduce and electroplate required voltage, and then significantly save power consumption.
In second preferred embodiment of the present invention; See also shown in Figure 6; This electroplanting device 4 is except comprising aforementioned electric coating bath 40, stationary installation 43 and said first anode metal sheet 41a, second anode metal sheet 41b; Still comprise two grading electrode metal sheet 41c, wherein, respectively this grading electrode metal sheet 41c lays respectively at respectively between this first anode metal sheet 41a and second anode metal sheet 41b; In other words; This first anode metal sheet 41a, grading electrode metal sheet 41c and second anode metal sheet 41b lay respectively at the position of different depthss in this plating tank 40, and respectively this grading electrode metal sheet 41c respectively with these plated body 42 keeping parallelisms, respectively this grading electrode metal sheet 41c is connected with plate supply Pc respectively.In this preferred embodiment; Respectively the side of this grading electrode metal sheet 41c corresponds to the left and right sides of this plated body 42 respectively fully; So be connected to the plate supply Pc of this grading electrode metal sheet 41c, can be continuously to this grading electrode metal sheet 41c power supply, the metals ion between 42 of this grading electrode metal sheet 41c and this plated bodies can be moved on this plated body 42; And after accomplishing reduction reaction, stably attached on this plated body 42.In addition, in second preferred embodiment, the power supply mode of said plate supply Pa, Pb is identical with the description person of first preferred embodiment institute, so repeat no more explanation in advance.
By technical characterictic of the present invention, the dealer can be earlier with the sample of a plated body as the examination plating actual when carrying out electroplating activity; Pattern (as: timed interval of supplying power and stopping power supply) with the intermittence power supply that determines this plate supply Pb; And the parameter that will control intermittent powering mode inputs in the aforementioned programmable logic controller 52, so, and the parameter that this programmable logic controller 52 just can be preset according to the dealer; Control the power supply of this plate supply Pb, to reach effect of the present invention.In sum; The electro-plating method that the present invention adopted; Be under the situation of a sidepiece part of this second anode metal sheet 41b corresponding to the contiguous the other end of a side (bottom) of this plated body 42; Make the plate supply Pb that is connected to this second anode metal sheet 41b,, be attached to the surface of the contiguous the other end of a side (bottom) of this plated body 42 to avoid too much metals ion intermittently to this second anode metal sheet 41b power supply; And exempt and hold the required exceptional space of baffler, reduce and electroplate required voltage.The present invention can not only simplify the mechanism design of electroplanting device, reduces cost of manufacture, more can save galvanized electric power and expend, and electroplating efficiency is promoted more.
Press, the above is merely some preferred embodiments of the present invention; Only technical characterictic of the present invention is not limited thereto, and all any this operators that is familiar with are in technical field of the present invention; Can think easily and variation or modification, all should be encompassed in the claim scope of the present invention.
Claims (4)
1. dynamic electroplanting device of adjustment anode supply area comprises:
One plating tank is loaded with electroplate liquid in it;
One stationary installation is fixed an end of a plated body, this plated body is immersed in this electroplate liquid, and this plated body is connected with a cathode power;
One first anode metal sheet; Be connected with a plate supply; This first anode metal sheet is positioned at this plating tank, and with this plated body keeping parallelism, a side of this first anode metal sheet corresponds to a side of this plated body fully; And be connected to this plate supply of this first anode metal sheet, can be continuously to this first anode metal sheet power supply; And
One second anode metal sheet; Be connected with another plate supply; This first anode metal sheet is positioned at this plating tank, and with this plated body keeping parallelism, sidepiece part of this second anode metal sheet is corresponding to the position of the contiguous the other end of a side of this plated body; And be connected to this another plate supply of this second anode metal sheet, can be intermittently to this second anode metal sheet power supply.
2. the electroplanting device of dynamic adjustment anode supply area as claimed in claim 1; Still comprise a power supply unit and a programmable logic controller; Be provided with said plate supply and this cathode power in this power supply unit; This power supply unit is connected with an external power source obtaining electric power, and this power supply unit is connected with this programmable logic controller, and this programmable logic controller can be controlled this power supply unit; Make this another plate supply that is connected to this second anode metal sheet, can be intermittently to this second anode metal sheet power supply.
3. the electroplanting device of dynamic adjustment anode supply area as claimed in claim 2, wherein this stationary installation is anchor clamps, a be clamped end of this plated body of this stationary installation.
4. dynamic electro-plating method of adjustment anode supply area; Be to be applied on the electroplanting device; This electroplanting device comprises a plating tank, a first anode metal sheet and a second anode metal sheet; Be loaded with electroplate liquid in this plating tank and be equipped with a plated body, this plated body is connected with a cathode power, and a side of this first anode metal sheet corresponds to a side of this plated body fully; And sidepiece part of this second anode metal sheet is corresponding to the position of the contiguous the other end of a side of this plated body, and this method comprises:
Make the plate supply that is connected to this first anode metal sheet, continuously to this first anode metal sheet power supply; And
Make the plate supply that is connected to this second anode metal sheet, intermittently, form an electrolytic coating with a side at this plated body to this second anode metal sheet power supply.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011100879091A CN102732938A (en) | 2011-04-06 | 2011-04-06 | Electroplating device for dynamically adjusting anode power-supply area and method thereof |
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| CN2011100879091A CN102732938A (en) | 2011-04-06 | 2011-04-06 | Electroplating device for dynamically adjusting anode power-supply area and method thereof |
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| CN103225094A (en) * | 2013-05-20 | 2013-07-31 | 深圳市博敏电子有限公司 | Single-sided current protection method for blind hole plate electroplating |
| CN104313657A (en) * | 2014-11-10 | 2015-01-28 | 临安振有电子有限公司 | Electro-deposition device of through hole of HDI printed circuit board |
| CN105628755A (en) * | 2015-12-30 | 2016-06-01 | 上海新阳半导体材料股份有限公司 | Method for detecting plating uniformity of plating solution in double-anode mode |
| CN110172725A (en) * | 2018-07-27 | 2019-08-27 | 新阳硅密（上海）半导体技术有限公司 | Electro-plating method, electroplanting device and its anode assemblies |
| CN110184641A (en) * | 2018-07-27 | 2019-08-30 | 新阳硅密（上海）半导体技术有限公司 | The electro-plating method of electroplanting device |
| CN112701072A (en) * | 2021-03-25 | 2021-04-23 | 西安奕斯伟硅片技术有限公司 | Wafer processing apparatus and wafer defect evaluation method |
| CN113423874A (en) * | 2018-12-28 | 2021-09-21 | 盛美半导体设备(上海)股份有限公司 | Electroplating device and electroplating method |
| CN113943966A (en) * | 2020-07-16 | 2022-01-18 | 南通深南电路有限公司 | Electroplating device and electroplating method for circuit board |
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