PT3356579T - Electroplating bath for electrochemical deposition of a cu-sn-zn-pd alloy, method for electrochemical deposition of said alloy, substrate comprising said alloy and uses of the substrate - Google Patents
Electroplating bath for electrochemical deposition of a cu-sn-zn-pd alloy, method for electrochemical deposition of said alloy, substrate comprising said alloy and uses of the substrateInfo
- Publication number
- PT3356579T PT3356579T PT167782846T PT16778284T PT3356579T PT 3356579 T PT3356579 T PT 3356579T PT 167782846 T PT167782846 T PT 167782846T PT 16778284 T PT16778284 T PT 16778284T PT 3356579 T PT3356579 T PT 3356579T
- Authority
- PT
- Portugal
- Prior art keywords
- alloy
- substrate
- electrochemical deposition
- electroplating bath
- electrochemical
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/005—Jewels; Clockworks; Coins
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP15187511.9A EP3150744B1 (en) | 2015-09-30 | 2015-09-30 | Electroplating bath for electrochemical deposition of a cu-sn-zn-pd alloy layer, method for electrochemical deposition of said alloy layer, substrate comprising said alloy layer and uses of the coated substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
PT3356579T true PT3356579T (en) | 2020-06-16 |
Family
ID=54249387
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PT151875119T PT3150744T (en) | 2015-09-30 | 2015-09-30 | Electroplating bath for electrochemical deposition of a cu-sn-zn-pd alloy, method for electrochemical deposition of said alloy, substrate comprising said alloy and uses of the substrate |
PT167782846T PT3356579T (en) | 2015-09-30 | 2016-09-30 | Electroplating bath for electrochemical deposition of a cu-sn-zn-pd alloy, method for electrochemical deposition of said alloy, substrate comprising said alloy and uses of the substrate |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PT151875119T PT3150744T (en) | 2015-09-30 | 2015-09-30 | Electroplating bath for electrochemical deposition of a cu-sn-zn-pd alloy, method for electrochemical deposition of said alloy, substrate comprising said alloy and uses of the substrate |
Country Status (5)
Country | Link |
---|---|
EP (2) | EP3150744B1 (en) |
CN (1) | CN108138346B (en) |
ES (2) | ES2790583T3 (en) |
PT (2) | PT3150744T (en) |
WO (1) | WO2017055553A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
PT3150744T (en) | 2015-09-30 | 2020-05-12 | Coventya S P A | Electroplating bath for electrochemical deposition of a cu-sn-zn-pd alloy, method for electrochemical deposition of said alloy, substrate comprising said alloy and uses of the substrate |
EP3540097A1 (en) | 2018-03-13 | 2019-09-18 | COVENTYA S.p.A. | Electroplated products and electroplating bath for providing such products |
IT201800004235A1 (en) * | 2018-04-05 | 2019-10-05 | White bronze alloy, galvanic bath and process to produce the white bronze alloy by electro-galvanic deposition | |
CN108864200B (en) * | 2018-08-06 | 2020-12-11 | 金川集团股份有限公司 | One-step preparation method of ethylenediamine palladium sulfate for electroplating |
IT202000011203A1 (en) * | 2020-05-15 | 2021-11-15 | Bluclad S P A | STAINLESS BRONZE ALLOY AND ITS USE IN GALVANIZED PRODUCTS |
FR3118067B1 (en) * | 2020-12-18 | 2023-05-26 | Linxens Holding | Process for depositing a bronze alloy on a printed circuit and printed circuit obtained by this process |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2916423A (en) | 1957-06-19 | 1959-12-08 | Metal & Thermit Corp | Electrodeposition of copper and copper alloys |
US3440151A (en) | 1965-06-02 | 1969-04-22 | Robert Duva | Electrodeposition of copper-tin alloys |
BE805602A (en) | 1973-10-03 | 1974-02-01 | Johnson Matthey Co Ltd | Cyanide-free gold electroplating bath - contg alkali metal gold complex and complexing agent and additives |
CH662583A5 (en) | 1985-03-01 | 1987-10-15 | Heinz Emmenegger | GALVANIC BATH FOR THE ELECTROLYTIC DEPOSITION OF GOLD-COPPER-CADMIUM-ZINC ALLOYS. |
JP3029948B2 (en) | 1993-04-07 | 2000-04-10 | シチズン時計株式会社 | Sn-Cu-Pd alloy plated member, plating bath used for its production |
JPH0827590A (en) | 1994-07-13 | 1996-01-30 | Okuno Chem Ind Co Ltd | Bright copper-tin alloy plating bath |
CN1097644C (en) | 1995-12-07 | 2003-01-01 | 西铁城钟表有限公司 | Ornamental member |
DE69523950T2 (en) | 1995-12-07 | 2002-06-20 | Citizen Watch Co., Ltd. | DECORATIVE ELEMENT |
JP2977503B2 (en) | 1997-02-13 | 1999-11-15 | 株式会社ビクトリア | Copper-palladium alloy plating solution and plating substrate |
CN1257996C (en) * | 2000-06-27 | 2006-05-31 | 西铁城钟表股份有限公司 | Decorative article having white film and prodn. method therefor |
CN101096769A (en) | 2006-06-26 | 2008-01-02 | 比亚迪股份有限公司 | Electroplating method |
EP1930478B1 (en) | 2006-12-06 | 2013-06-19 | Enthone, Inc. | Electrolyte composition and method for the deposition of quaternary copper alloys |
JP5642928B2 (en) | 2007-12-12 | 2014-12-17 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | Bronze electroplating |
EP2497841B1 (en) * | 2011-03-09 | 2015-09-02 | Umicore AG & Co. KG | Sn-Ag-Cu-Alloys |
EP2757180B1 (en) | 2013-01-18 | 2015-08-12 | Valmet Plating S.R.L. | A process for electrolytically depositing a tin- and ruthenium-based alloy, the electrolytic bath that permits said alloy to deposit and the alloy obtained by means of said process |
EP2799595A1 (en) | 2013-05-03 | 2014-11-05 | Delphi Technologies, Inc. | Electric contact element |
AT514818B1 (en) | 2013-09-18 | 2015-10-15 | W Garhöfer Ges M B H Ing | Deposition of Cu, Sn, Zn coatings on metallic substrates |
ITUB20152876A1 (en) * | 2015-08-05 | 2017-02-05 | Bluclad S R L | Tin / copper alloys containing palladium, method for their preparation and use. |
PT3150744T (en) | 2015-09-30 | 2020-05-12 | Coventya S P A | Electroplating bath for electrochemical deposition of a cu-sn-zn-pd alloy, method for electrochemical deposition of said alloy, substrate comprising said alloy and uses of the substrate |
-
2015
- 2015-09-30 PT PT151875119T patent/PT3150744T/en unknown
- 2015-09-30 ES ES15187511T patent/ES2790583T3/en active Active
- 2015-09-30 EP EP15187511.9A patent/EP3150744B1/en not_active Revoked
-
2016
- 2016-09-30 PT PT167782846T patent/PT3356579T/en unknown
- 2016-09-30 ES ES16778284T patent/ES2791197T3/en active Active
- 2016-09-30 CN CN201680056531.XA patent/CN108138346B/en active Active
- 2016-09-30 EP EP16778284.6A patent/EP3356579B1/en not_active Revoked
- 2016-09-30 WO PCT/EP2016/073427 patent/WO2017055553A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
EP3356579B1 (en) | 2020-03-11 |
EP3150744B1 (en) | 2020-02-12 |
ES2790583T3 (en) | 2020-10-28 |
WO2017055553A1 (en) | 2017-04-06 |
ES2791197T3 (en) | 2020-11-03 |
PT3150744T (en) | 2020-05-12 |
CN108138346B (en) | 2021-03-05 |
EP3150744A1 (en) | 2017-04-05 |
EP3356579A1 (en) | 2018-08-08 |
CN108138346A (en) | 2018-06-08 |
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