ITUB20152876A1 - Tin / copper alloys containing palladium, method for their preparation and use. - Google Patents

Tin / copper alloys containing palladium, method for their preparation and use.

Info

Publication number
ITUB20152876A1
ITUB20152876A1 ITUB2015A002876A ITUB20152876A ITUB20152876A1 IT UB20152876 A1 ITUB20152876 A1 IT UB20152876A1 IT UB2015A002876 A ITUB2015A002876 A IT UB2015A002876A IT UB20152876 A ITUB20152876 A IT UB20152876A IT UB20152876 A1 ITUB20152876 A1 IT UB20152876A1
Authority
IT
Italy
Prior art keywords
tin
preparation
copper alloys
alloys containing
containing palladium
Prior art date
Application number
ITUB2015A002876A
Other languages
Italian (it)
Inventor
Lorenzo Cavaciocchi
Leandro Luconi
Gabriele Gori
Original Assignee
Bluclad S R L
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=54364603&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ITUB20152876(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Bluclad S R L filed Critical Bluclad S R L
Priority to ITUB2015A002876A priority Critical patent/ITUB20152876A1/en
Priority to PCT/IB2016/054703 priority patent/WO2017021916A2/en
Priority to EP16767356.5A priority patent/EP3332044B1/en
Priority to CN201680045399.2A priority patent/CN108138263A/en
Publication of ITUB20152876A1 publication Critical patent/ITUB20152876A1/en
Priority to HK18112782.7A priority patent/HK1253577A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/005—Jewels; Clockworks; Coins
ITUB2015A002876A 2015-08-05 2015-08-05 Tin / copper alloys containing palladium, method for their preparation and use. ITUB20152876A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
ITUB2015A002876A ITUB20152876A1 (en) 2015-08-05 2015-08-05 Tin / copper alloys containing palladium, method for their preparation and use.
PCT/IB2016/054703 WO2017021916A2 (en) 2015-08-05 2016-08-04 Tin/copper alloys containing palladium, method for their preparation and use thereof
EP16767356.5A EP3332044B1 (en) 2015-08-05 2016-08-04 Tin/copper alloys containing palladium, method for their preparation and use thereof
CN201680045399.2A CN108138263A (en) 2015-08-05 2016-08-04 Tin/copper alloy containing palladium, method and application thereof for its preparation
HK18112782.7A HK1253577A1 (en) 2015-08-05 2018-10-08 Tin/copper alloys containing palladium, method for their preparation and use thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITUB2015A002876A ITUB20152876A1 (en) 2015-08-05 2015-08-05 Tin / copper alloys containing palladium, method for their preparation and use.

Publications (1)

Publication Number Publication Date
ITUB20152876A1 true ITUB20152876A1 (en) 2017-02-05

Family

ID=54364603

Family Applications (1)

Application Number Title Priority Date Filing Date
ITUB2015A002876A ITUB20152876A1 (en) 2015-08-05 2015-08-05 Tin / copper alloys containing palladium, method for their preparation and use.

Country Status (5)

Country Link
EP (1) EP3332044B1 (en)
CN (1) CN108138263A (en)
HK (1) HK1253577A1 (en)
IT (1) ITUB20152876A1 (en)
WO (1) WO2017021916A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITUB20152876A1 (en) 2015-08-05 2017-02-05 Bluclad S R L Tin / copper alloys containing palladium, method for their preparation and use.
PT3150744T (en) * 2015-09-30 2020-05-12 Coventya S P A Electroplating bath for electrochemical deposition of a cu-sn-zn-pd alloy, method for electrochemical deposition of said alloy, substrate comprising said alloy and uses of the substrate
IT201800004235A1 (en) * 2018-04-05 2019-10-05 White bronze alloy, galvanic bath and process to produce the white bronze alloy by electro-galvanic deposition
IT202000011203A1 (en) 2020-05-15 2021-11-15 Bluclad S P A STAINLESS BRONZE ALLOY AND ITS USE IN GALVANIZED PRODUCTS

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06293990A (en) * 1993-04-07 1994-10-21 Nippon Shinkinzoku Kako Kk Sn-cu-pd alloy plated member and plating bath for producing the same
US5972526A (en) * 1995-12-07 1999-10-26 Citizen Watch Co., Ltd. Decorative member
EP1930478A1 (en) * 2006-12-06 2008-06-11 Enthone, Inc. Electrolyte composition and method for the deposition of quaternary copper alloys
EP2799595A1 (en) * 2013-05-03 2014-11-05 Delphi Technologies, Inc. Electric contact element

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1097644C (en) * 1995-12-07 2003-01-01 西铁城钟表有限公司 Ornamental member
EP2497841B1 (en) 2011-03-09 2015-09-02 Umicore AG & Co. KG Sn-Ag-Cu-Alloys
AT514818B1 (en) 2013-09-18 2015-10-15 W Garhöfer Ges M B H Ing Deposition of Cu, Sn, Zn coatings on metallic substrates
ITUB20152876A1 (en) 2015-08-05 2017-02-05 Bluclad S R L Tin / copper alloys containing palladium, method for their preparation and use.

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06293990A (en) * 1993-04-07 1994-10-21 Nippon Shinkinzoku Kako Kk Sn-cu-pd alloy plated member and plating bath for producing the same
US5972526A (en) * 1995-12-07 1999-10-26 Citizen Watch Co., Ltd. Decorative member
EP1930478A1 (en) * 2006-12-06 2008-06-11 Enthone, Inc. Electrolyte composition and method for the deposition of quaternary copper alloys
EP2799595A1 (en) * 2013-05-03 2014-11-05 Delphi Technologies, Inc. Electric contact element

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
MD. ARIFUR RAHMAN ET AL: "Experimental Studies and Thermodynamic Assessment of Ternary Cu-Pd-Sn Phase Relations Focusing on the Sn-Rich Alloys", JOURNAL OF ELECTRONIC MATERIALS., vol. 43, no. 1, 4 October 2013 (2013-10-04), US, pages 176 - 186, XP055269831, ISSN: 0361-5235, DOI: 10.1007/s11664-013-2735-4 *

Also Published As

Publication number Publication date
CN108138263A (en) 2018-06-08
HK1253577A1 (en) 2019-06-21
WO2017021916A2 (en) 2017-02-09
EP3332044B1 (en) 2020-01-01
WO2017021916A3 (en) 2017-03-16
EP3332044A2 (en) 2018-06-13

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