WO2012011727A3 - Electroplating apparatus - Google Patents

Electroplating apparatus Download PDF

Info

Publication number
WO2012011727A3
WO2012011727A3 PCT/KR2011/005321 KR2011005321W WO2012011727A3 WO 2012011727 A3 WO2012011727 A3 WO 2012011727A3 KR 2011005321 W KR2011005321 W KR 2011005321W WO 2012011727 A3 WO2012011727 A3 WO 2012011727A3
Authority
WO
WIPO (PCT)
Prior art keywords
electrolyte
spraying part
electroplating apparatus
plated
spraying
Prior art date
Application number
PCT/KR2011/005321
Other languages
French (fr)
Korean (ko)
Other versions
WO2012011727A2 (en
Inventor
김윤용
Original Assignee
주식회사 케이엠더블유
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 케이엠더블유 filed Critical 주식회사 케이엠더블유
Priority to CN201180035366.7A priority Critical patent/CN103025922B/en
Publication of WO2012011727A2 publication Critical patent/WO2012011727A2/en
Publication of WO2012011727A3 publication Critical patent/WO2012011727A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/06—Filtering particles other than ions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/026—Electroplating of selected surface areas using locally applied jets of electrolyte

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The present invention relates to an electroplating apparatus comprising: a plating vessel for accommodating an electrolyte containing ions of the metal to be plated; an electrolyte spraying part for receiving the electrolyte and spraying same onto a predetermined area of the object to be plated using at least one spray nozzle; and a circulation pump for sucking the electrolyte in the plating vessel and supplying same to the electrolyte spraying part at a predetermined pressure, so that the electrolyte can be sprayed from the electrolyte spraying part.
PCT/KR2011/005321 2010-07-20 2011-07-20 Electroplating apparatus WO2012011727A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201180035366.7A CN103025922B (en) 2010-07-20 2011-07-20 electroplating device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100070226A KR101693217B1 (en) 2010-07-20 2010-07-20 Electroplating apparatus
KR10-2010-0070226 2010-07-20

Publications (2)

Publication Number Publication Date
WO2012011727A2 WO2012011727A2 (en) 2012-01-26
WO2012011727A3 true WO2012011727A3 (en) 2012-05-03

Family

ID=45497291

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/005321 WO2012011727A2 (en) 2010-07-20 2011-07-20 Electroplating apparatus

Country Status (3)

Country Link
KR (1) KR101693217B1 (en)
CN (1) CN103025922B (en)
WO (1) WO2012011727A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101704615B1 (en) * 2016-04-19 2017-02-08 (주)아이케이텍 Plating Equipment
AU2017295870B2 (en) 2016-07-13 2022-04-28 Iontra Inc Electrochemical methods, devices and compositions
CN106757226B (en) * 2017-01-11 2018-10-30 吉林大学 A kind of profiling fluidic device and application thereof preventing plated item upper Positioning holes plating leakage
CN106917132B (en) * 2017-04-27 2018-12-07 北京纽堡科技有限公司 A kind of electroplanting device
TWI663294B (en) * 2017-12-15 2019-06-21 Chipbond Technology Corporation Electroplating device and pressure chamber thereof
EP3872236B1 (en) * 2020-02-28 2022-02-16 Semsysco GmbH Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate
CN112899743B (en) 2021-01-19 2021-09-21 鑫巨(深圳)半导体科技有限公司 Electroplating device and electroplating method
CN114808084A (en) 2021-01-29 2022-07-29 泰科电子(上海)有限公司 Electroplating device and electroplating system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05267304A (en) * 1992-03-18 1993-10-15 Fujitsu Ltd Apparatus and method for plating
KR100325974B1 (en) * 1999-06-24 2002-03-07 한수철 The equipment and pluting system nickel water a semiconductor
JP2005097732A (en) * 2003-08-21 2005-04-14 Ebara Corp Plating apparatus
JP2006118019A (en) * 2004-10-25 2006-05-11 Almex Inc Surface treatment method and surface treatment equipment for flat shaped object

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4330380B2 (en) * 2003-05-29 2009-09-16 株式会社荏原製作所 Plating apparatus and plating method
EP1602127A2 (en) * 2003-03-11 2005-12-07 Ebara Corporation Plating apparatus
CN101255594B (en) * 2007-12-07 2010-06-23 东莞洲亮通讯科技有限公司 Electroplating production technique and equipment
KR101693223B1 (en) * 2009-04-17 2017-01-05 주식회사 케이엠더블유 Electroplating apparatus
CN101665965B (en) * 2009-10-13 2011-06-01 广州杰赛科技股份有限公司 Electroplating device of copper plating of graphite powder and technique

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05267304A (en) * 1992-03-18 1993-10-15 Fujitsu Ltd Apparatus and method for plating
KR100325974B1 (en) * 1999-06-24 2002-03-07 한수철 The equipment and pluting system nickel water a semiconductor
JP2005097732A (en) * 2003-08-21 2005-04-14 Ebara Corp Plating apparatus
JP2006118019A (en) * 2004-10-25 2006-05-11 Almex Inc Surface treatment method and surface treatment equipment for flat shaped object

Also Published As

Publication number Publication date
KR101693217B1 (en) 2017-01-05
KR20120008891A (en) 2012-02-01
WO2012011727A2 (en) 2012-01-26
CN103025922B (en) 2016-06-01
CN103025922A (en) 2013-04-03

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