CN210215608U - Electroplating solution input device for electroplating equipment and corresponding electroplating equipment - Google Patents
Electroplating solution input device for electroplating equipment and corresponding electroplating equipment Download PDFInfo
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- CN210215608U CN210215608U CN201920928322.0U CN201920928322U CN210215608U CN 210215608 U CN210215608 U CN 210215608U CN 201920928322 U CN201920928322 U CN 201920928322U CN 210215608 U CN210215608 U CN 210215608U
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- plating solution
- electroplating
- plating
- conduit
- solution inlet
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- 238000009713 electroplating Methods 0.000 title claims abstract description 75
- 238000007747 plating Methods 0.000 claims abstract description 143
- 238000004891 communication Methods 0.000 claims abstract description 12
- 239000010949 copper Substances 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 238000000034 method Methods 0.000 abstract description 10
- 239000000243 solution Substances 0.000 description 120
- 238000003756 stirring Methods 0.000 description 13
- 239000000306 component Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 238000013019 agitation Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 238000005342 ion exchange Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The utility model relates to an electroplating solution input device for electroplating equipment, which is characterized in that the device comprises: a plating solution inlet configured to input a plating solution; a first plating solution conduit in communication with the plating solution inlet for conducting a plating solution; and a first plurality of plating solution inlet ports in communication with the first plating solution conduit for inputting plating solution from the first plating solution conduit into the plating apparatus, wherein the first plurality of plating solution inlet ports are oriented such that the output plating solution rotates in a first direction. Through the utility model, the uniformity of each component in the electroplating solution can be improved in the electroplating process, thereby improving the electroplating quality.
Description
Technical Field
The present invention relates generally to the field of semiconductor manufacturing, and more particularly to an electroplating solution input device for electroplating equipment. In addition, the utility model also relates to an electroplating device using the electroplating solution input device.
Background
Nowadays, semiconductor devices have been advanced to the aspects of modern life. Whereas the core components of most electronic products such as computers, mobile phones, etc., like processors, memories, etc., contain semiconductor devices. Semiconductor devices have played a vital role in modern information devices.
One important process in semiconductor manufacturing is electroplating, which functions to plate a layer of another metal or alloy on a target surface using the principle of electrolysis, for example, by plating a via hole with copper metal using electroplating. The principle of electroplating is that the metal (e.g., Cu) at the anode loses electrons and becomes a metal cation (e.g., Cu)2+) The metal cations (e.g. Cu) that form into solution and reach the cathode by ion exchange2+) As a result of the gain of electrons, deposit on the target surface as elemental metal (e.g., Cu). One disadvantage of the prior art electroplating apparatus is that the respective components (e.g., additives) in the electroplating solution tend to become non-uniform in concentration as the electroplating process proceeds, which can result in rough electroplated layers, non-uniform thicknesses, and even scorch.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide an electroplating solution input device and corresponding electroplating equipment for electroplating equipment, through this electroplating solution input device and/or this electroplating equipment, can improve the homogeneity of each component in the electroplating solution in the electroplating process to improve electroplating quality.
In a first aspect of the present invention, the task is solved by an electroplating solution feeding device for an electroplating apparatus, comprising:
a plating solution inlet configured to input a plating solution;
a first plating solution conduit in communication with the plating solution inlet for conducting a plating solution; and
a first plurality of plating solution input ports in communication with the first plating solution conduit for inputting plating solution from the first plating solution conduit into the plating apparatus, wherein the first plurality of plating solution input ports are oriented such that the output plating solution rotates in a first direction.
In a preferred embodiment of the present invention, it is provided that the apparatus further comprises:
a second plating solution conduit in communication with the plating solution inlet for conducting the plating solution; and
a second plurality of plating solution inlet ports in communication with the second plating solution conduit for inputting plating solution from the second plating solution conduit into the plating apparatus, wherein the second plurality of plating solution inlet ports are oriented such that the output plating solution is rotated in a second direction opposite the first direction.
Through setting up two sets of electroplating solution input ports that stirring direction is opposite, can further improve the homogeneity of electroplating solution to further improve electroplating quality.
In one embodiment of the invention, it is provided that the first direction is clockwise and the second direction is counterclockwise; or
The second direction is clockwise and the first direction is counter-clockwise.
In a further embodiment of the invention, it is provided that the supply opening for the electroplating solution is a nozzle. It should be noted here that other forms of electroplating solution inlet ports are also contemplated under the teachings of the present invention, such as spray orifices, outlet ports, and the like.
In a preferred embodiment of the present invention, it is provided that the plating solution inlet includes four plating solution inlets which are sequentially arranged at intervals of 90 °. The solution input speed can be increased and the stirring effect can be improved by arranging a plurality of electroplating solution inlets. It is also possible to provide the plating solution inlets in other ways, such as 6 plating solution inlets spaced 60 ° apart in sequence, etc. under the teachings of the present invention.
In a further preferred embodiment of the invention, it is provided that the first electroplating solution line and/or the second electroplating solution line are annular, wherein:
each of the first plurality of plating solution inlet ports is oriented at a first angle to a tangent at an intersection of the first plating solution conduit and the plating solution inlet port; and/or
Each of the second plurality of plating solution inlet ports is oriented at a second angle from a tangent at an intersection of the second plating solution conduit and the plating solution inlet port, wherein the second angle is opposite the opening direction of the first angle.
Other shapes of the plating solution conduit are also contemplated in light of the teachings of the present invention, as long as the stirring effect of the plating solution can be achieved, for example, a rectangular, square, or oval plating solution conduit can be provided. Further, "the second angle and the first angle are open in opposite directions" means that the difference between the direction in which the second angle (which is smaller than 180 °) faces and the direction in which the first angle (which is smaller than 180 °) faces is substantially 180 °.
In a second aspect of the invention, the aforementioned object is achieved by an electroplating apparatus having an electroplating solution input device according to the invention, wherein the electroplating solution input device is arranged between the anode of the electroplating apparatus and the high-resistance virtual anode HRVA.
In a preferred embodiment of the invention, it is provided that the electroplating device is an electroplating device for electroplating copper. The copper electroplating process is an important process in the semiconductor process, and the quality of the copper electroplating can be improved through the copper electroplating device.
The utility model discloses have following beneficial effect at least: by adopting the electroplating solution input device, the electroplating solution can be stirred, so that the uniformity of each component in the electroplating solution is improved, and the electroplating quality is improved; furthermore, the utility model discloses an electroplating solution input device need not electric stirring device and can realize automatic stirring effect, its simple structure, low cost, easily industrial popularization. Particularly, the utility model discloses the mixed solution circulation system has been changed and the structure of chamber entry is being advanced, increase at the chamber input port for example annular input device promptly, there is the electroplating solution input port that a plurality of horizontal oblique angles set up on the device, under the condition of the pump control solution velocity of flow on the circulation system, reach control solution input direction, make the flow of its solution form in the cavity and rotate and reach stirring effect, thereby promote the transmission of material, eliminate concentration polarization and improve current density, reduce the porosity of cladding material, the mixture of solution with higher speed with the messenger's temperature, the concentration is even unanimous, make the wafer surface bright level and smooth, the plating layer is even stable.
Drawings
The invention will be further elucidated with reference to the drawings in conjunction with the detailed description.
FIG. 1 shows a first embodiment of an electroplating apparatus according to the present invention;
FIG. 2 shows a schematic view of an electroplating solution input apparatus according to the present invention; and
fig. 3 shows a second embodiment of an electroplating apparatus according to the invention.
Detailed Description
It should be noted that the components in the figures may be exaggerated and not necessarily to scale for illustrative purposes. In the figures, identical or functionally identical components are provided with the same reference symbols.
In the present invention, "disposed on …", "disposed above …" and "disposed over …" do not exclude the presence of an intermediate therebetween, unless otherwise specified. Further, "disposed on or above …" merely indicates the relative positional relationship between two components, and may also be converted to "disposed below or below …" and vice versa in certain cases, such as after reversing the product direction.
In the present invention, the embodiments are only intended to illustrate the aspects of the present invention, and should not be construed as limiting.
In the present application, the terms "a" and "an" do not exclude the presence of a plurality of elements, unless otherwise indicated.
It is further noted herein that in embodiments of the present invention, only a portion of the components or assemblies may be shown for clarity and simplicity, but those skilled in the art will appreciate that the components or assemblies may be added as needed for specific scenarios, given the teachings of the present invention.
It is also to be noted that, within the scope of the present invention, the expressions "identical", "equal", etc., do not mean that the two values are absolutely equal, but allow a certain reasonable error, that is, the expressions also cover "substantially identical", "substantially equal". By analogy, in the present disclosure, the terms "perpendicular to", "parallel to", and the like in the table direction also cover the meaning of "substantially perpendicular to", "substantially parallel to".
In addition, although the present invention is described with reference to a copper plating process, it should be understood that the present invention may be applied to other plating processes.
The invention will be further elucidated with reference to the drawings in conjunction with the detailed description.
Fig. 1 shows a first embodiment of an electroplating apparatus 100 according to the present invention.
As shown in fig. 1, an electroplating apparatus 100 according to the present invention electroplates copper onto a wafer 102. For this reason, the copper metal loses electrons and copper ions (Cu) at the anode 1062+) The copper ions move towards the cathode by ion exchange, acquire electrons at the cathode after passing through a High Resistance Virtual Anode (HRVA) 103, and deposit as metallic copper on the wafer 102 near the cathode. HRVA 103 is, for example, configured to have a higher resistance than the copper seed layer on wafer 102 and is placed near wafer 102, which acts to force the same amount of current to flow to the surface of wafer 102, thereby achieving a uniform current distribution across the wafer surface.
In order to realize the exchange of the plating solution, a plating solution input device 101 and a plating solution outlet 108 are provided. The plating solution is input into the plating apparatus 100 from the plating solution input device 101, and is discharged from the plating solution outlet 108.
The plating solution feeding device 101 includes the following components:
an electroplating solution inlet 107 configured to input an electroplating solution. The plating solution inlet 107 may be provided in plural numbers, which are, for example, uniformly spaced apart from each other. The solution feed speed can be increased and the stirring effect can be improved by providing a plurality of plating solution inlets 107. For example, 4 plating solution inlets 107 sequentially spaced at 90 ° or 6 plating solution inlets 107 sequentially spaced at 60 ° are provided.
A first plating solution conduit 104 communicating with the plating solution inlet 107 for guiding the plating solution. The plating solution conduit is, for example, annular or other closed shape.
A first plurality of plating solution inlet ports 105 in communication with the first plating solution conduit 104 for inputting plating solution from the first plating solution conduit 104 into the plating apparatus 100, wherein the first plurality of plating solution inlet ports 105 are oriented such that the output plating solution is rotated in a first direction, which may be counterclockwise or clockwise as viewed from above (direction a). Referring to the rotating arrow in fig. 1, the plating solution is rotated counterclockwise from above (direction a), but clockwise rotation is also conceivable.
Fig. 2 shows a plan view of the plating solution supply device 101 according to the present invention, as viewed from the direction a of fig. 1.
As shown in fig. 2, the plating solution inlet device 101 has 4 plating solution inlets 107 arranged at 90 ° intervals in sequence on the circumference of the annular plating solution pipe 104, that is, uniformly on the circumference. The plating solution feed opening 105 is arranged in the plating solution conduit 104 in such a way that the plating solution feed opening 105 is oriented or directed such that the tangential velocity of the water flow (see arrows in fig. 2) fed out by the plating solution feed opening 105 results in a preferably unidirectional stirring action, i.e. a stirring effect is achieved by the oblique angle spraying of the plating solution feed openings 105. As shown in fig. 2, all of the plating solution inlet ports 105 are oriented to promote counter-clockwise rotational agitation (as indicated by the rotational arrows in fig. 2). Here, the angles of tangents of the plating solution inlet ports 105 at the intersection of the first plating solution pipe 104 and the plating solution inlet ports 105 are preferably all the same, for example, 45 °. To this end, the plating solution inlet 105 may be a pipe extending a certain length in its orientation and may be provided with a nozzle at the end.
Fig. 3 shows a second embodiment of an electroplating apparatus 100 according to the present invention.
The second exemplary embodiment of fig. 3 differs from the first exemplary embodiment of fig. 1 primarily in that the following are additionally provided in the second exemplary embodiment:
a second plating solution conduit 109 communicating with the plating solution inlet 107 for guiding the plating solution.
A second plurality of plating solution inlet ports 110 in communication with the second plating solution conduit 109 for inputting plating solution from the second plating solution conduit 109 into the plating apparatus, wherein the second plurality of plating solution inlet ports 110 are oriented such that the output plating solution is rotated in a second direction opposite to the first direction. Here, the second direction is a clockwise direction, which is opposite to the first direction, i.e., a counterclockwise direction, thereby achieving a better stirring effect. To this end, all of the second plurality of plating solution inlet ports 105 are oriented to promote clockwise rotational agitation.
The utility model discloses have following beneficial effect at least: by adopting the electroplating solution input device, the electroplating solution can be stirred, so that the uniformity of each component in the electroplating solution is improved, and the electroplating quality is improved; furthermore, the utility model discloses an electroplating solution input device need not electric stirring device and can realize automatic stirring effect, its simple structure, low cost, easily industrial popularization. That is to say, the utility model discloses the mixed solution circulation system has been changed and the structure of chamber entry is being advanced, increase at the chamber input port for example annular input device promptly, there is the electroplating solution input port that a plurality of horizontal oblique angles set up on the device, under the condition of the pump control solution velocity of flow on the circulation system, reach control solution input direction, make the flow of its solution form in the cavity and rotate and reach the stirring effect, thereby promote the transmission of material, eliminate concentration polarization and improve current density, reduce the porosity of cladding material, the mixture of solution with higher speed with make the temperature, the concentration is even unanimous, make the wafer surface bright level and smooth, the plating layer is even stable.
Although some embodiments of the present invention have been described in the present document, it will be understood by those skilled in the art that these embodiments are shown by way of example only. Numerous variations, substitutions and modifications will occur to those skilled in the art in light of the teachings of the present invention without departing from the scope thereof. It is intended that the following claims define the scope of the invention and that methods and structures within the scope of these claims and their equivalents be covered thereby.
Claims (8)
1. An electroplating solution input device for electroplating equipment, which is characterized by comprising:
a plating solution inlet configured to input a plating solution;
a first plating solution conduit in communication with the plating solution inlet for conducting a plating solution; and
a first plurality of plating solution input ports in communication with the first plating solution conduit for inputting plating solution from the first plating solution conduit into the plating apparatus, wherein the first plurality of plating solution input ports are oriented such that the output plating solution rotates in a first direction.
2. The plating solution delivery apparatus as recited in claim 1, further comprising:
a second plating solution conduit in communication with the plating solution inlet for conducting the plating solution; and
a second plurality of plating solution inlet ports in communication with the second plating solution conduit for inputting plating solution from the second plating solution conduit into the plating apparatus, wherein the second plurality of plating solution inlet ports are oriented such that the output plating solution is rotated in a second direction opposite the first direction.
3. The plating solution feeding device as recited in claim 1 or 2, wherein the first direction is a clockwise direction and the second direction is a counterclockwise direction; or
The second direction is clockwise and the first direction is counter-clockwise.
4. The plating solution inlet device as claimed in claim 1 or 2, wherein the plating solution inlet is a nozzle.
5. The plating solution inlet device as claimed in claim 1 or 2, wherein the plating solution inlet port comprises four plating solution inlet ports arranged in sequence at intervals of 90 °.
6. The plating solution feeding device as claimed in claim 1 or 2, wherein the first plating solution conduit and/or the second plating solution conduit is annular, wherein:
each of the first plurality of plating solution inlet ports is oriented at a first angle to a tangent at an intersection of the first plating solution conduit and the plating solution inlet port; and/or
Each of the second plurality of plating solution inlet ports is oriented at a second angle from a tangent at an intersection of the second plating solution conduit and the plating solution inlet port, wherein the second angle is opposite the opening direction of the first angle.
7. An electroplating apparatus having an electroplating solution inlet device according to one of claims 1 to 6, wherein the electroplating solution inlet device is arranged between the anode of the electroplating apparatus and a high-resistance virtual anode HRVA.
8. The plating apparatus as recited in claim 7, wherein said plating apparatus is a plating apparatus for plating copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920928322.0U CN210215608U (en) | 2019-06-19 | 2019-06-19 | Electroplating solution input device for electroplating equipment and corresponding electroplating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920928322.0U CN210215608U (en) | 2019-06-19 | 2019-06-19 | Electroplating solution input device for electroplating equipment and corresponding electroplating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210215608U true CN210215608U (en) | 2020-03-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920928322.0U Expired - Fee Related CN210215608U (en) | 2019-06-19 | 2019-06-19 | Electroplating solution input device for electroplating equipment and corresponding electroplating equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210215608U (en) |
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2019
- 2019-06-19 CN CN201920928322.0U patent/CN210215608U/en not_active Expired - Fee Related
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200331 |