CN108624943A - A kind of horizontal continuity electroplanting device and preparation method thereof - Google Patents
A kind of horizontal continuity electroplanting device and preparation method thereof Download PDFInfo
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- CN108624943A CN108624943A CN201810791573.9A CN201810791573A CN108624943A CN 108624943 A CN108624943 A CN 108624943A CN 201810791573 A CN201810791573 A CN 201810791573A CN 108624943 A CN108624943 A CN 108624943A
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- roller
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- electroplanting device
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- 238000002360 preparation method Methods 0.000 title description 2
- 238000007747 plating Methods 0.000 claims abstract description 100
- 239000007921 spray Substances 0.000 claims abstract description 46
- 239000007788 liquid Substances 0.000 claims abstract description 39
- 238000009713 electroplating Methods 0.000 claims abstract description 37
- 238000002048 anodisation reaction Methods 0.000 claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052802 copper Inorganic materials 0.000 claims abstract description 21
- 239000010949 copper Substances 0.000 claims abstract description 21
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000010936 titanium Substances 0.000 claims abstract description 19
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 19
- 239000003814 drug Substances 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 238000002386 leaching Methods 0.000 claims description 2
- 238000007654 immersion Methods 0.000 claims 1
- 238000005096 rolling process Methods 0.000 claims 1
- 240000002853 Nelumbo nucifera Species 0.000 abstract description 3
- 235000006508 Nelumbo nucifera Nutrition 0.000 abstract description 3
- 235000006510 Nelumbo pentapetala Nutrition 0.000 abstract description 3
- 230000001737 promoting effect Effects 0.000 abstract 1
- 241000237509 Patinopecten sp. Species 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 8
- 235000020637 scallop Nutrition 0.000 description 8
- 239000007787 solid Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 235000014121 butter Nutrition 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 241000196324 Embryophyta Species 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
- C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
Abstract
The present invention provides a kind of horizontal continuity electroplanting device, electroplating bath including being loaded with copper facing liquid, it immerses the electroplating bath for being loaded with copper facing liquid and sprays the anodization spray tube up and down of liquid medicine to plating piece, the conveying roller roller up and down of plate is plated for horizontal feed, plate or more tough cathode conductive roller is plated with being placed on horizontal feed frame, the anodization spray tube is the cylinder structure being made using titanium.Horizontal continuity electroplanting device of the present invention has piercing capability strong, and efficiently solves the problems, such as edges of boards lotus leaf, white dot problem and pin hole problems in the prior art, effective the advantages that promoting plating piece product quality.
Description
Technical field
The present invention relates to copper facing electroplating technology, specially a kind of horizontal continuity electroplanting device.
Background technology
It is well known that electronic product is to frivolous, low power directional development.It is required that the intensive multilayer direction of wiring board is developed, it is right
The demand for answering existing FPC board production technologies new solves original plant issue, invention kind new type water to meet this series of problems
Flat continuous electroplating tank.
Existing this copperizing continuously is the vertical following defect of copper facing：
（1）Conventional vertical plating causes plating plate or more tension different and scollop, scallop problem occurs because of soft board dead weight speed difference.
（2）Conventional vertical continuous electroplating cathode uses electroplating clamp, is clipped in copper coin edge, causes plating copper coin power-on and power-off stream strong
Degree causes copper facing uneven once in difference, and scollop, scallop occurs in coiled strip copper material after leading to plating.Product quality is influenced, is increased follow-up
Process difficulty.
（3）Anode titanium net is exposed in the liquid of electroplating bath, and oxygen and hydrogen will be generated in electroplating process Anodic titanium net,
Bubble is formed in liquid, bubble constantly adheres to plate surface rupture to be plated, plate surface to be plated is caused to generate white dot and needle
Hole problem；Influence plate glossiness to be plated and beauty.
(4) distance of the jet pipe in vertical continuous electroplating bath to plate face is 50-70mm；Farther out apart from plate face, liquid medicine is worn
Hole ability is weak.
(5) using chain and plating folder transmission, time length causes chain-loose, transmission bounce to cause for vertical continuous plating
Cathode plating folder poor contact.Transmission system is located above electroplating bath, chain greasisng oil often occurs and falls into pollution in electroplating bath
Liquid medicine influences product quality；Dismounting maintenance is difficult.
Invention content
The present invention provides a kind of piercing capability is strong, and efficiently solve the problems, such as edges of boards lotus leaf, white in the prior art
Spot problem and pin hole problems effectively promote the horizontal continuity electroplanting device of plating piece product quality.
The present invention can be achieved through the following technical solutions：
A kind of horizontal continuity electroplanting device, including it is loaded with the electroplating bath of copper facing liquid, immerse the plating for being loaded with copper facing liquid
Slot and the anodization spray tube up and down that liquid medicine is sprayed to plating piece, for the horizontal feed roller devices of horizontal feed plating plate, and
It is placed in plating plate or more tough cathode conductive roller on horizontal feed frame, the anodization spray tube is using titanium system
Cylinder structure made of work, the anodization spray tube are being coated with oxidation iridium coating layer close to plating plate one side, are effectively improving electricity
60% or more efficiency is plated, anodic passivity problem is reduced, improves 30% or more electroplating evenness and anode service life 15 years or more.This
When invention horizontal continuity electroplanting device is using horizontal feed roller devices conveying plating plate, plating plate passes through in horizontal feed roller devices
Horizontal roller drive advance, effectively avoid conventional vertical plating cause because conduct oneself with dignity speed difference plate plate above and below tension difference and
Caused by scollop, scallop problem；The tough cathode conductive roller installed on the horizontal feed frame is driven by tooth, and plating plate is led in tough cathode
It is passed through above electric idler wheel, tough cathode conductive roller is contacted with plating plate top and bottom, and plating plate sprays electricity to tough cathode conductive roller
It solves liquid and increases electric conductivity, compared to vertical plating, current distribution evenly, and does not have vertical folder point, thoroughly solves plating
Plate edges of boards scollop, scallop problem；Plate is plated by horizontal feed roller devices horizontal feed, plating plate passes through quilt after tough cathode conductive roller
It send to the liquid for immersing electroplating bath, liquid is directly sprayed to by the anodization spray tube of the both sides above and below plating plate by plating
The upper and lower surface of plate effectively instead of anode titanium net in the prior art and jet pipe integrated structure, and keeps liquid jet flow more equal
It is even, bubble is effectively reduced, white dot and pin hole problems are solved；Horizontal roller in the horizontal feed roller devices is solid
Idler wheel is conveyed using horizontal solid idler wheel, has good supporting role to soft board, do not have transmission chain in structure, without butter,
It thoroughly solves the chain greasisng oil that conventional vertical plating often occurs and falls into and pollute liquid medicine in electroplating bath, influence product quality
Problem.
Further, the distance of the anodization spray tube to plating piece plate face is 5mm~8mm, greatly improves medicine
The piercing capability of water, piercing capability are 4 times or more of conventional vertical plating.
Further, plating plate limiting plate is equipped in the electroplating bath, the plating plate limiting plate is located at upper and lower conveying roller roller
Top electroplating bath at a side position.The setting of drill traverse end plating plate limiting plate is electroplated, operation is according to plating plate width tune
Whole, degree of allowing edges of boards edge 5mm or so is stuck in inside limiting plate, avoids anode titanium spray tube from causing plating plate to swing plating plate impact, resistance
Inactive portion bubble is kept off to generate.
Further, the roller diameter on the conveying roller roller up and down is 20mm~32mm, the between centers between roller and roller
It is divided into 35mm~125mm, stable transmission can be obtained.
Further, the tough cathode conductive roller is mounted on horizontal feed frame, and tough cathode conductive roller drives plating plate
It is passed through above tough cathode conductive roller, the tough cathode conductive roller is contacted with the top and bottom of plating plate.
Further, the tough cathode conductive roller is made of the external stainless steel of copper material.The tough cathode is conductive
Roller diameter is 40mm, obtains excellent conductive performance.
Further, the distance up and down of two neighboring anodization spray tube is 40mm~50mm, and left and right distance is 40mm
~50mm effectively ensures the uniformity for plating plate liquid jet flow.
Further, the spray apertures on the anodization spray tube be aperture, the spray apertures be a diameter of 0.4mm~
1.0mm.The anodization spray tube is sprayed using aperture, needs anode titanium net and common jet pipe to integrate by original, wiring is prolonged
Electroplating bath external connection is extended to, effectively avoids electric wire etching problem, the soaking compartment design of electroplating bath is simple, and liquid medicine is made to exchange
More fully, aperture spray effectively avoids the air bubble problem that original titanium net is also easy to produce, and effectively ensures that anode titanium spray tube conduction is disliked
Property cycle, further increase plating plate uniformity, and then improve plating copper mass, promoted product appearance quality, keep appearance more beautiful
It is beautiful.
Horizontal continuity electroplanting device of the present invention has following advantageous effect：
The first, when horizontal continuity electroplanting device of the present invention is using horizontal feed roller devices conveying plating plate, plating plate passes through horizontal defeated
It send the horizontal roller in roller devices to drive to advance, conventional vertical plating is effectively avoided to cause to plate on plate because conducting oneself with dignity speed difference
Lower tension it is different and caused by scollop, scallop problem, improvement rate 100%, it is 0 to make scollop, scallop problem rate；
The second, the tough cathode conductive roller installed on the described horizontal feed frame is driven by tooth, and plating plate is on tough cathode conductive roller
Face passes through, and tough cathode conductive roller is contacted with plating plate top and bottom, and plating plate increases to tough cathode conductive roller spray electrolyte
Electric conductivity, compared to vertical plating, current distribution evenly, and does not have vertical folder point, thoroughly solves plating plate edges of boards lotus
Limb problem；
Third, plating plate are by horizontal feed roller devices horizontal feed, and plating plate after tough cathode conductive roller by being sent to leaching
Liquid is directly sprayed to the upper and lower of plating plate by the liquid for entering electroplating bath by the anodization spray tube of the both sides above and below plating plate
Surface effectively instead of anode titanium net in the prior art and jet pipe integrated structure, and makes liquid jet flow evenly, effectively subtracts
Few bubble, solves white dot and pin hole problems；
4th, the horizontal roller in the horizontal feed roller devices is solid idler wheel, is conveyed using horizontal solid idler wheel, to soft
Plate has good supporting role, does not have transmission chain in structure, without butter, thoroughly solves conventional vertical plating and often occurs
Chain greasisng oil fall into the problem of polluting liquid medicine in electroplating bath, influencing product quality；
5th, liquid, the distance of the anodization spray tube to plating piece plate face are sprayed to plating plate using anodization spray tube
For 5mm~8mm, the piercing capability of liquid medicine is greatly improved, piercing capability is 4 times or more of conventional vertical plating.
Description of the drawings
Attached drawing 1 is the structural schematic diagram of horizontal continuity electroplanting device of the present invention；
Attached drawing 2 is the vertical view of horizontal continuity electroplanting device of the present invention；
Attached drawing 3 is the D-D diagrammatic cross-sections in attached drawing 2.
Specific implementation mode
In order that those skilled in the art will better understand the technical solution of the present invention, with reference to embodiment and attached drawing
Product of the present invention is described in further detail.
As shown in Figure 1 to Figure 3, a kind of horizontal continuity electroplanting device, including it is loaded with the electroplating bath 1 of copper facing liquid, it immerses
It is loaded with the electroplating bath 1 of copper facing liquid and sprays the spray tube of anodization up and down 4 of liquid medicine to plating piece, plate is plated for horizontal feed
Horizontal feed roller devices 3, and on horizontal feed frame 6 being placed in plating plate above and below tough cathode conductive roller 5, the sun
Pole plating spray tube 4 is the cylinder structure being made using titanium, and the anodization spray tube 4 is applied close to plating plate one side
It is covered with oxidation iridium coating layer, effectively improves 60% or more electroplating efficiency, reduces anodic passivity problem, improves 30% or more electroplating evenness
With anode service life 15 years or more.When horizontal continuity electroplanting device of the present invention is using the conveying plating plate of horizontal feed roller devices 3,
It plates plate and is driven by the horizontal roller in horizontal feed roller devices 3 and advanced, effectively avoid conventional vertical plating because of speed of conducting oneself with dignity
Difference and causing plate plate up and down tension it is different and caused by scollop, scallop problem；The tough cathode installed on the horizontal feed frame 6 is led
Electric idler wheel 5 is driven by tooth, and plating plate passes through on tough cathode conductive roller 5, and tough cathode conductive roller 5 has with plating plate top and bottom
Contact, plating plate spray electrolyte to tough cathode conductive roller 5 and increase electric conductivity, and compared to vertical plating, current distribution is more
Uniformly, and there is no vertical folder point, thoroughly solve the problems, such as plating plate edges of boards scollop, scallop；Plating plate passes through 3 water of horizontal feed roller devices
Flat conveying, plating plate immerse the liquid of electroplating bath 1 by being sent to after tough cathode conductive roller 5, by being located at plating plate or more two
Liquid is directly sprayed to the upper and lower surface of plating plate by the anodization spray tube 4 of side, effectively instead of anode in the prior art
Titanium net and jet pipe integrated structure, and make liquid jet flow evenly, bubble is effectively reduced, white dot and pin hole problems are solved；
Horizontal roller in the horizontal feed roller devices 3 is solid idler wheel, is conveyed using horizontal solid idler wheel, is had well to soft board
Supporting role, there is no transmission chain in structure, without butter, thoroughly solve the chain profit that conventional vertical plating often occurs
Lubricating oil falls into the problem of polluting liquid medicine in electroplating bath 1, influencing product quality.
As shown in Figures 2 and 3, the distance of the anodization spray tube 4 to plating piece plate face is 5mm~8mm, is greatly carried
The high piercing capability of liquid medicine, piercing capability are 4 times or more of conventional vertical plating.
As depicted in figs. 1 and 2, plating plate limiting plate 2 is equipped in the electroplating bath 1, the plating plate limiting plate 2 is located at defeated up and down
It send in the electroplating bath 1 of the top of idler wheel roller 31,32 at a side position.Electroplating bath 1 soaks the setting of end plating plate limiting plate 2, when work
It waits according to plating plate width adjustment, degree of allowing edges of boards edge 5mm or so is stuck in inside limiting plate, avoids anode titanium spray tube 4 to plating plate punching
It hits and plating plate is caused to swing, blocking inactive portion bubble generates.
As shown in Figure 1, Figure 2 and Figure 3, the roller diameter on the conveying roller roller 31,32 up and down is 20mm~32mm, roller
Between centers between roller is divided into 35mm~125mm, can obtain stable transmission.The tough cathode conductive roller 5 is mounted on level
On carriage 6, tough cathode conductive roller 5 drives plating plate to be passed through above tough cathode conductive roller 5, the tough cathode conductive roller
5 contact with the top and bottom of plating plate.The tough cathode conductive roller 5 is made of the external stainless steel of copper material.Described the moon
Copper conductive roller 5 a diameter of 40mm in pole obtains excellent conductive performance.The distance up and down of two neighboring anodization spray tube 4 is
40mm~50mm, left and right distance is 40mm~50mm, effectively ensures the uniformity for plating plate liquid jet flow.The anodization spray
Spray apertures on pipe 4 are aperture, and the spray apertures are a diameter of 0.4mm~1.0mm.The anodization spray tube 4 is using small
Hole sprays, and needs anode titanium net and common jet pipe to integrate by original, wiring extends to 1 external connection of electroplating bath, effectively avoids electricity
The soaking compartment design of line cable corrosion problem, electroplating bath 1 is simple, so that liquid medicine is exchanged more abundant, and aperture spray effectively avoids original
Carry out the air bubble problem that titanium net is also easy to produce, effectively ensures the conductive vicious circle of anode titanium spray tube 4, further increase the equal of plating plate
Even property, and then plating copper mass is improved, product appearance quality is promoted, keeps appearance more beautiful.
As shown in Figure 1 to Figure 3, roll-to-roll plating piece makes it laggard by upper and lower tough cathode conveying roller by conveying device
Enter to the electroplating bath 1 for being loaded with copper facing liquid, so that plating piece surface liquid medicine is returned servant fully by the spray of anodization spray tube 4, and
Uniform current density is distributed on plating piece, so that plating piece plating is adjusted uniformly through limiting plate and is provided plating piece edge coating stability,
Ensure reliable in quality, because using new anode nozzle, relatively former anode titanium net and common jet pipe, reduction groove body is simpler,
Titanium net blocking is avoided to cause liquid medicine deposition problems, cable installation more safety that can examine.
The foregoing is only a preferred embodiment of the present invention, is not intended to limit the present invention in any form；It is all
The those of ordinary skill of the industry can be shown in by specification attached drawing and described above and swimmingly implement the present invention；But it is all
Those skilled in the art without departing from the scope of the present invention, using disclosed above technology contents
The equivalent variations for a little variation, modification and evolution made are the equivalent embodiment of the present invention；Meanwhile it is all according to the present invention
Substantial technological to the variation, modification and evolution etc. of any equivalent variations made by above example, still fall within the present invention's
Within the protection domain of technical solution.
Claims (9)
1. a kind of horizontal continuity electroplanting device, it is characterised in that：Electroplating bath including being loaded with copper facing liquid, immersion are loaded with plating
The electroplating bath of copper liquid and the anodization spray tube up and down that liquid medicine is sprayed to plating piece, the horizontal feed for horizontal feed plating plate
Roller devices, and it is placed in plating plate or more tough cathode conductive roller, the anodization spray tube on horizontal feed frame
For the cylinder structure being made using titanium.
2. horizontal continuity electroplanting device according to claim 1, it is characterised in that：The anodization spray tube is to plating piece
The distance of plate face is 5mm~8mm.
3. horizontal continuity electroplanting device according to claim 2, it is characterised in that：Plating plate limit is equipped in the electroplating bath
Plate, in the electroplating bath of the plating plate limiting plate top that is located at upper and lower conveying roller roller at a side position.
4. horizontal continuity electroplanting device according to claim 3, it is characterised in that：The horizontal feed roller devices are by more
Conveying roller roller is constituted group up and down, and the roller diameter on the conveying roller roller up and down is 20mm~32mm, between roller and roller
Between centers is divided into 35mm~125mm.
5. horizontal continuity electroplanting device according to claim 4, it is characterised in that：The tough cathode conductive roller is mounted on
On horizontal feed frame, tough cathode conductive roller drives plating plate to be passed through above tough cathode conductive roller, the tough cathode conduction rolling
It takes turns and is contacted with the top and bottom of plating plate.
6. horizontal continuity electroplanting device according to claim 5, it is characterised in that：The tough cathode conductive roller is by copper material
The external stainless steel of matter is made.
7. horizontal continuity electroplanting device according to claim 6, it is characterised in that：The tough cathode conductive roller is a diameter of
40mm。
8. according to the horizontal continuity electroplanting device described in any one of claim 1 to 7 claim, it is characterised in that：Adjacent two
The distance up and down of a anodization spray tube is 40mm~50mm, and left and right distance is 40mm~50mm.
9. horizontal continuity electroplanting device according to claim 8, it is characterised in that：Spray on the anodization spray tube
Leaching hole is aperture, and the spray apertures are a diameter of 0.4mm~1.0mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810791573.9A CN108624943A (en) | 2018-07-18 | 2018-07-18 | A kind of horizontal continuity electroplanting device and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810791573.9A CN108624943A (en) | 2018-07-18 | 2018-07-18 | A kind of horizontal continuity electroplanting device and preparation method thereof |
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| CN108624943A true CN108624943A (en) | 2018-10-09 |
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ID=63688991
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| CN201810791573.9A Pending CN108624943A (en) | 2018-07-18 | 2018-07-18 | A kind of horizontal continuity electroplanting device and preparation method thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109778288A (en) * | 2019-02-19 | 2019-05-21 | 昆山科比精工设备有限公司 | A kind of roll-to-roll horizontal electroplating bath device |
| CN109811392A (en) * | 2019-02-19 | 2019-05-28 | 昆山科比精工设备有限公司 | The roll-to-roll horizontal galvanic anode radical occlusion device of one kind and electroplating device |
| CN109837583A (en) * | 2019-02-19 | 2019-06-04 | 昆山科比精工设备有限公司 | A kind of roll-to-roll horizontal plating line of flexible board |
| CN111809208A (en) * | 2020-06-12 | 2020-10-23 | 黄健 | Oxidation auxiliary assembly for aluminum profile oxidation workshop |
| CN113943967A (en) * | 2021-10-14 | 2022-01-18 | 浙江爱旭太阳能科技有限公司 | Horizontal electroplating equipment for solar photovoltaic product and jig thereof |
| CN115074795A (en) * | 2022-08-19 | 2022-09-20 | 昆山科比精工设备有限公司 | Cathode conducting device and electroplating equipment |
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Application publication date: 20181009 |