CN217677855U - Conductive roller mechanism of conductive device - Google Patents
Conductive roller mechanism of conductive device Download PDFInfo
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- CN217677855U CN217677855U CN202221126541.5U CN202221126541U CN217677855U CN 217677855 U CN217677855 U CN 217677855U CN 202221126541 U CN202221126541 U CN 202221126541U CN 217677855 U CN217677855 U CN 217677855U
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Abstract
The utility model discloses a conductive roller mechanism of electric installation, the setting is in the plating bath inslot, including first conductive roller, second conductive roller, third conductive roller and fourth conductive roller, first conductive roller, second conductive roller, the axis of third conductive roller and fourth conductive roller is located four summits of same rhombus respectively, the electro-coppering membrane is alternately in proper order through four first conductive rollers, second conductive roller, third conductive roller and fourth conductive roller, the electro-coppering membrane is through first conductive roller, second conductive roller, the wrap angle of third conductive roller and fourth conductive roller all is greater than 90. The utility model provides a rhombus conducting roller mechanism makes copper electroplating film and conducting roller fully contact, lowers the current density of the contact surface of copper electroplating film and conducting roller greatly, reduces the rate of heat generation, prevents that the copper electroplating film from leading to ablating the perforation because of generating heat.
Description
Technical Field
The utility model relates to an electro-coppering film equipment technical field, specific theory relates to an electrically conductive roller mechanism of electric installation.
Background
Electroplating is a process of plating a thin layer of metal or alloy on the surface of metal by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material workpiece by using the action of electrolysis so as to play a role in preventing metal oxidation (such as corrosion), improving wear resistance, conductivity and light reflection, enhancing the appearance and the like. With the development of modern industrial technology, the demand for film coating on the surface of a film substrate is increasing, and the film substrate is widely applied to the fields of new energy materials, high-performance automobile films, plasma television flat panel displays, touch screens, solar cells, flexible printed circuit boards (FPCs), chip On Films (COFs) and the like.
In the existing copper electroplating film equipment, a conductive roller mechanism of a film coating conductive device is complex in structure, and the contact surface of the conductive roller and the copper electroplating film is small, so that the current density of the contact surface of the copper electroplating film is too high, the heating rate is high, and the film is easy to ablate and perforate.
The above drawbacks are to be improved.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model provides a conductive roller mechanism of a conductive device.
The utility model discloses technical scheme as follows:
the utility model provides a conductive roller mechanism of conductive device, sets up in the plating solution inslot, including first conductive roller, second conductive roller, third conductive roller and fourth conductive roller, first conductive roller the second conductive roller the third conductive roller reaches the axis of fourth conductive roller is located four summits of same rhombus respectively, and the electro-coppering membrane is alternately through four in proper order first conductive roller the second conductive roller the third conductive roller reaches the fourth conductive roller, the electro-coppering membrane passes through first conductive roller the second conductive roller the third conductive roller reaches the wrap angle of fourth conductive roller all is greater than 90.
According to the scheme, the wrap angle of the electroplated copper film passing through the first conductive roller is 190-200 degrees, the wrap angle of the electroplated copper film passing through the second conductive roller is 215-225 degrees, the wrap angle of the electroplated copper film passing through the third conductive roller is 215-225 degrees, and the wrap angle of the electroplated copper film passing through the fourth conductive roller is 190-200 degrees.
According to above scheme the utility model discloses, first conductive roll the second conductive roll the third conductive roll reaches the radius of fourth conductive roll is C, first conductive roll with interval between the second conductive roll first conductive roll with interval between the third conductive roll the fourth conductive roll with interval between the second conductive roll the fourth conductive roll with interval between the third conductive roll all is less than C.
According to the above scheme the utility model discloses, first conductive roller the second conductive roller the third conductive roller reaches two rows about the fourth conductive roller falls into, first conductive roller is located the left side of arranging down, the second conductive roller is located the left side of arranging on, the third conductive roller is located the right side of arranging down, the fourth conductive roller is located the right side of arranging on, first conductive roller with the third conductive roller soaks in the pure water of plating bath, the lower extreme of second conductive roller with the lower extreme of fourth conductive roller soaks in the pure water of plating bath.
Further, the film outlet end of the fourth conductive roller is positioned on the outer side of the right side wall of the plating solution tank.
Further, the first conductive roller is closer to a left side wall of the plating solution tank than the second conductive roller, and the fourth conductive roller is closer to a right side wall of the plating solution tank than the third conductive roller.
According to above scheme the utility model discloses, first conductive roller the second conductive roller the third conductive roller reaches the inside of fourth conductive roller all is provided with the circulative cooling pipe.
According to above-mentioned scheme the utility model discloses, first conductive roller the second conductive roller the third conductive roller reaches four DC power supply's positive pole is connected respectively to the fourth conductive roller.
According to above-mentioned scheme the utility model discloses, first conductive roller the second conductive roller the third conductive roller reaches the fourth conductive roller is SUS304 steel roller.
Compared with the prior art, the beneficial effects of the utility model reside in that:
the four conductive rollers of the rhombic conductive roller mechanism provided by the utility model adopt the rhombic arrangement to generate a large wrap angle, so that the electroplated copper film is fully contacted with the conductive rollers, the current density of the contact surface of the electroplated copper film and the conductive rollers is greatly reduced, the heating rate is reduced, and the electroplated copper film is prevented from being ablated and perforated due to heating; the structure is simple and compact, the tension is not blocked, and the control of the tension of the film is facilitated so as to better walk the film.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the connection between the plating solution tank and the present invention;
in the context of the figures, it is,
1. a first conductive roller; 2. a second conductive roller; 3. a third conductive roller; 4. a fourth conductive roller; 401. a circulating cooling pipe; 5. Electroplating a copper film; 6. plating solution tank.
Detailed Description
In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail.
It is to be noted that the terms "comprises" and "comprising" and any variations thereof in the description and claims of the invention are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus. The terms "disposed" and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The terms "upper", "lower", "left", "right", and the like indicate orientations or positions based on the orientations or positions shown in the drawings, and are only for convenience of description and not to be construed as limiting the technical solution. The terms "first", "second", "third" and "fourth" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or as implying the number of technical features.
Referring to fig. 1 and 2, an embodiment of the present invention provides a conductive roller mechanism of a conductive device, which is disposed in a plating solution tank 6, the rhombic conductive roller mechanism includes a first conductive roller 1, a second conductive roller 2, a third conductive roller 3 and a fourth conductive roller 4, the first conductive roller 1, the second conductive roller 2, the third conductive roller 3 and the fourth conductive roller 4 are respectively connected to anodes of four dc power sources, the central axes of the first conductive roller 1, the second conductive roller 2, the third conductive roller 3 and the fourth conductive roller 4 are respectively located on four vertices of the same rhombus, an electroplated copper film 5 sequentially crosses four first conductive rollers 1, the second conductive rollers 2, the third conductive rollers 3 and the fourth conductive rollers 4, and the wrap angle of the electroplated copper film 5 passing through the first conductive rollers 1, the second conductive rollers 2, the third conductive rollers 3 and the fourth conductive rollers 4 is greater than 90 °. The four conductive rollers of the rhombic conductive roller mechanism provided by the utility model adopt the rhombic arrangement to generate a large wrap angle, so that the electroplated copper film 5 is fully contacted with the conductive rollers, the current density of the contact surface of the electroplated copper film 5 and the conductive rollers is greatly reduced, the heating rate is reduced, and the electroplated copper film 5 is prevented from being ablated and perforated due to heating; the structure is simple and compact, the tension is not isolated, and the control of the film tension is more facilitated so as to better walk the film.
In this embodiment, the wrap angle of the electroplated copper film 5 passing through the first conductive roller 1 is 190 to 200 °, the wrap angle of the electroplated copper film 5 passing through the second conductive roller 2 is 215 to 225 °, the wrap angle of the electroplated copper film 5 passing through the third conductive roller 3 is 215 to 225 °, and the wrap angle of the electroplated copper film 5 passing through the fourth conductive roller 4 is 190 to 200 °. By adopting the arrangement, the device can be ensured to run smoothly, the electroplated copper film 5 can be fully contacted with the conductive roller, the current density of the contact surface of the electroplated copper film 5 and the conductive roller is greatly reduced, the heating rate is reduced, and the electroplated copper film 5 is prevented from being ablated and perforated due to heating.
Meanwhile, in order to enable the wrap angle of the electroplated copper film 5 passing through the first conductive roller 1 to reach 190-200 degrees, the wrap angle of the electroplated copper film 5 passing through the second conductive roller 2 to reach 215-225 degrees, the wrap angle of the electroplated copper film 5 passing through the third conductive roller 3 to reach 215-225 degrees, the wrap angle of the electroplated copper film 5 passing through the fourth conductive roller 4 to reach 190-200 degrees, the radiuses of the first conductive roller 1, the second conductive roller 2, the third conductive roller 3 and the fourth conductive roller 4 are all set to be C, and the distance between the first conductive roller 1 and the second conductive roller 2, the distance between the first conductive roller 1 and the third conductive roller 3, the distance between the fourth conductive roller 4 and the second conductive roller 2 and the distance between the fourth conductive roller 4 and the third conductive roller 3 are all set to be smaller than C.
Referring to fig. 2, in the embodiment, the first conductive roller 1, the second conductive roller 2, the third conductive roller 3 and the fourth conductive roller 4 are divided into two rows, the first conductive roller 1 is located on the left side of the lower row, the second conductive roller 2 is located on the left side of the upper row, the third conductive roller 3 is located on the right side of the lower row, the fourth conductive roller 4 is located on the right side of the upper row, the first conductive roller 1 and the third conductive roller 3 are soaked in pure water, and the lower end of the second conductive roller 2 and the lower end of the fourth conductive roller 4 are soaked in pure water in the plating solution tank 6. The first conductive roller 1, the second conductive roller 2, the third conductive roller 3 and the fourth conductive roller 4 can be cooled by soaking the first conductive roller 1 and the third conductive roller 3 in pure water, and the lower end of the second conductive roller 2 and the lower end of the fourth conductive roller 4 in pure water, so that copper ions can be diluted to the maximum extent, copper plating of the first conductive roller 1, the second conductive roller 2, the third conductive roller 3 and the fourth conductive roller 4 can be prevented, contact surfaces of the first conductive roller 1, the second conductive roller 2, the third conductive roller 3, the fourth conductive roller 4 and the electroplated copper film 5 can be filled and lubricated, and scratching and perforation ablation of the film surface of the electroplated copper film 5 can be prevented. Meanwhile, the film outlet end of the fourth conductive roller 4 is positioned at the outer side of the right side wall of the plating solution tank 6, so that the electroplated copper film 5 keeps a large wrap angle when passing through the fourth conductive roller 4.
Referring to fig. 2, in the present embodiment, the first conductive roller 1 is closer to the left side wall of the plating solution tank 6 than the second conductive roller 2, and the fourth conductive roller 4 is closer to the right side wall of the plating solution tank 6 than the third conductive roller 3, so that the copper plating film 5 keeps a large wrap angle when passing through the first conductive roller 1.
Referring to fig. 1, in the present embodiment, a circulation cooling pipe 401 is disposed inside each of the first conductive roller 1, the second conductive roller 2, the third conductive roller 3 and the fourth conductive roller 4, and the circulation cooling pipe 401 is used for circulating cooling water for cooling the conductive rollers and the electroplated copper film 5 passing through the conductive rollers. The circulation cooling pipe 401 is a reserve function and can be selectively used.
Preferably, the first conductive roller 1, the second conductive roller 2, the third conductive roller 3, and the fourth conductive roller 4 are SUS304 steel rollers.
It will be understood that modifications and variations are possible to those skilled in the art in light of the above teachings and that all such modifications and variations are considered to be within the purview of the invention as set forth in the appended claims.
The above description is given for the exemplary application of the present invention with reference to the accompanying drawings, and it is obvious that the present invention is not limited by the above method, as long as the present invention adopts various improvements of the method concept and the technical solution, or the present invention is directly applied to other occasions without improvement, and all of them are within the protection scope of the present invention.
Claims (9)
1. The utility model provides a conductive roller mechanism of electric installation, sets up in the plating bath groove, its characterized in that includes first conductive roller, second conductive roller, third conductive roller and fourth conductive roller, the first conductive roller, the second conductive roller, the third conductive roller and the axis of fourth conductive roller is located four summits of same rhombus respectively, and the electro-coppering film alternately passes through four in proper order first conductive roller, the second conductive roller, the third conductive roller and the fourth conductive roller, the wrap angle that the electro-coppering film passes through first conductive roller, the second conductive roller, the third conductive roller and the fourth conductive roller all is greater than 90.
2. The conductive roller mechanism of a conductive device according to claim 1, wherein a wrap angle of the plated copper film passing through the first conductive roller is 190 ° -200 °, a wrap angle of the plated copper film passing through the second conductive roller is 215 ° -225 °, a wrap angle of the plated copper film passing through the third conductive roller is 215 ° -225 °, and a wrap angle of the plated copper film passing through the fourth conductive roller is 190 ° -200 °.
3. The conductive roller mechanism of the conductive device according to claim 1, wherein the radii of the first conductive roller, the second conductive roller, the third conductive roller and the fourth conductive roller are all C, and a distance between the first conductive roller and the second conductive roller, a distance between the first conductive roller and the third conductive roller, a distance between the fourth conductive roller and the second conductive roller, and a distance between the fourth conductive roller and the third conductive roller are all smaller than C.
4. The conductive roller mechanism of a conductive device according to claim 1, wherein the first conductive roller, the second conductive roller, the third conductive roller and the fourth conductive roller are divided into two upper and lower rows, the first conductive roller is located on the left side of the lower row, the second conductive roller is located on the left side of the upper row, the third conductive roller is located on the right side of the lower row, the fourth conductive roller is located on the right side of the upper row, the first conductive roller and the third conductive roller are immersed in pure water in the plating bath, and the lower end of the second conductive roller and the lower end of the fourth conductive roller are immersed in pure water in the plating bath.
5. The conductive roller mechanism of a conductive device according to claim 4, wherein a film outlet end of the fourth conductive roller is located outside a right side wall of the plating bath tank.
6. The conductive roller mechanism of a conductive device according to claim 4, wherein the first conductive roller is closer to a left side wall of the plating bath tank than the second conductive roller, and the fourth conductive roller is closer to a right side wall of the plating bath tank than the third conductive roller.
7. The conductive roller mechanism of a conductive device according to claim 1, wherein a circulation cooling pipe is provided inside each of the first conductive roller, the second conductive roller, the third conductive roller, and the fourth conductive roller.
8. The conductive roller mechanism of a conductive device according to claim 1, wherein the first conductive roller, the second conductive roller, the third conductive roller, and the fourth conductive roller are connected to positive electrodes of four direct current power supplies, respectively.
9. The conductive roller mechanism of a conductive device according to claim 1, wherein the first conductive roller, the second conductive roller, the third conductive roller, and the fourth conductive roller are SUS304 steel rollers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221126541.5U CN217677855U (en) | 2022-05-11 | 2022-05-11 | Conductive roller mechanism of conductive device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221126541.5U CN217677855U (en) | 2022-05-11 | 2022-05-11 | Conductive roller mechanism of conductive device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217677855U true CN217677855U (en) | 2022-10-28 |
Family
ID=83738930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221126541.5U Active CN217677855U (en) | 2022-05-11 | 2022-05-11 | Conductive roller mechanism of conductive device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217677855U (en) |
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2022
- 2022-05-11 CN CN202221126541.5U patent/CN217677855U/en active Active
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