EP3149222A4 - Plating or coating method for producing metal-ceramic coating on a substrate - Google Patents

Plating or coating method for producing metal-ceramic coating on a substrate Download PDF

Info

Publication number
EP3149222A4
EP3149222A4 EP15798809.8A EP15798809A EP3149222A4 EP 3149222 A4 EP3149222 A4 EP 3149222A4 EP 15798809 A EP15798809 A EP 15798809A EP 3149222 A4 EP3149222 A4 EP 3149222A4
Authority
EP
European Patent Office
Prior art keywords
plating
substrate
coating
producing metal
coating method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP15798809.8A
Other languages
German (de)
French (fr)
Other versions
EP3149222A1 (en
Inventor
Bo Hu
Chao XIONG
Wei Gao
Yuxin Wang
Xin Shu
Shanghai WEI
Soroor GHAZIOF
See Leng TAY
Ying JU
Marzieh SHARIFI
Christopher W. Goode
Glen SLATER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Auckland Uniservices Ltd
Original Assignee
Auckland Uniservices Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Auckland Uniservices Ltd filed Critical Auckland Uniservices Ltd
Publication of EP3149222A1 publication Critical patent/EP3149222A1/en
Publication of EP3149222A4 publication Critical patent/EP3149222A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1664—Process features with additional means during the plating process
    • C23C18/1669—Agitation, e.g. air introduction
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1676—Heating of the solution
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/02—Heating or cooling
EP15798809.8A 2014-05-27 2015-05-26 Plating or coating method for producing metal-ceramic coating on a substrate Withdrawn EP3149222A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462003341P 2014-05-27 2014-05-27
PCT/IB2015/053902 WO2015181706A1 (en) 2014-05-27 2015-05-26 Plating or coating method for producing metal-ceramic coating on a substrate

Publications (2)

Publication Number Publication Date
EP3149222A1 EP3149222A1 (en) 2017-04-05
EP3149222A4 true EP3149222A4 (en) 2018-06-06

Family

ID=54698204

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15798809.8A Withdrawn EP3149222A4 (en) 2014-05-27 2015-05-26 Plating or coating method for producing metal-ceramic coating on a substrate

Country Status (5)

Country Link
US (1) US20170101722A1 (en)
EP (1) EP3149222A4 (en)
CN (1) CN107075683A (en)
TW (1) TWI674332B (en)
WO (1) WO2015181706A1 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT201700012608A1 (en) * 2017-02-06 2018-08-06 Arnaldo Morganti Improved anti-friction mechanical components, coating process and plant tank for their manufacture
CN107012378B (en) * 2017-04-25 2019-12-17 湖南理工学院 Cu70Zr20Ti10Amorphous alloy reinforced SiC composite material and preparation process thereof
CN107012377B (en) * 2017-04-25 2019-03-26 湖南理工学院 A kind of SiC ceramic matrix composite material and its preparation process
CN107299368B (en) * 2017-08-09 2019-12-10 无锡市恒利弘实业有限公司 Electroplating method for cyanide-free composite plating of RE-TiO 2 -Ag layer on surface of steel substrate
CN107385440B (en) * 2017-08-09 2019-12-10 无锡市恒利弘实业有限公司 Electroplating method for cyanide-free composite plating of La-TiO 2 -Ag layer on surface of steel substrate
CN107779934A (en) * 2017-10-25 2018-03-09 昆山钴瓷金属科技有限公司 A kind of preparation method of oil pipeline nano-composite coating
CN107876048A (en) * 2017-12-04 2018-04-06 安徽中弘科技发展有限公司 A kind of photocatalyst preparation for effectively removing indoor decoration pollution
CN107955413A (en) * 2017-12-08 2018-04-24 马鞍山虹润彩印有限责任公司 A kind of preparation method for applying the conductive filler on electrically conductive ink
CN108411343A (en) * 2018-04-10 2018-08-17 上海大学 A kind of plating cobalt tungsten manganese high-strength steel and its preparation method and application
CN110016709A (en) * 2018-11-15 2019-07-16 暨南大学 Zn@P nano-deposit with photoproduction cathodic protection effect and preparation method thereof
CN110158065A (en) * 2019-06-10 2019-08-23 德华兔宝宝装饰新材股份有限公司 A kind of Surface uniformization plating Ni-P-SiO2The preparation method of the anticorrosion timber of Nanocomposites layer
US11608563B2 (en) * 2019-07-19 2023-03-21 Asmpt Nexx, Inc. Electrochemical deposition systems
CN110373706B (en) * 2019-08-22 2021-05-14 电子科技大学 Online maintenance method of acidic bright copper plating electroplating solution
US11270872B2 (en) 2019-09-25 2022-03-08 Western Digital Technologies, Inc. Base conducting layer beneath graphite layer of ceramic cathode for use with cathodic arc deposition
CN110760916B (en) * 2019-11-18 2022-04-05 和县科嘉阀门铸造有限公司 Method for improving corrosion resistance of magnesium alloy valve
CN111676499A (en) * 2020-07-30 2020-09-18 华南理工大学 Hydrogen-resistant coating based on cathode plasma electrolytic deposition and preparation method thereof
CN114016008B (en) * 2021-10-27 2023-08-29 东北电力大学 Electroless Ni-P-PTFE-TiO plating 2 Composite nano-coating and preparation method thereof
CN114182241A (en) * 2021-11-24 2022-03-15 国网浙江省电力有限公司舟山供电公司 Ni-W-P/Ni-P nano cerium oxide composite anticorrosive coating and process
CN115058746B (en) * 2022-07-07 2024-04-12 中国人民解放军陆军装甲兵学院 Metal coating, preparation method and application thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2103718A1 (en) * 2006-09-28 2009-09-23 Nihon Parkerizing Co., Ltd. Method for coating ceramic film on metal, electrolysis solution for use in the method, and ceramic film and metal material
WO2011002311A1 (en) * 2009-06-29 2011-01-06 Auckland Uniservices Limited Plating or coating method for producing metal-ceramic coating on a substrate

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US3993799A (en) * 1974-10-04 1976-11-23 Surface Technology, Inc. Electroless plating process employing non-noble metal hydrous oxide catalyst
JPS59123796A (en) * 1982-12-28 1984-07-17 Kawasaki Steel Corp Production of electrogalvanized steel sheet having high corrosion resistance
JPS63282294A (en) * 1987-05-11 1988-11-18 Inax Corp Metal-solid corpuscle composite plating and its production
JPH05171454A (en) * 1991-12-20 1993-07-09 Kanai Hiroyuki Dispersion plating method
JP4167468B2 (en) * 2002-10-08 2008-10-15 新日本製鐵株式会社 Metal plate surface treatment agent, surface-treated metal plate excellent in tension rigidity, manufacturing method thereof, and high-rigidity panel
JP4201813B2 (en) * 2004-11-05 2008-12-24 日本パーカライジング株式会社 Metal electrolytic ceramic coating method, electrolytic solution for metal electrolytic ceramic coating, and metal material
DE102005047739B3 (en) * 2005-09-29 2007-02-08 Siemens Ag Substrate with matrix layer for turbine systems and production process has multilayer of and or encapsulated nanoparticles that release a colored material above a threshold temperature
CN103194784B (en) * 2013-04-11 2016-03-02 江苏大学 A kind of method taking colloid as template controllable electric deposition and prepare nano-ZnO thin film
US10190232B2 (en) * 2013-08-06 2019-01-29 Lam Research Corporation Apparatuses and methods for maintaining pH in nickel electroplating baths

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2103718A1 (en) * 2006-09-28 2009-09-23 Nihon Parkerizing Co., Ltd. Method for coating ceramic film on metal, electrolysis solution for use in the method, and ceramic film and metal material
WO2011002311A1 (en) * 2009-06-29 2011-01-06 Auckland Uniservices Limited Plating or coating method for producing metal-ceramic coating on a substrate

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2015181706A1 *

Also Published As

Publication number Publication date
TW201610225A (en) 2016-03-16
CN107075683A (en) 2017-08-18
WO2015181706A1 (en) 2015-12-03
EP3149222A1 (en) 2017-04-05
TWI674332B (en) 2019-10-11
US20170101722A1 (en) 2017-04-13

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