KR20100067823A - Electroplating device and fabricating method for the - Google Patents

Abstract

PURPOSE: A plating device and a wiring board manufacturing method using the same are provided to carry out plating without dipping a work piece in plating liquid by employing a floating method which makes the plating liquid contact only to a single side of the work piece. CONSTITUTION: A plating device(50) comprises a plating bath(51), a plating unit, a plating liquid supply unit(53), and conducting units(11,13). The plating bath in which plating liquid is filled so that a single side of a work piece(60) is plated by contacting the plating liquid. The plating liquid supply unit is formed under the plating tub and comprises a plurality of holes for supplying the plating liquid to the single side of the work piece. The conducting units apply current to the work piece.

Description

Plating apparatus and fabrication method of wiring board using same {electroplating device and fabricating method for the}

The embodiment relates to a plating apparatus and a manufacturing method of a wiring board using the same.

Electronic devices are becoming smaller, lighter, and thinner, and thus, high integration of components used in electronic devices is required. To cope with this, a tape carrier package using a polyimide in the form of a tape, which is an insulator capable of implementing a fine pitch, may be a tape carrier package (hereinafter referred to as "TCP").

In a wiring board such as a tape carrier used as an electronic component, a wiring pattern such as an inner lead is generally formed on the surface of a substrate, and various hole patterns such as via holes and ground patterns are formed. It forms on the back side.

The via hole is a through hole penetrating through the insulator substrate and reaching the wiring pattern, and serves to electrically connect the wiring pattern formed on the surface and the back surface by plating a metal in the hole.

Solder ball to the external connection terminal junction of the wiring pattern In order to secure high bonding strength and high reliability, via-filling copper plating is commonly used to fill via holes.

1 is a block diagram showing a plating process using a general plating apparatus.

Referring to FIG. 1, a general plating apparatus includes a plating part 3 for plating a plated body in a plating bath, and a plating part 3 at front and rear ends of the plating part 3 so that plating metal ions are reduced in plating solution. Mask forming portion for attaching a masking tape to the first conducting portion 1 and the second conducting portion 5 for applying current to the object to be plated, and the portion where plating is not performed before being carried into the plating portion 3. (2), the mask removal part 4 for removing the masking tape from the to-be-plated body which is carried out to the said plating part 3 and the plating is completed is included.

The first conducting portion 1 is disposed before the plating portion 3 and connected to the plated body, and the second conducting portion 5 is disposed after the plating portion 3 and connected to the plated body to thereby form the plating portion. (3) Allow current to flow to the plated body located in (3).

The plating bath may further include a splitter plate and a positive electrode plate for injecting a plating liquid.

Such a general plating apparatus requires a mask forming portion 2 and a mask removing portion 4 because plating is performed while the entire tape carrier is immersed in the plating liquid in the plating portion 3.

That is, conventionally, the method of spraying a plating liquid to a to-be-plated body with the spray was used, soaking the whole tape carrier which is a to-be-plated body in the plating liquid in a plating tank. In this case, a process of attaching the masking tape to the circuit surface and a process of detaching the masking tape after plating are required in order to allow plating only on one side of the tape carrier.

When the masking tape is detached / attached, the equipment investment cost and material cost are increased, and the process yield due to defects is lowered.

In addition, when the masking tape is attached to the circuit part, the current passing method becomes complicated, which increases the complexity of the entire process, and when the masking tape is not completely removed in the detachment process, defects may be caused by foreign matter.

In addition, as the tape carrier is lifted by spraying the plating liquid at a high pressure by spraying, the liquid penetration in the via hole is not uniformly performed, so that plating may be uneven.

The embodiment provides a plating apparatus in which the plating liquid contacts only one surface of the to-be-plated body to perform plating.

The embodiment provides a compact and simple plating apparatus by omitting the apparatus for the detaching process of the masking tape.

The embodiment provides a method of manufacturing a wiring board using a plating apparatus with a simple process and improved process reliability.

The plating apparatus according to the embodiment includes a plating tank in which a plating liquid is contained and a one side of a plated body to contact the plating liquid.

In the method of manufacturing a wiring board using the plating apparatus according to the embodiment, the wiring board is carried into a plating bath containing a plating solution, one side of the wiring board is in contact with the plating solution and plating is performed, and the wiring board is in a plating bath. Including the steps to be taken out.

The plating apparatus according to the embodiment does not need a process for attaching and detaching a masking tape, so the equipment is compact and the plating process time is shortened.

The plating apparatus according to the embodiment does not need to attach or detach the masking tape, so that the current flow becomes simple, thereby simplifying the process and improving yield.

Plating apparatus according to the embodiment is a floating (floating) method for contacting the plating liquid only on one side, the plating is made, there is no need to deposit the plated body in the plating liquid has a simple configuration of the equipment.

The wiring board manufactured by using the plating apparatus according to the embodiment has an excellent effect of excellent plating characteristics in the liquid penetration uniformity in the via hole.

A plating apparatus and a method of manufacturing a wiring board using the same according to an embodiment will be described in detail with reference to the accompanying drawings.

In the description of the embodiments, where described as being formed "on / over" of each layer, the on / over may be directly or through another layer ( indirectly) includes everything formed.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not necessarily reflect the actual size.

2 is a block diagram showing the configuration of a plating apparatus according to the embodiment. 3 is a cross-sectional view showing a plating process of the plating apparatus according to the embodiment.

2 and 3, the plating apparatus 50 is disposed below the plating bath 51 in which the plating liquid 57 is contained and the plating bath 51, and the plating solution 50 is formed on one side of the plated body 60. Plating liquid supply parts 53 having a plurality of holes for supplying 57 at a constant flow rate, and conducting parts 11 and 13 disposed at both ends of the plating bath 51 to apply current to the plated body 60. It includes.

The plating apparatus may further include a guide part for guiding one side of the plated body 60 to contact the plating solution 57.

The plated body 60 may be formed in a tape carrier structure.

The to-be-plated body 60 is, for example, a wiring board having a circuit surface formed on one surface and a via hole formed on the other surface, and plating is performed in the via hole by the plating apparatus.

The to-be-plated body 60 is floated on the plating liquid 57 in the plating tank 51 to be plated only on one side, and the other surface that is not plated, that is, the circuit surface is in contact with the outside air.

Although not shown, the guide unit maintains a constant tension to prevent the lifting to be uniformly plated on the plated body (60). The guide part may be formed in a roller type, and the guide part may serve to transfer the plated body 60 at a constant speed in the plating part 12.

The guide portion may serve to change the conveying direction of the plated body 60 in the form of a tape carrier, and prevent sagging.

The conductive part may include a first conductive part 11 and a second conductive part 13.

The first conducting portion 11 is disposed in front of the plating portion 12 when the transfer direction of the plated body 60 is a reference, and the second conducting portion 13 is the plating portion 12. It is placed at the rear end.

As a result, a current may be applied to the plated body 60 positioned in the plating part 12.

The electrode plate 55 is further disposed in the plating bath 51 to correspond to the plated body 60.

The electrode plate 55 may be, for example, a positive electrode plate. In this case, the plated body 60 serves as a negative electrode plate.

The electrode plate 55 may use an insoluble substrate coated with an iridium oxide film (IrO ₂ ) on titanium (Ti).

The electrode plate 55 may be disposed between the plated body 60 and the plating solution supply unit 53, and the electrode plate 55 may have a mesh structure.

The fine particles of the plating metal of the plating liquid 57 are reduced between the plated body 60 and the electrode plate 55 by the current formed by the plated body 60 and the electrode plate 55 at the cathode side. It is deposited on the surface of the plated body 60 is firmly attached to the plating is made.

Meanwhile, when plating is performed on the plated body 60 in the plating unit 12, the plating solution supply unit 53 disposed under the plating tank 51 continuously supplies the plating solution 57 to the electrode plate 55. The plating liquid 57 is supplied to the plating surface of the plated body 60 through the mesh plate electrode plate 55.

The plating liquid supply unit 53 may have a porous plate structure, and the plating liquid 57 is injected at a predetermined flow rate through the plurality of holes.

In the general deposition type plating apparatus 50, the plated body 60 is deposited by plating in the plating solution 57, and the plating solution 57 is sprayed at a high pressure by spraying on the deposited plated body 60. In the plating apparatus 50 according to the embodiment, the plating solution 50 is plated with the plated body 60 floating on the plating solution 57 so that only one surface thereof is in contact with the plating solution 50. By spraying the plating liquid at a flow rate of 30 to 80 l / min.

The flow rate is determined by adjusting the flow rate control unit 12a so that the plating liquid does not overflow to the back surface of the plated body 60 that does not contact the plating liquid 57 when the plating liquid 57 is injected onto the plated body 60. .

At this time, since the to-be-plated body 60 is a film type, tension and path lines are optimized to prevent sagging.

Therefore, the hole size of the plating liquid supply part 53 may also be larger than the hole size of the splitter plate used in the plating apparatus 50 of the general deposition type.

The plating solution 57 may include at least one of copper sulfate (CuSO ₄ ), sulfuric acid (H ₂ SO ₄ ), iron sulfate (FeSO ₄ ), and sodium chloride (NaCl).

The plating liquid may further include an additive, and the additive may include at least one of an accelerator, a moderator, and a planarizer.

Accelerators include disulfide-based BISSulfopropyl disulfide (SPS), MPSA (3-mercapto-1-propanesulfonic acid), DPS (3-N, N-dimethylaminodithiocarbamoyl-1-propanesulfonic acid) and MBIS (2-mercapto-5 -benzimidazolesulfonic acid).

The moderator includes at least one of polyethylene glycol (PEG) and Thiourea.

The planarizer mainly uses the nitrogen and / or ammonium series.

Here, by placing an ultrasonic washing tank in front of the plating unit 12, by adding a accelerator of a predetermined concentration in the ultrasonic washing tank can improve the wettability (wettability) in the via hole.

FIG. 4 is an enlarged view of portion “A” of FIG. 3.

5 is a cross-sectional view showing a wiring board manufactured using the plating apparatus according to the embodiment.

3 to 5, a manufacturing process of the plated body 60 in which the plating process is performed by the plating apparatus 50 according to the embodiment will be described.

First, an insulating substrate 10 is prepared.

The substrate 10 may be a substrate in which epoxy and an inorganic filler are filled in a polyimide material or glass fiber. The thickness of the substrate 10 may be 20 ~ 200㎛.

A plurality of via holes 20 are formed in the substrate 10. The via hole 20 may be formed by using the substrate 10 by using one of a mechanical drill, a laser drill, and a punching process. The via hole 20 may also form the substrate 10 through a selective etching method such as photolithography.

The metal film 30 is formed on the other surface of the substrate 10 on which the via holes 20 are formed.

The metal film 30 may be a copper thin film.

The metal film 30 may be attached to the substrate 10 using an adhesive.

The substrate 10 prepared as described above is carried into the plating bath 51 containing the plating liquid.

At this time, only one side of the substrate 10 on which the via hole 20 is formed is floated in the plating liquid 57 so as to be brought into contact with the plating liquid 57.

The substrate 10, which is in contact with the plating liquid 57, has a current flowing through the first and second conducting portions 11 and 13 and a predetermined voltage is applied to the electrode plate 55, thereby providing the substrate 10 and the electrode. The plating metal in the plating solution 57 is reduced by the current density flowing between the plates 55 so that the plating metal is filled in the via hole 20.

The flow rate of the plating liquid injected to one side of the wiring substrate is controlled to be 30 to 80 l / min. So that the substrate 10 floated on the plating liquid 57 does not lift or the plating liquid overflows on the circuit surface of the substrate 10. do.

The plating apparatus 50 according to the embodiment does not need to attach or detach the masking tape, so that the current flow becomes simple, the process may be simplified and the yield may be improved.

In addition, the plating apparatus 50 according to the embodiment is a floating method of contacting the plating liquid only on one side, and since plating is performed, there is no need to deposit the plated body 60 in the plating liquid 57 so that the configuration of the equipment is reduced. Simple.

The wiring board manufactured using the plating apparatus 50 according to the embodiment has excellent plating characteristics because of excellent liquid penetration uniformity in the via hole.

Plating may be performed by a desired thickness in one plating bath 51, or a plurality of plating baths 51 may be provided to sequentially plate a plurality of plating baths.

Thereafter, the substrate 10 is removed from the plating bath 51 to form a conductor layer having a desired thickness in the via hole, thereby completing the plating process.

Referring to FIG. 5, after the wiring board is taken out of the plating bath 51, the metal pattern 30 formed on the other surface of the substrate 20 is patterned to form the metal pattern 30a. The metal pattern 30a forms a circuit portion electrically connected to the semiconductor chip to be mounted.

The metal pattern 30a may be formed using a photolithography process.

The metal pattern 30a may be a wiring pattern for electrically connecting the conductor layer 42 and the semiconductor chip to be mounted on the substrate 10.

A non-conductive solder resist 50 is formed on the metal pattern 30a to protect the substrate 10. The solder resist 50 forms an insulating film on the metal pattern 30a in a region other than the metal pattern region connected to the semiconductor chip.

The solder resist 50 may expose a portion of the metal pattern 30a.

A first plating pattern 61 is formed on the conductor layer 42 in the via hole 11 and a second plating pattern 62 is formed on the first plating pattern 61.

The first and second plating patterns 61 and 62 include at least one of metal groups including Au, Ti, Ta, Ag, Ni, Pd, and Co.

In the above embodiment, the plating pattern (first and second plating patterns) of the double layer is formed on the conductor layer 42, but it may be formed by a single layer plating pattern, or may be formed by two or more plating patterns. will be.

The first plating pattern 61 and the second plating pattern 62 may also be formed on the metal pattern 30a exposed by the solder resist 50.

A solder ball 70 is formed in the via hole 11 to complete a ball grid array (BGA) package.

Before forming the solder ball 70 in the via hole 11, a semiconductor chip may be mounted on the metal pattern 30a of the substrate 10.

That is, after the semiconductor chip is bonded to the solder resist of the substrate 10 by using an adhesive, and the metal pattern 30a and the external electrode of the semiconductor chip are electrically connected by bonding wires, an insulator is formed around the semiconductor chip. Seal with.

Thereafter, the substrate 10 on which the semiconductor chip is mounted is turned upside down, and a solder ball 70 for forming an external connection terminal is placed on the via hole 11. When the solder balls 70 are heated, the solder balls 70 are reflowed to bond the solder balls 70 to the plating patterns 61 and 62 in the via holes 11.

Since the wiring board manufactured by using the plating apparatus according to the embodiment has excellent liquid permeation uniformity in the via hole and excellent properties of the filled plating film, bonding reliability with the solder ball may be improved.

While the above embodiments have been described in detail, the present invention is not limited to these embodiments, and various changes can be made without departing from the spirit thereof.

1 is a block diagram showing a plating process using a general plating apparatus.

2 is a block diagram showing the configuration of a plating apparatus according to the embodiment.

3 is a cross-sectional view showing a plating process of the plating apparatus according to the embodiment.

FIG. 4 is an enlarged view of portion “A” of FIG. 3.

5 is a cross-sectional view showing a wiring board manufactured using the plating apparatus according to the embodiment.

Claims (12)

A plating bath containing a plating liquid; And A plating apparatus comprising a plating portion in which one surface of a to-be-plated body contacts the plating liquid and is plated. The method of claim 1, And a plating solution supply unit disposed under the plating bath and having a plurality of holes formed therein to supply the plating solution to one side of the plated body. The method of claim 1, Plating apparatus further comprises a conducting portion disposed on both ends of the plating bath for applying a current to the plated body. The method of claim 1, Plating apparatus further comprising an electrode plate disposed in the plating bath. The method of claim 2, The plating apparatus supplying portion supplying the plating liquid at a flow rate of 30 ~ 80l / min. The method of claim 4, wherein And the electrode plate is disposed between the plated body and the plating liquid supply unit. Bringing the wiring board into the plating bath containing the plating liquid; Plating on one side of the wiring board while contacting the plating liquid; And And manufacturing the wiring board from the plating bath. The method of claim 7, wherein In the step of plating the one side of the wiring substrate in contact with the plating liquid, The flow rate of the plating liquid sprayed to one side of the said wiring board is 30-80 L / min., The manufacturing method of the wiring board. The method of claim 7, wherein Before the step of bringing the wiring board into the plating bath, Forming a plurality of via holes penetrating the wiring substrate; And Forming a metal film on one surface of the wiring board manufacturing method of a wiring board. 10. The method of claim 9, The one side in contact with the plating liquid is a surface on which the via hole is formed. 10. The method of claim 9, After the wiring board is taken out of the plating bath, And forming a circuit part by patterning the metal film. The method of claim 7, wherein In the step of plating the one side of the wiring substrate in contact with the plating liquid, And the other side of the wiring board is in contact with the outside air.

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