PT3356579T - Electroplating bath for electrochemical deposition of a cu-sn-zn-pd alloy, method for electrochemical deposition of said alloy, substrate comprising said alloy and uses of the substrate - Google Patents

Electroplating bath for electrochemical deposition of a cu-sn-zn-pd alloy, method for electrochemical deposition of said alloy, substrate comprising said alloy and uses of the substrate

Info

Publication number
PT3356579T
PT3356579T PT167782846T PT16778284T PT3356579T PT 3356579 T PT3356579 T PT 3356579T PT 167782846 T PT167782846 T PT 167782846T PT 16778284 T PT16778284 T PT 16778284T PT 3356579 T PT3356579 T PT 3356579T
Authority
PT
Portugal
Prior art keywords
alloy
substrate
electrochemical deposition
electroplating bath
electrochemical
Prior art date
Application number
PT167782846T
Other languages
Portuguese (pt)
Original Assignee
Coventya S P A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=54249387&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PT3356579(T) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Coventya S P A filed Critical Coventya S P A
Publication of PT3356579T publication Critical patent/PT3356579T/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/005—Jewels; Clockworks; Coins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
PT167782846T 2015-09-30 2016-09-30 Electroplating bath for electrochemical deposition of a cu-sn-zn-pd alloy, method for electrochemical deposition of said alloy, substrate comprising said alloy and uses of the substrate PT3356579T (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP15187511.9A EP3150744B1 (en) 2015-09-30 2015-09-30 Electroplating bath for electrochemical deposition of a cu-sn-zn-pd alloy layer, method for electrochemical deposition of said alloy layer, substrate comprising said alloy layer and uses of the coated substrate

Publications (1)

Publication Number Publication Date
PT3356579T true PT3356579T (en) 2020-06-16

Family

ID=54249387

Family Applications (2)

Application Number Title Priority Date Filing Date
PT151875119T PT3150744T (en) 2015-09-30 2015-09-30 Electroplating bath for electrochemical deposition of a cu-sn-zn-pd alloy, method for electrochemical deposition of said alloy, substrate comprising said alloy and uses of the substrate
PT167782846T PT3356579T (en) 2015-09-30 2016-09-30 Electroplating bath for electrochemical deposition of a cu-sn-zn-pd alloy, method for electrochemical deposition of said alloy, substrate comprising said alloy and uses of the substrate

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PT151875119T PT3150744T (en) 2015-09-30 2015-09-30 Electroplating bath for electrochemical deposition of a cu-sn-zn-pd alloy, method for electrochemical deposition of said alloy, substrate comprising said alloy and uses of the substrate

Country Status (5)

Country Link
EP (2) EP3150744B1 (en)
CN (1) CN108138346B (en)
ES (2) ES2790583T3 (en)
PT (2) PT3150744T (en)
WO (1) WO2017055553A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PT3150744T (en) 2015-09-30 2020-05-12 Coventya S P A Electroplating bath for electrochemical deposition of a cu-sn-zn-pd alloy, method for electrochemical deposition of said alloy, substrate comprising said alloy and uses of the substrate
EP3540097A1 (en) 2018-03-13 2019-09-18 COVENTYA S.p.A. Electroplated products and electroplating bath for providing such products
IT201800004235A1 (en) * 2018-04-05 2019-10-05 White bronze alloy, galvanic bath and process to produce the white bronze alloy by electro-galvanic deposition
CN108864200B (en) * 2018-08-06 2020-12-11 金川集团股份有限公司 One-step preparation method of ethylenediamine palladium sulfate for electroplating
IT202000011203A1 (en) * 2020-05-15 2021-11-15 Bluclad S P A STAINLESS BRONZE ALLOY AND ITS USE IN GALVANIZED PRODUCTS
FR3118067B1 (en) * 2020-12-18 2023-05-26 Linxens Holding Process for depositing a bronze alloy on a printed circuit and printed circuit obtained by this process

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2916423A (en) 1957-06-19 1959-12-08 Metal & Thermit Corp Electrodeposition of copper and copper alloys
US3440151A (en) 1965-06-02 1969-04-22 Robert Duva Electrodeposition of copper-tin alloys
BE805602A (en) 1973-10-03 1974-02-01 Johnson Matthey Co Ltd Cyanide-free gold electroplating bath - contg alkali metal gold complex and complexing agent and additives
CH662583A5 (en) 1985-03-01 1987-10-15 Heinz Emmenegger GALVANIC BATH FOR THE ELECTROLYTIC DEPOSITION OF GOLD-COPPER-CADMIUM-ZINC ALLOYS.
JP3029948B2 (en) 1993-04-07 2000-04-10 シチズン時計株式会社 Sn-Cu-Pd alloy plated member, plating bath used for its production
JPH0827590A (en) 1994-07-13 1996-01-30 Okuno Chem Ind Co Ltd Bright copper-tin alloy plating bath
CN1097644C (en) 1995-12-07 2003-01-01 西铁城钟表有限公司 Ornamental member
DE69523950T2 (en) 1995-12-07 2002-06-20 Citizen Watch Co., Ltd. DECORATIVE ELEMENT
JP2977503B2 (en) 1997-02-13 1999-11-15 株式会社ビクトリア Copper-palladium alloy plating solution and plating substrate
CN1257996C (en) * 2000-06-27 2006-05-31 西铁城钟表股份有限公司 Decorative article having white film and prodn. method therefor
CN101096769A (en) 2006-06-26 2008-01-02 比亚迪股份有限公司 Electroplating method
EP1930478B1 (en) 2006-12-06 2013-06-19 Enthone, Inc. Electrolyte composition and method for the deposition of quaternary copper alloys
JP5642928B2 (en) 2007-12-12 2014-12-17 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． Bronze electroplating
EP2497841B1 (en) * 2011-03-09 2015-09-02 Umicore AG & Co. KG Sn-Ag-Cu-Alloys
EP2757180B1 (en) 2013-01-18 2015-08-12 Valmet Plating S.R.L. A process for electrolytically depositing a tin- and ruthenium-based alloy, the electrolytic bath that permits said alloy to deposit and the alloy obtained by means of said process
EP2799595A1 (en) 2013-05-03 2014-11-05 Delphi Technologies, Inc. Electric contact element
AT514818B1 (en) 2013-09-18 2015-10-15 W Garhöfer Ges M B H Ing Deposition of Cu, Sn, Zn coatings on metallic substrates
ITUB20152876A1 (en) * 2015-08-05 2017-02-05 Bluclad S R L Tin / copper alloys containing palladium, method for their preparation and use.
PT3150744T (en) 2015-09-30 2020-05-12 Coventya S P A Electroplating bath for electrochemical deposition of a cu-sn-zn-pd alloy, method for electrochemical deposition of said alloy, substrate comprising said alloy and uses of the substrate

Also Published As

Publication number Publication date
EP3356579B1 (en) 2020-03-11
EP3150744B1 (en) 2020-02-12
ES2790583T3 (en) 2020-10-28
WO2017055553A1 (en) 2017-04-06
ES2791197T3 (en) 2020-11-03
PT3150744T (en) 2020-05-12
CN108138346B (en) 2021-03-05
EP3150744A1 (en) 2017-04-05
EP3356579A1 (en) 2018-08-08
CN108138346A (en) 2018-06-08

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