CN1174249A - Jet electroplating method - Google Patents
Jet electroplating method Download PDFInfo
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- CN1174249A CN1174249A CN 96109442 CN96109442A CN1174249A CN 1174249 A CN1174249 A CN 1174249A CN 96109442 CN96109442 CN 96109442 CN 96109442 A CN96109442 A CN 96109442A CN 1174249 A CN1174249 A CN 1174249A
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Abstract
In the jet electroplating method, the ion supply and reduction is separated into the first electrolysis system providing electrolyte containing metal ions and the second jet electroplating system. The said jet electroplating system has several jet electroplating pipes, which are used as anode and have several nozzles each. Printed circuit boards as cathod are conveyed to pass through jet electroplating pipes for automatic continous jet electroplating the wall of small holes in boards homogeneously.
Description
The present invention relates to a kind of jet electrolysis-plating method, particularly relate to and a kind of galvanized ion supply and reduction are separated into a dimension electrolysis (ion supply) system and Quadratic Finite Element spraying plating (reduction) system, it is tabular by plated item to can be used on automatic continuous plating, as the electro-plating method and the lead frame in the unicircuit (LEADFRAME) of printed circuit board (PCB), and can overcome the galvanized jet electrolysis-plating method that can't be eliminated by the bubble in the plated item hole of general immersion type.
The galvanized effect of Industrial products is product surface is provided a protective layer and promotes the attractive in appearance of Industrial products surface; then be in the plate face of printed circuit board (PCB) (hereinafter to be referred as the PC plate) and hole, to electroplate aspect the electronic industry; generally in the surface of PC plate and hole, plate the layer of copper metal, can make development of PC plate circuit and etching.
As shown in Figure 1, electro-plating method in the past is the immersion type electrochemical plating, most metal all can be used as plated material, commonly used is nickel, chromium, cadmium, copper, silver, zinc, gold and tin etc., electric plating method is to be seated in the same plating tank 13 by plated item 11 and eletrolyzable pure metal 12 and to be immersed in the electrolytic solution 14, eletrolyzable pure metal 12 is an anode 15, by plated item 11 is negative electrode 16, this electrolytic solution 14 is the solution of plated metal salt, used electric current is the direct current of 6-24 volt, during energising, the eletrolyzable pure metal 12 of anode 15 is dissociated into metal ion to electrolytic solution 14, and because the potential difference of anode and cathode, makes metal ion reduce deposition in this electrolytic solution 14 on by plated item 11 surfaces, and the metal ion in the electrolytic solution 14, then eletrolyzable pure metal 12 materials by anode 15 continue to replenish.
The PC plate of electronic industry develops into the double-sided multi-layer circuit card by single face, particularly two-sided galvanized PC plate, on the substrate that is covered with the copper layer, bore several apertures, to plug the conducting that some are electrically connected the electronic component of double-sided PCB or are used for interlayer circuit and surface lines, therefore need electroplate these apertures, be that as shown in Figure 1 immersion type is electroplated to the plating of aperture in the past, with the copper billet is anode 15, the PC plate that is plated is a negative electrode 16, make each aperture hole wall of PC plate plate the layer of copper metal, but electro-plating method in the past still has following shortcoming to the method for electroplating the aperture hole wall on this PC plate:
One, general immersion type is electroplated meeting generation bubble hydrogen in electrolytic solution, particularly be electrically connected negative electrode and can produce bubble hydrogen, and easily in the aperture attached to galvanized PC plate, and the bubble in this aperture and be not easy to eliminate, and cause the aperture hole wall can't electroplate or electroplate uneven shortcoming.
Two, uneven shortcoming can't be electroplated or electroplate to the aperture hole wall of this PC plate, can cause the downgrade of PC plate maybe can not use, and fraction defective is high, and increase the cost of electronic industry.
Three, immersion type plating tank anodic size in the past is a fixed, but the workpiece size of negative electrode is not necessarily identical, so point discharge effect that can cause because of the different with the anodic electrode size of negative electrode by plated item, make by the uneven coating around the plated item and spare, and can influence carrying out (as the etching) processing of subsequent handling.
Four, when the electroplating activity of PC plate, each PC plate needs to lift earlier to put on the shelf, unloads the good PC plate of plating again after plating is good, depends in the operation manually, so the processing procedure more complicated, the people is the error rate height that causes.
Main purpose of the present invention provides a kind of making and is tabularly electroplated and electroplate uniform jet electrolysis-plating method by the aperture hole wall on the plated item.
Second purpose of the present invention provides a kind of jet electrolysis-plating method that overcomes the bubble of hole inner cathode generation in the past.
The 3rd purpose of the present invention provides and a kind of galvanized ion supply and reduction is separated into a dimension electrolysis (ion supply) system and Quadratic Finite Element spraying plating (reduction) system, can automatic continuous flash plate by the jet electrolysis-plating method of plated item and aperture hole wall thereof.
The present invention is characterized in: ion supply and reduction are separated into a dimension electrolysis (ion supply) system and Quadratic Finite Element spraying plating (reduction) system, in this dimension electrolysis (ion supply) system, provide the electrolytic solution that contains metal ion, and import provided in this Quadratic Finite Element spraying plating (reduction) system be provided with most spray orifices more than two and electrically in the anodic spraying plating pipe, making the PC plate is that negative electrode is also carried by the spraying plating pipe, to carry out the continuous and automatic spraying plating, electroplated and electroplate effect of uniform thereby reach by plated item aperture hole wall, and overcome the shortcoming that produces bubble when in the past electroplating at tabular.
Method of the present invention comprises: a dimension electrolysis (ion supply) system, and it is to utilize electrolysis process that metal ion is released in the suitable electrolytic solution; Quadratic Finite Element spraying plating (reduction) system, it provides the spraying plating pipe that is located at more than two by on the plated item transport path, continuously be provided with more than two side by side spray orifice on each spraying plating pipe with appropriate intervals, the electrolytic solution that will contain metal ion imports respectively and evenly sprays the electrolytic solution that has metal ion in each spraying plating pipe and from each spray orifice, it is electrical that this spraying plating pipe is electrically connected anode, and to make by plated item be negative electrode and carry continuously by each spraying plating pipe, with the metal ion reduce deposition negative electrode by plated item on the aperture hole wall that wears.
The present invention is described in detail below in conjunction with drawings and Examples:
Fig. 1 is the synoptic diagram of groove shape immersion type electrochemical plating in the past;
Fig. 2 is the synoptic diagram of method preferred embodiment of the present invention;
Fig. 3 is the partial schematic diagram of Quadratic Finite Element spraying plating (reduction) system of method preferred embodiment of the present invention;
Fig. 4 is that the inventive method produces the synoptic diagram of electroplating with first preferred embodiment of metal ion;
Fig. 5 is that the inventive method produces the synoptic diagram of electroplating with second preferred embodiment of metal ion.
As shown in Figure 2, the present invention mainly is that metal ion supply and reduction with electroplating process is separated into a dimension electrolysis (ion supply) system 2 and Quadratic Finite Element spraying plating (reduction) system 3.
This dimension electrolysis (ion supply) system 2 utilizes electrolysis process that metal ion is released in the suitable electrolytic solution 21, and extracts the electrolytic solution 21 contain metal ion and offer the required metal ion of Quadratic Finite Element spraying plating (reduction) system 3.
This Quadratic Finite Element spraying plating (reduction) system 3 provides most to be located at by the spraying plating pipe 31 on plated item 4 transport paths, be provided with most spray orifices 311 side by side with proper spacing continuously on each spraying plating pipe 31, the electrolytic solution 21 that will contain metal ion imports respectively in each spraying plating pipe 31 and from its each spray orifice 311 and evenly sprays the electrolytic solution 21 that has metal ion, it is electrical that this spraying plating pipe 31 is electrically connected anode, and make this be negative electrode and continuous the conveying by each spraying plating pipe 31 by plated item 4, this spraying plating pipe 31 be sprayed at by the metal ion in the electrolytic solution on the plated item 4 21 can reduce deposition this of negative electrode by plated item 4 surfaces on, particularly can be sprayed at the hole wall (shown in Figure 3) of this aperture 411 that is worn on plated item 4 equably, just can reach this by the purpose of plated item 4 surfaces and the continuous uniformly-coating of aperture hole wall thereof.In addition, below this spraying plating pipe 31, provide an electroplate liquid backflash 32, can collect the electrolytic solution 21 that consumes metal ion and recirculation and extract to be back to and remove to replenish metal ion in this dimension electrolysis (ion supply) system 2.
This dimension electrolysis (ion supply) system 2 can fully provide the metal ion of electroplating usefulness, and the present invention illustrates that with two preferred embodiments it produces the method for metal ion:
First method, as shown in Figure 4, utilize anode dissociating metals ionic efficient to be higher than metal ion and produce the electrolytic solution that contains metal ion in the sedimentary efficient of cathodic reduction, its method is but but that electrolytic metal 22 is inserted in most the non-expendable hoops 23 that are immersed in electrolytic metal 22 metal salt solutions, this hoop 23 can be a kind of metal hoop as titanium alloy, only provide electric action and the on-consumable effect, and this each hoop 23 is connected to an anode and cathode reversible dc supply 24 (as Fig. 2) at interval, this anode and cathode reversible dc supply 24 can make each hoop 23 just produce respectively, the negative pole direct current, and exchange polarity after the time through one section setting, but make the electrolytic metal 22 in this each hoop 23 alternately when anode, consume the metal ion that produces, and utilize anode dissociating metals ionic efficient to be higher than at metal ion in the sedimentary efficient of cathodic reduction, when desiring to be deposited on negative electrode, metal ion reverses polarity simultaneously, making negative electrode transfer anode to discharges metal ion and oppositely pushes back metal ion again, the polarity of electrode can alternately be changed, and friendship phase release metal ions, the electrolytic solution 21 that contains metal ion with generation, the electrolytic solution 21 that will contain metal ion is provided out by the metal ion that just can provide this Quadratic Finite Element plating (reduction) system 3 required, and the anode metal that should alternately consume can be avoided making the too fast shortcoming of anode consumption at same electrode dissociating metals, but elongate the time of replenishing electrolytic metal, also can avoid the shortcoming of metal ion reduce deposition on negative electrode in this electrolytic solution 21.
Second method, as shown in Figure 5, be between the anode 25 of electrolyzer and negative electrode 26, an electrodialysis film 27 to be set, but this electrolytic metal 22 is provided with anode 25 and is immersed in the electrolytic solution 21,26 on negative electrode is a conductive electrode 28 and is immersed in the dilute acid soln 29 of electroconductibility, this electrodialysis film 27 has the characteristic that does not allow metal ion pass through and can conduct electricity, and can keep the electric connection path of this anode 25 and negative electrode 26, but the electrolytic metal 22 that therefore connects this anode 25 can continue to discharge ion in electrolytic solution, but can be separated on the electrode 28 that can not be deposited on this negative electrode 26 by this electrodialysis film 27, make this electrolytic solution 21 be full of metal ion, this electrolytic solution 21 that contains metal ion is extracted out the metal ion that just can provide this Quadratic Finite Element plating (reduction) system 3 required.
As Fig. 2, shown in 3, this is example by plated item 4 with two-sided galvanized PC plate 41, in this dimension electrolysis (ion supply) system 2, be positive electrode and dissociate cupric ion at this electrolytic solution 21 with the copper metal, the electrolytic solution 21 that contains cupric ion extracts to this isolating Quadratic Finite Element spraying plating (reduction) system 3 through recycle pump 51, and import on most, following correspondence be located in the spraying plating pipe 31 on these PC plate 41 transport paths and from these spraying plating pipe 31 spray orifices 311 evenly spray have metal ion electrolytic solution 21 on the PC plate, lower face, make the electrolytic solution of sprinkling form the successive cascade one, this spraying plating pipe 31 is that the electrical connection anode is electrical, provide the anode when electroplating electrical, so this spraying plating pipe 31 must be the material of non-electrolysis, it can be the metal of titanium alloy, the electrical of this electrolytic solution 21 only is provided and itself do not produce chemical reaction or dissociating metals ion, and the continuous conveying of this PC plate 41 is conveying roller 52 conveyings that each spraying plating pipe 31 is arranged by most consecutive intervals, and roller 52 in position is to connect the electrical negative electrode conductive casters 53 of negative electrode, make PC plate 41 become the electrical of negative electrode by this spraying plating pipe 31, by this, the copper metal ion that this spraying plating pipe 31 is sprayed at electrolytic solution 21 on the PC plate 41 can be deposited on the PC plate 41 of negative electrode, the hole wall of several apertures that worn on this PC plate 41 is electroplated evenly, so, make this PC plate 41 continuously by this majority spraying plating pipe 31, just can be with each aperture hole wall continuous electroplating last layer copper coating of this PC plate 41; And the electrolytic solution 21 that flows down when spraying plating after these electroplate liquid backflash 32 collections that are located at the below, is extracted by this recycle pump 51 and removes to replenish metal ion in pump around circuit to dimension electrolysis (ion supply) systems 2.
By above-mentioned structure, the present invention is separated into a dimension electrolysis (ion supply) system 2 and Quadratic Finite Element spraying plating (reduction) system 3 with supply of electroplated metal ion and reduction, and utilize this dimension electrolysis (ion supply) but system 2 continues to produce and includes electrolytic metal ionic electrolytic solution 21, and continue the continuous PC plate of carrying 41 of supply or electroplated required metal ion by plated item 4, make this by plated item 4 or PC plate 41 and on each aperture hole wall can straight line carry continuously automatically and carry out flash plate, the effect that the present invention can reach is as follows:
One, utilizes the water column of electrolytic solution 21 that spraying plating pipe 31 sprays, can destroy the bubble that in the PC of negative electrode plate 41 apertures, produces and adhere to, and constantly provide new electrolytic solution, overcome the shortcoming that general immersion type can't be eliminated by bubble in the plated item 4 aperture hole walls, this is electroplated evenly by the hole wall of plated item 4 (particularly printed circuit board (PCB)) aperture.
Two, uneven shortcoming can't be electroplated or electroplate to the aperture hole wall that overcomes this PC plate 41, and the fraction defective of this PC plate 41 in electroplating process lowered, and can reduce the cost of electronic industry and enhance competitiveness.
Three, the PC plate 41 of negative electrode is by the parallel electrolytic solution water column of anode spraying plating pipe, make its plate face area be covered (the plate face of contact cascade could be electroplated) by the electrolytic solution cascade of continuous parallel convection current ejection, make coating be plated on this equably, do not have in the past the point discharge effect that is caused because of workpiece and electrode size difference by in each aperture hole wall of plated item 4.
Four, utilize isolating this dimension electrolysis (ion supply) system 2 and Quadratic Finite Element spraying plating (reduction) system 3, reach this by the aperture hole wall continous way flash plate of plated item 4 as printed circuit board (PCB), make the electroplating activity fully automated, can enhance productivity, the purpose that reduces cost.
Claims (8)
1, a kind of jet electrolysis-plating method is separated into a dimension electrolysis (ion supply) system and Quadratic Finite Element spraying plating (reduction) system with the metal ion supply and the reduction of electroplating process, it is characterized in that:
This dimension electrolytic system is to utilize electrolysis process that metal ion is released in the electrolytic solution, and extracts the electrolytic solution contain metal ion and offer the required metal ion of Quadratic Finite Element spraying plating system;
This Quadratic Finite Element spraying plating system provides the spraying plating pipe that is located at more than two by on the plated item transport path, it is electrical that this spraying plating pipe is electrically connected anode, and to make this be negative electrode by plated item and carry continuously by each spraying plating pipe, this electrolytic solution that contains metal ion imported respectively in each spraying plating pipe and by this spraying plating pipe electrolytic solution is sprayed at by on the plated item, be sprayed at by the metal ion reduce deposition in the electrolytic solution on the plated item negative electrode by plated item on, the electrolytic solution that consumes metal ion then reclaims and pump around circuit removes to replenish metal ion to this dimension electrolytic system.
2, jet electrolysis-plating method as claimed in claim 1 is characterized in that:
Be provided with to consecutive intervals more than two side by side and be used to spray the spray orifice of electrolytic solution on each spraying plating pipe of this Quadratic Finite Element electroplating system.
3, jet electrolysis-plating method as claimed in claim 1 is characterized in that:
Each spraying plating pipe below of this Quadratic Finite Element electroplating system is an electroplate liquid backflash of collecting electrolytic solution.
4, jet electrolysis-plating method as claimed in claim 1 is characterized in that:
Each spraying plating pipe of this Quadratic Finite Element electroplating system is the titanium alloy metal.
5, jet electrolysis-plating method as claimed in claim 1 is characterized in that:
This continuous carrying method by plated item provides conveying roller that two above consecutive intervals arrange carrying by plated item, and a roller is to connect negative electrode electrically to make the negative electrode conductive casters that is become negative electrode by plated item that passes through.
6, jet electrolysis-plating method as claimed in claim 1 is characterized in that:
In this Quadratic Finite Element electroplating system, each spraying plating pipe of each plating tank be located in each plating tank by the top of plated item transport path and below.
7, jet electrolysis-plating method as claimed in claim 1 is characterized in that:
This dimension electrolytic system has an anode and cathode reversible dc supply, but is electrically connected the electrolytic metal that is immersed in more than two in the metal salt solution respectively, and the polarity of each metal can alternately be changed, and mutual release metal ions is in electrolytic solution.
8, jet electrolysis-plating method as claimed in claim 1 is characterized in that:
This dimension electrolytic system is provided with an electrodialysis film between the anode of this electrolyzer and negative electrode, but be anode and be immersed in this electrolytic solution with electrolytic metal, negative electrode is a conductive electrode and is immersed in the diluted acid of electroconductibility, this electrodialysis film can not pass through metal ion and can conduct electricity, and keep the electric connection of this anode and negative electrode, make anode can continue to discharge ion in this electrolytic solution, and make this electrolytic solution be full of metal ion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 96109442 CN1174249A (en) | 1996-08-16 | 1996-08-16 | Jet electroplating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 96109442 CN1174249A (en) | 1996-08-16 | 1996-08-16 | Jet electroplating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1174249A true CN1174249A (en) | 1998-02-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 96109442 Pending CN1174249A (en) | 1996-08-16 | 1996-08-16 | Jet electroplating method |
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| Country | Link |
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| CN (1) | CN1174249A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6174417B1 (en) | 1998-05-20 | 2001-01-16 | Process Automation International Ltd. | Electroplating machine |
| US6261425B1 (en) | 1998-08-28 | 2001-07-17 | Process Automation International, Ltd. | Electroplating machine |
| CN102330085A (en) * | 2011-09-13 | 2012-01-25 | 南京航空航天大学 | Composite processing method and device of multilayer film by chemical plating and jet electroplating |
| CN103305882A (en) * | 2012-03-07 | 2013-09-18 | 深南电路有限公司 | Electroplating method for PCB plate and apparatus |
| CN103348042A (en) * | 2011-01-28 | 2013-10-09 | Ppg工业俄亥俄公司 | Electrical contact arrangement for coating process |
| CN105470465A (en) * | 2015-01-21 | 2016-04-06 | 万向A一二三系统有限公司 | Pre-lithiation treatment process and device of silicon-based negative electrode |
| CN105862097A (en) * | 2016-06-06 | 2016-08-17 | 浙江振有电子股份有限公司 | HDI plate through-hole copper filling system based on pulse technology |
| CN108624943A (en) * | 2018-07-18 | 2018-10-09 | 惠州市捷成机电设备有限公司 | A kind of horizontal continuity electroplanting device and preparation method thereof |
| CN110923761A (en) * | 2019-12-26 | 2020-03-27 | 重庆切普电子技术有限公司 | Spraying electroplating system |
| CN112899743A (en) * | 2021-01-19 | 2021-06-04 | 鑫巨(深圳)半导体科技有限公司 | Electroplating device and electroplating method |
| CN112941579A (en) * | 2019-11-26 | 2021-06-11 | 昆山东威科技股份有限公司 | Production method for improving copper thickness of circuit board hole dense area and circuit board |
| WO2021164474A1 (en) * | 2020-02-20 | 2021-08-26 | 深圳市海瀚新能源技术有限公司 | Coating conductive device, coating system and coating method for conductive film |
-
1996
- 1996-08-16 CN CN 96109442 patent/CN1174249A/en active Pending
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6241860B1 (en) | 1998-05-20 | 2001-06-05 | Process Automation International, Ltd. | Electroplating machine |
| US6251234B1 (en) | 1998-05-20 | 2001-06-26 | Process Automation International, Ltd. | Electroplating machine |
| US6174417B1 (en) | 1998-05-20 | 2001-01-16 | Process Automation International Ltd. | Electroplating machine |
| US6261425B1 (en) | 1998-08-28 | 2001-07-17 | Process Automation International, Ltd. | Electroplating machine |
| CN103348042A (en) * | 2011-01-28 | 2013-10-09 | Ppg工业俄亥俄公司 | Electrical contact arrangement for coating process |
| CN103348042B (en) * | 2011-01-28 | 2016-10-26 | Ppg工业俄亥俄公司 | The electrical contact construction processed for coating |
| CN102330085A (en) * | 2011-09-13 | 2012-01-25 | 南京航空航天大学 | Composite processing method and device of multilayer film by chemical plating and jet electroplating |
| CN102330085B (en) * | 2011-09-13 | 2012-10-03 | 南京航空航天大学 | Composite processing method and device of multilayer film by chemical plating and jet electroplating |
| CN103305882A (en) * | 2012-03-07 | 2013-09-18 | 深南电路有限公司 | Electroplating method for PCB plate and apparatus |
| CN103305882B (en) * | 2012-03-07 | 2016-08-10 | 深南电路有限公司 | Pcb board electro-plating method and device |
| CN105470465B (en) * | 2015-01-21 | 2018-02-13 | 万向一二三股份公司 | The prelithiation handling process and device of a kind of silicon-based anode |
| CN105470465A (en) * | 2015-01-21 | 2016-04-06 | 万向A一二三系统有限公司 | Pre-lithiation treatment process and device of silicon-based negative electrode |
| CN105862097A (en) * | 2016-06-06 | 2016-08-17 | 浙江振有电子股份有限公司 | HDI plate through-hole copper filling system based on pulse technology |
| CN108624943A (en) * | 2018-07-18 | 2018-10-09 | 惠州市捷成机电设备有限公司 | A kind of horizontal continuity electroplanting device and preparation method thereof |
| CN112941579A (en) * | 2019-11-26 | 2021-06-11 | 昆山东威科技股份有限公司 | Production method for improving copper thickness of circuit board hole dense area and circuit board |
| CN110923761A (en) * | 2019-12-26 | 2020-03-27 | 重庆切普电子技术有限公司 | Spraying electroplating system |
| WO2021164474A1 (en) * | 2020-02-20 | 2021-08-26 | 深圳市海瀚新能源技术有限公司 | Coating conductive device, coating system and coating method for conductive film |
| US11821100B2 (en) | 2020-02-20 | 2023-11-21 | Xiamen Hithium Energy Storage Technology Co., Ltd. | Conductive plating apparatus, plating system and plating method for conductive film |
| CN112899743A (en) * | 2021-01-19 | 2021-06-04 | 鑫巨(深圳)半导体科技有限公司 | Electroplating device and electroplating method |
| US11702758B2 (en) | 2021-01-19 | 2023-07-18 | Simetric Semiconductor Solutions Co., Ltd. | Electroplating device and electroplating method |
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