JP6948053B2 - フィリングめっきシステム及びフィリングめっき方法 - Google Patents
フィリングめっきシステム及びフィリングめっき方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 17
- 239000000654 additive Substances 0.000 claims description 128
- 230000000996 additive effect Effects 0.000 claims description 104
- 238000009713 electroplating Methods 0.000 claims description 92
- 150000001875 compounds Chemical class 0.000 claims description 19
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 14
- -1 nitrogen-containing organic compound Chemical class 0.000 claims description 14
- 150000002894 organic compounds Chemical class 0.000 claims description 14
- 229910052717 sulfur Inorganic materials 0.000 claims description 14
- 239000011593 sulfur Substances 0.000 claims description 14
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 13
- 229920000570 polyether Polymers 0.000 claims description 13
- 238000011282 treatment Methods 0.000 description 28
- 230000000052 comparative effect Effects 0.000 description 22
- 230000006866 deterioration Effects 0.000 description 13
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 239000000243 solution Substances 0.000 description 10
- 230000007423 decrease Effects 0.000 description 9
- 239000002202 Polyethylene glycol Substances 0.000 description 8
- 239000007864 aqueous solution Substances 0.000 description 8
- 229920001223 polyethylene glycol Polymers 0.000 description 8
- XXACTDWGHQXLGW-UHFFFAOYSA-M Janus Green B chloride Chemical compound [Cl-].C12=CC(N(CC)CC)=CC=C2N=C2C=CC(\N=N\C=3C=CC(=CC=3)N(C)C)=CC2=[N+]1C1=CC=CC=C1 XXACTDWGHQXLGW-UHFFFAOYSA-M 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 229910052708 sodium Inorganic materials 0.000 description 5
- 239000011734 sodium Substances 0.000 description 5
- VVJKKWFAADXIJK-UHFFFAOYSA-N Allylamine Chemical compound NCC=C VVJKKWFAADXIJK-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 239000000969 carrier Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XCENPWBBAXQVCG-UHFFFAOYSA-N 4-phenylpiperidine-4-carbaldehyde Chemical compound C=1C=CC=CC=1C1(C=O)CCNCC1 XCENPWBBAXQVCG-UHFFFAOYSA-N 0.000 description 2
- NJSSICCENMLTKO-HRCBOCMUSA-N [(1r,2s,4r,5r)-3-hydroxy-4-(4-methylphenyl)sulfonyloxy-6,8-dioxabicyclo[3.2.1]octan-2-yl] 4-methylbenzenesulfonate Chemical compound C1=CC(C)=CC=C1S(=O)(=O)O[C@H]1C(O)[C@@H](OS(=O)(=O)C=2C=CC(C)=CC=2)[C@@H]2OC[C@H]1O2 NJSSICCENMLTKO-HRCBOCMUSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- RAHZWNYVWXNFOC-UHFFFAOYSA-N sulfur dioxide Inorganic materials O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 229920006322 acrylamide copolymer Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000011328 necessary treatment Methods 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229920002006 poly(N-vinylimidazole) polymer Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920005606 polypropylene copolymer Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/028—Electroplating of selected surface areas one side electroplating, e.g. substrate conveyed in a bath with inhibited background plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrodes Of Semiconductors (AREA)
- Chemically Coating (AREA)
- Coating With Molten Metal (AREA)
Description
実施例1として、めっきの電解めっきセルを分割しめっき中断回数を1とし、添加剤付着領域での添加剤の処理(以下めっき中断時の処理)は、レベラーとしてヤヌスグリーンB水溶液を付着させた。また電解銅めっき、めっき浴の条件、噴流撹拌条件はブランクと同様とした。また、めっき1回の中断時間は2分とした。さらに、めっき前の処理には、レベラー、ブライトナー、キャリアーの添加剤は付着させなかった。
実施例2として、めっき中断回数を10とし、めっき中断時の処理は、ブライトナーとしてビス−(3−ナトリウムスルホプロピル)ジスルフィド水溶液を付着させた。その他の条件は実施例1と同様とした。
実施例3として、めっき中断回数を実施例2と同様に10とし、めっき中断時の処理は、キャリアーとしてポリエチレングリコール(平均分子量10000)水溶液を付着させた。その他の条件は実施例1と同様とした。
実施例4として、めっき中断回数を実施例2と同様に10とし、めっき中断時の処理は、レベラーとしてヤヌスグリーンB水溶液を付着させた。その他の条件は実施例1と同様とした。
比較例1として、めっき中断回数を1とし、めっき中断時の処理にイオン交換水を付着させた。その他の条件は実施例1と同様とした。
比較例2として、めっき中断回数を10とし、めっき中断時の処理にイオン交換水を付着させた。その他の条件は実施例1と同様とした。
比較例3として、めっき中断回数を比較例2と同様に10とし、めっき中断時の処理は空中で放置とした。その他の条件は実施例1と同様とした。
比較例4として、めっき中断回数を比較例2と同様に10とし、めっき前の処理には、ブライトナーとしてビス−(3−ナトリウムスルホプロピル)ジスルフィド水溶液を付着させた。また、めっき中断時の処理にイオン交換水を付着させた。その他の条件は実施例1と同様とした。
比較例5として、めっき中断回数を比較例2と同様に10とし、めっき前の処理には、キャリアーとしてポリエチレングリコール(平均分子量10000)水溶液を付着させた。また、めっき中断時の処理にイオン交換水を付着させた。その他の条件は実施例1と同様とした。
比較例6として、めっき中断回数を比較例2と同様に10とし、めっき前の処理には、レベラーとしてヤヌスグリーンB水溶液を付着させた。また、めっき中断時の処理にイオン交換水を付着させた。その他の条件は実施例1と同様とした。
150 ビアにフィリングめっきを形成させた後の断面 151 ビアホール 152 ビアホールフィリングめっき h153 窪み 160 スルーホールにフィリングめっきを形成させた後の断面 161 スルーホール 162 スルーホールフィリングめっき
S10 前処理 S20電解めっき S30添加剤付着 S40 電解めっき S50 後処理
Claims (5)
- 被めっき物のビアホール及び/又はスルーホールにフィリングめっきを形成させるフィリングめっきシステムであって、
複数の電解めっきセルと、
前記各電解めっきセルの間に設けられた添加剤付着領域とを備え、
前記添加剤付着領域で、少なくとも窒素含有有機化合物を含むレベラーと、硫黄含有有機化合物を含むブライトナーと、ポリエーテル化合物を含むキャリアーとの添加剤を含む溶液を、前記被めっき物に直接付着させ、
前記添加剤は、窒素含有有機化合物を含むレベラー、硫黄含有有機化合物を含むブライトナー、ポリエーテル化合物を含むキャリアーから選ばれる前記電解めっきセル中に添加された添加剤と同じ成分であることを特徴とするフィリングめっきシステム。 - 前記添加剤付着領域で前記添加剤を含む溶液を、非通電状態の前記被めっき物に直接付着させることを特徴とする請求項1に記載のフィリングめっきシステム。
- 前記添加剤の濃度は、前記電解めっきセル中の添加剤の濃度と同じであることを特徴とする請求項2に記載のフィリングめっきシステム。
- 前記電解めっきセルは、前記被めっき物を水平又は垂直に搬送しながらめっきを行う装置であることを特徴とする請求項1乃至3の何れか1項に記載のフィリングめっきシステム。
- 被めっき物のビアホール及び/又はスルーホールにフィリングめっきを形成させるフィリングめっき方法であって、
複数の電解めっきセルでめっき処理する間に、添加剤付着領域で少なくとも窒素含有有機化合物を含むレベラーと、硫黄含有有機化合物を含むブライトナーと、ポリエーテル化合物を含むキャリアーとの添加剤を含む溶液を、前記被めっき物に直接付着させ、
前記添加剤は、窒素含有有機化合物を含むレベラー、硫黄含有有機化合物を含むブライトナー、ポリエーテル化合物を含むキャリアーから選ばれる前記電解めっきセル中に添加される添加剤と同じ成分であることを特徴とするフィリングめっき方法。
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JP2017003286A JP6948053B2 (ja) | 2017-01-12 | 2017-01-12 | フィリングめっきシステム及びフィリングめっき方法 |
US15/854,537 US11560640B2 (en) | 2017-01-12 | 2017-12-26 | Filling plating system and filling plating method |
KR1020170184297A KR102441765B1 (ko) | 2017-01-12 | 2017-12-29 | 필링 도금 시스템 및 필링 도금 방법 |
TW107101027A TWI760418B (zh) | 2017-01-12 | 2018-01-11 | 澆注(filling)鍍敷系統及澆注鍍敷方法 |
CN201810031845.5A CN108315781B (zh) | 2017-01-12 | 2018-01-12 | 填充镀敷系统及填充镀敷方法 |
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WO2021245766A1 (ja) * | 2020-06-02 | 2021-12-09 | 奥野製薬工業株式会社 | 断続的電気めっき方法 |
CN112410833B (zh) * | 2020-11-19 | 2022-03-18 | 广州三孚新材料科技股份有限公司 | 一种无氰镀铜光亮剂及其制备方法和应用 |
KR102496247B1 (ko) * | 2021-01-06 | 2023-02-06 | 와이엠티 주식회사 | 전기 도금 용액 첨가제 및 이를 포함하는 고속 도금 가능한 고전류 전기 니켈 도금 용액 |
CN115074789B (zh) * | 2022-08-22 | 2022-11-25 | 深圳市板明科技股份有限公司 | 一种线路板盲孔快速填充电镀铜溶液及快速填充方法 |
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US3535222A (en) * | 1964-02-04 | 1970-10-20 | Aluminium Lab Ltd | Apparatus for continuous electrolytic treatment |
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JP2018111863A (ja) | 2018-07-19 |
US20180195193A1 (en) | 2018-07-12 |
KR102441765B1 (ko) | 2022-09-07 |
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