TWI649458B - Plating apparatus - Google Patents

Abstract

The electroplating apparatus includes an electrolysis cell and a stereo anode group. The three-dimensional anode group is disposed in the electrolytic cell and includes a first anode and a second anode. The first anode extends in the first direction. The second anode extends in the first direction, wherein the first anode and the second anode are aligned in the second direction and spaced apart from each other, wherein the first direction is substantially perpendicular to the second direction.

Description

Plating equipment

This invention relates to an electroplating apparatus, and more particularly to an electroplating apparatus having a three-dimensional anode set.

Conventional electroplating is thicker than the film thickness of other parts (such as the middle part) due to the edge phenomenon, which results in uneven coating thickness. Therefore, it has been proposed that a technique for obtaining a uniform plating film thickness is one of the efforts of those skilled in the art.

Accordingly, the present invention provides an electroplating apparatus that can ameliorate the aforementioned conventional problems.

According to an embodiment of the invention, an electroplating apparatus is proposed. The electroplating apparatus includes an electrolysis cell and a stereo anode group. The three-dimensional anode group is disposed in the electrolytic tank and includes a first anode and a second anode. The first anode extends in a first direction. The second anode extends in the first direction, wherein the first anode and the second anode are aligned in a second direction and spaced apart from each other, wherein the first direction is substantially perpendicular to the second direction.

In order to better understand the above and other aspects of the present invention, the following detailed description of the embodiments and the accompanying drawings

Please refer to FIGS. 1A-1C. FIG. 1A is a schematic view of a plating apparatus 100 according to an embodiment of the present invention, and FIG. 1B is a view of a three-dimensional anode group 120 of FIG. 1A viewed from a viewing angle V1. FIG. 1C is a schematic view showing the structure of the first anode 121 of FIG. 1A viewed from the viewing angle V1.

The electroplating apparatus 100 includes an electrolysis tank 105, a power supply 106, a filter 110, a pump 115, a stereo anode group 120, a three-dimensional carrier 130, a support frame 140, a rocker 150, a drive mechanism 155, a driver 160, and a current sharing Plate 170.

The electrolytic cell 105 is used for accommodating the three-dimensional anode group 120, the three-dimensional carrier 130, the support frame 140, the rocker 150 and the flow equalization plate 170. The three-dimensional carrier plate 130, the three-dimensional anode group 120 and the object to be plated W1 (where the object placement area is placed) are sequentially arranged in the second direction X, wherein the second direction X is, for example, a plating direction or an electric field direction. The object to be plated W1 is, for example, a conductor such as a metal plate. The negative electrode of the power supply 106 is electrically connected to the object to be plated W1, and the electrode of the power supply 106 is electrically connected to the stereo anode group 120 to provide a current signal to the stereo anode group 120, and the stereo anode group 120 is An electric field is generated between the objects to be plated W1, and the material of the three-dimensional anode group 120 is plated on the object to be plated W1.

The electrolytic bath 105 has a plating solution L1 therein. The electrolytic cell 105 includes a bottom plate 1051 having an opening 1051a. The plating solution L1 enters the electrolytic cell 105 from the opening 1051a of the electrolytic cell 105 by the pump 115 and passes through the space between the flow equalizing plate 170 and the three-dimensional anode group 120 and the object to be plated W1, and then passes through the upper portion of the electrolytic cell 105. Return to the pump 115. The plating solution L1 will first pass through the filter of the filter 110 before entering the electrolytic cell 105, and the impurities and/or particles (if any) of the plating solution L1 can be removed.

The three-dimensional anode group 120 includes a first anode 121, a second anode 122, and a third anode 123. In another embodiment, the number of anodes of the three-dimensional anode assembly 120 can exceed three or less than two. The first anode 121, the second anode 122, and the third anode 123 extend in the first direction Y. The first anode 121, the second anode 122, and the third anode 123 are arranged in the second direction X and spaced apart from each other, wherein the first direction Y is substantially perpendicular to the second direction X. Since the distance between the anode and the object to be plated W1 is different, the thickness of each part of the object to be plated W1 differs from the distance of the anodes, and the thickness of each part of the object to be plated W1 differs. In other words, by designing the distance between the anode and the object to be plated W1, the desired coating thickness of the specific region of the object to be plated W1 can be obtained, or the film thickness of the entire layer of the plating film formed on the object to be plated W1 can be made uniform.

As shown in FIG. 1A, the first anode 121, the second anode 122, and the third anode 123 are electrically connected to the power supply 106 through a plurality of wires. The power supply 106 can provide different or the same current to the first anode 121, the second anode 122, and the third anode 123. For example, the electroplating apparatus 100 further includes a first variable resistor 1061, a second variable resistor 1062, and a third variable resistor 1063, wherein the first variable resistor 1061 is coupled to the first anode 121 and the power supply 106, and the second The variable resistor 1062 is coupled to the second anode 122 and the power supply 106, and the third variable resistor 1063 is coupled to the third anode 123 and the power supply 106. The power supply 106 or another controller may control the resistance values of the first variable resistor 1061, the second variable resistor 1062, and the third variable resistor 1063 to provide different or the same current to the first anode 121 and the second anode. 122 and a third anode 123.

As shown in Fig. 1A, in the anodes of the present embodiment, the first anode 121 is closest to the object to be plated W1. The position of the first anode 121 substantially corresponds to the intermediate portion R1 of the object to be plated W1. Thus, the intermediate portion R1 of the object to be plated W1 of the present embodiment has a thick film thickness as compared with the thickness of the plating material of the conventional object to be plated. Among the anodes, the third anode 123 is farthest from the object to be plated W1. The position of the third anode 123 substantially corresponds to the edge region R3 of the object to be plated W1. Therefore, the film thickness of the edge region R3 of the object to be plated W1 of the present embodiment is thinner than that of the conventional plated article. Thus, the difference in film thickness between the intermediate portion R1 and the edge region R3 of the object to be plated W1 of the embodiment of the present invention is reduced as compared with the thickness of the coating of the conventional object to be plated.

As shown in FIG. 1C, the first anode 121 includes a mesh structure 1211 and a plurality of soluble anode particles 1212, and the soluble anode particles 1212 are filled in a plurality of meshes 1211a of the mesh structure 1211. The positive ions of the soluble anode particles 1212 are combined with the electrons of the plating solution L1 to form a compound in the electroplating process, and then precipitated on the surface of the object to be plated W1 to form a plating film. Therefore, the soluble anode particles 1212 are gradually consumed during the electroplating process. In one embodiment, the soluble anode particles 1212 can be copper, nickel, or other metals required for the substrate W1. The mesh structure 1211 is, for example, made of titanium metal, which is not consumed. In addition, the second anode 122 and the third anode 123 have a structure similar to that of the first anode 121, and details are not described herein again. In addition, one mesh 1211a may be filled with one or several soluble anode particles 1212, and the shape of the soluble anode particles 1212 is not limited by the drawings, and may be circular, elliptical, pie-shaped or irregular.

In addition, the mesh diameters of the mesh structures of the first anode 121, the second anode 122, and the third anode 123 may be different, so that the first anode 121, the second anode 122, and the third anode 123 have different surface roughnesses to control The plating solution L1 flows through the flow rates of the first anode 121, the second anode 122, and the third anode 123, thereby controlling the thickness of the plating film formed on the object to be plated W1. For example, the mesh inner diameter of the mesh structure of the first anode 121 is smaller than the mesh inner diameter of the mesh structure of the second anode 122, so that the roughness of the second anode 122 is greater than the roughness of the first anode 121, so that the plating solution L1 flows through the first The flow rate of the two anodes 122 is smaller than the flow rate of the first anode 121, and the thickness of the coating of the object to be plated W1 is also different.

As shown in FIGS. 1A and 1B, the projections of the first anode 121, the second anode 122, and the third anode 123 in the second direction X do not overlap each other. In this way, it is possible to prevent the positive ions of the anodes from excessively interfering with each other toward the moving path of the object to be plated W1. In another embodiment, the projections of the first anode 121, the second anode 122, and the third anode 123 in the second direction X may partially overlap.

Further, as shown in FIGS. 1A and 1B, one of the first anode 121, the second anode 122, and the third anode 123 is a ring-shaped anode. For example, the second anode 122 and the third anode 123 are ring electrodes, and the first anode 121 is an electrode extending continuously from the outer side surface without a through hole. In detail, as shown in FIG. 1B, the first anode 121 viewed from the viewing angle V1 does not have any penetration portion, and the second anode 122 surrounds the first penetration portion 122a to allow the first anode 121 to pass through from the first. The portion 122a is exposed, and the third anode 123 surrounds the second through portion 123a to allow the first anode 121 and the second anode 122 to be exposed from the second through portion 123a.

As shown in FIG. 1A, the three-dimensional carrier 130 is disposed on the support frame 140 and is configured to carry the three-dimensional anode assembly 120. The three-dimensional carrier 130 includes a first carrier 131, a second carrier 132, and a third carrier 133. The first carrier 131 carries the first anode 121 and is translationally coupled to the support frame 140 in a second direction X. The second carrier 132 carries the second anode 122 and is translationally coupled to the support frame 140 in a second direction X. The third carrier 133 carries a third anode 123 and is translationally coupled to the support frame 140 in a second direction X. Since the first carrier 131, the second carrier 132, and the third carrier 133 are translationally coupled to the support frame 140, the first anode 121, the second anode 122, and the third anode 123 can be adjusted relative to the object to be plated W1. the distance.

Referring to FIGS. 2A and 2B, FIG. 2A is a schematic view showing a three-dimensional carrier 130 of FIG. 1A viewed from a viewing angle V1, and FIG. 2B is an enlarged view of a region 2B' of FIG. 1A.

As shown in FIG. 2B, the support frame 140 includes at least one first bracket sliding portion 141. The first carrier 131 includes at least one first carrier sliding portion 1311. The first bracket sliding portion 141 and the first carrier sliding portion 1311 both extend in the second direction X, wherein the first bracket sliding portion 141 is slidably coupled to the first carrier sliding portion 1311. In this way, the first carrier 131 can be relatively moved relative to the support frame 140 in the second direction X, thereby adjusting the relative distance between the first anode 121 and the object to be plated W1. After the relative position of the first carrier 131 and the support frame 140 is determined, the fixing hole 107 can be fixed to the fixing hole 141a of the first bracket sliding portion 141 and the plurality of fixing holes 1311a of the first carrier sliding portion 1311. The position of the support frame 140 and the first carrier 131 is temporarily fixed. As shown in FIG. 2B, the number of the fixing holes 1311a of the first carrier sliding portion 1311 is plural to provide a multi-step stroke adjustment function.

As shown in FIG. 2B, the fixing member 107 is, for example, a threaded member, and the fixing hole 1311a of the first carrier sliding portion 1311 is a screw hole. Alternatively, the fixing member 107 may be temporarily fixed to the fixing hole 141a and the fixing hole 1311a in a snapping manner (for example, a tight fit). In this design, the fixing member 107 may not be threaded, and the fixing hole 1311a may not be a screw hole.

In addition, as shown in FIGS. 2A and 2B, the number of the first carrier sliding portions 1311 connecting the first carrier members 131 may be four, which are disposed at two opposite corners of the first anode 121, as shown in FIG. 2A. The arrangement areas A1 to A4 of the first holder sliding portion 141 are shown (drawn as circular dashed lines). However, the embodiment of the present invention does not limit the number and/or arrangement position of the first carrier sliding portion 1311.

Similarly, the second support frame 140 further includes a second bracket sliding portion (not labeled) and a third bracket sliding portion (not labeled), and the second carrier member 132 and the third carrier member 133 respectively include at least one second carrier member a sliding portion (not shown) and at least a third carrier sliding portion (not shown). The connection relationship between the second bracket sliding portion and the second carrier sliding portion is similar to the connection relationship between the first bracket sliding portion 141 and the first carrier sliding portion 1311. The connection relationship between the third bracket sliding portion and the third carrier sliding portion is similar to the connection relationship between the first bracket sliding portion 141 and the first carrier sliding portion 1311. Further, the number of second carrier sliding portions connecting the second carrier 132 may be four, as shown in FIG. 2A, four circular dashed lines of the second carrier 132. However, embodiments of the present invention do not limit the number and/or arrangement of the second carrier sliding portions. The number of the third carrier sliding portions that connect the third carrier member 133 may be four, as shown by the second circular 133 of the third carrier member 133 shown in FIG. 2A. However, embodiments of the present invention do not limit the number and/or arrangement of the third carrier sliding portions.

Referring to FIG. 3, another attitude diagram of the three-dimensional carrier 130 and the three-dimensional anode assembly 120 of FIG. 1A is shown. As can be seen from the figure, in the first anode 121, by adjusting the relative positions of the first carrier sliding portion 1311 and the first holder sliding portion 141, the respective arrangement areas A1 to A4 (shown in FIG. 2B) can be adjusted. The distance of the support frame 140. By similar adjustment, the second anode 122 and/or the third anode 123 can be adjusted to different inclined postures with respect to the object to be plated W1, as shown in FIG. In another embodiment, at least one of the first anode 121, the second anode 122, and the third anode 123 can be adjusted to an inclined posture with respect to the object to be plated W1, and the others can be adjusted to be parallel with respect to the object to be plated W1. attitude. The embodiment of the present invention does not limit the posture of the first anode 121, the second anode 122, and/or the third anode 123, which may depend on the designed coating thickness distribution of the object to be plated W1.

Please refer to FIG. 4, which shows a schematic diagram of the rocker 150 of FIG. 1A viewed in the second direction X. The paddle 150 and the three-dimensional anode group 120 (shown in FIG. 1A) are arranged in the second direction X. The driver 160 is configured to drive the rocker 150 to move in at least one of the first direction Y and the third direction Z, wherein the third direction Z is substantially perpendicular to the first direction Y. Since the paddle 150 moves at least one of the first direction Y and the third direction Z, the plating solution L1 can be disturbed to adjust the ion reaction efficiency, provide sufficient positive ions on the surface of the object to be plated W1, or remove by-products such as bubbles. Further, the driver 160 is, for example, a motor that can drive the rocker 150 to move in at least one of the first direction Y and the third direction Z through the drive mechanism 155. The drive mechanism 155 herein is, for example, a rack and pinion set, a scotch yoke or other suitable mechanism.

As shown in FIG. 4, the rocker 150 includes a connector 151 and at least one agitating paddle 152. The connector 151 extends in the third direction Z. The disturbance paddle 152 is coupled to the connector 151 and extends in the first direction Y. The driving mechanism 155 is connected to the connecting member 151 to drive the disturbing paddle 152 to move in at least one of the first direction Y and the third direction Z.

As shown in FIG. 4, each of the disturbing paddles 152 has at least one conductive region 152C. The conductive region 152C can attract the power line, increase the current density around the conductive region 152C, and increase the coating thickness of the region of the corresponding conductive region 152C in the substrate W1. In other words, through the pattern design of the plurality of conductive regions 152C of the disturbing paddles 152, different coating thicknesses of different regions of the object to be plated W1 can be obtained. Moreover, embodiments of the present invention do not limit the number, size, and/or location of conductive regions 152C of each of the disturbing paddles 152. In addition, in terms of process, the paddle 150 may be a conductive frame, such as a metal conductive frame, the outer surface of which may be coated with an insulating layer, but a portion is exposed, wherein the exposed outer surface portion is defined as a conductive region 152C. In another embodiment, the entire paddle 150 can be an insulated paddle or the outer surface of the entire conductive frame can be coated with an insulating layer without exposing any conductive regions.

Referring to Figure 5, there is shown a cross-sectional view of the disturbing paddle 152 of Figure 4 in the direction 5-5'. The disturbance paddle 152 includes a first plate 1521 and a second plate 1522. The first plate 1521 has a first end 1521a and a second end 1521b. The distance H1 of the first plate 1521 from the three-dimensional anode group 120 (not shown in FIG. 5) is gradually shorter from the second end 1521b of the first plate 1521 toward the first end 1521a. That is, the distance H2 of the first plate piece 1521 from the object to be plated W1 is gradually shortened from the first end 1521a of the first plate piece 1521 toward the second end 1521b. Thus, when the disturbing paddle 152 moves in the -Z direction, the plating solution L1 moves relative to the +Z direction, so that the plating solution L1 is squeezed from the larger space distance H2 to a smaller space distance H2 to achieve the disturbing plating solution. The effect of L1, in turn, increases the ion exchange efficiency to provide sufficient positive ions on the surface of the object to be plated W1.

Further, as shown in FIG. 5, the first plate piece 1521 is away from the three-dimensional anode group 120 than the second plate piece 1522, that is, the first plate piece 1521 is closer to the object to be plated W1 than the second plate piece 1522. The second plate 1522 has a third end 1522a and a fourth end 1522b, and the first end 1521a of the first plate 1521 is coupled to the third end 1522a of the second plate 1522. The distance H3 of the second plate 1522 from the three-dimensional anode group 120 is gradually longer from the fourth end 1522b of the second plate 1522 to the third end 1522a, that is, the distance H4 of the second plate 1522 from the object W1 is from the second The third end 1522a of the plate 1522 is tapered toward the fourth end 1522b. Thus, the first plate 1521 and the second plate 1522 are connected to form, for example, a V-shape, and the V-shaped space (ie, the space between the first plate 1521 and the second plate 1522) can accommodate the plating solution L1. .

Further, the first plate 1521 has a through hole 1521r. Thus, when the disturbing paddle 152 moves in the +Z direction, the plating solution L1 between the first plate 1521 and the second plate 1522 is forced to be extruded from the through hole 1521r to disturb the first plate 1521 and the object to be plated. The plating solution L1 between W1 further increases the ion exchange efficiency to provide sufficient positive ions on the surface of the object to be plated W1.

Further, in another embodiment, the disturbing paddle 152 may have a solid cross section, such as a polygon, a circle, or an ellipse, etc., wherein the polygon is, for example, a diamond, a rectangle, or the like. In other embodiments, the paddle 150 may be replaced with a current equalizing plate 170 or 170' to provide a current sharing effect. In another embodiment, the perturbation paddle 152 of the paddle 150 of FIG. 4 can have a honeycomb structure similar or identical to the honeycomb holes (such as 170a, 270a1, and/or 270a2) described below to provide a current sharing effect.

As shown in FIGS. 1A and 6A and 6B, FIG. 6A is a plan view of the current equalizing plate 170 of FIG. 1A, and FIG. 6B is a plan view of the current sharing plate 270 of another embodiment. As shown in FIG. 1A, the current equalizing plate 170 is disposed below the three-dimensional anode group 120. For example, the bottom plate 1051 of the electrolytic cell 105 has an opening 1051a. The current equalizing plate 170 is located between the opening 1051a of the electrolytic cell 105 and the three-dimensional anode group 120. For example, the opening 1051a and the three-dimensional anode group 120 are arranged in the first direction Y. As shown in Fig. 6A, the flow equalizing plate 170 has a plurality of honeycomb holes 170a for disturbing the passing plating solution L1 to improve ion exchange efficiency.

As shown in Fig. 6B, the flow equalization plate 270 of another embodiment has a plurality of honeycomb holes 270a. The wall thickness t1 of the honeycomb hole 270a is different from the wall thickness of the honeycomb hole 170a of Fig. 6A. Further, the inner diameter d1 of the honeycomb hole 270a of the sixth embodiment may be different from the inner diameter of the honeycomb hole 170a of the sixth embodiment. Comparing Figs. 6A and 6B, the wall thickness t1 of the honeycomb hole 270a of Fig. 6B is larger than the wall thickness of the honeycomb hole 170a of Fig. 6A, so that the inner diameter d1 of the honeycomb hole 270a is larger than the inner diameter of the honeycomb hole 170a. In summary, the honeycomb holes of the current sharing plate of the embodiment of the present invention may have different wall thicknesses and/or inner diameters to change the flow rate of the plating solution L1 passing through the honeycomb holes, thereby being controlled to be formed on the object to be plated W1. Coating thickness.

Referring to Figure 7, a schematic view of a current sharing plate 170' in accordance with another embodiment of the present invention is shown. The flow plate 170' has a plurality of first honeycomb holes 170a1 and a plurality of second honeycomb holes 170a2, wherein the distribution density of the first honeycomb holes 170a1 is different from the distribution density of the second honeycomb holes 170a2. As shown, the distribution density of the first honeycomb apertures 170a1 is greater than the distribution density of the second honeycomb apertures 170a2. The difference in distribution density of the honeycomb holes allows the plating solution L1 passing through different regions of the flow equalizing plate 170' to have different flow rates to control the thickness of the plating film formed on the object to be plated W1. Further, the inner diameter of the first honeycomb hole 170a1 and the inner diameter of the second honeycomb hole 170a2 may be different to achieve a similar effect. It can be seen from the above that the plurality of honeycomb holes of the current sharing plate of the embodiment of the present invention may have different densities and/or different inner diameters in different regions, so that the flow rate of the plating solution L1 passing through the honeycomb holes is different to control the formation of the honeycomb layer. The thickness of the coating on the plating material W1.

Please refer to FIGS. 8A and 8B. FIG. 8A is a schematic diagram of a three-dimensional carrier 230, a support frame 240 and a three-dimensional anode assembly 120 according to another embodiment of the present invention, and FIG. 8B is viewed from a viewing angle V1. A schematic view of a three-dimensional anode assembly 120 of Figure 8A.

The three-dimensional carrier 230 includes a first carrier 231, a second carrier 232, and a third carrier 233. In this embodiment, the first carrier 231, the second carrier 232, and the third carrier 233 are movable relative to the support frame 240 along the first direction Y and/or the third direction Z to adjust the first anode 121, the first The positions of the two anodes 122 and the third anodes 123 with respect to the object to be plated W1 are controlled to control the thickness of the plating film formed on the object to be plated W1.

Please refer to FIG. 9 , which illustrates a schematic view of a three-dimensional carrier 330 , a support frame 340 , and a three-dimensional anode assembly 120 according to another embodiment of the present invention.

The three-dimensional carrier 330 includes a first connecting flange 331, a second connecting flange 332, a third connecting flange 333, a fourth connecting flange 334, a fourth connecting flange 334, a first connecting rod 335, and a second connection. The rod 336, the fifth connecting flange 337, the sixth connecting flange 338 and at least one fixing element 339. The first connecting flange 331 and the third connecting flange 333 are respectively connected (eg, fixed) to opposite sides of the first anode 121. The second connecting flange 332 and the fourth connecting flange 334 are respectively connected to opposite sides of the second anode 122. The first connecting rod 335 is connected to the support frame 340 and passes through the first connecting flange 331 and the second connecting flange 332 to connect the first anode 121 and the second anode 122 in series. The second connecting rod 336 is connected to the support frame 340 and passes through the third connecting flange 333 and the fourth connecting flange 334 to serially connect the first anode 121 and the second anode 122. Since the first connecting rod 335 and the second connecting rod 336 are respectively connected to opposite sides of the three-dimensional anode group 120, the relative positional relationship of the anodes of the three-dimensional anode group 120 is more stable. In another embodiment, one of the first connecting rod 335 and the second connecting rod 336 may be omitted if not necessary.

In addition, the fifth connecting flange 337 and the sixth connecting flange 338 are respectively connected to opposite sides of the third anode 123. The first connecting rod 335 and the second connecting rod 336 can pass through the fifth connecting flange 337 and the sixth connecting flange 338, respectively, to connect the first anode 121, the second anode 122 and the third anode 133 in series.

As shown in Fig. 9, the first connecting rod 335 has a plurality of fixing holes 335a, and the first connecting flange 331 has a fixing hole 331a. By adjusting the relative position of the first connecting rod 335 and the first connecting flange 331, the fixing hole 331a of the first connecting flange 331 can be correspondingly positioned with one of the fixing holes 335a of the first connecting rod 335. When the relative position of the first connecting rod 335 and the first connecting flange 331 is determined, the fixing member 339 can pass through the corresponding fixing hole 331a and the fixing hole 335a to fix the relative relationship between the first anode 121 and the first connecting rod 335. position.

In addition, the connection relationship between the first connecting rod 335 and the second connecting flange 332 is the same as the connecting relationship between the first connecting rod 335 and the first connecting flange 331 , and details are not described herein again. The connection relationship between the first connecting rod 335 and the fifth connecting flange 337 is the same as the connecting relationship between the first connecting rod 335 and the first connecting flange 331, and details are not described herein. In addition, the second connecting rod 336 has a structure similar or similar to that of the first connecting rod 335. The connection relationship between the second connecting rod 336 and the third connecting flange 333, the fourth connecting flange 334 and the sixth connecting flange 338 is the same as the connecting relationship between the first connecting rod 335 and the first connecting flange 331. No longer.

Referring to FIG. 10, a schematic diagram of a plating apparatus 400 in accordance with another embodiment of the present invention is shown. The electroplating apparatus 400 includes an electrolysis cell 105, a power supply 106, a filter 110, a pump 115, a stereo anode group 120, a stereoscopic carrier 130, a support frame 140, a paddle 150, a drive mechanism 155, and a driver 160. The electroplating apparatus 400 of the embodiment of the present invention has similar or identical features to the electroplating apparatus 100, except that the flow direction of the plating solution L1 is different, and the three-dimensional anode set 120 and the three-dimensional carrier 130 are different from the height of the object to be plated W1.

As shown in Fig. 10, the bottom portion 140b of the support frame 140 and the bottom portion 120b of the three-dimensional anode group 120 have a distance from the bottom plate 1051 of the electrolytic cell 105 to provide a flow path for the plating solution L1. Further, the top portion W11 of the object to be plated W1 is lower than the top portion 120u of the three-dimensional anode group 120 to provide a plating liquid channel L1 to an upper flow path. In addition, the electrolytic cell 105 further includes a side plate 1052, wherein the side plate 1052 has an opening 1052a. In this manner, the plating solution L1 enters the electrolytic cell 105 laterally from the opening 1052a, and then flows out of the electrolytic cell 105 through the lower flow path and the upper flow path. Since the plating solution L1 passes through the bottom portion 120b of the three-dimensional anode group 120, the plating solution between the bottom portion 120b of the three-dimensional anode group 120 and the bottom plate 1051 can be disturbed to sufficiently circulate the plating solution to enhance the ion exchange efficiency.

Referring to Figure 11, there is shown a schematic view of a first anode 121' in accordance with another embodiment of the present invention. The first anode 121' has a first surface 121s1 and a second surface 121s2, wherein the first anode 121' is disposed on the first carrier 131 with the first surface 121s1. The second surface 121s2 is inclined with respect to the first surface 121s1 such that the relative distance between each point of the second surface 121s2 and the object to be plated W1 is different to control the thickness of the plating film formed on the object to be plated W1. The first surface 121s1 is, for example, a plane, a curved surface, or a combination thereof. The first surface 121s1 may have a contour in which the intermediate portion protrudes from the edge region such that the intermediate portion of the first surface 121s1 is spaced apart from the object to be plated W1 by a distance smaller than the distance of the edge region from the object to be plated W1. Alternatively, the first surface 121s1 may have a contour in which the intermediate portion is recessed with respect to the edge region such that the intermediate portion of the first surface 121s1 is spaced apart from the object to be plated W1 by a distance greater than the distance of the edge region from the object to be plated W1. In addition, the geometry of the first surface 121s1 may depend on the coating design of the substrate W1, and the embodiment of the present invention does not limit the geometry of the first surface 121s1. In addition, the second anode 121 and the third anode 123 may have surface features similar to or the same as those of the first anode 121', and will not be described herein.

In summary, the electroplating apparatus of the embodiment of the present invention includes a three-dimensional anode group. The three-dimensional anode group includes a plurality of anodes, and the distance between the anodes and the object to be plated is different, so that the thickness of the plating film on the object to be plated can be made uniform, or the desired coating thickness can be obtained. In one embodiment, the relative distance and/or angle of the anodes of the three-dimensional anode assembly relative to the substrate can be adjusted. In another embodiment, the anode of the three-dimensional anode set has a surface, the number of points of which may be different from the relative distance of the object to be plated W1, wherein the surface is, for example, a plane, a curved surface or a combination thereof. In other embodiments, the inlet through the plating solution may be disposed on the side plate of the electrolytic cell, so that the plating solution flows through the bottom of the three-dimensional anode group and the top of the object to be plated, so that the plating solution is fully circulated, and the ion exchange efficiency is improved.

In conclusion, the present invention has been disclosed in the above embodiments, but it is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

100,400‧‧‧Electroplating equipment

105‧‧‧electrolyzer

1051‧‧‧floor

1052‧‧‧ side panels

1051a, 1052a‧‧‧ openings

106‧‧‧Power supply

1061‧‧‧First variable resistor

1062‧‧‧Second variable resistor

1063‧‧‧ Third variable resistor

107, 339‧‧‧Fixed components

110‧‧‧Filter

115‧‧‧ pump

120‧‧‧Three-dimensional anode group

120b, 140b‧‧‧ bottom

120u, W11‧‧‧ top

121, 121'‧‧‧ first anode

121s1‧‧‧ first surface

121s2‧‧‧ second surface

1211‧‧‧Mesh structure

1212‧‧‧Soluble anode particles

1211a‧‧‧Mesh

122‧‧‧Second anode

122a, 123a‧‧‧ penetration

123‧‧‧ Third anode

130, 230, 330‧‧‧ three-dimensional carrier

131, 231‧‧‧ first carrier

132, 232‧‧‧second carrier

133, 233‧‧‧ third carrier

1311‧‧‧First carrier sliding part

140, 240, 340‧‧‧ support frame

141‧‧‧First bracket sliding part

141a, 1311a, 331a, 335a‧‧‧ fixing holes

150‧‧‧Woist

151‧‧‧Connecting parts

152‧‧‧ disturbed paddle

1521‧‧‧ first board

1521a‧‧‧ first end

1521b‧‧‧second end

1521r‧‧‧through hole

1522‧‧‧ second plate

1522a‧‧‧ third end

1522b‧‧‧ fourth end

152C‧‧‧ conductive area

155‧‧‧ drive mechanism

160‧‧‧ drive

170, 170’, 270‧‧ ‧ flow boards

170a, 270a‧‧‧ honeycomb holes

170a1‧‧‧First Honeycomb Hole

170a2‧‧‧Second honeycomb hole

331‧‧‧First connecting flange

332‧‧‧Second connection flange

333‧‧‧ Third connecting flange

334‧‧‧fourth connection flange

335‧‧‧first connecting rod

336‧‧‧Second connecting rod

337‧‧‧ fifth connecting flange

338‧‧‧6th connection flange

D1‧‧‧Down

H1, H2, H3, H4‧‧‧ distance

L1‧‧‧ plating solution

R1, R2, R3‧‧‧ areas

V1‧‧ Perspective

W1‧‧‧ plating

X‧‧‧second direction

T1‧‧‧ wall thickness

Y‧‧‧First direction

Z‧‧‧ third direction

FIG. 1A is a schematic view of an electroplating apparatus according to an embodiment of the invention. FIG. 1B is a view showing a three-dimensional anode group of FIG. 1A viewed from a viewing angle V1. FIG. 1C is a schematic view showing the structure of the first anode of FIG. 1A viewed from the viewing angle V1. FIG. 2A is a schematic diagram showing a three-dimensional carrier of FIG. 1A viewed from a viewing angle V1. Fig. 2B is an enlarged view of a region 2B' of Fig. 1A. Fig. 3 is a view showing another posture of the three-dimensional carrier and the three-dimensional anode assembly of Fig. 1A. FIG. 4 is a schematic view showing the paddle of FIG. 1A viewed in the second direction X. Fig. 5 is a cross-sectional view showing the disturbing paddle of Fig. 4 in the direction 5-5'. Fig. 6A is a plan view showing the current sharing plate of Fig. 1A. FIG. 6B is a top view of a current sharing plate of another embodiment. FIG. 7 is a schematic view showing a current sharing plate according to another embodiment of the present invention. FIG. 8A is a schematic view showing a three-dimensional carrier, a support frame and a three-dimensional anode assembly according to another embodiment of the invention. FIG. 8B is a schematic view showing a three-dimensional anode group of FIG. 8A viewed from a viewing angle V1. FIG. 9 is a schematic view showing a three-dimensional carrier, a support frame and a three-dimensional anode assembly according to another embodiment of the present invention. Figure 10 is a schematic view of an electroplating apparatus in accordance with another embodiment of the present invention. 11 is a schematic view showing a first anode according to another embodiment of the present invention.

Claims (20)

An electroplating apparatus comprising: an electrolytic cell; and a three-dimensional anode set disposed in the electrolytic cell, and comprising: a first anode extending along a first direction; and a second anode extending along the first direction The first anode and the second anode are arranged in a second direction and spaced apart from each other, wherein the first direction is substantially perpendicular to the second direction; wherein a distance between the first anode and a substrate placement area It is different from the distance between the second anode and the object placement area. The electroplating apparatus of claim 1, wherein the projections of the first anode and the second anode in the second direction do not overlap each other. The electroplating apparatus of claim 1, wherein one of the first anode and the second anode is a toroidal anode. The electroplating apparatus of claim 1, further comprising: a support frame; a first carrier member that carries the first anode and is translatably coupled to the support frame in the second direction; and a second A carrier carrying the second anode and being translatably coupled to the support frame in the second direction. The electroplating apparatus of claim 4, wherein the support frame comprises a first bracket sliding portion and a second bracket sliding portion, the first carrier package a first carrier sliding portion, the second carrier member includes a second carrier sliding portion, the first bracket sliding portion, the second bracket sliding portion, the first carrier sliding portion and the second carrier The sliding portion extends in the second direction, wherein the first bracket sliding portion is slidably coupled to the first carrier sliding portion, and the second bracket sliding portion is slidably coupled to the second carrier sliding portion. The electroplating apparatus according to claim 1, further comprising: a support frame; a first connecting flange connected to the first anode; a second connecting flange connected to the second anode; and a a first connecting rod is coupled to the support frame and passes through the first connecting flange and the second connecting flange to connect the first anode and the second anode. The electroplating apparatus according to claim 6, wherein the first connecting flange is connected to one side of the first anode, and the second connecting flange is connected to one side of the second anode, and the electroplating apparatus is further The method includes: a third connecting flange connected to the opposite side of the first anode; a fourth connecting flange connected to the opposite side of the second anode; and a second connecting rod connected to the The support frame passes through the third connecting flange and the fourth connecting flange to connect the first anode and the second anode. The electroplating apparatus according to claim 1, further comprising: a paddle arranged in the second direction with the three-dimensional anode group; and a driver for driving the paddle along the first direction and a At least one of the third directions moves, wherein the third direction is substantially perpendicular to the first direction. The electroplating apparatus of claim 1, further comprising: a paddle arranged in the second direction with the three-dimensional anode group, and comprising: a connecting member extending along the third direction; and a disturbance A paddle is coupled to the connector and extends along the first direction, the perturbation paddle having a conductive region. The electroplating apparatus of claim 1, further comprising: a paddle arranged in the second direction with the three-dimensional anode group, and comprising: a connecting member extending along the third direction; and a disturbance a paddle connected to the connecting member and extending along the first direction, the disturbing paddle comprising a first plate, the first plate having a first end and a second end, the first plate being spaced apart from the three-dimensional The distance of the anode group is gradually shorter from the direction of the second end of the first sheet toward the first end. The electroplating apparatus of claim 10, wherein the disturbing paddle further comprises a second plate, the first plate being away from the stereo anode group than the second plate; the second plate having a a third end and a fourth end, the first end of the first plate is connected to the third end of the second plate, and the distance between the second plate and the three-dimensional anode group is from the second The fourth end of the plate is gradually elongated toward the third end. The electroplating apparatus of claim 10, wherein the first sheet has a uniform aperture. For example, the electroplating equipment mentioned in the scope of claim 1 includes: A current sharing plate is disposed between the three-dimensional anode group and an opening of a bottom plate of the electrolytic cell, and has a plurality of honeycomb holes. The electroplating apparatus of claim 13, wherein the honeycomb holes have different densities in different regions. The electroplating apparatus of claim 13, wherein the honeycomb holes have different inner diameters in different regions. The electroplating apparatus of claim 1, wherein the first anode and the second anode each comprise a mesh structure, the first anode is closer to the object placement area than the second anode, the first anode The mesh inner diameter of the mesh structure is smaller than the mesh inner diameter of the mesh structure of the second anode. The electroplating apparatus of claim 1, wherein the electrolysis cell comprises a side plate having an opening allowing the plating solution to enter the electrolysis cell, and the bottom of the stereo anode group and the electrolysis cell There is a distance between the bottom plates. The electroplating apparatus of claim 1, wherein the first anode has a first surface opposite to the second surface, the second surface being inclined relative to the first surface. The electroplating apparatus of claim 4, wherein the first anode has a first surface and a second surface, and the first anode is disposed on the first carrier with the first surface, The intermediate portion of the second surface is spaced from the object placement region by a distance that is shorter than the edge region of the second surface from the substrate placement region. The electroplating apparatus of claim 1, further comprising: a paddle arranged in the second direction with the three-dimensional anode group, and comprising: a connecting member extending along the third direction; and a disturbance A paddle is coupled to the connector and extends along the first direction, the perturbation paddle having at least one honeycomb aperture.