TWI664321B - Eletroplating auxiliary plate and electroplating system provided with same - Google Patents

Abstract

The plating auxiliary plate of the present invention is applied to a plating system, which mainly has a non-conductive plate body disposed between the anode and the surface to be plated. The plating auxiliary plate shields the anode part to form a shielding area, and The plating auxiliary board is provided with at least one shielding member facing the anode. The shielding member can block the flow between the plating solution in the shielded area and the plating solution in other areas of the plating tank, that is, it can be prevented by more positive and reliable means. The metal plating layer is deposited on the surface to be plated opposite to the shielded area, and has the ability to adjust the electric field distribution during plating.

Description

Electroplating auxiliary board and electroplating system using same

The invention relates to an electroplating auxiliary plate and an electroplating system using the same, in particular to an electroplating auxiliary plate that adjusts the electric field distribution and the metal ion diffusion path during electroplating by more positive and reliable means.

Electroplating is an electrolytic reaction. Electrolytic reaction is used to plate a metal on the surface of another metal to form a metal shell film. We call this process electroplating. The electroplating technology is widely used in various applications and different fields. From the early decorative purposes that are mainly aesthetic, such as forming a glossy film on the surface of the container, it has gradually developed into the current high-tech industry, such as the manufacturing process of semiconductors, which is an indispensable technology in the current technology industry. .

Generally speaking, the process of electroplating technology includes providing a plating bath, a plating solution, a cathode, an anode, an object to be plated, and a plated metal. The plating solution, the cathode, the anode, the object to be plated, and the plated metal are all located in the plating tank, the object to be plated is coupled to the cathode, and the plated metal is coupled to the anode. In this configuration, when an external voltage V is applied between the cathode and the anode, the electroplated metal will precipitate electroplated metal ions M +, and the surface of the object to be plated will collect electrons e-. The positively-charged electroplated metal ion M + is attracted by the negative charge carried by the electron e-, and the plating solution is used as a medium to flow to the surface of the object to be plated. When the electroplated metal ions M + reach the surface of the object to be plated, they will combine with the electrons e- to form metal atoms, which are deposited on the surface of the object to be plated to form an electroplated metal layer. When the plating metal is completely precipitated or the application of the applied voltage V is stopped, the plating reaction is stopped.

The currently known electroplating systems can be divided into a soluble anodizing system and an insoluble anodizing system according to the method of providing metal plating. In an insoluble anodizing system, when the current flows from the top of the anode to the bottom of the anode, the amount of current will decrease due to the resistance. In other words, at the top of the anode, due to the larger current passing through it, there will be more metal. The ions are decomposed and released, and the current passing through the lower part is less than the current passing through the upper part, so less metal ions are decomposed and released, and the power line distribution in the plating bath is uneven (that is, the current density distribution is not uniform). Uniform). This phenomenon will cause the product to be relatively thick in the area where the power line density is high, that is, the current density is high. Conversely, the product is relatively thin in the area where the power line density is low, that is, the current density is low, so the film on the product surface is coated. The thickness uniformity is not good, and the coating with uneven thickness is likely to affect subsequent processes or product performance, thereby reducing the overall process yield.

Therefore, a variety of anodes are available on the market to supply power and generate the current density required to achieve uniform plating. For example, Taiwan Patent Publication No. I530593, which mainly provides a multi-anode control device with a cathode connection For use, the cathode connector is electrically connected to one side of the substrate. The multi-anode control device includes: an anode module including a plurality of anode grids side by side and separated by a distance; and a power supply control module, respectively Is connected to each of the anode grids, and the power supply control module supplies power to each of the anode grids separately to generate the required current density in each of the anode grids, which can make the current density obtained by each anode grid different from the substrate The cathodes obtained at the positions are complementary to each other, thereby uniformly plating the substrate.

Although the above-mentioned multi-anode technology can achieve the effect of uniform plating and control the electric field distribution; however, the overall structure of the multi-anode control device is relatively complicated and the cost is relatively high. Furthermore, due to the marginal effect of the anode network, the anode network The marginal current density will increase, so in fact, it is still necessary to use the power supply control module to adjust the current provided to each anode network separately according to the situation, which causes inconvenience in use.

In view of this, the present invention provides a plating auxiliary board and a plating system using the same System, especially a plating auxiliary board that adjusts the electric field distribution and metal ion diffusion path during electroplating by a more positive and reliable method.

In the present invention, the plating auxiliary board is applied to a plating system and is a non-conductive plate body. The plate body has at least one side surface, and a shielding member is provided at the at least one side surface. The shielding member protrudes from the surface of the plate body. Predetermined height.

In a preferred embodiment, a driving module is further provided, which is connected with the plating auxiliary plate and can drive the plating auxiliary plate to be displaced.

In a preferred embodiment, the shielding member is fixed to the plate body by a fixing member.

According to a second aspect of the present invention, it provides an electroplating system suitable for electroplating an object to be plated. The electroplating system includes at least: an electroplating tank for installing a plating solution; and a cathode disposed in the electroplating tank. And is coupled to the object to be plated; at least one anode is disposed in the plating tank and is coupled to a plated metal, the anode faces a surface to be plated of the object to be plated; and at least one above-mentioned plating auxiliary plate is located at the anode Between the plate and the surface to be plated, the shielding member of the plating auxiliary plate faces the anode, and the shielding member fills a gap between the plating auxiliary plate and the anode.

In a preferred embodiment, at least one guide groove is provided on an inner side surface of the plating tank for inserting the plating auxiliary board.

In another preferred embodiment, the plating auxiliary plate has a guide edge portion that can be penetrated deep into the guide groove, and a shielding portion extending from the guide edge portion to the inside of the plating groove, and the shielding member is It is located on at least one side of the shielding portion.

In a more preferred embodiment, the shielding portion is further provided with at least one opening, and the opening can be exposed by the anode portion.

10‧‧‧Plating Auxiliary Board

11‧‧‧ plate

111‧‧‧ side

112‧‧‧Guide Edge

113‧‧‧ shelter

114‧‧‧ opening

12‧‧‧ shelter

13‧‧‧Fixed parts

21‧‧‧plating tank

211‧‧‧Guide

22‧‧‧plating solution

23‧‧‧ cathode

24‧‧‧Anode

24a‧‧‧ sheltered area

24b‧‧‧Uncovered area

25‧‧‧plated metal

30‧‧‧ to be plated

31‧‧‧ surface to be plated

40‧‧‧metal plating

Fig. 1 is a perspective view showing the structure of the first embodiment of the plating auxiliary plate in the present invention; Fig. 2 is an exploded view showing the second embodiment of the plating auxiliary plate in the present invention; Schematic diagram of the structure of the plating system; and FIG. 4 is a perspective view showing the structure of the second embodiment of the plating auxiliary board in the present invention.

Unless otherwise stated, the following terms used in the specification and scope of the patent application have the definitions given below. Please note that the use of the singular word "a" in the specification and scope of the patent application is intended to cover one or more of the stated matters, such as at least one, at least two, or at least three, and is not meant to mean merely having A single item. In addition, the use of open-ended conjunctions such as "including" and "having" in the scope of a patent application indicates a combination of elements or components described in a claim, and does not exclude other components or components not specified in the claim. It should also be noted that the term "or" generally includes "and / or" in the sense, unless the content clearly indicates otherwise. The term "about" used in the description of this application and the scope of the patent application is used to modify any slightly variable error, but such slight change will not change its essence.

Please refer to FIG. 1. The plating auxiliary board 10 of the present invention is a non-conductive board body 11. The plating auxiliary board of the present invention is used in a plating system. The board body 11 must be resistant to the corrosion and corrosion of the plating solution. Made of materials that cause plating reactions. These materials have dielectric properties or are composite materials containing a dielectric coating to prevent potential changes induced in the plating bath from causing metal plating on the plating auxiliary board or chemical reaction with the plating auxiliary board to pollute the plating liquid. The material of the plating auxiliary board includes, but is not limited to, plastic, such as polypropylene, polyethylene, polyvinyl chloride, fluoropolymer, polytetrafluoroethylene (PTFE), or polyvinylidene fluoride. This material can block the passage of power lines. The power line The orbit that moves the positive and negative ions in the plating solution under the action of an external electric field is called a power line.

The plate body 11 has at least one side surface 111. In the embodiment shown in the figure, the plate body 11 is rectangular and has four side surfaces 111. Although the shape of the plate body 11 is described in this specification and illustrated in the drawings, The plate can have various other shapes known to those skilled in the art. A shielding member 12 is provided on the at least one side 111, and the shielding member 12 protrudes from a predetermined height of the bottom of the surface of the plate 11. In a preferred embodiment, the shielding member 12 can be made integrally with the plate body 11.

In another preferred embodiment, as shown in FIG. 2, the shielding member 12 is fixed to the plate body 11 by a fixing member 13. Although the present specification describes and illustrates the structure in which the fixing member 13 is configured as a screw, the fixing member 13 may have various other fixing structures known to those skilled in the art. The shielding member 12 is the same as the plate body 11 and is made of a non-conductive material, and can be made of the materials mentioned in the above specific embodiments of the plate body.

The plating auxiliary board of the present invention is suitable for being set in a plating system to adjust the electric field distribution during plating, and to prevent the metal plating layer deposition in a specific area by more positive and reliable means. In a specific embodiment of the electroplating system, as shown in FIG. 3, the electroplating system includes at least: a plating tank 21 for installing a plating solution 22; a cathode 23 is disposed in the plating tank 21 and is coupled to the Plating 30; at least one anode 24 is disposed in the plating tank 21 and is coupled to a plating metal 25, the anode 24 faces a to-be-plated surface 31 of the to-be-plated 30; the cathode 23 and at least one anode 24 are disposed in the plating tank 21 and at least partially immersed in the plating solution 22. Another power source (not shown) supplies at least one anode 24 and cathode 23 with positive and negative electricity respectively to form a power line passing through the plating solution 22. The anode 24 may include a soluble anode and an insoluble anode. In a preferred embodiment, the anode 24 is an insoluble anode that is used to conduct current, and the metal ions in the plating solution 22 are supplemented with metal salts. . The insoluble anode is generally a good conductor, and does not cause chemical interaction with the plating solution 22 and does not corrode the solution.

In a preferred embodiment, the pair of anodes 24 can be placed separately The two sides of the plating tank 21 opposite to the cathode 23 are hung on the cathode 23 to be plated, so that the plating solution in the plating tank 21 is made in the state where the anode 24 and the cathode 23 are inputting current, respectively. 22 The metal ions deposited on the cathode end are precipitated due to the electrolytic reaction. After the metal ions are reduced on the cathode 23, a metal plating layer 40 is deposited and deposited on the surface of the object 30 to be plated.

The plating auxiliary plate 10 is disposed in the plating tank 21 between the anode 24 and the surface to be plated 31. The plating auxiliary plate 10 partially shields the anode 24 to form a shielded area 24a and a non-shielded area 24b. The plate body 11 of the plate 10 is slightly parallel to the surface to be plated 31, and the shielding member 12 of the plating auxiliary plate 10 faces the anode 24, and the shielding member 12 is filled between the plating auxiliary plate 10 and the anode 24. The gap. In a preferred embodiment, the height of the shielding member 12 may be slightly smaller than the gap between the plating auxiliary plate 10 and the anode 24, and the length of the shielding member 12 may be slightly smaller than the width of the plating tank 21.

Among them, the plate body 11 of the plating auxiliary board 10 can block the formation of some power lines and change the original electric field distribution. After the plating auxiliary board 10 is added, the electric field distribution in the plating tank 21 changes, especially the power lines of the 30 parts to be plated. The improvement is no longer denser than other parts, so that the current distribution on the non-shielded area 24b is uniform, and the thickness of the electroplated metal layer obtained by electroplating can be uniform; on the other hand, no power line is formed at the shielded area 24a, and the shield 12 is filled in the The gap between the plating auxiliary plate 10 and the anode 24 can block the flow of the plating solution in the shielded area 24a and the plating solution in other areas of the plating tank, and cause the stagnation of the plating solution in the shielded area 24a, and the shielded area 24a. The difficulty of the electrolytic reaction is greatly increased, so that the metal plating layer can not be deposited on the to-be-plated surface 31 of the shielded area 24a, so that the metal-plated layer 40 can be locally deposited on the to-be-plated surface 31 of the object to be plated. The shape of the plating auxiliary plate or the position relative to the surface to be plated is changed to obtain a metal plating layer having a specific position or a specific shape. In addition to the above-mentioned plating auxiliary plate 10, in addition to the ability to adjust the electric field distribution during plating, the diffusion path of metal ions in the plating solution can also be adjusted to increase the uniformity of the thickness of the metal plating layer on the surface of the object to be plated. purpose.

In a preferred embodiment, the inner surface of the plating tank 21 is provided to One guide groove 211 is missing, as shown in FIG. 4, for inserting the electroplating auxiliary board 10, and the plate 11 of the electroplating auxiliary board 10 has opposite sides on the opposite sides, which can be guided into the guide groove 211. The shielding portion 113 extends from the guiding edge portion 112 to the inside of the plating tank, and the shielding member 12 is located on at least one side of the shielding portion 113. The shielding portion 113 is further provided with at least one opening 114. The opening 114 can expose the non-shielded area 24b of the anode 24, and the position and shape of the opening 114 are relative to the position and shape of the metal plating layer formed after the surface to be plated is plated. In the above-mentioned preferred embodiment, the guide edge portions 112 on the opposite sides of the plate body 11 are inserted into the guide groove 211, and the bottom side of the shielding portion 113 of the plate body 11 contacts the bottom surface of the plating tank 21, so only A shielding member 12 needs to be provided on the top side of the shielding portion 113 of the plate body 11 to block the flow between the plating solution at the shielding area 24a opposite to the shielding portion 113 and the plating solution in other areas of the plating tank. In another preferred embodiment, if the shielding portion 113 of the plate body 11 of the present invention is moved to another position, for example, when moving upward, the bottom side of the shielding portion 113 does not contact the bottom surface of the plating tank 21 at this time, so that the shielding area is allowed. A conductive state between the plating solution at 24a and the plating solution in other areas of the plating tank is formed, and a shielding member 12 may be further provided on the bottom side of the shielding portion 113 so as to achieve a complete blocking effect.

In another preferred embodiment, the present invention further includes a driving module (not shown), which is connected to the plating auxiliary plate, which can drive the displacement of the plating auxiliary plate, thereby changing the plating auxiliary plate relative to the plating auxiliary plate in an automated manner. Position of the surface to be plated.

The above embodiments are only for the purpose of illustrating the present invention, rather than limiting the present invention. Various alterations or changes made by those skilled in the related art without departing from the technical scope of the present invention should also belong to the protection scope of the present invention.

Claims (3)

An electroplating system is suitable for electroplating an object to be plated. The electroplating system includes at least: an electroplating tank for installing electroplating solution, and the inner side of the electroplating tank is provided with at least one guide groove; a cathode, provided with At least one anode is disposed in the plating bath and is coupled to a plating metal, the anode faces a to-be-plated surface of the to-be-plated object; and at least one plating auxiliary plate is A non-conductive plate body, and the electroplating auxiliary plate has a guide edge portion which can be penetrated into the guide groove, and a shielding portion extending from the guide edge portion to the inside of the electroplating groove, and the shielding portion is further provided with at least one An opening for exposing the surface to be plated, and a shielding member is provided between the shielding portion and the opening, the shielding member protrudes at a predetermined height from the bottom of the surface of the plate body, and the plating auxiliary plate is located at the anode and Between the surfaces to be plated, the opening can be exposed to the surface to be plated, the shielding member faces the anode, and the shielding member fills a gap between the plating auxiliary plate and the anode. The electroplating system according to claim 1, wherein the shielding member is fixed to the plate body by a fixing member. The electroplating system according to claim 1 or 2, further comprising a driving module, which is connected to the electroplating auxiliary plate and can drive the electroplating auxiliary plate to be displaced.