CN207828440U - Electroplating system - Google Patents
Electroplating system Download PDFInfo
- Publication number
- CN207828440U CN207828440U CN201721195569.3U CN201721195569U CN207828440U CN 207828440 U CN207828440 U CN 207828440U CN 201721195569 U CN201721195569 U CN 201721195569U CN 207828440 U CN207828440 U CN 207828440U
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- CN
- China
- Prior art keywords
- plating
- accessory plate
- anode
- surfacing
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Electroplating Methods And Accessories (AREA)
Abstract
The plating accessory plate of the utility model is applied to electroplating system, it mainly has a nonconducting plate body, it is set to the anode and this is waited between surfacing, the anode part is covered and forms shaded areas by the plating accessory plate, and the covering that the plating accessory plate is equipped with is toward the anode, the flowing between the electroplate liquid at shaded areas and the electroplate liquid in other regions of electroplating bath can be blocked, can more positive, reliable means prevent what the coat of metal was deposited on the opposite shaded areas from waiting in surfacing that there is the ability of field distribution when adjustment plating.
Description
Technical field
The utility model is in relation to a kind of plating accessory plate and applies its electroplating system, it is especially a kind of with it is more positive,
Reliable means adjust the plating accessory plate of field distribution and metal ion diffusion path when plating.
Background technology
Plating be a kind of cell reaction, using cell reaction a kind of metal-plated on another metallic surface, with shape
At one layer of metal shell film, such process is known as being electroplated by we.And electroplating technology is widely applied to various different use
Way in different field.From decorative use of the early stage based on beauty, such as have glossiness film in formation one on vessel surface,
Gradually develop to and be applied to high-tech industry now, as semiconductor processing procedure in, be now indispensable one in scientific and technological industry
Item technology.
In general, the flow of electroplating technology includes providing an an electroplating bath, electroplate liquid, a cathode, an anode, one to be plated
Object and a plating metal.Wherein electroplate liquid, cathode, anode, object to be plated and plating metal are all located in electroplating bath, and to be plated
Object is coupled with cathode, and plating metal is then coupled with anode.Configured in this way, when bestowing an applied voltage V between cathode and anode, electricity
Plating metal ion M+ can be precipitated in plating metal, and set electron e- is then assembled on object surface to be plated.This positively charged plating metal from
Sub- M+ can be attracted by the negative electrical charge of electronics e- institutes band, and object surface to be plated is flowed to as medium (medium) with electroplate liquid.When
When plating metal ion M+ arrives at object surface to be plated, will with electronics e- in conjunction with and form metallic atom, and be deposited on object to be plated
Surface forms electroplated metal layer.When plating metal is precipitated completely or stops applying applied voltage V, electroplating reaction just stops.
The electroplating system being currently known can then divide into dissolubility anodization system and not according to plating metal presentation mode
Dissolve anodization system.In insoluble anode electroplating system, when electric current flow to anode bottom from anode top, electricity
Flow can successively decrease because of resistance, in other words, at anode top, due to the metal larger, more by electric current herein
Ion is decomposed release, and by lower portion by few compared with the electric current by the top position therefore less gold of electric current
Belong to ion to be decomposed and releases, and then generates in electroplating bath electric force lines distribution and uneven (i.e. the Density Distribution of electric current is not
Uniformly) the phenomenon that.This phenomenon will cause product position, and coating is relatively at the big region of the higher i.e. current density of the density of electric fluxline
Thickness, otherwise it is that then coating is relatively thin in current density small region that product position is relatively low in the density of electric fluxline, so that product table
The film thickness uniformity of face coating is bad, and coating in uneven thickness most probably influences follow-up process or product efficiency, and then reduces
Overall process yield.
Therefore occur on the market it is a kind of powered respectively with multiple anodes and generate required current density respectively, it is uniform to reach
The effect of plating mainly provides a kind of multianode control device such as TaiWan, China patent announcement I 530593, collocation
One cathodic connection uses, and the cathodic connection is electrically connected at one side of substrate, which includes：One sun
Pole module, including each other side by side and between be separated by most anode networks of a spacing；And a power supply control module, electrically connect respectively
It is connected to the respectively anode network, which powers respectively to the respectively anode network, needed for being generated respectively in the respectively anode network
Current density, the current density that each anode network can be made to obtain respectively, the cathode electricity obtained respectively with substrate different location
It is complimentary to one another, to carry out uniformly-coating to substrate.
Although above-mentioned habit has the effect of multianode technology can reach uniformly-coating, and control field distribution；So, whole more
Anodic control apparatus structure composition is complex, and cost is also relatively high；Furthermore due to the edge effect of anode network so that sun
The current density in polar net limit can increase instead, so actually still needing to adjust separately offer optionally with power supply control module
To the electric current of each anode network, so causes and use upper inconvenience.
Utility model content
The technical issues of the utility model is solved in a kind of plating accessory plate of offer and applies its electroplating system, special
It is not a kind of plating adjusting field distribution and metal ion diffusion path when plating with more positive, reliable means
Accessory plate.
Technological means used by the utility model is as described below.
Accessory plate is electroplated in the utility model and is applied to electroplating system, is nonconducting plate body, and the plate body has at least
One side, this is equipped with a covering at least at one side, which protrudes from one predetermined altitude of plate body surface.
In a preferred embodiment, it is further provided with a driving module, links with the plating accessory plate, can drive
The plating accessory plate displacement.
In a preferred embodiment, the covering is fixed on the plate body using a fixing piece.
Second aspect according to the present utility model provides a kind of electroplating system, should suitable for an object to be plated is electroplated
Electroplating system includes at least as follows.
One electroplating bath, for installing electroplate liquid.
One cathode is set to the electroplating bath and couples the object to be plated.
An at least anode is set to the electroplating bath and couples a plating metal, and the anode surface is to be plated to the one of the object to be plated
Face.
And at least one above-mentioned plating accessory plate, positioned at the anode and between this waits for surfacing, the plating accessory plate should
For covering toward the anode, which is filled in the gap between the plating accessory plate and the anode.
In a preferred embodiment, the medial surface of the electroplating bath is equipped with an at least guide groove, for plugging the electricity
Plate accessory plate.
In another preferred embodiment, the plating accessory plate has to penetrate with the guide edge of the guide groove
Portion, and the shielding portion inside the electroplating bath is extended to by the guiding edge, and the covering is then located at the shielding portion at least
Side.
In more preferable specific embodiment, the shielding portion is further provided at least one opening, and the opening is for the sun
Pole part is exposed.
Technique effect caused by the utility model：Divided to adjust electric field when plating with more positive, reliable means
Cloth and metal ion diffusion path.
Description of the drawings
Fig. 1 show the structural perspective that accessory plate first embodiment is electroplated in the utility model.
Fig. 2 show the stereogram exploded view that accessory plate second embodiment is electroplated in the utility model.
Fig. 3 show the structural schematic diagram of electroplating system in the utility model.
Fig. 4 show the structural perspective that accessory plate second embodiment is electroplated in the utility model.
Figure number explanation：
Accessory plate 10 is electroplated
Plate body 11
Side 111
Guide edge 112
Shielding portion 113
Opening 114
Covering 12
Fixing piece 13
Electroplating bath 21
Guide groove 211
Electroplate liquid 22
Cathode 23
Anode 24
Shaded areas 24a
Non-obstructing region 24b
Object 30 to be plated
Wait for surfacing 31
The coat of metal 40.
Specific implementation mode
Refering to Figure 1, the plating accessory plate 10 of the utility model is nonconducting plate body 11, the electricity of the utility model
It plates accessory plate to be applied in electroplating system, plate body 11 need to be by that can resist the erosion of electroplate liquid and not generate the material of electroplating reaction
It is made.These materials have dielectric property or to include the composite material of dielectricity coating, to prevent from luring in electroplating bath
The variation of electricity position causes metal plating on plating accessory plate, or generates chemical reaction with plating accessory plate and pollute and be electroplated
Liquid.The material of accessory plate is electroplated including but not limited to being plastics, such as polypropylene, polyethylene, polyvinyl chloride, fluoropolymer, poly- four
Vinyl fluoride (polytetrafluoroethylene, PTFE) or polyvinylidene fluoride (polyvinylidene
fluoride).The material can stop that power line passes through.The power line be electroplate liquid in negative ions under the action of an external electric field
The track for making displacement is known as power line.
And the plate body 11 has an at least one side 111, in embodiment as shown in the figure, plate body 11 has four for rectangle
A side 111, although this specification illustrates and schema is painted the shape of plate body 11 as rectangle, which can have affiliated technology
Have various other shapes known to usually intellectual in field.This is equipped with a covering 12, the masking at least at one side 111
Part 12 protrudes from 11 surface of plate body, one predetermined altitude.In a preferred embodiment, which can be with this
Plate body 11 is made into integration.
In another preferred embodiment, as shown in Fig. 2, the covering 12 is fixed on the plate using a fixing piece 13
Body 11.Although this specification illustrates and schema is painted the structure that fixing piece 13 is configured as screw, which can have institute
Belong to various other fixed structures known to tool usually intellectual in technical field.And the covering 12 is similarly not with plate body 11
Conductive material, and can be as made by the material mentioned in above-mentioned plate body specific embodiment.
The plating accessory plate of the utility model is suitable for being arranged in electroplating system, to adjust field distribution when plating,
The coat of metal deposition of specific region is prevented with more positive, reliable means.In the specific embodiment of the electroplating system,
As shown in figure 3, the electroplating system includes at least：One electroplating bath 21 is for installing electroplate liquid 22；One cathode 23 is set to the electroplating bath
21 and couple the object 30 to be plated；An at least anode 24 is set to the electroplating bath 21 and couples a plating metal, which faces
The one of the object 30 to be plated waits for surfacing 31；Cathode 23 and an at least anode 24 are set in electroplating bath 21, and at least local soaking in
In electroplate liquid 22.It is another to there is power supply (not shown) to supply at least an anode 24 and 23 positive electricity of cathode and negative electricity respectively, passed through with being formed
The power line of electroplate liquid 22.Anode 24 may include dissolubility anode and insoluble anode, in a preferred embodiment
In, anode 24 is insoluble anode, be used for conducting electric current, and the metal ion in electroplate liquid 22 is mended with metal salt
It fills.Insoluble anode is usually good electric conductor, and chemical action and foul solution will not be generated with electroplate liquid 22 not yet
It can suffer erosion.
In a preferred embodiment, pairs of anode 24 can be respectively placed in inside electroplating bath 21 relative to
The both sides of cathode 23, and the object to be plated 30 for being intended to be electroplated is hung in cathode 23, make to input electricity in anode 24 and cathode 23 respectively
In the state of stream, enables the electroplate liquid 22 in electroplating bath 21 that depositing is precipitated because of cell reaction in the metal ion of cathode terminal, wait for gold
Belong to ion after the reduction of cathode 23, forms deposition and plate in the coat of metal 40 on 30 surface of object to be plated.
Plating accessory plate 10 is set in electroplating bath 21, positioned at the anode 24 and between this waits for surfacing 31, plating auxiliary
24 part of anode is covered and forms shaded areas 24a and non-obstructing region 24b by plate 10, the plate body 11 of the plating accessory plate 10
It is slightly parallel to wait for surfacing 31 in this, and the covering 12 of the plating accessory plate 10, toward the anode 24, which is filled in
Gap between the plating accessory plate 10 and the anode 24.In a preferred embodiment, the height of the covering 12 can
With equal to the gap size being slightly less than between the plating accessory plate 10 and the anode 24, and the length of covering 12 can be equal to and be slightly less than
The width of the electroplating bath 21.
Wherein, plating accessory plate 10 plate body 11 can stop portions power line formation, change original field distribution, add
The variation of 21 internal electric field of electroplating bath distribution, the power line of 30 part of object especially to be plated have improved not after plating accessory plate 10
It is again close compared with other positions, so that homogeneous current distribution on non-obstructing region 24b, is electroplated the plating metal layer thickness of gained
It also can uniformity；Conversely, do not form power line at shaded areas 24a, and covering 12 be filled in the plating accessory plate 10 with
Gap between the anode 24, can block the flowing between the electroplate liquid at shaded areas 24a and the electroplate liquid in other regions of electroplating bath,
It allows at shaded areas 24a and causes the stagnation of electroplate liquid, and the cell reaction difficulty at shaded areas 24a significantly increases, make opposite
Shaded areas 24a's waits for that surfacing 31 can not have coat of metal deposition, allow plated body wait for surfacing 31 can local deposits have metal
Coating 40, user more can be according to the shape for changing plating accessory plate needed for it or relative to waiting for the position of surfacing, and is had
The coat of metal of specific position or specific shape.And above-mentioned plating accessory plate 10 is in addition to can reach the electric field point when adjustment plating
Outside the ability of cloth, the diffusion path of metal ion in electroplate liquid is also can adjust, allows the uniform film thickness of plated body surface metal plating layer
Degree is promoted, and achievees the purpose that uniformly-coating.
In a preferred embodiment, the medial surface of the electroplating bath 21 is equipped with an at least guide groove 211, such as Fig. 4 institutes
Show, for plugging the plating accessory plate 10, the avris that the plate body 11 2 of the plating accessory plate 10 is opposite has for penetrating with this
The guiding edge 112 of guide groove 211, and the shielding portion 113 inside the electroplating bath is extended to by the guiding edge 112, and the screening
Shield 12 is then located at at least side of the shielding portion 113, which is further provided at least one opening 114, the opening
114 is exposed for the non-obstructing region 24b of the anode 24, and the position of the opening 114 and shape are then relative to waiting for that surfacing carries out electricity
The position of the formed coat of metal and shape after plating.In above-mentioned preferred embodiment, 11 2 relative edge side of plate body is led
Draw edge 112 to be inserted in guide groove 211, and the bottom surface of 113 bottom side of shielding portion of plate body 11 then contact plating slot 21, therefore only need
One covering 12 is set in 113 top side of shielding portion of plate body 11, you can at the opposite shaded areas 24a of barrier shielding portion 113
Flowing between electroplate liquid and the electroplate liquid in other regions of electroplating bath.In another preferred embodiment, the utility model
If the shielding portion 113 of plate body 11 is moved to other positions, such as when up moving, at this time 113 bottom side of shielding portion and contactless electricity
The bottom surface of coating bath 21, and electroplate liquids of the shaded areas 24a at this is allowed to be communicated with composition between the electroplate liquid in other regions of electroplating bath
State then further can be provided with covering 12 in 113 bottom side of shielding portion, use and have the function that obstruct completely.
In another preferred embodiment, the utility model is further provided with a driving module (not shown), with
The plating accessory plate links, and can drive the plating accessory plate displacement, and it is opposite to change plating accessory plate by an automated manner
In the position for waiting for surfacing.
Claims (3)
1. a kind of electroplating system, which is characterized in that suitable for an object to be plated is electroplated, which includes at least：
One electroplating bath, for installing electroplate liquid, and the medial surface of the electroplating bath is equipped with an at least guide groove；
One cathode is set to the electroplating bath and couples the object to be plated；
An at least anode is set to the electroplating bath and couples a plating metal, which waits for surfacing to the one of the object to be plated；With
And
At least one plating accessory plate, is nonconducting plate body, and the plating accessory plate has the guiding for penetrating with the guide groove
Edge, and the shielding portion inside the electroplating bath is extended to by the guiding edge, which is further provided at least one opening,
And a covering is equipped between the shielding portion and the opening, which protrudes from one predetermined altitude of plate body surface, the plating
Accessory plate is located at the anode and between this waits for surfacing, which waits for that surfacing is exposed for this, which waits for surfacing toward this,
The covering is filled in the plating accessory plate and this waits for gap between surfacing.
2. the electroplating system as described in claim 1, which is characterized in that the covering is fixed on the plate body using a fixing piece.
3. the electroplating system as described in claim 1 or 2, which is characterized in that a driving module is equipped with, with the plating accessory plate
Connection, drives the plating accessory plate displacement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721195569.3U CN207828440U (en) | 2017-09-18 | 2017-09-18 | Electroplating system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721195569.3U CN207828440U (en) | 2017-09-18 | 2017-09-18 | Electroplating system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207828440U true CN207828440U (en) | 2018-09-07 |
Family
ID=63384089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721195569.3U Expired - Fee Related CN207828440U (en) | 2017-09-18 | 2017-09-18 | Electroplating system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207828440U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109518260A (en) * | 2017-09-18 | 2019-03-26 | 先丰通讯股份有限公司 | Accessory plate and the electroplating system using it is electroplated |
-
2017
- 2017-09-18 CN CN201721195569.3U patent/CN207828440U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109518260A (en) * | 2017-09-18 | 2019-03-26 | 先丰通讯股份有限公司 | Accessory plate and the electroplating system using it is electroplated |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180907 Termination date: 20210918 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |