CN106917132B - A kind of electroplanting device - Google Patents
A kind of electroplanting device Download PDFInfo
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- CN106917132B CN106917132B CN201710289002.0A CN201710289002A CN106917132B CN 106917132 B CN106917132 B CN 106917132B CN 201710289002 A CN201710289002 A CN 201710289002A CN 106917132 B CN106917132 B CN 106917132B
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- anode
- cathode
- groove body
- solution
- channel
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/02—Heating or cooling
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/06—Filtering particles other than ions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention belongs to electroplating technology more particularly to a kind of electroplanting devices.Electroplanting device includes groove body, and is arranged in the intracorporal solution of slot, anode and cathode, wherein is formed with the channel for solution circulation between the cathode and anode, the fluidic device flowed through for controlling solution from channel is provided with positioned at the bottom of the groove body.Electroplanting device provided by the invention can be such that solution recycles between a cathode and an anode by the setting of fluidic device, it is ensured that various ion concentration uniformities in the temperature uniformity and solution of all coating contact surfaces.Pass through the isolation of anode baffle, it can be ensured that the uniformity consistency of current density on coating, and then the uniformity of coating can be improved.
Description
Technical field
The invention belongs to electroplating technology more particularly to a kind of electroplanting devices.
Background technique
General general electroplating bath is all as composed by anode plate, cathode-workpiece and rectifier.Not due to general workpiece
It is very regular, so not being very stringent to the required distance of anode and cathode.
Printing dedicated templates, in order to increase the wearability on surface, are needed before printing in template surface since area is larger
One layer of antifriction metal (AFM) is plated, number to be printed can be greatly improved in this way.Especially paper currency printing template is since number to be printed is larger
The surface abrasion for reducing template, need to plate one layer of hard chrome on surface.Since printing dedicated templates are a complete plane, face
Product is 1*0.9 square metres, it is desirable that all coating uniformities in plane are of uniform thickness, and error cannot be greater than 1um, especially work
The concentric thickness of the thickness of part surrounding is consistent, this just increases difficulty to electroplating technology.General coating bath tooling is can not to protect
Card.Specific process must be adopted, just can guarantee that plane thickness of coating error is less.
In the prior art, template will guarantee entire board thickness uniformity in plating, just can guarantee prolonged paper
Coin printing quality.And in the plating process due to edge effect, general coating is all that four sides plating thickness, intermediate deposit are thin, above-mentioned
Problem is as caused by electric current distribution unevenness.
In view of the above-mentioned problems, it is non-uniform to propose that one kind is able to solve printing stencil thickness of coating existing in the prior art
New method.
Summary of the invention
(1) technical problems to be solved
For existing technical problem, the present invention provides a kind of electroplanting devices, are able to solve and deposit in the prior art
The non-uniform problem of thickness of coating.
(2) technical solution
In order to achieve the above object, the main technical schemes that the present invention uses include:
A kind of electroplanting device, including groove body are proposed, and is arranged in the intracorporal solution of slot, anode and cathode, in which: institute
State be formed between cathode and anode for solution circulation channel, positioned at the bottom of the groove body be provided with for control solution from
The fluidic device that channel is flowed through.
As a kind of preferred embodiment of above-mentioned electroplanting device, the fluidic device includes jet nozzle, the jet nozzle
Positioned at the lower section in channel；
The jet nozzle includes tube body, and the multiple fluid apertures being arranged on tube body；The multiple fluid apertures and channel
Input end is oppositely arranged.
As a kind of preferred embodiment of above-mentioned electroplanting device, the fluidic device further includes being arranged above jet nozzle,
Liquid barrier below cathode and anode；
The liquid barrier includes plate body, and is arranged on plate body for adjusting the liquid flow direction sprayed by jet nozzle
Strip hole.
As a kind of preferred embodiment of above-mentioned electroplanting device, the tube body is spindle rotationally arranged on groove body, and in pipe
The junction of body and groove body is provided with sealing device.
It further include attached slot as a kind of preferred embodiment of above-mentioned electroplanting device, and the filter being connected to the attached slot；
The top of the groove body is provided with overflow port, and the inlet of the attached slot is connected to overflow port, and the attached slot goes out
Liquid mouth is connected to the inlet of filter, and the liquid outlet of filter is connected to the inlet of fluidic device, and the solution is filtering
Under the action of pumping in device, channel is sprayed by fluidic device after filter, then attached slot is returned to by overflow port.
As a kind of preferred embodiment of above-mentioned electroplanting device, it is provided between the anode and cathode for reducing anode four
The current density anode baffle in week；
The anode baffle is frame-like structures, and the maximum surface of both the anode baffle and anode is oppositely arranged.
As a kind of preferred embodiment of above-mentioned electroplanting device, the width of the anode baffle is 80-100mm.
As a kind of preferred embodiment of above-mentioned electroplanting device, the anode includes anode titanium basket, and the titanium basket flatness is missed
Difference is not more than 5mm.
As a kind of preferred embodiment of above-mentioned electroplanting device, the anode and cathode is arranged by electrode seat and copper bar in groove body
It is interior, and the spacing between anode and cathode is adjustable.
As a kind of preferred embodiment of above-mentioned electroplanting device, the spacing between the cathode and anode is 100-150mm.
(3) beneficial effect
The beneficial effects of the present invention are: electroplanting device provided by the invention can make solution by the setting of fluidic device
It recycles between a cathode and an anode, it is ensured that various ion concentrations in the temperature uniformity and solution of all coating contact surfaces
Uniformity.Pass through the isolation of anode baffle, it can be ensured that the uniformity consistency of current density on coating, and then plating can be improved
The uniformity of layer.
Detailed description of the invention
Fig. 1 is that the side for the electroplanting device that the specific embodiment of the invention provides is intended to；
Fig. 2 is the top view for the electroplanting device that the specific embodiment of the invention provides；
Fig. 3 is the structural schematic diagram for the liquid barrier that the specific embodiment of the invention provides；
Fig. 4 is the structural schematic diagram for the anode baffle that the specific embodiment of the invention provides.
[description of symbols]
1: groove body；2: anode；3: cathode；4: fluidic device；5: attached slot；6: anode baffle；7: electrode seat；8: cathode copper bar；
9: anode copper bar；10: filter；
41: jet nozzle；42: liquid barrier；
421: plate body；422: strip hole.
Specific embodiment
In order to preferably explain the present invention, in order to understand, with reference to the accompanying drawing, by specific embodiment, to this hair
It is bright to be described in detail.
As shown in Figures 1 to 4, present embodiments provide for a kind of electroplanting devices comprising groove body 1, and be arranged in slot
Solution, anode 2 and cathode 3 in body 1, wherein be formed with the channel for solution circulation between cathode 2 and anode 3, be located at groove body
1 bottom is provided with the fluidic device 4 flowed through for controlling solution from channel.
In the present embodiment, by the setting of fluidic device 4, solution can be made to recycle between cathode 3 and anode 2,
It can guarantee various ion concentration uniformities in the temperature uniformity and solution of all coating contact surfaces.Pass through anode baffle
Isolation, it can be ensured that the uniformity consistency of current density on coating, and then the uniformity of coating can be improved.
Specifically, fluidic device 4 includes jet nozzle 41, jet nozzle 41 is located at the lower section in channel.Jet nozzle 41 wraps
Tube body is included, and the multiple fluid apertures being arranged on tube body, the input end in multiple fluid apertures and channel is oppositely arranged.Preferably,
Multiple fluid apertures are evenly distributed on tube body, by tube body, and are uniformly distributed the setting of fluid apertures, be can be improved into channel
The uniformity of liquid.Preferably, being provided with two jet nozzles 41 arranged side by side below channel, pass through two jet streams
The setting of jet pipe 41, it is ensured that the flow of solution in jet stream to groove body 1.The quantity of certain jet nozzle 41 can be according to groove body
1 and/or the size in channel be configured.
Fluidic device further includes being arranged above jet nozzle 41, the liquid barrier 42 of 2 lower section of cathode 3 and anode.Referring to figure
3, liquid barrier 42 includes plate body 421, and is arranged on plate body 421 for adjusting the solution flow direction sprayed by jet nozzle 41
Strip hole 422.This plate body 421 with strip hole 422, the solution that can be sprayed to jet nozzle 41 have the function of guiding.
The solution that further can ensure to be sprayed by jet nozzle 41 is passed through by the channel between anode 2 and cathode 3.The bottom of groove body 1
It is provided with support protrusion and limiting card, liquid barrier 42 is overlapped in support protrusion, and is locked by limiting card.Thus, it is possible to real
The bottom of groove body 1 is removably arranged in existing liquid barrier 42, convenient for the cleaning of liquid barrier 42.
Tube body is spindle rotationally arranged on groove body 1, and the junction of tube body and groove body 1 is provided with sealing device.It is logical
The rotary setting of tube body is crossed on groove body 1, the solution spray angle to jet nozzle 41 can be carried out according to actual needs
Adjustment.
Electroplanting device further includes attached slot 5, and the filter 10 being connected to attached slot 5, the top of groove body 1 are provided with overflow
Mouthful.The inlet of attached slot 5 is connected to overflow port, and the liquid outlet of attached slot 5 is connected to the inlet of filter 10, and filter 10 goes out
Liquid mouth is connected to the inlet of fluidic device, i.e., the liquid outlet of filter 10 is connected to the inlet of jet nozzle 41.
Under the action of solution pumps in filter 10, channel is sprayed by fluidic device after filter device, then by overflow
Mouth returns to attached slot 5.Thus, it is possible to which solution is made to form closed cycle between groove body 1 and attached slot 5, it should be noted that in attached slot
Heating device is additionally provided in 5, thus, it is possible to which the temperature to solution is adjusted.The specific course of work of heating device are as follows: attached
Temperature-detecting device is provided in slot 5, heating device and temperature-detecting device are electrically connected with control device, control device according to
The operation of the set value calculation heating device of the temperature detection value and temperature of temperature-detecting device.Adjusting to solution temperature,
Other than the work of control heating device, control device can also control turning for pump according to the temperature detection value of temperature-detecting device
Speed adjusts solution temperature.
The anode baffle 6 of the current density for reducing 2 surrounding of anode is provided between anode 2 and cathode 3.Reference Fig. 4,
Anode baffle 6 is frame-like structures, and the maximum surface of both anode baffle 6 and anode 2 is oppositely arranged.Specifically, anode 2 includes
Titanium basket, the maximum surface of both anode baffle 6 and titanium basket are oppositely arranged.Pass through the setting of anode baffle 6, it is possible to reduce titanium basket four
The current density in week, prevents the surrounding thickness of coating blocked up, reduces the edge effect of electric current.
The width of anode baffle 6 is 80-100mm, specifically, the width of anode baffle 6 is 90mm or 95mm.
Titanium basket flatness error is not more than 5mm.Titanium basket flatness error is 4mm, 3mm or 2mm.By guaranteeing titanium basket table
The flatness in face, it is ensured that it does not have the problem of warpage, deformation, thus, it is possible to improve the uniformity of electric current distribution.
Titanium basket includes multiple titanium basket units, and titanium basket is by being spliced to form between multiple titanium basket units.
Anode 2 and cathode 3 are arranged in groove body 1 by electrode seat 7 and copper bar, and the spacing between anode 2 and cathode 3 can
It adjusts.Spacing between cathode 3 and anode 2 is 100-150mm.Specifically, spacing between cathode 3 and anode 2 be 110mm,
120mm, 130mm or 140mm.Spacing between cathode 3 and anode 2 can be determined according to the size of plating piece, by yin
The adjustment of size between pole 3 and anode 2, it is ensured that the uniformity of coating.
Specifically, groove body 1 is made of the plastic plate of corrosion resistance, electrode seat 7 is made of isolation material, and electrode seat includes cathode
It is U-shaped structure and the upper end for being fixed on groove body 1 that seat and anode seat, cathode block and anode, which are done, wherein is arranged on groove body 1 useful
In the long waist shaped hole of installation cathode block, by adjusting the rigging position of cathode block and long waist shaped hole, adjustable cathode 3 and anode
Spacing between 2.Cathode copper bar 8 and anode copper bar 9, cathode copper bar 8 and anode copper are respectively arranged on anode seat and cathode block
Row 9 is respectively engaged in the U-shaped opening of cathode block or anode seat.Cathode copper bar 8 hangs printing stencil for hanging cathode.Sun
Pole copper bar 9 hangs titanium basket for hanging anode, and nickel plate or nickel beans are filled in titanium basket.Electroplanting device further includes rectifier, is used
Electroplating power supply is provided in passing through cathode copper bar 8 and anode copper bar 9 for cathode 3 and anode 2.
The technical principle of the invention is described above in combination with a specific embodiment, these descriptions are intended merely to explain of the invention
Principle shall not be construed in any way as a limitation of the scope of protection of the invention.Based on explaining herein, those skilled in the art
It can associate with other specific embodiments of the invention without creative labor, these modes fall within this hair
Within bright protection scope.
Claims (7)
1. a kind of electroplanting device, including groove body (1), and the solution, anode (2) and the cathode (3) that are arranged in groove body (1),
It is characterized in that: being formed with the channel for solution circulation between the cathode (3) and anode (2), be located at the bottom of the groove body (1)
It is provided with the fluidic device (4) flowed through for controlling solution from channel；
The fluidic device (4) includes jet nozzle (41), and the jet nozzle (41) is located at the lower section in channel；
The jet nozzle (41) includes tube body, and the multiple fluid apertures being arranged on tube body；The multiple fluid apertures and channel
Input end is oppositely arranged；
The fluidic device (4) further includes liquid barrier of the setting above jet nozzle (41), below cathode (3) and anode (2)
(42)；
The liquid barrier (42) includes plate body (421), and is arranged on plate body (421) and is sprayed for adjusting by jet nozzle (41)
The strip hole (422) of liquid flow direction out；
The tube body is spindle rotationally arranged on groove body (1), and the junction of tube body and groove body (1) is provided with sealing dress
It sets.
2. electroplanting device according to claim 1, which is characterized in that further include attached slot (5), and with the attached slot (5)
The filter (10) of connection；
The top of the groove body (1) is provided with overflow port, and the inlet of the attached slot (5) is connected to overflow port, the attached slot (5)
Liquid outlet be connected to the inlet of filter (10), the liquid outlet of filter (10) is connected to the inlet of fluidic device (4),
The solution under the action of pump, sprays into channel by fluidic device (4) after filter, then by overflow port in filter (10)
Return to attached slot (5).
3. electroplanting device according to claim 1, which is characterized in that be arranged between the anode (2) and cathode (3) useful
In the anode baffle (6) for reducing anode (2) surrounding current density；
The anode baffle (6) is frame-like structures, and the maximum surface of both the anode baffle (6) and anode (2) is opposite to be set
It sets.
4. electroplanting device according to claim 1, which is characterized in that the width of the anode baffle (6) is 80-
100mm。
5. electroplanting device according to claim 1, which is characterized in that the anode (2) includes anode titanium basket, the titanium basket
Flatness error is not more than 5mm.
6. electroplanting device according to claim 1, which is characterized in that the anode (2) and cathode (3) pass through electrode seat (7)
With copper bar setting in groove body (1), and the spacing between anode (2) and cathode (3) is adjustable.
7. electroplanting device according to claim 1 or 6, which is characterized in that between the cathode (3) and anode (2)
Away from for 100-150mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710289002.0A CN106917132B (en) | 2017-04-27 | 2017-04-27 | A kind of electroplanting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710289002.0A CN106917132B (en) | 2017-04-27 | 2017-04-27 | A kind of electroplanting device |
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| Publication Number | Publication Date |
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| CN106917132A CN106917132A (en) | 2017-07-04 |
| CN106917132B true CN106917132B (en) | 2018-12-07 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111304720B (en) * | 2018-12-12 | 2021-04-16 | 欣兴电子股份有限公司 | Electroplating device and electroplating method |
| CN112410851A (en) * | 2019-08-23 | 2021-02-26 | 盛美半导体设备(上海)股份有限公司 | Cathode cavity |
| CN111254479A (en) * | 2020-03-27 | 2020-06-09 | 京东方科技集团股份有限公司 | Electrochemical deposition device |
| CN112626599A (en) * | 2020-12-08 | 2021-04-09 | 南京鸿音工程技术有限公司 | Electroplating equipment with impurity removal function |
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| CN1637171A (en) * | 2003-09-02 | 2005-07-13 | 日本爱铝美克斯株式会社 | Plating apparatus and method |
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Effective date of registration: 20210511 Address after: 301914 No.3 standard workshop, 32 Jiyunhe street, Tianjin special purpose vehicle industrial park, Jizhou District, Tianjin Patentee after: Newcastle Technology (Tianjin) Co.,Ltd. Address before: No.248 waiying, Taihu Town, Tongzhou District, Beijing Patentee before: BEIJING NEWPOWER TECHNOLOGY Co.,Ltd. |