TWI666346B - Electroplating apparatus - Google Patents

Abstract

An electroplating device having a feeding mechanism capable of smoothly supplying an electrolyte, including: a rotating cathode having a roller shape and an electrodeposited metal foil; an anode disposed along a cylindrical circumferential surface of the rotating cathode; and an electrolysis A liquid supply mechanism is provided below the rotating cathode to supply an electrolyte. The electrolyte supply mechanism includes a guide extending in a width direction, and the guide is attached above a supply unit that supplies the electrolyte. The guide includes a first extension portion extending upward from a central portion of the supply unit; and a second extension portion connected to the first extension portion and extending to a flow path between the rotating cathode and the anode. An upstream side and a downstream side.

Description

Electroplating equipment

The present invention relates to electroplating equipment for continuously manufacturing electroplated thin metal plates.

Metal flakes are prepared by continuously rolling a metal plate to a desired thickness or by plating metal ions onto a cathode drum. In the case of manufacturing metal flakes by rolling, there may be a limit because the thickness cannot be changed, and the plating method can produce an ultra-thin foil with a thickness of 20 μm or less. Therefore, if metal ions can Evenly deposited on the cathode drum, it is possible to produce ultra-thin foil metal flakes that are not manufactured by the rolling method.

FIG. 1 is a schematic diagram of an apparatus for continuously producing a metal plate by electroplating, in which a drum-shaped rotating cathode 1 and a concentric arc anode 2 are arranged at a predetermined distance. In this case, for example, when a plating electrolyte containing one or more metal ions (for example, iron, copper, nickel, chromium, etc.) is mixed in the electrolytic cell 7 at a constant ratio, a supply tube 3 and a The feeding mechanism 4 provides it in the space between the rotating cathode 1 and the anode 2; metal ions are plated on the surface of the rotating cathode to form a thin metal plate 10. The formed thin metal plate is separated from the surface of the rotating cathode through a peeling drum 8. In order to uniformly deposit metal ions on the surface of the cathode, the electrolyte should be smoothly supplied to the space between the electrolyte flow path 6, the rotating cathode 1, and the anode 2.

FIG. 2 is an electrolyte feed mechanism 4 according to one of the prior art. The electrolytic solution supplied to the feeding mechanism 4 is sent to the flow path 6. The electrolyte is continuously supplied to the upstream and downstream outlets of the flow path 6 through the gaps 20 and 21, the gaps 20 and 21 having a predetermined injection angle between the upper plate and the both sides of the feeding mechanism 4 in a vertical direction. θ. However, where the electrolyte reaches the surface of the rotating cathode through the gaps 20 and 21 in the region D between the points (a and b), new electrolyte may not be continuously supplied in the region and the flow is stagnant. The metal ions deposited in this region may have different concentrations from the metal ions in other regions, resulting in a problem of unevenness of the metal composition in the central portion of the thickness direction of the finally produced thin metal plate. In order to greatly reduce the area of uneven metal composition in the thin metal plate, the injection angle θ of the electrolyte should be reduced. As the injection angle decreases, the pressure of the electrolyte reaching the surface of the rotating cathode increases. Therefore, the supply of the electrolytic solution in the flow path 6 may be uneven.

On the other hand, FIG. 3 also discloses a prior art feeding mechanism 5. In this case, that is, the injection port 22 is the upper part of the feeding mechanism 5 in FIG. 3 and the electrolyte is vertically injected to the cathode, there will be no flow blocking area as shown in FIG. 2. However, since the electrolytic solution strongly reaches the cathode and then falls in the vertical direction, there is a problem that it is difficult for the injected electrolytic solution to flow uniformly in the upstream and downstream directions of the flow path.

One aspect of the present invention is to provide a plating equipment including a feeding mechanism for smoothly supplying an electrolytic solution.

According to an aspect of the present invention, the electroplating equipment includes a rotating cathode having a drum shape and an electrodeposited metal foil; an anode provided along a cylindrical circumferential surface of the rotating cathode; and an electrolyte supplying mechanism provided on the rotating Under the cathode to supply the electrolyte. The electrolyte supply mechanism includes a guide extending in a width direction, and the guide is attached above a supply unit that supplies the electrolyte. The guide includes a first extension portion extending upward from a central portion of the supply unit, and a second extension portion connected to the first extension portion and extending to an upstream side of a flow path between the rotating cathode and the anode. And one downstream side.

The first extension portion may be connected to a central portion of the second extension portion, in which case the guide member is substantially T-shaped as a whole.

The lower surface of the second extension portion may be inclined, so that an edge thereof is closer to the rotating cathode, rather than a central portion of the second extension portion connected to the first extension portion and closer to the rotating cathode. In a state where an upper surface of the second extension portion is planar, the thickness of the second extension portion can be reduced from a central portion toward an edge.

The supply unit may be provided with a front penetrating portion and a rear penetrating portion to supply an electrolyte to a lower surface of the second extension portion on the upstream side and the downstream side of the flow path.

The second extension is separated from the rotating cathode by a distance smaller than half the distance between the portion of the rotating cathode adjacent to the supply unit and the anode.

The front and rear penetrating portions are structured such that virtual extension lines at the centers of the front and rear penetrating portions intersect each other.

The supply unit may include a supply pipe having a circular shape, the supply pipe extending in a width direction of the rotating cathode, and a virtual extension line at the center of the front and rear penetration portions in a section of the supply pipe intersects the center of the supply pipe .

The lower surface of the second extension portion may be inclined at an acute angle with respect to an all-line direction of the rotating cathode facing the guide.

The supply unit may include a quadrangular supply tube extending along a width direction of the rotating cathode, and the front and rear penetrating portions may be parallel to each other.

The front and rear penetrating portions may be formed by slits or a plurality of through holes.

The supply unit may include a supply pipe, and the supply pipe may have an intermediate plate disposed therein, the intermediate plate having a plurality of through holes formed therein.

The above and other aspects, features, and advantages of the present invention will be more clearly understood through the following detailed description in conjunction with the accompanying drawings.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

4 to 6 are schematic views of a plating apparatus according to a first embodiment of the present invention, and a sectional view of a feeding mechanism and a perspective view of the feeding mechanism of the plating apparatus.

As shown in FIG. 4, the plating apparatus according to the first embodiment may include a rotary cathode 1 having a drum shape, in which a metal foil is electrodeposited in the same manner as the prior art plating equipment; an anode 2 A cylindrical peripheral surface is provided; and an electrolytic solution feeding mechanism 100 is provided below the rotating cathode to supply an electrolytic solution.

The electrolyte feeding mechanism 100 may include a guide 130 extending above the supply unit 110 in a length direction, and the electrolyte is supplied through the supply unit 110. The guide 130 may include a first extension portion 131 extending upward from a central portion of the supply unit 110; and a second extension portion 135 connected to the first extension portion 131 and extending to the rotating cathode 1 and anode 2 An upstream side and a downstream side of a flow path 6 therebetween. In this case, the first extension portion 131 may be connected to a central portion of the second extension portion, so that the guide 130 is substantially T-shaped as a whole.

The supply unit 110 may be provided with a supply pipe 111 connected to a lower portion thereof so that the electrolytic solution can be supplied to the supply unit 110 from an electrolytic solution supply source. The intermediate plate 120 having one of the plurality of through holes 121 may be disposed in the supply unit 110, so that the electrolyte passing through the intermediate plate 120 may have a stable flow in the supply unit 110.

In the first embodiment, the supply unit 110 may be a supply pipe having a circular cross section, and the first extension portion 131 of the guide 130 may be connected to the supply unit 110 in the length direction of the supply unit 110. Upper center part in width direction.

In the supply unit 110, penetrating portions 113 and 114 may be respectively provided on the upstream side and the downstream side of the flow path 6, which are portions where the first extension portion 131 of the guide 130 is connected to the supply unit 110. The electrolytic solution in the supply unit 110 may be supplied through the penetrating portions 113 and 114, and the electrolytic solution that has passed through the penetrating portions 113 and 114 may be supplied to the flow path 6 through the guide 130.

The guide 130 of the first embodiment will be described in detail through FIGS. 4 and 5.

In the first embodiment shown in FIG. 4, the guide 130 may be substantially T-shaped. In this case, an upper surface 134 of the second extension portion 135 may be a plane, and a lower surface 133 of the second extension portion 135 may be inclined while having an acute angle with respect to the horizontal direction. For example, the lower surface 133 may be inclined at an acute angle with respect to a tangent direction of a point on the rotating cathode 1 facing the guide 130. Therefore, the guide 130 can prevent the electrolyte solution that has been dispersed through the supply unit 110 from reaching the rotating cathode quickly, and the electrolyte reaching the rotating cathode quickly can make the flow of the electrolyte uneven.

In addition, the front and rear penetration portions 113 and 114 of the supply unit 110 may be provided to face the lower surface of the second extension portion on the upstream side and the lower surface of the second extension portion on the downstream side, respectively. For example, as shown in FIG. 4, the penetrating portions 113 and 114 may be configured in such a manner that virtual extension lines at the centers of the front and rear penetrating portions 113 and 114 may intersect the lower surface 133. The virtual extension lines of the centers of the front and rear perforated portions 113 and 114 may intersect at a predetermined angle, and the intersection points of the virtual extension lines may coincide with the center of the circular supply pipe as the supply unit. Therefore, the electrolytic solution can be discharged while being inclined at a predetermined angle while leaving the supply unit 110, and this structure is also suitable in terms of processing the penetration portions 113 and 114.

In the first embodiment, the penetrating portions 113 and 114 may be formed by a plurality of through holes provided along the length direction of the supply unit 110, so that the electrolyte flows that have passed through the through holes can be merged so as to extend the length of the supply unit. A uniform flow of the electrolytic solution is obtained in the direction.

Referring again to FIG. 4, the supply unit 110 may be disposed between the anodes 2, and thus, the guide 130 may extend into the flow path 6. Between the portion where the second extension portion 135 starts to be connected to the first extension portion 131 (specifically, the central portion of the guide 130 where the second extension portion 135 is connected to the first extension portion 131) and the rotating cathode 1 A distance L may be smaller than the distance H between the rotating cathode 1 and the anode 2. For example, the second extension portion 135 may be arranged to extend in the width direction to the middle position or above the flow path 6, and the electrolyte is guided by the second extension portion 135 to impact the points a and b of the rotating cathode 1. The distance D can be shortened, reducing the area where the electrolyte stagnates, thereby improving the quality of the plating.

In the first embodiment, the electrolytic solution that has passed through the supply pipe 111 may pass through the intermediate plate 120 having the through hole 121 and the supply unit 110 having the penetration portions 113 and 114, and then the electrolytic solution may be supplied to the guide 130 Flow path 6. Through the first extension portion 131 of the guide 130, the provided electrolytic solution can be supplied to the upstream and downstream sides of the flow path without mixing the electrolyte solutions of the upstream and downstream sides, and the electrolyte can be passed through the second extension portion 135. Guided in the direction of the flow path. At this time, since the lower surface of the second extension portion 135 is inclined, the stagnation of the electrolytic solution can be reduced, and the influence of the electrolytic solution on the rotating cathode can also be reduced. Therefore, variations in the composition in the thin metal plate derived from the plating equipment can be reduced.

7 and 8 are other exemplary embodiments. FIG. 7 is a perspective view of the feeding mechanism 100 of the second embodiment in the disclosure, and FIG. 8 is a perspective view of the feeding mechanism 100 of the third embodiment in the disclosure.

Except for the feeding mechanism 100, the components of the second embodiment and the third embodiment are the same as those of the first embodiment, and a description thereof will be omitted.

In the case of the second embodiment, the components are the same as those of the first embodiment except that the shape of the through hole of the intermediate plate 120 of the supply unit 110 and the shape of the guide 130 are different. In the second embodiment, the through hole formed on the intermediate plate 120 of the supply unit 110 may be a long slit-like through hole 121 instead of a circular through hole. The shape of the through hole can be selected according to the flow rate of the electrolyte.

In addition, in the second embodiment, the guide 130 may be Y-shaped instead of being substantially T-shaped as described in the first embodiment. In the second embodiment, likewise, the lower surface 133 of the second extension 135 of the guide 130 may be inclined so that its edge portion rotates closer to the center than the center portion of the second extension connected to the first extension cathode. Therefore, the electrolytic solution supplied through the penetrating portions 113 and 114 may be guided by the second extension portion 135.

In the third embodiment of FIG. 8, the shape of the guide 130 may be the same as that of the second embodiment, and the shapes of the penetrating portions 113 and 114 of the supply unit 110 may be different from those of the second embodiment. According to an exemplary embodiment of the present invention, although the penetrating portions 113 and 114 may have circular through holes as in the first and second embodiments, the penetrating portions 113 and 114 may also have slits as in the third embodiment shape. In this case as well, the virtual extension line of the through seam 116 can intersect the lower surface of the second extension portion 135 in the width direction, so the electrolyte that has passed through the through seam 116 can be guided by the member 130. guide.

Fig. 9 shows a fourth embodiment of the present invention.

As shown in FIG. 9, the electroplating apparatus according to the fourth embodiment may include a rotating cathode 1 having a drum shape, and electrodepositing a metal foil in the same manner as in the first to third embodiments; an anode 2, along the rotating cathode A cylindrical circumference of 1 is provided; and a feeding mechanism 100 is provided below the rotating cathode to supply an electrolyte. In the fourth embodiment, one of the supply units 110 'of the electrolytic solution feeding mechanism 110 may be a supply pipe having a quadrangular cross section, which is different from the first to third embodiments.

The first extension portion 131 of the guide 130 may be connected to a center portion of the upper surface of the supply unit 110 ′, and the penetrating portions 113 and 114 may be respectively formed on the upstream side and the downstream side of the flow path based on the first extension portion 131. In this case, the penetrating portions 113 and 114 may be formed by a plurality of circular through holes or through slits, and may be formed perpendicular to the upper surface of the supply unit and below the second extension portion 135.

Although the present invention has been described by an exemplary embodiment, various modifications can be made to the exemplary embodiment without being limited thereto.

For example, according to an exemplary embodiment of the present invention, regarding the guide 130, a connection surface or a corner or an edge connected to each other at the first extension 131 and the second extension 135 may be curved to prevent the electrolyte flow from being affected Disturbance, this can also be used for the connecting part of the guide 130 and the supply unit 110 '.

In addition, according to the exemplary embodiment, the shapes of the through hole and the penetrating portion may be modified as needed, and the shape of the through hole of the intermediate plate 121 may also be modified as needed.

As described above, according to the exemplary embodiment, it is possible to provide a plating apparatus including a feeding mechanism that can smoothly supply an electrolytic solution through the above-mentioned configuration.

Although exemplary embodiments have been shown and described in the foregoing, it will be apparent to those having ordinary knowledge in the art that it may be done without departing from the scope of the invention as defined by the scope of the appended patent applications. Modifications and changes.

1                        Rotating cathode                        20                        gap                        10                        Sheet metal                        twenty one                        gap                        100                        Electrolyte feeding mechanism                        twenty two                        Note entrance                        110, 110 ’                        Supply unit                        3                        Supply pipe                        111                        Supply tube                        4                        Feeding mechanism                        113                        Penetration                        5                        Feeding mechanism                        114                        Penetration                        6                        Flow path                        116                        Through seam                        7                        Electrolytic cell                        120                        Middle plate                        8                        Peeling roller                        121                        Through hole                        a                        point                        130                        Guide                        b                        point                        131                        First extension                        D                        distance                        133                        lower surface                        H                        distance                        134                        Upper surface                        L                        distance                        135                        Second extension                        θ                        Injection angle                        2                        anode                       

FIG. 1 is a schematic diagram of a plating apparatus according to the prior art.
FIG. 2 is an enlarged view of the plating apparatus of FIG. 1.
FIG. 3 is a schematic diagram of a plating apparatus according to the prior art.
FIG. 4 is a schematic diagram of a plating apparatus according to a first embodiment of the present invention.
Fig. 5 is a sectional view of a feeding mechanism of the plating apparatus according to the first embodiment.
Fig. 6 is a perspective view of a feeding mechanism of the plating apparatus of the first embodiment.
FIG. 7 is a perspective view of a feeding mechanism of a plating apparatus according to a second embodiment of the present invention.
8 is a perspective view of a feeding mechanism of a plating apparatus according to a third embodiment of the present invention.
FIG. 9 is a schematic diagram of a plating apparatus according to a fourth embodiment of the present invention.

Claims (12)

An electroplating device comprising:
A rotating cathode with a roller shape and electrodeposited metal foil;
An anode is provided along a cylindrical circumferential surface of the rotating cathode; and an electrolyte supplying mechanism is provided below the rotating cathode to supply an electrolyte,
Wherein, the electrolyte supply mechanism includes a guide extending in a width direction, the guide is above a supply unit that supplies the electrolyte, and the guide includes a first extension from the center of the supply unit. A portion extends upward; and a second extension connected to the first extension and extending to an upstream side and a downstream side of a flow path between the rotating cathode and the anode. The electroplating equipment according to item 1 of the scope of patent application, wherein the first extension is connected to a central portion of the second extension, and in this case, the guide is substantially T-shaped as a whole. The electroplating equipment according to item 2 of the scope of patent application, wherein the lower surface of the second extension is inclined so that its edge is closer to the rotating cathode than to the second extension connected to the first extension. A central portion of the extension is near the rotating cathode. The electroplating equipment according to item 2 of the scope of patent application, wherein in a state where an upper surface of the second extension portion is planar, the thickness of the second extension portion decreases from the center portion toward an edge The electroplating equipment according to item 1 of the scope of patent application, wherein the supply unit is provided with a front penetration portion and a rear penetration portion to align the first penetration portion on the upstream side and the downstream side of the flow path. The lower surfaces of the two extensions are supplied with electrolyte. The electroplating equipment according to item 1 of the scope of patent application, wherein the second extension is spaced from the rotating cathode by half the distance between the portion of the rotating cathode adjacent to the supply unit and the anode. Still a small distance apart. The electroplating equipment according to item 5 of the scope of patent application, wherein the front and rear penetrating portions are structured such that virtual extension lines at the centers of the front and rear penetrating portions intersect each other. The electroplating equipment according to item 5 of the patent application scope, wherein the supply unit includes a supply pipe having a circular shape, the supply pipe extends in a width direction of the rotating cathode, and The virtual extension lines at the center of the front and rear penetrations intersect the center of the supply tube. The electroplating apparatus according to item 3 or 4 of the scope of patent application, wherein the lower surface is inclined at an acute angle with respect to an all-line direction of the rotating cathode facing the guide. The electroplating equipment according to item 5 of the patent application scope, wherein the supply unit may include a quadrangular supply pipe extending along a width direction of the rotating cathode, and the front and rear penetrating portions are parallel to each other. The electroplating equipment according to item 5 of the scope of patent application, wherein the front and rear penetrating portions are formed by a slit or a plurality of through holes. The electroplating equipment according to item 11 of the scope of patent application, wherein the supply unit includes a supply pipe, and the supply pipe has an intermediate plate provided therein, and the intermediate plate has a plurality of through holes formed therein.