CN112941579A - Production method for improving copper thickness of circuit board hole dense area and circuit board - Google Patents
Production method for improving copper thickness of circuit board hole dense area and circuit board Download PDFInfo
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- CN112941579A CN112941579A CN201911177313.3A CN201911177313A CN112941579A CN 112941579 A CN112941579 A CN 112941579A CN 201911177313 A CN201911177313 A CN 201911177313A CN 112941579 A CN112941579 A CN 112941579A
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- circuit board
- electroplating
- copper thickness
- plating
- dense area
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
Abstract
The invention discloses a production method for improving the copper thickness of a circuit board hole dense area and a circuit board, wherein the method comprises the following steps: s1, horizontally placing and fixing a circuit board in a plating bath, wherein the circuit board is connected with a negative electrode of a plating power supply and is immersed in plating solution in the plating bath; s2, fixing an electroplating anode plate in the electroplating bath, wherein the electroplating anode plate is connected with the anode of an electroplating power supply, is positioned under the circuit board and has a certain distance with the circuit board; s3, spraying the electroplating solution to the circuit board through a circulating pump device at a pressure greater than or equal to a preset pressure value, starting an electroplating power supply, and electroplating for a preset time; and S4, overturning the circuit board, spraying the electroplating solution to the circuit board through a circulating pump device at a pressure greater than or equal to a preset pressure value, and starting an electroplating power supply to electroplate for a preset time. By implementing the invention, the copper thickness of the circuit board hole dense area can be improved, so that the copper thickness of the circuit board panel area and the copper thickness of the hole dense area are more uniform.
Description
Technical Field
The invention relates to the technical field of circuit board electroplating, in particular to a production method for improving the copper thickness of a circuit board hole dense area and a circuit board.
Background
With the rapid development of electronic products, circuit boards are also developed in the direction of small aperture, high density, multiple layers and thin lines, and the high-precision thin lines become mainstream products. The requirement for the uniformity distribution of the copper thickness of the circuit board before the circuit is manufactured is higher when the high-precision fine circuit is manufactured. In the process of electroplating copper on a circuit board, the uniformity of the copper thickness distribution of the circuit board is a difficult problem, especially in the area with dense holes of a Ball Grid Array (BGA) of an IC carrier. The holes on the circuit board are used as interlayer connection and welding positions of the circuit, strict requirements are imposed on the thickness of hole copper, during the copper electroplating process, the plated layer in the holes is easy to form a horn shape, and when the copper plating thickness of the board surface meets the requirements, the copper thickness of the plated layer in the holes is at least 5-10 microns thinner than that of the board surface. In order to increase the copper thickness of the plating layer in the BGA dense area hole to meet the thickness requirement, the circuit board is usually produced by adopting a mode of prolonging the electroplating time, but when the copper thickness in the middle of the hole meets the requirement, the copper thickness of the hole opening is excessively thick, and the copper plating thickness of other areas of the board surface exceeds more.
Disclosure of Invention
In view of this, the embodiment of the invention provides a production method for increasing the copper thickness of a circuit board hole dense area and a circuit board, so as to solve the problem that the copper thickness distribution of the circuit board is seriously uneven in the circuit board copper electroplating process.
According to a first aspect, an embodiment of the present invention provides a production method for increasing a copper thickness in a circuit board hole dense area, including: s1, horizontally placing and fixing a circuit board in a plating bath, wherein the circuit board is connected with a negative electrode of a plating power supply and is immersed in plating solution in the plating bath; s2, fixing an electroplating anode plate in the electroplating bath, wherein the electroplating anode plate is connected with the anode of an electroplating power supply, is positioned under the circuit board and has a certain distance with the circuit board; s3, spraying the electroplating solution to the circuit board through a circulating pump device at a pressure greater than or equal to a preset pressure value, starting an electroplating power supply, and electroplating for a preset time; and S4, overturning the circuit board, spraying the electroplating solution to the circuit board through a circulating pump device at a pressure greater than or equal to a preset pressure value, and starting an electroplating power supply to electroplate for a preset time.
Alternatively, in steps S3 and S4, the pressure is the head pressure of the circulating pump device spray solution and the plating solution on the surface of the circuit board in the plating tank or the circulating pipe pressure of the circulating pump device.
Optionally, the height of the liquid level difference between the spray liquid of the circulating pump device and the electroplating liquid on the surface of the circuit board in the electroplating bath is 80-100 cm.
Optionally, the preset pressure value is 2.5-3.5 kg/cm2。
Optionally, in step S2, the plated anode plate is an insoluble anode.
Optionally, in step S2, the distance between the circuit board and the plated anode plate is 8-12 CM.
Alternatively, in steps S2 and S3, the plating is performed at a current density of 2-3 ASD.
Optionally, before step S1, the method further includes: s0. the circuit board is fully electroplated with copper to a predetermined thickness.
Optionally, in step S0, the predetermined thickness is 8-15 μm.
According to a second aspect, an embodiment of the present invention provides a circuit board, where the circuit board is prepared by using the method for increasing the copper thickness in the hole dense region of the circuit board in the first aspect or any implementation manner of the first aspect.
According to the production method for improving the copper thickness of the dense area of the circuit board hole, the circuit board is horizontally placed and fixed in the electroplating bath, the circuit board is connected with the negative electrode of the electroplating power supply, the circuit board is immersed in the electroplating solution in the electroplating bath, the electroplating anode plate is fixed in the electroplating bath, the electroplating anode plate is connected with the positive electrode of the electroplating power supply and is positioned under the circuit board and has a certain distance with the circuit board, the electroplating solution is sprayed to the circuit board by a circulating pump device at the pressure greater than or equal to the preset pressure value, the electroplating power supply is started, and electroplating is carried out for the preset time; and then the circuit board is turned over, the electroplating solution is sprayed to the circuit board by the pressure which is more than or equal to the preset pressure value through the circulating pump device, the electroplating power supply is started, and the electroplating is carried out for the preset time, so that the electroplating solution quickly passes through the hole under the action of external pressure, the electroplating anode plate is only arranged on one side of the circuit board, cations moving in the electroplating solution are only concentrated on one side of the circuit board, which is opposite to the electroplating anode plate, so that the applied current only acts in the flowing hole of the electroplating solution and around the hole opening on one side of the electroplating anode plate, and only the hole of the circuit board and the hole opening on one side of the electroplating anode. Through with the positive and negative twice copper facing of circuit board, can thicken downthehole and the pore mouth around the copper thickness of both sides of circuit board to promote circuit board BGA hole intensive district copper thickness, thereby make the copper thickness of the normal panel district of circuit board and BGA hole intensive district copper thickness comparatively even.
Drawings
In order to more clearly illustrate the detailed description of the invention or the technical solutions in the prior art, the drawings that are needed in the detailed description of the invention or the prior art will be briefly described below. It is obvious that the drawings in the following description are some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
Fig. 1 shows a flow chart of a production method for increasing copper thickness in a circuit board hole dense area according to an embodiment of the invention;
FIG. 2 is a schematic diagram showing an aperture in one side of a circuit board and copper thickness in a hole in the circuit board in an embodiment of the invention;
FIG. 3 is a schematic diagram showing the aperture on the other side of the circuit board and the copper thickness in the hole in the circuit board in an embodiment of the invention;
fig. 4 is a flow chart of another method for producing copper thickness in the hole dense region of the elevated circuit board according to the embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
This invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concept of the invention to those skilled in the art, and the present invention will only be defined by the appended claims. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity.
In the process of electroplating copper on a circuit board, the uniformity of the copper thickness distribution of the circuit board is a difficult problem, especially in the area with dense holes of a Ball Grid Array (BGA) of an IC carrier. The general phenomenon is that for the circuit board hole dense area, when the production conditions are the same, the copper thickness of the area is at least 5-10 microns thinner than that of other common areas of the board surface, as shown in table 1, the copper thickness of other common areas of the board surface is 5.8 microns thicker than that of the BGA hole dense area on average, and the problem cannot be solved no matter how the electroplating equipment and the electroplating solution are adjusted. In view of this phenomenon, the inventors found that under the same electroplating condition, the area to be electroplated in the dense area of the circuit board holes is generally 8-15 times of the area to be electroplated in other areas (under the condition that the surface areas of the dense area of the circuit board holes and other areas are the same), and that no matter how much the electroplating equipment and the electroplating solution are adjusted, the abnormality of serious uneven thickness of the electroplated copper cannot be effectively improved because the difference between the areas to be electroplated is too great.
TABLE 1
Therefore, the inventor finds a production method for improving the copper thickness of the circuit board hole dense area according to repeated tests. As shown in fig. 1, the method for producing copper thickness in the enhanced wiring board hole dense region includes:
s1, horizontally placing and fixing a circuit board in a plating bath, wherein the circuit board is connected with a negative electrode of a plating power supply and is immersed in plating solution in the plating bath; specifically, the electroplating bath can be divided into three layers, the electroplating power supply can be a direct current rectifier, and the circuit board is connected with the cathode of the rectifier and then horizontally placed and fixed at the bottom of the upper layer of the electroplating bath. The lower layer of the plating tank is used for storing and collecting the plating solution. The liquid level of the electroplating solution in the electroplating bath exceeds the upper surface of the circuit board. The electroplating solution used in the embodiment of the invention is a common electroplating solution with a normal formula.
S2, fixing an electroplating anode plate in the electroplating bath, wherein the electroplating anode plate is connected with the anode of an electroplating power supply, is positioned under the circuit board and has a certain distance with the circuit board; specifically, the electroplating anode plate may be a soluble anode or an insoluble anode, and in this embodiment, the electroplating anode plate is taken as an insoluble anode for example, after the insoluble anode is connected to the anode of the rectifier, the insoluble anode is placed in the middle layer of the electroplating bath and fixed, a certain distance is provided between the insoluble anode and the circuit board, and the distance between the circuit board and the electroplating anode plate is 8-12 CM.
And S3, spraying the electroplating solution to the circuit board through a circulating pump device at a pressure greater than or equal to a preset pressure value, starting an electroplating power supply, and electroplating for a preset time. Specifically, the circulating pump device can be a circulating pump, and the embodiment of the invention pressurizes the electroplating solution by the circulating pump, wherein the preset pressure value is 3.0kg/cm2The pressure may be a head pressure or a plating solution circulating pipe pressure, and the pressure is controlled to be 3.0kg/cm or more by a circulating pump2The electroplating solution is sprayed to the circuit board under the pressure, the electroplating solution rapidly passes through the hole under the action of external pressure, and the electroplating power supply is turned on at the moment to give a production current value. Because the electroplating anode plate is only arranged on one side of the circuit board, cations moving in the electroplating solution are only concentrated on one side of the circuit board, which is opposite to the electroplating anode plate, and the applied current only acts in the hole where the electroplating solution flows and around the hole opening on one side of the electroplating anode plate, so that copper plating is only carried out on the hole of the circuit board and around the hole opening on one side of the electroplating anode plate. Generally, production conditions are determined according to the required thickness of the electroplated copper, and an electroplating power supply is generally recommended to carry out electroplating at a current density of 2-3 ASD for a preset time to reach the required thickness of the electroplated copper. The required thickness of the electroplated copper is set according to the actual production requirement, and the electroplating preset time is equal to the thickness of the electroplated copperIs proportional. The desired thickness of the electroplated copper is determined, and the predetermined time for electroplating can be determined. For example, the plating conditions of 3ASD plating for 30 minutes can make the thickness of copper in the hole of the board and the hole of the board on the side of the board as thick as shown in fig. 2.
And S4, overturning the circuit board, spraying the electroplating solution to the circuit board through a circulating pump device at a pressure greater than or equal to a preset pressure value, and starting an electroplating power supply to electroplate for a preset time. Specifically, because the outside of the aperture of the circuit board on the side opposite to the electroplated anode plate is hardly plated with copper, the circuit board needs to be turned over and the other side of the circuit board needs to be electroplated using the same process conditions and method. For example, the plating conditions of 3ASD plating for 30 minutes can make the thickness of copper in the hole of the circuit board and the hole of the circuit board on the other side of the circuit board to the thickness shown in fig. 3.
According to the production method for improving the copper thickness of the BGA hole dense area of the circuit board, the circuit board is horizontally placed and fixed in an electroplating bath, the circuit board is connected with the negative electrode of an electroplating power supply, the circuit board is immersed in electroplating solution in the electroplating bath, an electroplating anode plate is fixed in the electroplating bath, the electroplating anode plate is connected with the positive electrode of the electroplating power supply and is positioned under the circuit board and has a certain distance with the circuit board, the electroplating solution is sprayed to the circuit board through a circulating pump device at the pressure greater than or equal to a preset pressure value, the electroplating power supply is started, and electroplating is carried out for a preset time; the circuit board is turned over again, the electroplating solution is sprayed to the circuit board by the pressure which is greater than or equal to the preset pressure value through the circulating pump device, the electroplating power supply is started, and the electroplating is carried out for the preset time, so that the electroplating solution rapidly passes through the hole under the action of external pressure, the electroplating anode plate is only arranged on one side of the circuit board, cations moving in the electroplating solution are only concentrated on one side of the circuit board, which is opposite to the electroplating anode plate, so that the applied current only acts in the flowing hole of the electroplating solution and around the hole opening on one side of the electroplating anode plate, and copper plating is carried out on the hole of the circuit board and around the hole opening. Through the positive and negative copper plating of circuit board, can thicken the hole of circuit board and the copper thickness around the drill way of two sides to promote the copper thickness of circuit board hole intensive district, finally make the copper thickness of circuit board panel district and the copper thickness of hole intensive district comparatively even.
In alternative embodiments, in steps S3 and S4, the pressure is the liquid level difference pressure between the spray liquid of the circulation pump device and the plating liquid on the surface of the circuit board in the plating tank or the circulation pipe pressure of the circulation pump device. Specifically, the height of the liquid level difference between the spraying liquid of the circulating pump device and the electroplating liquid on the surface of the circuit board in the electroplating bath is 80-100 cm, and in actual operation, the electroplating liquid can be sprayed to the circuit board when lifted to the height of 80-100 cm away from the surface of the circuit board in the electroplating bath by the circulating pump device. The plating solution may be pressurized to at least 3.0kg/cm by a circulation pump device2And spraying to the circuit board.
In actual production, before the copper thickness of the dense area of the circuit board hole is increased, the circuit board needs to be subjected to one-time full-board electroplating (so-called 'flash plating' or 'pre-plating', which aims to protect a thin chemical copper layer in the hole and carry out copper plating on the normal board surface of the circuit board), and the preset thickness is 8-15 μm, so that the board surface of the circuit board and the dense area of the hole are attached with copper with the preset thickness.
For example, as shown in fig. 4, before step S1, the method further includes: s0. the circuit board is fully electroplated with copper to a predetermined thickness. After the copper plating is carried out on the circuit board, the copper thickness of the board surface of the circuit board can meet the requirement, the copper thickness of the hole dense area of the circuit board is smaller than that of the normal board surface, and after the copper thickness of the hole dense area is increased by adopting the method of the steps S1-S4, the copper thickness of the normal board surface of the circuit board can be equal to that of the BGA hole dense area, so that the copper thickness of the normal panel area of the circuit board is more uniform than that of the BGA hole dense area.
The embodiment of the invention also provides a circuit board which is prepared by adopting the production method for improving the copper thickness of the circuit board hole dense area in any implementation mode. The specific method for increasing the copper thickness in the circuit board hole dense area is described in the above embodiments, and is not described herein again.
According to the circuit board provided by the embodiment of the invention, the circuit board is horizontally placed and fixed in the electroplating bath, the circuit board is connected with the cathode of the electroplating power supply, the circuit board is immersed in the electroplating solution in the electroplating bath, the electroplating anode plate is fixed in the electroplating bath, the electroplating anode plate is connected with the anode of the electroplating power supply and is positioned under the circuit board and has a certain distance with the circuit board, the electroplating solution is sprayed to the circuit board by a circulating pump device at the pressure greater than or equal to the preset pressure value, the electroplating power supply is started, and electroplating is carried out for the preset time; the circuit board is turned over again, the electroplating solution is sprayed to the circuit board by the pressure which is greater than or equal to the preset pressure value through the circulating pump device, the electroplating power supply is started, and the electroplating is carried out for the preset time, so that the electroplating solution rapidly passes through the hole under the action of external pressure, the electroplating anode plate is only arranged on one side of the circuit board, cations moving in the electroplating solution are only concentrated on one side of the circuit board, which is opposite to the electroplating anode plate, so that the applied current only acts in the flowing hole of the electroplating solution and around the hole opening on one side of the electroplating anode plate, and copper plating is carried out on the hole of the circuit board and around the hole opening. Through the copper plating of positive and negative twice with the circuit board, can thicken the hole of circuit board and the copper thickness around the drill way of two sides, promote the circuit board hole and concentrate district's copper thickness to make the copper thickness of the normal panel district of circuit board and the copper thickness of the concentrated district of hole comparatively even.
Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations fall within the scope defined by the appended claims.
Claims (10)
1. The production method for improving the copper thickness of the dense area of the circuit board hole is characterized by comprising the following steps of:
s1, horizontally placing and fixing a circuit board in a plating bath, wherein the circuit board is connected with a negative electrode of a plating power supply and is immersed in plating solution in the plating bath;
s2, fixing an electroplating anode plate in the electroplating bath, wherein the electroplating anode plate is connected with the anode of an electroplating power supply, is positioned under the circuit board and has a certain distance with the circuit board;
s3, spraying the electroplating solution to the circuit board through a circulating pump device at a pressure greater than or equal to a preset pressure value, starting an electroplating power supply, and electroplating for a preset time;
and S4, overturning the circuit board, spraying the electroplating solution to the circuit board by a circulating pump device at a pressure greater than or equal to a preset pressure value, starting the electroplating power supply, and electroplating for a preset time.
2. The method of claim 1, wherein in steps S3 and S4, the pressure is a difference between the spray liquid of the circulating pump device and the plating liquid on the surface of the circuit board in the plating tank or the pressure of the circulating pipe of the circulating pump device.
3. The method for increasing the copper thickness in the dense area of circuit board holes as claimed in claim 2, wherein the height of the liquid level difference between the spray liquid of the circulating pump device and the electroplating liquid on the surface of the circuit board in the electroplating bath is 80-100 cm.
4. The production method for improving the copper thickness of the circuit board hole dense area according to claim 1, wherein the preset pressure value is 2.5-3.5 kg/cm2。
5. The method of claim 1, wherein in step S2, the plated anode plate is an insoluble anode.
6. The method for increasing the copper thickness in the circuit board hole dense area according to claim 1, wherein in step S2, the distance between the circuit board and the electroplating anode plate is 8-12 CM.
7. The method of claim 1, wherein the plating is performed at a current density of 2-3 ASD in steps S2 and S3.
8. The method for producing copper thickness in the raised circuit board hole dense area as claimed in claim 1, further comprising, before step S1:
s0. the circuit board is fully electroplated with copper to a predetermined thickness.
9. The method for producing copper thickness in the raised circuit board hole dense area as claimed in claim 8, wherein in step S0, the predetermined thickness is 8-15 μm.
10. A circuit board is characterized in that a plurality of circuit boards are arranged,
the circuit board is prepared by the production method for improving the copper thickness of the circuit board hole dense area according to any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911177313.3A CN112941579B (en) | 2019-11-26 | 2019-11-26 | Production method for improving copper thickness of circuit board hole dense area and circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911177313.3A CN112941579B (en) | 2019-11-26 | 2019-11-26 | Production method for improving copper thickness of circuit board hole dense area and circuit board |
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| CN112941579B CN112941579B (en) | 2022-09-23 |
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Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1174249A (en) * | 1996-08-16 | 1998-02-25 | 柯建信 | Jet electroplating method |
| JP2001358462A (en) * | 2000-06-12 | 2001-12-26 | Ibiden Co Ltd | Via hole-filling device |
| TW578805U (en) * | 2001-04-12 | 2004-03-01 | Jian-Shin Ke | Structure for uniformly distributing current for porous anode |
| CN1746339A (en) * | 2005-09-07 | 2006-03-15 | 沪士电子股份有限公司 | Jetting electroplating method directly of nozzle |
| TW201408819A (en) * | 2012-08-23 | 2014-03-01 | ming-hong Guo | Electroplating assistant plate and electroplating apparatus using the same |
| CN206109565U (en) * | 2016-08-29 | 2017-04-19 | 广州兴森快捷电路科技有限公司 | Electroplating device |
| CN106609387A (en) * | 2015-10-23 | 2017-05-03 | 宣浩卿 | Spraying apparatus for plating solution on printed circuit board |
| CN107313085A (en) * | 2016-04-26 | 2017-11-03 | 中国科学院金属研究所 | The copper plating fill method of fine blind hole in a kind of high density circuit board |
| CN207672141U (en) * | 2017-09-29 | 2018-07-31 | 麦德美科技（苏州）有限公司 | Electroplanting device with locomotive function jet flow bar |
| CN208038573U (en) * | 2017-09-29 | 2018-11-02 | 麦德美科技（苏州）有限公司 | Electroplanting device with locomotive function jet flow bar |
| CN110493976A (en) * | 2019-08-23 | 2019-11-22 | 生益电子股份有限公司 | A kind of PCB electroplanting device |
-
2019
- 2019-11-26 CN CN201911177313.3A patent/CN112941579B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1174249A (en) * | 1996-08-16 | 1998-02-25 | 柯建信 | Jet electroplating method |
| JP2001358462A (en) * | 2000-06-12 | 2001-12-26 | Ibiden Co Ltd | Via hole-filling device |
| TW578805U (en) * | 2001-04-12 | 2004-03-01 | Jian-Shin Ke | Structure for uniformly distributing current for porous anode |
| CN1746339A (en) * | 2005-09-07 | 2006-03-15 | 沪士电子股份有限公司 | Jetting electroplating method directly of nozzle |
| TW201408819A (en) * | 2012-08-23 | 2014-03-01 | ming-hong Guo | Electroplating assistant plate and electroplating apparatus using the same |
| CN106609387A (en) * | 2015-10-23 | 2017-05-03 | 宣浩卿 | Spraying apparatus for plating solution on printed circuit board |
| CN107313085A (en) * | 2016-04-26 | 2017-11-03 | 中国科学院金属研究所 | The copper plating fill method of fine blind hole in a kind of high density circuit board |
| CN206109565U (en) * | 2016-08-29 | 2017-04-19 | 广州兴森快捷电路科技有限公司 | Electroplating device |
| CN207672141U (en) * | 2017-09-29 | 2018-07-31 | 麦德美科技（苏州）有限公司 | Electroplanting device with locomotive function jet flow bar |
| CN208038573U (en) * | 2017-09-29 | 2018-11-02 | 麦德美科技（苏州）有限公司 | Electroplanting device with locomotive function jet flow bar |
| CN110493976A (en) * | 2019-08-23 | 2019-11-22 | 生益电子股份有限公司 | A kind of PCB electroplanting device |
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| CN112941579B (en) | 2022-09-23 |
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