JP2014019946A - Plating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plating device having a shielding member capable of fluidly dealing with the various appearances of the plating deviation of the object to be plated, and effective for the reduction of process time and the reduction of process cost.SOLUTION: The plating device 100 comprises: a plating tank 110 storing a plating liquid and charged with the object 200 to be plated; an anode(s)120 oppositely arranged on one side or both the sides of the object 200 to be plated; and a shielding member 130 arranged between the object 200 to be plated and the anode(s) 120, composed of a first plate 131 and a second plate 133 adjacently arranged to the first plate 131, and in which the first plate 131 and the second plate 133 or the first plate 131 and the second plate 133 mutually parallelly move.

Description

  The present invention relates to a plating apparatus.

  Electrolytic plating can be used not only for metal decoration and surface protection, but also in various fields such as electronic component, printed circuit board, and semiconductor device circuit formation.

  In electrolytic plating, an object to be plated is immersed in a plating solution, the object to be plated is a cathode, and a metal to be electrodeposited is applied as an anode. A plating film can be formed such that desired metal ions are electrodeposited on the surface of the object to be plated.

  At this time, the current concentrates on the end of the object to be plated, and the metal ions are concentrated on the end of the object to be plated, so that a plating deviation occurs and the uniform plating thickness is obtained. The problem that it cannot be obtained may occur.

  On the other hand, a plating apparatus according to the prior art is disclosed in Patent Document 1.

US Pat. No. 5,217,598

  The objective of this invention is providing the plating apparatus which has a shielding member which can respond | correspond fluidly to various aspects of the plating deviation of a to-be-plated thing.

  Another object of the present invention is to provide a plating apparatus that is effective for shortening the process time and reducing the process cost.

  The plating apparatus according to the present embodiment includes a plating bath that contains a plating solution and into which an object to be plated is placed, an anode that is disposed on one or both surfaces of the object to be plated, the object to be plated, and the object And a first plate and a second plate disposed adjacent to the first plate, wherein the first plate, the second plate, or the first plate and the second plate are disposed between the anode and the anode. And shielding members that move in parallel with each other.

  Here, it is preferable that a shielding pattern including a plurality of penetrating portions and a plurality of shielding portions is formed on each of the first plate and the second plate of the shielding member.

  At this time, the shielding pattern formed on the first plate and the shielding pattern formed on the second plate are preferably the same.

  In addition, it is preferable that the shielding pattern formed on the first plate and the shielding pattern formed on the second plate are different from each other.

  In addition, the first plate and the second plate of the shielding member are each composed of a plurality of regions corresponding to each other, and each region constituting the first plate and each region constituting the second plate have a plurality of regions, respectively. It is preferable that a shielding pattern including a penetrating portion and a plurality of blocking portions is formed.

  At this time, each shielding pattern formed in each region of the first plate is preferably the same as or different from each shielding pattern formed in a region corresponding to the second plate.

  Further, it is preferable that the first plate and the second plate of the shielding member move in a direction perpendicular to the bottom surface of the plating tank.

  At this time, it is preferable that the first plate and the second plate of the shielding member move in a sliding manner.

  In addition, the plating apparatus according to the present embodiment includes a plating bath that contains a plating solution and into which an object to be plated is placed, an anode that is disposed to face one or both surfaces of the object to be plated, and the object to be plated. And a plurality of plates disposed adjacent to each other, and each of the plurality of plates includes a shielding member that moves parallel to the adjacent plates.

  Here, it is preferable that a shielding pattern including a plurality of penetration portions and a plurality of shielding portions is formed on each of the plurality of plates of the shielding member.

  At this time, it is preferable that the shielding patterns formed on the plurality of plates are the same.

  The shielding patterns formed on the plurality of plates are preferably different from each other.

  In addition, each of the plurality of plates of the shielding member includes a plurality of regions corresponding to each other, and a shielding pattern including a plurality of penetration portions and a plurality of shielding portions is formed in each region of each plate. Is preferred.

  In addition, it is preferable that the shielding patterns formed for each of the regions corresponding to the plurality of plates are the same or different from each other.

  Further, it is preferable that the plurality of plates of the shielding member respectively move in a direction perpendicular to the bottom surface of the plating tank.

  The plurality of plates of the shielding member preferably move in a sliding manner.

  The shielding member according to the present invention has a shielding pattern including a penetrating part and a shielding part, and is composed of two slide-movable plates, so that the aperture ratio for each position of the shielding member can be adjusted. Therefore, it is possible to easily adjust the current flow or interruption according to position.

  In addition, since the shielding member according to the present invention can adjust the aperture ratio for each position by sliding the two plates as described above, one shielding member can cope with various aspects of plating deviation. It has an effect that can be.

  In addition, as described above, the present invention can cope with various aspects of plating deviation with one shielding member, and compared with the conventional design and production of a shielding member having a different pattern every time according to the plating deviation. The process time is shortened and the process cost is reduced.

It is sectional drawing which shows the structure of the plating apparatus by one Example of this invention. It is sectional drawing which shows the structure of the shielding member of the plating apparatus by one Example of this invention. It is sectional drawing which shows the change of the aperture ratio according to area | region by the plate movement of the shielding member by one Example of this invention. It is sectional drawing which shows the change of the aperture ratio according to area | region by the plate movement of the shielding member by one Example of this invention. It is sectional drawing which shows the change of the aperture ratio according to area | region by the plate movement of the shielding member by one Example of this invention. It is a graph which shows the distribution of the plating thickness by the plating process using the plating apparatus which applied the conventional shielding member, and the plating apparatus which applied the shielding member by this invention.

  Objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and preferred embodiments with reference to the accompanying drawings. In this specification, when adding reference numerals to the components of each drawing, it is noted that the same components are given the same number as much as possible even if they are shown in different drawings. There must be. The terms “one side”, “other side”, “first”, “second” and the like are used to distinguish one component from another component, and the component is the term It is not limited by. Hereinafter, in describing the present invention, detailed descriptions of known techniques that may obscure the subject matter of the present invention are omitted.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  1 is a cross-sectional view showing a structure of a plating apparatus according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view showing a structure of a shielding member of the plating apparatus according to an embodiment of the present invention. FIG. 5 is a cross-sectional view showing a change in aperture ratio for each region due to plate movement of the shielding member according to one embodiment of the present invention.

  Referring to FIG. 1, the plating apparatus 100 according to the present embodiment includes a plating tank 110, an anode 120, and a shielding member 130.

  The plating tank 110 can accommodate a plating solution necessary for plating and can have a size that allows the workpiece 200 to be charged.

  The object to be plated 200 in the present embodiment is preferably a printed circuit board (PCB), but is not particularly limited thereto, and may be a steel sheet, a silicon wafer, or the like on which other galvanization is performed. preferable.

  The plating tank 110 may include a plating solution supply unit (not shown) for supplying a plating solution, and the plating solution supply unit (not shown) has a discharge pipe (having a plurality of holes through which the plating solution is discharged) ( And a supply pipe (not shown) for supplying a plating solution connected to both ends of the discharge pipe (not shown).

  Here, the discharge pipe (not shown) can prevent the plating solution from being stagnated due to stirring.

  In addition, the plating solution may overflow the plating tank 110 or may be recirculated by flowing out by suction.

  The plating tank 110 may further include an agitator (not shown) that circulates the plating solution by injecting air into the plating solution.

  The anode 120 is disposed opposite to the object to be plated 200 so that metal ions released from the anode 120 can be easily electrodeposited on the object to be plated 200.

  In the present embodiment, the anode 120 is preferably a quadrangular prism type or a cylindrical type, but is not particularly limited thereto.

  Further, in FIG. 1, the anode 120 is illustrated as being disposed opposite to both surfaces of the object to be plated 200, but is not particularly limited thereto, and when plating is intended only on one surface of the object to be plated 200. It is also possible to dispose only the surface.

  In this embodiment, the anode 120 may include an anode basket (not shown) and a plating metal charged into the anode basket.

  Here, the anode basket (not shown) is preferably made of a porous network so that metal ions released from the plating metal can easily flow out, but is not particularly limited thereto. .

  The plated metal is preferably in the form of a ball, but is not particularly limited thereto.

  Here, the plating metal is a metal to be electrodeposited on the workpiece 200, and not only a pure metal but also an alloy can be used.

  The plating metal in this example is a group consisting of copper (Cu), nickel (Ni), tin (Sn), silver (Ag), platinum (Pt), gold (Au), zinc (Zn), and alloys thereof. However, it is not particularly limited to this.

  When a current is applied by connecting a rectifier to the object to be plated 200, which is an anode 120 and a cathode, arranged in this way, the plating metal of the anode 120 is electrolyzed. Thus, the metal ions of the plating metal are released into the plating solution, and the electrons move to the cathode through the rectifier.

  The metal ions released to the plating solution move to the cathode and are combined with the electrons on the surface of the object to be plated 200 to perform plating.

  In the present embodiment, the shielding member 130 may be disposed between the workpiece 200 and the anode 120.

  At this time, the shielding member 130 may be disposed so as to be adjacent to the object to be plated 200 among the anode 120 and the object to be plated 200, or may be disposed so as to be adjacent to the anode 120. .

  As illustrated in FIG. 1, the shielding member 130 according to the present embodiment may include a first plate 131 and a second plate 133 disposed adjacent to the first plate 131.

  In the present embodiment, it is described that the shielding member 130 is composed of two plates, that is, the first plate 131 and the second plate 133 as described above. It is also possible to consist of plates arranged adjacent to each other, and it goes without saying that the present invention can be applied to such a case.

  In the present embodiment, the shielding member 130 is preferably composed of the first plate 131 and the second plate 133 having the same area, but is not particularly limited thereto.

  Here, the “same” does not mean that they are exactly matched in a mathematical sense, but means that they are substantially the same in consideration of design errors, manufacturing errors, measurement errors, and the like. . Hereinafter, the meaning of “same” as used in this description means that it is substantially the same as described above.

  The first plate 131 and the second plate 133 of the shielding member 130 according to the present embodiment can move in parallel with each other.

  At this time, the first plate 131 may be configured to be fixed and the second plate 133 may be moved. Conversely, the second plate 133 is maintained to be fixed and One plate 131 can also be configured to move.

  Alternatively, it is also possible to configure both the first plate 131 and the second plate 133 to move.

  In the present embodiment, the first plate 131 and the second plate 133 of the shielding member 130 are preferably moved in the vertical direction with respect to the bottom surface of the plating tank 110, but are not particularly limited thereto.

  In addition, the first plate 131 and the second plate 133 are preferably moved in a sliding manner, but are not particularly limited thereto.

  The plating apparatus 100 according to the present embodiment may further include a moving unit (not shown) that can move the first plate 131 and the second plate 133 of the shielding member 130.

  Various known means can be used as the moving means (not shown), and detailed description thereof will be omitted.

  In addition, as illustrated in FIG. 2, the first plate 131 and the second plate 133 of the shielding member 130 according to the present embodiment include a plurality of penetration portions 131 a and 133 a and a plurality of shielding portions 131 b and 133 b, respectively. A shielding pattern can be formed.

  At this time, the through portion is preferably formed to have a hole or slit shape, but is not particularly limited thereto.

  Further, the shielding pattern formed on the first plate 131 and the shielding pattern formed on the second plate 133 may be formed to have the same or different shapes.

  Here, the “same shape” and “different shape” mean that the first plate 131 and the second plate 133 having the same area are brought into contact with each other so as to be positioned on the same line. It can mean that the positions of the through part 131a and the blocking part 131b of the second plate 133 coincide with and deviate from the positions of the through part 133a and the blocking part 133b of the second plate 133, respectively.

  More specifically, the shielding pattern formed on the first plate 131 and the shielding pattern formed on the second plate 133 are formed to have the same shape. The positions of the plurality of through portions 131a formed and the positions of the plurality of through portions 133a formed in the second plate 133 coincide with each other, and the positions of the plurality of blocking portions 131b formed in the first plate 131 and the second This means that the positions of the plurality of blocking portions 133b formed on the plate 133 coincide with each other.

  That is, as shown in part a of FIG. 2, the positions of the through portions 131 a of the first plate 131 coincide with the positions of the through portions 133 a of the second plate 133, and the positions of the blocking portions 131 b of the first plate 131 The positions of the blocking portions 133b of the second plates 133 are the same.

  In addition, the fact that the shielding pattern formed on the first plate 131 and the shielding pattern formed on the second plate 133 are formed to have shapes different from each other, as shown in part b of FIG. The position of the penetrating part 131a of each first plate 131 and the position of the penetrating part 133a of each second plate 133 are shifted, and the position of each blocking part 131b of each first plate 131 and the position of each blocking part 133b of each second plate 133 are shifted. It means that it will shift.

  At this time, as shown in part b of FIG. 2, the displacement portion 131 a of the first plate 131 is in contact with the blocking portion 133 b of the second plate 133, and the blocking portion 131 b of the first plate 131 is the second plate. For example, the through portion 131a of the first plate 131 may be connected to the through portion 133a of the second plate 133 and the blocking portion so that only a part of the through portion 133a may be displaced. You may make it contact | connect both 133b.

  The case where the shielding patterns of the first plate 131 and the second plate 133 are the same or different from the entire area has been described above.

  Hereinafter, each of the first plate 131 and the second plate 133 includes a plurality of regions corresponding to each other, and each of the regions constituting the first plate 131 and the regions constituting the second plate 133 includes a plurality of through portions 131a, 133a, and A case where a shielding pattern including a plurality of blocking portions 131b and 133b is formed will be described.

  In this embodiment, the first plate 131 and the second plate 133 will be described as having three regions A, B, and C, respectively, as shown in FIG. It is also possible to consist of regions or more than four regions.

  In the present embodiment, the first plate 131 and the second plate 133 may each include three regions, for example, A, B, and C regions, as shown in FIG. The area and the area A of the second plate 133, the area B of the first plate 131 and the area B of the second plate 133, the area C of the first plate 131 and the area C of the second plate 133, respectively, have positions and areas. Can correspond to each other.

  That is, the first plate 131 and the second plate 133 may be formed of a plurality of regions having the same area, and the position and area for each region may correspond to each other. This is only an example, and the present invention is not particularly limited thereto.

  Further, the A, B, and C regions constituting the first plate 131 and the A, B, and C regions constituting the second plate 133 include a plurality of through portions 131a and 133a and a plurality of blocking portions 131b and 133b, respectively. A pattern can be formed.

  At this time, the shielding patterns formed in the A, B, and C regions of the first plate 131 may be formed to have the same shape or different shapes. You can also.

  Similarly, the respective shielding patterns formed in the A, B, and C regions of the second plate 133 can be formed to have the same shape or different shapes. You can also.

  Further, the shielding pattern formed in the A region of the first plate 131 and the shielding pattern formed in the A region of the second plate 133 can be formed to have the same shape or different shapes. The shielding pattern formed in the B region of the first plate 131 and the shielding pattern formed in the B region of the second plate 133 can also be formed to have the same shape or different shapes. The shielding pattern formed in the C region of the first plate 131 and the shielding pattern formed in the C region of the second plate 133 can also be formed to have the same shape or different shapes.

  That is, the shielding patterns formed in the regions A, B, and C of the first plate 131 and the corresponding regions A, B, and C of the second plate 133 may have the same shape. It can also have a shape.

  At this time, the meanings of the “same shape” and “different shape” have already been described in detail, and will be omitted below.

  In FIG. 2, the shielding pattern of area A of the first plate 131 and the shielding pattern of area A of the second plate 133 are formed to have the same shape, and the shielding pattern of area B of the first plate 131 is The shielding pattern of the B region of the second plate 133 is formed to have a shape different from that of the second plate 133, and the shielding pattern of the C region of the first plate 131 and the shielding pattern of the C region of the second plate 133 are the same. What is formed with the shape of is shown.

  This is only one example, and it is needless to say that the present invention is not particularly limited thereto and can be embodied in various shapes.

  2, the first plate 131 or the second plate 133 is not moved, that is, the first plate 131 and the second plate 133 are in contact with each other at the same line. As shown by the arrows in FIG. 2, the current flowing from the anode 120 to the object to be plated 200 can pass through the A region and the C region of the first plate 131 and the second plate 133, and in the B region. Can be blocked.

  At this time, the region through which current can pass is indicated by a, and the region through which current can be interrupted is indicated by b. This was applied similarly to FIGS.

  The shielding member 130 having the structure illustrated in FIG. 2 has a structure in which an upper end portion and a lower end portion allow current to pass therethrough and a central portion can block the current. The shielding member 130 having such a structure can be applied when the plating thickness of the central portion is thicker than the upper end portion / lower end portion of the workpiece 200.

  In addition, as shown in FIG. 3, when the first plate 131 of the shielding member 130 having the above-described configuration is fixed, when the second plate 133 is moved in a sliding direction in the arrow direction, the first plate The regions A, B, and C of 131 and the regions A, B, and C of the second plate 133 are shifted from each other, and unlike the shielding member 130 illustrated in FIG. The upper end and the lower end have a structure capable of partially interrupting the current.

  Similarly, as illustrated in FIG. 4, when the first plate 131 of the shielding member 130 having the above-described configuration is fixed and the second plate 133 is moved in a sliding direction in the direction of the arrow, The A, B, and C regions of the first plate 131 and the A, B, and C regions of the second plate 133 are shifted from each other, so that, unlike the shielding member 130 illustrated in FIG. The upper end portion and the lower end portion have a structure capable of partially interrupting the current.

  As described above, the shielding member 130 having the structure shown in FIGS. 3 and 4 can be applied when the plating thickness of the upper end / lower end is thicker than the center of the workpiece 200.

  On the other hand, as illustrated in FIG. 5, the first plate 131 of the shielding member 130 having the above-described configuration moves the second plate 133 in a fixed state in a sliding manner, In contrast, the amount of movement of the second plate 133 is set such that the penetrating part 131a and blocking part 131b of the first plate 131 and the penetrating part 133a and blocking part 133b of the second plate 133 are partially overlapped. Can be adjusted.

  As a result, as shown in FIG. 5, only a part of the current can pass through all the regions other than both ends of the shielding member 130 (part c). That is, the amount of current passing through the shielding member 130 is adjusted.

  At this time, in FIGS. 3 to 5, it is described that only the second plate 133 moves while the first plate 131 of the shielding member 130 is fixed. However, this is only one example, and the second plate 133 is moved. It goes without saying that the first plate 131 can be moved in a state where is fixed, and it is also possible for both the first plate 131 and the second plate 133 to move.

  As described above, the first plate and the second plate on which the shielding patterns including the plurality of penetration portions and the plurality of shielding portions are respectively formed constitute a shielding member, and the first plate and the second plate are slid. The penetrating part and the blocking part formed in the first plate by moving in a manner and the penetrating part and the blocking part formed in the second plate are respectively matched or intersected, or a part thereof is overlapped The position of the part through which the current passes and the part of the part through which the current is blocked can be adjusted, and the amount of current to be passed can be adjusted by adjusting the size of the current passing part.

  Usually, it is preferable that various aspects of plating deviations appear depending on the type of plating equipment and the object to be plated. Conventionally, however, the process time can be reduced by designing, producing and using shielding plates corresponding to various aspects of plating deviations. However, by applying the shielding member according to the present embodiment, it is possible to fluidly utilize various aspects of plating deviation with a single shielding member, thereby reducing the process time. The effect of shortening and cost saving can be obtained.

  FIG. 6 is a graph showing the distribution of plating thickness when there is no shielding plate, when a conventional shielding plate is used, and when the shielding member according to this embodiment is used.

  As shown in FIG. 6, when there is no shielding plate and when a conventional shielding plate is used, the plating thickness formed at the center portion of the substrate and the plating thickness formed at the upper end portion and the lower end portion When the shielding member according to the present embodiment is used with a large deviation, the deviation between the plating thickness formed at the central portion of the substrate and the plating thickness formed at the upper end portion and the lower end portion is reduced as compared with the above case. Can be confirmed.

  As described above, the present invention has been described in detail based on the specific embodiments. However, the present invention is only for explaining the present invention, and the present invention is not limited thereto. It will be apparent to those skilled in the art that modifications and improvements within the technical idea of the present invention are possible.

  All simple variations and modifications of the present invention belong to the scope of the present invention, and the specific scope of protection of the present invention will be apparent from the appended claims.

  The present invention has a shielding member that can fluidly cope with various aspects of plating deviation of an object to be plated, and can be applied to a plating apparatus that is effective in reducing process time and process cost.

DESCRIPTION OF SYMBOLS 100 Plating apparatus 110 Plating tank 120 Anode
130 shielding member 131 first plate 131a penetrating part 131b shielding part 133 second plate 133a penetrating part 133b shielding part 200 object to be plated

Claims (16)

A plating tank that contains a plating solution and into which an object to be plated is placed;
An anode disposed opposite to one or both surfaces of the object to be plated;
The first plate, the second plate, or the first plate includes a first plate and a second plate disposed adjacent to the first plate and disposed between the object to be plated and the anode. A shielding member in which the plate and the second plate move in parallel with each other;
The plating apparatus characterized by including.   The plating apparatus according to claim 1, wherein a shielding pattern including a plurality of through portions and a plurality of shielding portions is formed on each of the first plate and the second plate of the shielding member.   The plating apparatus according to claim 2, wherein the shielding pattern formed on the first plate and the shielding pattern formed on the second plate are the same.   The plating apparatus according to claim 2, wherein the shielding pattern formed on the first plate and the shielding pattern formed on the second plate are different from each other. Each of the first plate and the second plate of the shielding member includes a plurality of regions corresponding to each other,
The shielding pattern including a plurality of penetrating portions and a plurality of blocking portions is formed in each region constituting the first plate and each region constituting the second plate, respectively. The plating apparatus according to 1.   The shield pattern formed in each region of the first plate is the same as or different from each shield pattern formed in a region corresponding to the second plate. Plating equipment.   The plating apparatus according to claim 1, wherein the first plate and the second plate of the shielding member move in a direction perpendicular to a bottom surface of the plating tank.   The plating apparatus according to claim 1, wherein the first plate and the second plate of the shielding member move in a sliding manner. A plating tank that contains a plating solution and into which an object to be plated is placed;
An anode disposed opposite to one or both surfaces of the object to be plated;
A plurality of plates disposed between and adjacent to the object to be plated and the anode, each of the plurality of plates moving in parallel with respect to the adjacent plates;
The plating apparatus characterized by including.   The plating apparatus according to claim 9, wherein a shielding pattern including a plurality of penetrating portions and a plurality of shielding portions is formed on each of the plurality of plates of the shielding member.   The plating apparatus according to claim 10, wherein the shielding patterns formed on the plurality of plates are the same as each other.   The plating apparatus according to claim 10, wherein the shielding patterns formed on the plurality of plates are different from each other.   Each of the plurality of plates of the shielding member includes a plurality of regions corresponding to each other, and each region of each plate is formed with a shielding pattern including a plurality of penetration portions and a plurality of shielding portions. The plating apparatus according to claim 9.   The plating apparatus according to claim 13, wherein the shielding patterns formed for each of the regions corresponding to the plurality of plates are the same or different from each other.   The plating apparatus according to claim 9, wherein each of the plurality of plates of the shielding member moves in a direction perpendicular to a bottom surface of the plating tank.   The plating apparatus according to claim 9, wherein each of the plurality of plates of the shielding member moves in a sliding manner.

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