WO2017018096A1 - Appareil de placage par aspiration - Google Patents

Appareil de placage par aspiration Download PDF

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Publication number
WO2017018096A1
WO2017018096A1 PCT/JP2016/068318 JP2016068318W WO2017018096A1 WO 2017018096 A1 WO2017018096 A1 WO 2017018096A1 JP 2016068318 W JP2016068318 W JP 2016068318W WO 2017018096 A1 WO2017018096 A1 WO 2017018096A1
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WO
WIPO (PCT)
Prior art keywords
plating
workpiece
suction
clip
plating solution
Prior art date
Application number
PCT/JP2016/068318
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English (en)
Japanese (ja)
Inventor
美智雄 川崎
Original Assignee
株式会社エリアデザイン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=57885506&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2017018096(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 株式会社エリアデザイン filed Critical 株式会社エリアデザイン
Priority to KR1020167024784A priority Critical patent/KR101917848B1/ko
Priority to CN201680001020.8A priority patent/CN107002274B/zh
Publication of WO2017018096A1 publication Critical patent/WO2017018096A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks

Definitions

  • the present invention relates to a suction plating apparatus for plating product workpieces, in which the product workpiece is moved in the plating solution in a state of being vertically immersed in the plating solution by a clip conveyor, thereby achieving efficient plating. Relates to the device.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2001-196728 discloses that in a multilayer printed wiring board, a uniform plating film can be formed on the inner wall surface even with a fine blind via hole corresponding to a fine wiring circuit.
  • a number of single-wafer suction plating devices are arranged on the floor of a non-airtight room, and information on the opening and loading of printed wiring boards in this suction plating device row
  • the printed wiring board is hooked to the support provided in the plate and plated, and the support is vibrated to cause a flow in the plating solution, defoaming treatment, and in the non-airtight chamber
  • a suction plating apparatus is disclosed in which an exhaust pump is connected and plating is performed in a state where the non-hermetic chamber is set to a reduced pressure atmosphere.
  • Patent Document 2 Japanese Patent Laid-Open No. 2002-47599 prevents a printed circuit board from being bent (warped) due to the flow of a liquid in a plating tank during a plating process in a printed circuit board plating jig.
  • a plating jig that enhances the strength of a holding member and prevents the clip from being scattered by a reaction force when the clip is detached from the holding material and the locking portion is locked to the vertical wall portion.
  • the support member on the downstream side in the plating solution flow direction of one of the support members constituting the pair of bifurcated support portions is arranged substantially at right angles to the holding member. It is disclosed that the printed circuit board is prevented from being bent by the influence of the plating solution circulating in the plating bath.
  • Patent Document 3 Japanese Patent Application Laid-Open No. 2003-73895 discloses a jig that is versatile with respect to the size of a product to be plated, in a jig for moving the product to be plated while suspended on a rail in continuous electroplating. Disclosed. This jig makes the left and right vertical sides of the product to be plated sandwiched between the vertical beam and the pressing member, and presses and urges the object to be plated to the vertical beam with a spring provided on the pressing member.
  • Patent Document 4 Japanese Patent Laid-Open No. 2014-224300 discloses that in the plating process, the plating solution in the processing tank is agitated in order to increase the plating processing efficiency or improve the finish.
  • an extraction means for extracting the processing liquid put in the processing tank, a processing liquid extracted from the extraction means, and a separately supplied gas A device for forming a coating film on the work surface by providing a microbubble generator that derives microbubbles using the above and agitating the treatment liquid with the microbubbles generated from the microbubble generator is disclosed.
  • the plating technology in the semiconductor industry which has evolved gradually, but demanded higher specifications, has never been 100% satisfied with user requirements, and always explores acceptable levels. It has become. This is not only the quality of the work, but also the quantity is required without degrading the quality. Among them, in electroplating, the thinness of workpieces that are produced every year is required, and the response is becoming increasingly difficult. One of the factors is the limit of current and voltage transmitted to the product workpiece, which leads to sparks, burns, variations in plating thickness, and plating defects.
  • the present invention provides a suction plating apparatus in which the device mechanism is devised and the speed of productivity can be increased without damaging the workpiece by a linked system.
  • the suction plating apparatus includes an improvement in the clip portion that holds the workpiece and an improvement related to the circulation of the plating solution.
  • Issues with the clip transport system include: avoiding sparks at the energized contact part of the work, transporting a soft work without damaging it with a stable low constant tension, and avoiding unnecessary power supply without causing stray currents. It is possible to freely adjust the plating thickness variation on both sides, and to adjust the thickness of the workpiece up and down and left and right.
  • liquid circulation issues include stable conveyance while correcting the warping of the workpiece, ensuring the current density and its stability without drastically increasing the amount of liquid exchange and reducing the metal concentration in the liquid.
  • it is possible to concentrate and replace the liquid in the immediate vicinity of the workpiece to be able to quickly update the liquid on the workpiece surface and to secure the current-carrying capacity, to supply a large volume of new liquid, and to update the liquid.
  • a rapid flow is generated on the workpiece surface.
  • the present invention provides a suction plating apparatus that can solve the above-described problems.
  • the product work is transported by vertically dipping in the plating solution, and this transport is performed by a clip conveyor.
  • the clip at this time works as a current-carrying (grounding) material, it must be a conductive material. However, it must cope with the chemical resistance of the plating solution. Chrome plating> titanium> stainless steel or the like is used.
  • the portion of the clip that is immersed in the liquid needs to be covered with an insulating material such as rubber, and only the contact portion with the workpiece needs to strongly hold the workpiece from both sides. In this case, the insulation of the clip protection needs to be 99% or more so that current does not flow directly to the clip without passing the workpiece from the anode side.
  • the tip including the clip is submerged in the liquid.
  • the advantage of vertical transport is that the plating state on both sides can be made symmetric or can be changed to the desired balance.
  • the work since the work is standing, there is no fear that dust will be placed, and since the clip is conveyed, there is an advantage that no extra tension is generated even if the processing length is long.
  • stability can be obtained by increasing the allowable energization amount by changing the clip pitch.
  • the present invention is a suction plating apparatus comprising a pretreatment process comprising at least a hot water washing section, a water washing section and an acidic degreasing section, a plating process, and a post-treatment process comprising at least a water washing section and a drying section.
  • the plating section for performing the plating step includes a plating tank for storing a plating solution for plating the workpiece, a plurality of clips for holding the upper end of the workpiece and energizing the workpiece, and the plurality of clips. And a circulating part for circulating a plating solution in the plating tank, the workpiece is arranged in parallel with the moving direction of the clip, and the clip is a workpiece.
  • the upper end of the clip and the portion of the tip that holds the workpiece of the clip that is not in contact with the workpiece are insulated in a predetermined range,
  • the predetermined range is insulated lip together with the workpiece is to be buried in the plating solution of the plating tank.
  • the clip includes a pair of arms for sandwiching the workpiece, electrode portions disposed opposite to each other at the tips of the pair of arms, and opening / closing means for opening and closing the pair of arms.
  • the periphery of the electrode portion is insulated so that the tip surface of each electrode portion is exposed, and a predetermined range of the tip portion of the arm is insulated.
  • the insulator around the electrode portion is arranged so as to slightly extend from the front end surface of the electrode portion when the arm is open.
  • the plating tank includes a plating solution suction port formed in the center of the bottom of the plating tank along the moving direction of the conveyor, and further, on both sides of the workpiece, an anode electrode plate facing the workpiece and a plating solution It is desirable that the discharge ports are alternately arranged in the moving direction of the workpiece.
  • the discharge port is disposed above the workpiece, and a plurality of the discharge ports may be disposed along the longitudinal direction of the workpiece.
  • the circulation section includes at least a suction pump connected to the suction port, a plating solution storage tank (management tank) connected to the suction pump, and a discharge pump connected to the discharge port. It is desirable to have it. Moreover, it is desirable to provide a filter for filtering the plating solution between the discharge pump and the discharge port.
  • the plating solution is sucked from directly under the workpiece, even if there are extra wrinkles or curled warping on the workpiece body, the plating solution with a very fast flow rate will flow downward on both sides of the workpiece. In order to move, an effect of stretching the work straight downward is also produced, and stable conveyance can be obtained.
  • suction can be performed at an overwhelming speed even if the discharge pump has a large capacity. Since the plating solution flow perpendicular to the workpiece can be created by placing the balance in a balanced manner, the low-concentration plating solution that has passed the metal ions to the workpiece surface is immediately returned to the management layer and constantly adjusted. Since it is possible to continue to provide a new plating solution that has just been formed on the workpiece surface, a high current density can be realized.
  • the plating solution passes through the work surface in a thin screen at a high speed, which can create attractive force on the work surface, which removes foreign matter adhering to the work, and also has uneven patterns, through holes, and via holes. This produces a desmear effect on the inside of the material, and further improves the adhesion of the plating itself, thereby accelerating the smooth flow of current.
  • the current density of conventional electrolytic copper plating has been limited to 3 to 5 A / dm2 if stability is required, and 6 to 8 A / dm2 for high-speed plating. According to this, stable plating at 12 A / dm 2 is demonstrated, and high-speed plating up to 15 A / dm 2 is possible without causing any damage to the workpiece.
  • the tip portion of the clip is insulated, and the workpiece including the tip portion of the clip is buried and moved in the plating solution, so that the contact spark generated between the workpiece and the clip is prevented. Therefore, efficient plating can be performed.
  • a suction port is provided in the center of the bottom of the plating tank corresponding to the movement range of the workpiece so that the plating solution circulates along the surface of the workpiece, so that the workpiece is not damaged and productivity can be improved. It can be done.
  • the suction plating apparatus 1 is roughly divided into three stages, a pretreatment process A, a plating process B, and a posttreatment process C, as shown in FIG.
  • the pretreatment step A includes, for example, a first hot water washing part A1 for washing a workpiece with hot water, an acid washing degreasing part A2 for degreasing the workpiece subjected to hot water washing, and a degreasing liquid used for degreasing from the workpiece surface.
  • 2 water washing part A3, water washing part A4 for washing the workpiece surface with water, and acid activation part A5 which performs final acid treatment on the workpiece surface, removes an extremely thin oxide film, and brings out an activated vegetable ground.
  • the workpiece surface is treated so that a good plating treatment can be performed on the workpiece surface.
  • the plating unit 2 executes a plating process B for performing copper sulfate plating, for example.
  • the post-processing step C includes a water washing part C1 for washing away the plating solution, a rust prevention part C2 for carrying out a rust-proofing process on the work surface, a water washing part C3 for carrying out water washing of the rust-proofed work surface, and air on the work surface. And an air part C4 for blowing off water and the like, and a drying part C5 for drying the work surface.
  • the plating unit 2 includes a conveyor 30 that moves the plurality of clips 10 holding the workpiece 40 along the plating tank 20 as shown in FIGS. 2 to 4.
  • a plating solution 21 is accommodated in the plating tank 20.
  • a suction port 22 provided in the center of the bottom of the plating tank 20 is formed with a predetermined length along the moving direction of the clip 10. In particular, the suction port 22 is located below the workpiece 40 held by the clip 10.
  • discharge pipes 23 and anode electrode plates 24 having plating solution discharge ports on both sides of the work 40 along the moving direction of the work 40 are alternately arranged in parallel along the moving direction.
  • the anode electrode plate 24 is connected to the anode electrode wire 24a by a connection screw 24b.
  • the connection screw 24b is formed of a conductive material.
  • the plating section 2 includes a suction pump 25 connected to the suction port 22, a plating solution storage tank (management tank) 26 connected to the suction pump 25, and a discharge pipe having the discharge port. 23 and the circulation part D comprised at least by the discharge pump 27 connected through the filter 28 is comprised.
  • the discharge pipe 23 is formed with a plurality of discharge ports along the longitudinal direction. Further, in place of the discharge pipe 23, a discharge pipe 23 'positioned near the surface of the plating solution 21 of the plating tank 20 may be used.
  • the low concentration plating solution that has passed the metal ions to the workpiece surface can be immediately returned to the management tank 26, and a new plating solution that has just been adjusted can be continuously provided on the surface of the workpiece 40. It can be realized.
  • the clip 10 is provided with a pair of arms 11, 11 and electrode portions 12, 12 provided opposite to each other at one end of the pair of arms 11, 11. It is done.
  • the pair of arms 11, 11 are rotatably supported by a rotation fulcrum 32 provided on a rod 31 extending from the conveyor 30 via support portions 13, 13.
  • springs 14 and 14 for urging the arms 11 and 11 in the closing direction are arranged between the arms 11 and 11 and the rod 31, and a clip provided at the other tip of the arms 11 and 11. Opening and closing rollers 15 and 15 are provided.
  • the clip 10 constitutes a cathode electrode via the conveyor 30. Further, as shown in FIG.
  • the clip opening and closing rollers 15 and 15 are urged inward by the opening and closing rails 16 and 16 so that the clip 10 is opened. As shown in FIG. When 15 and 15 deviate from the open / close rails 16 and 16, the springs 14 and 14 are closed to hold the workpiece.
  • the clip 10 according to the present invention is subjected to insulation treatment around the respective electrode portions 12 and 12 and a predetermined range of the arms 11 and 11 to form an insulating film.
  • the insulating film includes an arm-side insulating film 50 that insulates a predetermined range of the arms 11 and 11 and an electrode-side insulating film 51 formed around each of the electrode portions 12 and 12. 51 is configured to extend a predetermined range from the electrode portions 12 and 12 in a state where the clip 10 is opened.
  • the workpiece 40 is held by the clip 10, and the tip surfaces 12 a of the electrode portions 12, 12 of the clip 10 come into contact with the workpiece 40, whereby the workpiece 40 is transferred from the anode electrode plate 24 to the workpiece 40 via the plating solution 21.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

La présente invention vise à fournir un appareil de placage par aspiration comportant des améliorations dans des agrafes pour le maintien d'une pièce à usiner et dans la circulation liquide circulation d'une solution de placage. À cet effet, la présente invention concerne un dispositif de placage par aspiration équipé: d'un étage de prétraitement A comportant au moins une unité de lavage à l'eau chaude, une unité de lavage à l'eau, une unité de dégraissage acide; d'un étage de placage B; et-d'un étage de post-traitement C comprenant au moins une unité de lavage à l'eau et une unité de séchage. Une unité de placage 2, qui fonctionne dans l'étage de placage B, comporte au moins: une cuve de placage qui contient une solution de placage pour le placage d'une pièce à travailler 40; une pluralité d'agrafes 10 pour maintenir l'extrémité supérieure de la pièce à travailler 40 et permettre la circulation de courant à travers la pièce à travailler 40; un convoyeur 30 pour déplacer la pluralité d'agrafes 10 le long de la cuve de placage 20; et une unité de circulation D pour circuler la solution de placage 21 dans la cuve de placage 20. La pièce à travailler 40 est disposée parallèle à la direction de déplacement des agrafes 10 et les agrafes 10 maintiennent l'extrémité supérieure de la pièce à travailler 40. Une partie d'extrémité de chaque agrafe 10 maintenant la pièce à travailler 40 est traitée de sorte qu'une région prédéterminée d'une partie de celle-ci qui n'est pas en contact avec la pièce à travailler 40 soit isolée. Les régions isolées prédéterminées des agrafes10 sont immergées dans la solution de placage 21 dans la cuve de placage 20 avec la pièce à travailler 40.
PCT/JP2016/068318 2015-07-29 2016-06-21 Appareil de placage par aspiration WO2017018096A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020167024784A KR101917848B1 (ko) 2015-07-29 2016-06-21 석션 도금장치
CN201680001020.8A CN107002274B (zh) 2015-07-29 2016-06-21 吸入镀敷装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-149218 2015-07-29
JP2015149218A JP6448494B2 (ja) 2015-07-29 2015-07-29 サクションめっき装置

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WO2017018096A1 true WO2017018096A1 (fr) 2017-02-02

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KR (1) KR101917848B1 (fr)
CN (1) CN107002274B (fr)
WO (1) WO2017018096A1 (fr)

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Publication number Priority date Publication date Assignee Title
TWI723755B (zh) * 2019-01-31 2021-04-01 日商Ａｌｍｅｘ Ｐｅ股份有限公司 工件保持治具及表面處理裝置
CN109878981A (zh) * 2019-03-28 2019-06-14 东莞宇宙电路板设备有限公司 电镀板传输装置
CN112276606A (zh) * 2019-07-22 2021-01-29 艾里亚设计股分有限公司 夹紧装置
KR102224884B1 (ko) 2019-10-01 2021-03-09 엔티피 주식회사 기판 도금장치
KR20220139646A (ko) 2021-04-08 2022-10-17 엔티피 주식회사 수직 연속형 동도금 장치 및 방법
KR102332772B1 (ko) 2021-05-18 2021-12-01 주식회사 지씨이 도금장치용 클램프
KR102575905B1 (ko) 2021-11-11 2023-09-08 엔티피 주식회사 도금 장치
CN115092622B (zh) * 2022-08-10 2024-04-26 广东双凯服饰有限公司 一种服装生产加工用清洁吊挂装置及其操作方法

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JPH06220695A (ja) * 1993-01-26 1994-08-09 Shikino Mekki Kk 鍍金処理方法及び鍍金処理装置
JPH10204691A (ja) * 1997-01-22 1998-08-04 Hideyuki Kobayashi 電気メッキ装置の製品搬送機構
JP2007321242A (ja) * 2006-06-05 2007-12-13 Marunaka Kogyo Kk 電気メッキ装置におけるクリップ式のワークハンガー

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JP2001196728A (ja) 2000-01-11 2001-07-19 Toshiba Chem Corp プリント配線板の製造方法およびプリント配線板の層間接続穴用メッキ装置
JP2002047599A (ja) 2000-07-27 2002-02-15 Ono Seisakusho:Kk プリント基板メッキ用治具
JP3756091B2 (ja) 2001-09-04 2006-03-15 木田精工株式会社 被メッキ品保持用の治具
KR200358909Y1 (ko) * 2004-05-18 2004-08-12 홍정표 양면 균일 도금층을 갖게 하는 전기도금장치
CN102776552B (zh) * 2012-08-02 2015-12-16 梅县金象铜箔有限公司 黑化铜箔补充铜离子时的自动控制工艺及其使用设备
JP6029537B2 (ja) 2013-05-14 2016-11-24 株式会社ハイビック平田 ワークの表面処理装置及び処理方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06220695A (ja) * 1993-01-26 1994-08-09 Shikino Mekki Kk 鍍金処理方法及び鍍金処理装置
JPH10204691A (ja) * 1997-01-22 1998-08-04 Hideyuki Kobayashi 電気メッキ装置の製品搬送機構
JP2007321242A (ja) * 2006-06-05 2007-12-13 Marunaka Kogyo Kk 電気メッキ装置におけるクリップ式のワークハンガー

Also Published As

Publication number Publication date
KR101917848B1 (ko) 2018-11-12
CN107002274A (zh) 2017-08-01
KR20170028870A (ko) 2017-03-14
JP2017031438A (ja) 2017-02-09
CN107002274B (zh) 2019-02-05
JP6448494B2 (ja) 2019-01-09

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