CN216738590U - Novel surface treatment machine device - Google Patents
Novel surface treatment machine device Download PDFInfo
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- CN216738590U CN216738590U CN202123169480.9U CN202123169480U CN216738590U CN 216738590 U CN216738590 U CN 216738590U CN 202123169480 U CN202123169480 U CN 202123169480U CN 216738590 U CN216738590 U CN 216738590U
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- copper foil
- groove
- novel surface
- silane
- deflector roll
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Abstract
The utility model discloses a novel surface treatment machine device, concretely relates to copper foil processing technology field mainly includes plating bath device and silane coating bath, the plating bath of improvement includes conducting roller, submerged deflector roll, and the copper foil gets into the plating bath from conducting roller, and the paper tinsel becomes 90 with the horizontal plane, and the deflector roll upwards moves out of the groove under two horizontal levels submerged. The novel surface machine processing device reduces the possibility of uneven electroplating and formed color difference caused by bubbles attached to the surface of the copper foil in the electroplating process, shortens the polar distance between an anode plate and the copper foil and reduces the electroplating cost; silane is more uniformly coated, the strength of the anti-stripping capability is stable and uniform, and the occurrence of silicon dots is reduced.
Description
Technical Field
The utility model belongs to the technical field of the copper foil processing, concretely relates to novel surface treatment machine device.
Background
The copper foil of the circuit board does not have anti-oxidation treatment in the production process, surface treatment is needed after production to achieve qualified anti-oxidation, anti-stripping and anti-corrosion performances, the produced rough foil is subjected to surface treatment in different modes according to the requirements of customers on the surface performance of finished foil, and the whole surface treatment process except silane coating belongs to an electroplating process. The coarsening, solidification, T5, acid chromium plating and silane are all single-side electroplating (most M surfaces and few S surfaces), the other is double-side electroplating, an oxygen evolution reaction can be generated on the surface of an anode in the electroplating process, a hydrogen evolution reaction can be generated on the surface of a cathode, namely copper foil, the hydrogen evolution side reaction on the surface of the cathode can be avoided to the greatest extent by adjusting current density and other parameters, but the oxygen evolution reaction on the surface of the anode cannot be effectively reduced, the electroplating effect can be influenced, different metal elements contained on the surface of a processing foil cannot be added into a system again for dissolving and using, the yield of the processing foil with poor electroplating effect can be reduced only by placing or other processing, and the cost is increased. Silane coating belongs to coating organosilane in the surface treatment process, in order to improve the peeling strength of the copper foil and meet the requirements of downstream customers, the S surface of the copper foil must be free from silane adhesion in the coating process, otherwise, the S surface has the defect of silicon points, which is unacceptable for the downstream customers;
the surface treatment machine in the prior art has the following problems:
the functional tanks for the front and the back treatment are all V-shaped tanks, the anode generates oxygen evolution reaction in the electroplating process, oxygen overflows from the liquid level from bottom to top after being precipitated on the surface of the anode plate, the distance between the anode plate and the copper foil is very small, the oxygen precipitated at the lower end of the anode plate is attached to the upper end of the copper foil after vertically upwards, and the copper foil surface treatment is conveyor belt type operation, so that the surface electroplating of the copper foil is not uniform. The silane is applied in a spray-type manner, which has two problems: (1) the spraying holes are blocked, so that the silane liquid is not sprayed on the rough surface of the copper foil, and the copper foil is low in peeling strength or uneven in coating; (2) if the silane liquid spraying hydraulic pressure is slightly large, the spraying liquid at two ends can be splashed onto the S surface to form silicon dots; we propose a novel surface treating apparatus for solving the above problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a novel surface treatment machine device to solve the problem that proposes among the above-mentioned background art.
In order to solve the technical problem, the utility model adopts the following technical scheme: a novel surface processor device;
the improved electrolytic bath comprises a conductive roller, submerged guide rollers and an anode plate, a copper foil enters the electrolytic bath from the conductive roller, the foil and a horizontal plane form 90 degrees, and the copper foil goes out of the electrolytic bath through the two horizontal submerged guide rollers. The silane coating tank comprises a tank-entering guide roller, an open square tank and a tank-exiting guide roller, the copper foil horizontally enters the tank-entering guide roller and covers the square tank after being subjected to surface treatment in the early stage, and then the copper foil is discharged from the tank through the tank-exiting guide roller, and the copper foil is in horizontal motion in the whole coating process.
Compared with the prior art, the beneficial effects of the utility model reside in that:
according to the novel surface treatment device, the number of the submerged guide rollers in the electroplating bath is adjusted to two and the shape of the trapezoid groove is adjusted to be square, so that oxygen bubbles separated out from an anode are prevented from adhering to the surface of a copper foil, the polar distance is shortened, the operation cost is greatly reduced, and an operator can easily clean the anode plate and the groove body; moreover, by adjusting silane plating to adhesive plating, the stability and uniformity of silane plating are improved, so that the peeling strength and oxidation resistance of the copper foil are improved, and the rejection rate of the copper foil is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a diagram: the structure of the electroplating bath of the utility model is shown schematically.
FIG. 2 is a diagram of: the structure of the silane coating bath of the utility model is schematically shown.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example (b):
the utility model provides a novel surface treatment device, as shown in figures 1 and 2, the novel surface treatment device comprises an electroplating bath and a silane plating bath, wherein a copper foil is uncoiled and then vertically enters the electroplating bath 3 through a conductive roller 1, passes through the middle of two parallel anode plates 2, then vertically moves upwards after passing through two submerged guide rollers 4, and also passes through two parallel anode plates 2, and the two parallel anode plates 2 run out of the previous electroplating bath through a bath outlet guide roller 5 and then enter the next electroplating bath; the silane coating bath comprises a groove-entering guide roller, a square groove and a groove-exiting guide roller, the copper foil horizontally enters the square groove through the groove-entering guide roller, the square groove is filled with silane coating solution, and the surface to be treated of the foil is contacted with the solution to be coated with silane and then horizontally runs to enter the next treatment unit through the groove-exiting guide roller.
According to the novel surface treatment device, the number of the submerged guide rollers in the electroplating bath is adjusted to two and the shape of the trapezoid groove is adjusted to be square, so that oxygen bubbles separated out from an anode are prevented from adhering to the surface of a copper foil, the polar distance is shortened, the operation cost is greatly reduced, and an operator can easily clean the anode plate and the groove body; moreover, by adjusting silane plating to adhesive plating, the stability and uniformity of silane plating are improved, so that the peeling strength and oxidation resistance of the copper foil are improved, and the rejection rate of the copper foil is reduced.
It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (5)
1. A novel surface processor device is characterized in that: including electrolysis trough device and silane coating bath, the electrolysis trough includes conducting roll, submerged deflector roll and anode plate, and the copper foil is from the vertical electrolysis trough that gets into of conducting roll, through the vertical upwards operation play groove of two submerged deflector rolls, the silane coating bath is including getting into groove deflector roll, uncovered square groove and play groove deflector roll, and the copper foil gets into and covers on square groove through getting into groove deflector roll level after earlier stage surface treatment washing, then moves out the groove through going out the groove deflector roll.
2. The novel surface treating machine arrangement as recited in claim 1, further comprising: the running direction of the copper foil in the electroplating bath is 85-90 degrees with the submerged guide roller.
3. The novel surface treating machine arrangement as recited in claim 1, further comprising: the polar distance between the copper foil and the anode plate is set to be 5-10 cm.
4. The novel surface treating machine arrangement as recited in claim 1, further comprising: the upper end of the silane-coated square groove is positioned on a horizontal plane with the groove-entering guide roller and the groove-exiting guide roller.
5. The novel surface treating machine arrangement as recited in claim 1, further comprising: the copper foil horizontally runs to the upper end of the silane coating square groove and is coated by means of adhesive coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123169480.9U CN216738590U (en) | 2021-12-16 | 2021-12-16 | Novel surface treatment machine device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123169480.9U CN216738590U (en) | 2021-12-16 | 2021-12-16 | Novel surface treatment machine device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216738590U true CN216738590U (en) | 2022-06-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123169480.9U Active CN216738590U (en) | 2021-12-16 | 2021-12-16 | Novel surface treatment machine device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216738590U (en) |
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2021
- 2021-12-16 CN CN202123169480.9U patent/CN216738590U/en active Active
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