KR101256312B1 - Apparatus to Plate Substrate - Google Patents

Abstract

In a substrate plating apparatus according to an embodiment of the present invention, an electrolyte is accommodated, and a chuck for holding a substrate, which is a plating target, is liftable at an inner upper side thereof, and a positive metal ion is generated at an inner lower side when an anode voltage is applied. A process chamber in which the target portion is disposed; And a plurality of through-holes formed through the target portion in the process chamber to control the flow of the electrolyte to move the positive metal ions therethrough, and at least one electrolyte having a gradient-shaped portion formed on the lower surface thereof. Diffuser; may include. According to an embodiment of the present invention, an electrolyte containing a high concentration of metal ions can be delivered to an inner region of a substrate having a relatively small current density compared to an outer region of the substrate, thereby improving plating uniformity of the substrate.

Description

Substrate Plating Apparatus {Apparatus to Plate Substrate}

A substrate plating apparatus is disclosed. More specifically, a substrate plating apparatus is disclosed that can improve uniformity of substrate plating by uniformly transferring metal ions for substrate plating through at least one diffuser.

In general, a metal film is patterned on the entire surface of a substrate in order to form a metal wiring on a silicon wafer constituting a semiconductor device. At this time, the metal film formed on the entire surface of the substrate is formed of aluminum, copper, or the like.

Among them, the metal film formed of copper has a high melting point compared to the metal film formed of aluminum, and thus may have a large resistance to electrical mobility. As a result, the reliability of the semiconductor device may be improved and the signal resistance is low. There is an advantage that can increase the delivery speed. Therefore, a metal film formed of copper is mainly used.

In order to pattern a metal film on a substrate, it is more resistant to electrical mobility and more expensive to manufacture than deposition methods such as physical vapor deposition (PVD) or chemical vapor deposition (CVD). Relatively inexpensive electroplating methods are preferred.

The substrate plating apparatus includes a process chamber in which an electrolytic solution is accommodated, a positive electrode disposed in an inner lower portion of the process chamber, and a positive (+ plus) metal ion, for the target portion which instance the discharge of copper ions (Cu ^{2 +),} disposed inside the upper portion of the process chamber, and a positive voltage to the sub-lifting possible chuck (chuck) and the target in a state of holding the substrate And a voltage applying unit for applying a negative voltage to the substrate.

In the conventional substrate plating apparatus having such a configuration, stirring is generally performed in the electrolyte in the process chamber in order to obtain good metal precipitates by electroplating. For example, air stirring, stirring by cathode vibration, and ultrasonic waves Agitation and the like can be applied. Stirring in electroplating improves the smoothness and gloss of the plated surface, reduces the concentration polarization, improves the plating efficiency, removes the film of gas bonded near the cathode, reduces pit generation, and activates the activity of metal ions at high current density. Excellent plating surface can be obtained.

Meanwhile, the conventional substrate plating apparatus may further include a diffuser disposed between the target portion and the substrate in the process chamber and having a disc shape in which a plurality of holes are regularly formed in order to improve plating efficiency of the substrate.

The diffuser serves to reduce the difference in concentration of locally generated metal ions by supplying a uniform electrolyte when the metal film is deposited on the substrate by electroplating, thereby improving the quality of the plating film.

However, in the conventional diffuser, since both surfaces have a flat plate shape, bubbles may be generated in the holes of the diffuser when the electrolyte flows into the process chamber, so that the flow of the electrolyte may not be smoothly performed, and thus plating uniformity may be reduced. There exists a possibility that the quality of the plated surface which precipitated may fall.

In addition, in the conventional diffuser, it is difficult to disperse the electric field line density concentrated in the outer region relative to the distribution of the electric field lines of the outer (border) region and the inner region of the substrate having different current densities, so that the plated film of the outer region of the substrate is formed inside the substrate. There is also a problem that is formed thick with respect to the area.

Therefore, it is urgent to develop a substrate plating apparatus having a new structure capable of realizing excellent plating quality by improving the plating uniformity of the substrate.

An object according to an embodiment of the present invention, it is possible to deliver an electrolyte containing a high concentration of metal ions to the inner region of the substrate relatively small current density compared to the outer region of the substrate, thereby improving the plating uniformity of the substrate It is to provide a substrate plating apparatus.

In addition, another object according to an embodiment of the present invention, by reducing the length of the through-hole formed in at least a portion of the electrolyte diffuser can prevent the generation of bubbles in the through hole of the electrolyte diffuser when the electrolyte flows in the flow of the electrolyte It is to provide a substrate plating apparatus that can smoothly.

In a substrate plating apparatus according to an embodiment of the present invention, an electrolyte is accommodated, and a chuck for holding a substrate, which is a plating target, is liftable at an inner upper side thereof, and a positive metal ion is generated at an inner lower side when an anode voltage is applied. A process chamber in which the target portion is disposed; And a plurality of through holes arranged in an upper portion of the target part in the process chamber to control the flow of the electrolyte for moving the plus metal ions, and having a gradient portion having a gradient shape on a lower surface thereof. At least one electrolyte diffuser, and by this configuration, it is possible to transfer the electrolyte containing a high concentration of metal ions to the inner region of the substrate having a relatively small current density compared to the outer region of the substrate, and thus plating uniformity of the substrate Can improve.

The electrolyte diffuser may be provided to have a concave shape in which the inner portion of the gradient portion enters the inner side relative to the outer portion.

The electrolyte diffuser may have a convex shape and a concave shape between the central part and the convex shape between the center part and the outer part based on the center part of the gradient part.

The through hole may be formed in an outer portion of the electrolyte diffuser, but the gradient portion may not be formed.

The electrolyte diffuser may have a vertical cross section such that the gradient portion is symmetrical with respect to the central portion of the electrolyte diffuser.

The at least one electrolyte diffuser may be a plurality of electrolyte diffusers, and may be disposed in a stacked structure between the substrate and the target unit.

The electrolyte diffuser may be formed of a hydrophilic polymer material or a hydrophobic polymer material that is surface-modified.

On the other hand, the substrate plating apparatus according to an embodiment of the present invention, the electrolyte is accommodated, a chuck to hold the substrate to be plated on the inner upper side is arranged to be liftable, and the lower inner side when the positive voltage is applied to the positive metal ion A process chamber in which a target portion to generate is disposed; And a plurality of through-holes formed through the target portion in the process chamber to control the flow of the electrolyte for moving the plus metal ions, and having an inner portion thinner than an outer portion. The inner portion includes at least one electrolyte diffuser having a flat upper and lower surfaces in parallel, and by such a configuration, a high concentration of metal ions is contained in the inner region of the substrate having a relatively low current density compared to the outer region of the substrate. One electrolyte can be delivered, thus improving the plating uniformity of the substrate.

The inner portion of the electrolyte diffuser may be manufactured by selectively adjusting the height in the thickness section of the outer portion of the electrolyte diffuser.

According to an embodiment of the present invention, an electrolyte containing a high concentration of metal ions can be delivered to an inner region of a substrate having a relatively small current density compared to an outer region of the substrate, thereby improving plating uniformity of the substrate.

In addition, according to an embodiment of the present invention, by reducing the length of the through-hole formed in at least a portion of the electrolyte diffuser, it is possible to prevent the generation of bubbles in the through-holes of the electrolyte diffuser when the electrolyte is introduced to smoothly flow the electrolyte can do.

1 is a view showing a schematic configuration of a substrate plating apparatus according to an embodiment of the present invention.
FIG. 2 is a vertical cross-sectional view of the electrolyte diffuser shown in FIG. 1.
3 is a plan view of the electrolyte diffuser illustrated in FIG. 2.
4A to 4C illustrate modified examples of the electrolyte diffuser illustrated in FIG. 2.
FIG. 5 illustrates a schematic configuration of a substrate plating apparatus according to another embodiment of the present invention, but the electrolyte diffusers are vertically cross-sectioned.
FIG. 6 is a cross-sectional view of an electrolyte diffuser provided in a substrate plating apparatus according to still another embodiment of the present invention.
7 is a graph showing a result of performing a substrate plating process using an electrolyte diffuser of the substrate plating apparatus according to the embodiment of the present invention.

Hereinafter, configurations and applications according to embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following description is one of several aspects of the patentable invention and the following description forms part of the detailed description of the invention.

In the following description, well-known functions or constructions are not described in detail for the sake of clarity and conciseness.

Hereinafter, the substrate will be described as a wafer made of silicon, but the type of the substrate is not limited thereto, and it is obvious that the substrate can be a flat panel display such as an LCD or a PDP. Further, the shape and size of the substrate are not limited to the drawings or description, and it is natural that the substrate can be manufactured in various shapes and sizes such as circular and square.

1 is a view showing a schematic configuration of a substrate plating apparatus according to an embodiment of the present invention, Figure 2 is a vertical cross-sectional view of the electrolyte diffuser shown in Figure 1, Figure 3 is a view of the electrolyte diffuser shown in Figure 2 Top view.

Referring to FIG. 1, the substrate plating apparatus 100 according to an exemplary embodiment of the present invention has an electrolyte 103 accommodated therein, and a chuck 125 for holding a substrate W, which is a plating target, is lifted at an inner upper portion thereof. A process chamber 110 in which a target portion 120 capable of generating positive metal ions is disposed under the inner side, and a voltage applying portion 140 for applying a voltage to the substrate W and the target portion 120; The electrolyte diffuser 150 may be disposed on the target 120 in the process chamber 110 to control the flow of the electrolyte 103 to move the positive metal ions.

1, the substrate plating apparatus 100 of this embodiment includes a filtration unit 130 (not shown) for filtering metal ions on the electrolyte solution 103 provided in the process chamber 110 so as to surround the target portion 120, ).

First, the process chamber 110 of the present embodiment may include an inner chamber 111 and an outer chamber 115, which may be assembled to be detachable from each other. In the inner chamber 111 of the present embodiment, as shown in FIG. 1, the electrolyte 103 is filled up to the upper end, and the lower end is equipped with the target part 120 and the filtration part 130 surrounding it, and the upper part thereof will be described later. The electrolyte diffuser 150 is mounted.

The inner chamber 111 is detachably coupled to the inside of the outer chamber 115 and can be protected from the external environment by such a coupling structure.

As such, the process chamber 110 of the present embodiment has an advantage of being easy to fabricate because of easy assembly and disassembly. However, the structure of the process chamber 110 is not limited to this, and it is natural that the inner chamber 111 and the outer chamber 115 can be integrally formed.

A chuck 125 for holding the substrate W is disposed on the inner upper portion of the process chamber 110 so as to be liftable. The chuck 125 grasps a rim portion of the substrate W with one surface of the substrate W to be plated downward and the substrate W is immersed in the electrolyte solution 103 by the lowering operation of the chuck 125, A voltage is applied from the voltage application unit 140 to perform the plating process on the substrate W. [

1, the voltage applying unit 140 applies a negative voltage to the substrate W and applies a positive voltage to the target portion 120 to be described later. The voltage applying unit 140 applies a negative voltage to the substrate W, The plating process for the substrate W can be performed by moving the positive metal ions generated from the target portion 120 in the direction of the substrate W through the electrolyte 103 when the voltage is applied.

1, the target portion 120 of the present embodiment is a portion for forming an anode. When the anode portion is completely immersed in the electrolyte solution 103 and the positive electrode voltage is applied from the voltage applying portion 140 The positive metal ion, that is, the metal ion (Cu ^{2 +} ) of this embodiment can be generated by the oxidation reaction.

In this embodiment, the upper surface of the target portion 120 may be provided irregularly. This is to, expand the substantial area of the upper surface of the target portion 120 to be a large amount of copper ion (Cu ^{+ 2)} occurs when a positive voltage is applied to the target portion 120.

Thus, when copper ions (Cu ^{2 +} ) are generated from the target portion 120, the generated copper ions (Cu ^{2 +} ) must be transferred to the substrate W to be plated. This is accomplished by the electrolyte 103 which is accommodated in the inner chamber 111 up to a line. Therefore, the electrolytic solution 103 is applied as a copper sulfate solution suitable for conducting copper ions (Cu ^{2 +} ). However, the present invention is not limited thereto, and it is needless to say that other kinds of electrolytic solution 103 can be applied.

1, the filtration unit 130 of the present embodiment includes copper ions (Cu ^{2 +} ) provided inside the inner chamber 111 to surround the target portion 120 and move through the electrolyte 103, Lt; / RTI > The filtration unit 130 may include a filtration hole (not shown) that is provided substantially parallel to the target portion 120 at an upper portion of the target portion 120 and has a diameter of 1 to 10 micrometers (μm) And may be provided with a membrane filter.

Although not shown, the substrate plating apparatus 100 of this embodiment is connected to an electrolyte solution supply unit (not shown) to supply the electrolyte solution 103 into the inner chamber 111 and to form a flow of the electrolyte solution 103 And may further include an electrolyte supply line (not shown).

It is possible to activate the movement of copper ions (Cu < ^{2 + &} gt ^; ) transferred from the target portion 120 to the substrate W through the electrolyte supply line.

On the other hand, the substrate plating apparatus 100 according to an embodiment of the present invention, as shown in Figure 1, the electrolyte diffuser that can improve the plating uniformity of the substrate W by smoothly flowing the electrolyte 103 150 may be further included.

In addition, the relatively takes a large voltage to the outside (edge) area than the inner (central) region of the anode voltage is applied when the substrate (W) to a substrate (W), copper ion (Cu ^{2 +)} is rushes into a region outside the substrate ( Uniform plating on W) may be inhibited, and the electrolytic solution diffuser 150 of the present embodiment may improve plating efficiency on the inside of the substrate W by reducing the resistance applied to the inner region relatively.

Referring to the configuration of the electrolyte diffuser 150 in detail, the electrolyte diffuser 150 of the present embodiment, as shown in Figures 2 and 3, a plurality of through holes 155 are formed regularly, a portion A gradient portion 151, which is graded at the lower end facing the target portion 120, is formed to have a different thickness than the other portions.

Accordingly, it is possible to pass to the electrolyte 103 is a substrate (W) that contains a copper ion (Cu ^{+ 2)} through the through hole 155, whereby the plating process for the substrate (W) can be performed.

By the way, as in the conventional diffuser (not shown), when the length of the through hole through which the electrolyte passes is the same across the diffuser, a relatively large amount of copper ions are bound to the outer region of the substrate W, and thus the outer region of the substrate W. It may be plated excessively than this inner region.

However, in the case of the electrolyte diffuser 150 of the present embodiment, as shown in FIG. 2, since the gradient portion 151 that is recessed inwardly from the lower surface of the electrolyte diffuser 150 is provided, the electrolyte diffuser 150 is provided. ) through-hole (copper ion (Cu ^{2 +),} the length of h1) shorter than the length of the through-hole (h2) formed in the outer portion of the electrolyte diffuser 150, thus moving along the electrolyte 103 formed in the inner portion of By increasing the effect of the transfer of the plating efficiency to the inner region of the substrate (W) can be improved.

That is, a relatively long through-hole h2 is formed in the outer portion of the electrolyte diffuser 150 corresponding to the outer region of the substrate W having a relatively large current density, and the substrate having a relatively small current density ( the relative transfer is relatively small through the inside portion of the electrolyte diffuser (150) corresponding to the inner area hole (h1) it is being formed through, copper ion (Cu ^{2 +)} in accordance with the current density distribution of the substrate (W) and W) This is possible. Therefore, it is possible to transfer substantially made uniform in the copper ion (Cu ^{+ 2)} in front of the substrate (W) is to be improved the plating uniformity of the substrate (W).

Herein, the configuration of the electrolyte diffuser 150 will be described in detail. As illustrated in FIG. 2, the gradient part 151 of the electrolyte diffuser 150 is based on the central portion of the electrolyte diffuser 150. a vertical by having a cross-section a substrate (W) substantially the same concentration of copper ions in a concentric circle in the virtual (Cu ^{+ 2)} can be passed to be symmetrical.

In addition, the electrolyte diffuser 150, may be provided with a hydrophilic high-molecular substance or the surface-reforming the hydrophobic high molecular material, and thus the copper ion (Cu ^{2 +)} substrate it is possible to smooth the flow of the electrolyte 103, the containing (W) The uniformity of plating can be improved.

However, the configuration of the gradient portion 151 of the electrolyte diffuser 150 is not limited to the above-described embodiment. The configuration of the gradient portion of the electrolyte diffuser 150 may be provided in various forms.

4A to 4C illustrate modified examples of the electrolyte diffuser illustrated in FIG. 2.

First, the electrolyte diffuser 150a illustrated in FIG. 4A has a concave gradient portion 151a similar to the electrolyte diffuser 150 (see FIG. 2) of the above-described embodiment, but the forming position is somewhat different. That is, the gradient portion 151a illustrated in FIG. 4A starts the gradient from a point A spaced apart from the outermost through hole 155a of the electrolyte diffuser 150a by a predetermined interval, for example, 1 mm, in the electrolyte diffuser. It is formed concave inward from the lower end surface of 150a.

The outer area of the gradient portion (151a) forming the point (A) of copper ion (Cu ^{2 +)} resistance can be much more increased, and thus the substrate (W) of which is due to the difference, it passes the outside region of the substrate (W) of the Excessive plating is prevented from occurring, and plating on the inner region of the substrate W can be reliably performed.

Meanwhile, the electrolyte diffuser 150b illustrated in FIG. 4B has a curved surface in which the gradient portions 151 and 151a of the electrolyte diffuser 150 (see FIG. 2) and the electrolyte diffuser 150a illustrated in FIG. 4A are concave. Unlike being provided in a shape, the gradient portion 151b is formed in a concave shape that is linearly reduced.

The electrolyte diffuser (150b) also, copper ion (Cu ^{2 +)} are delivered to the inner area of the substrate (W) relative to receive the copper ion (Cu ^{2 +)} resistance is passed to the outside area of the substrate (W) is to receive resistance By lowering the transfer of copper ions (Cu ^{2 +} ) to the inner region of the substrate (W) having a relatively small current density, it is possible to efficiently improve the uniformity of the substrate (W) plating.

On the other hand, in the gradient portion 151c of the electrolyte diffuser 150c shown in FIG. 4C, a portion between the central portion and the outer portion enters inward with respect to the central portion of the lower surface of the electrolyte diffuser 150c, and the central portion is convex. It has a shape and is formed to have a concave shape in between.

The electrolyte diffuser (150c) has, relative to the through-hole (155c) formed in the center portion and the outside portion by having a through-hole (155c) is a relatively short length is formed in the area between one containing a copper ion (Cu ^{2 +)} When the electrolyte 103 is moved, the resistance may be reduced, and thus the plating efficiency of the portion of the substrate W corresponding to the inter-region may be improved. The electrolyte diffuser 150c may be used like the electrolyte diffuser 150 or 150a of the above-described embodiments rather than being used alone. This will be described through the following examples.

Meanwhile, hereinafter, a substrate plating apparatus according to another embodiment of the present invention will be described, and description thereof will be omitted for parts substantially the same as the substrate plating apparatus of the above-described embodiment.

FIG. 5 illustrates a schematic configuration of a substrate plating apparatus according to another embodiment of the present invention, but the electrolyte diffusers are vertically cross-sectioned.

As shown therein, the substrate plating apparatus 200 according to another embodiment of the present invention includes two electrolyte diffusers 250a and 250b instead of a single electrolyte diffuser, and the electrolyte diffusers 250a and 250b are formed of a substrate ( It is arranged in a laminated structure between W) and the target portion 220. Here, for convenience of description, the electrolyte diffuser 250a disposed below is referred to as a first electrolyte diffuser 250a, and the electrolyte diffuser 250b disposed above is referred to as a second electrolyte diffuser 250b. do.

First, the copper ions first electrolyte diffuser (250a), the example gradient portion foregoing exemplary (150, see FIG. 2) that is substantially the same as the gradient portion as long as the electrolytic solution 203 to pass through the first containing (Cu ^{2 +)} ( It may be provided as an electrolyte diffuser (250a) having a (251a). The first electrolyte diffuser 250a may reduce the resistance of the electrolyte 203 passing through the inner part by having a relatively short length of the through-hole 255a of the inner part than the through-hole 255a of the outer part. Therefore, the electrolyte 203 can be reliably transferred to the inner region of the substrate W. FIG.

Meanwhile, the second electrolyte diffuser 250b may be provided as an electrolyte diffuser 250b having a gradient portion 251b that is substantially the same as the gradient portion 151c shown in FIG. 4C of a variation of the above-described embodiment. . The second electrolyte diffuser 250b has a shorter through hole 255b in the area therebetween than the through holes 255b in the central portion and the outer inner portion. Accordingly, the electrolyte 203 transferred through the relatively short through hole 255a formed in the center portion of the first electrolyte diffuser 250a may have a relatively long through hole 255b formed in the center portion of the second electrolyte diffuser 250b. the transfer can be thereby more precisely adjust the concentration of the copper ion (Cu ^{+ 2)} is transferred to the substrate (W) through.

In addition, since the length of the through hole 255b formed in the outer portion of the second electrolyte diffuser 250b is relatively long, a relatively small concentration of copper ions passes through the outer portions of the first and second electrolyte diffusers 250a and 250b. (Cu ^{+ 2)} is transmitted thereby can be prevented from being excessively generated in the gold outer region of the substrate (W).

However, in another exemplary embodiment described above, the number of the electrolyte diffusers 250a and 250b is two and provided in a laminated structure, but the present invention is not limited thereto and three or more electrolyte diffusers may be provided in a laminated structure. Do.

Meanwhile, hereinafter, the electrolyte diffuser of the substrate plating apparatus according to another embodiment of the present invention will be described, but the description thereof will be omitted for parts substantially the same as the electrolyte diffuser provided in the substrate plating apparatus of the above-described embodiments. .

FIG. 6 is a cross-sectional view of an electrolyte diffuser provided in a substrate plating apparatus according to still another embodiment of the present invention.

As shown in the figure, the through hole 355 is regularly formed over the entire area of the electrolyte diffuser 350 of the present embodiment. However, the inner portion 351b is provided to have a thinner thickness than the outer portion 351a, but the inner portion 351b has a flat top and bottom surfaces thereof.

Accordingly, a relatively long through hole 355a is provided in the outer portion 351a of the electrolyte diffuser 350, and a relatively short through hole 355b is provided in the inner portion 351b of the electrolyte diffuser 350. , one containing a copper ion (Cu ^{2 +)} to the inner portion (351b) relative to the outer portion (351a) of the electrolyte diffuser 350, the electrolyte receives a smaller resistance can pass through the electrolyte diffuser 350, thus the substrate ( Plating of the inner region of W) can be reliably performed.

However, in the present embodiment, the case in which the inner portion 351b is provided at the center height of the outer portion 351a of the electrolyte diffuser 350 is illustrated in FIG. 6, but the inner portion 351b is illustrated in FIG. 6. Naturally, it can be provided higher and lower than that indicated by a dotted line.

Thus, according to another embodiment of the present invention, it is possible to pass the electrolytic solution 103 containing a high concentration of copper ion (Cu ^{2 +)} at a relatively inner region than in the outer regions of the substrate (W), the substrate (W In addition to preventing excessive plating of the outer region, there is an advantage of improving the plating uniformity of the entire surface of the substrate (W).

On the other hand, Figure 7 is a graph showing the result of performing a substrate plating process using the electrolyte diffuser of the substrate plating apparatus according to an embodiment of the present invention.

As shown in FIG. 7, the outer portion of the substrate W is plated thicker than the inner region of the substrate W, but the electrolyte diffusers 150, 150a to 150c, 250, and 350 of the present embodiment are plated. when using the inner area (see lower figure), the substrate (W), copper ion substrate (W) by (Cu ^{+ 2)} is reached much in the center area of the amount of it can be seen that the relatively thick plated. That is, the electrolytic solution diffuser (150, 150a to 150c, 250, 350) due to the outer region of the current density is relatively large substrate (W) with copper ion (Cu ^{2 +)} is unpatriotic rather, a relatively small current density of substrate ( W) a high concentration of copper ions (Cu ^{+ 2} in the inner area of) can be reached can be confirmed through 7 that can improve the coating uniformity of the whole substrate (W).

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. Therefore, such modifications or variations will have to be belong to the claims of the present invention.

100: substrate plating apparatus 110: process chamber
120: target portion 130: filtration portion
140: voltage applying unit 150: electrolyte diffuser
151: gradient part 155: through hole

Claims (9)

A process chamber in which an electrolyte is accommodated, and a chuck for holding a substrate, which is a plating target, is liftable at an inner upper side thereof, and a target unit at an inner lower side to generate a positive metal ion when an anode voltage is applied; And
A plurality of through-holes are formed in the process chamber, the plurality of through-holes are formed in the upper portion of the target portion to control the flow of the electrolyte to move the plus metal ions, and at least a gradient portion having a gradient shape is formed on the lower surface of the process chamber. One electrolyte diffuser;
Including;
The electrolytic solution diffuser is a substrate plating apparatus having a vertical cross-section is formed so that the gradient portion is symmetrical with respect to the central portion of the electrolyte diffuser.
The method of claim 1,
The electrolytic solution diffuser is provided with a substrate plating apparatus so that the inner portion of the gradient portion has a concave shape inwardly compared to the outer portion.
The method of claim 1,
The electrolytic solution diffuser is a substrate plating apparatus in which the portion between the center portion and the outer portion is moved inward with respect to the center portion of the gradient portion, so that the center portion has a convex shape and the portion therebetween has a concave shape.
The method of claim 1,
The through-hole is formed in the outer portion of the electrolyte diffuser, wherein the gradient portion is a substrate plating apparatus.
delete The method of claim 1,
The at least one electrolyte diffuser is a plurality of electrolyte diffusers, the substrate plating apparatus disposed in a laminated structure between the substrate and the target portion.
The method of claim 1,
The electrolytic solution diffuser is a substrate plating apparatus provided with a hydrophilic polymer material or a surface-modified hydrophobic polymer material.
A process chamber in which an electrolyte is accommodated, and a chuck for holding a substrate, which is a plating target, is liftable at an inner upper side thereof, and a target unit at an inner lower side to generate a positive metal ion when an anode voltage is applied; And
A plurality of through-holes are formed in the process chamber to control the flow of the electrolyte to move the plus metal ions, and are formed to have a thinner thickness than an outer portion. At least one electrolyte diffuser having a flat upper and lower surface portion;
Including;
The electrolytic solution diffuser is a substrate plating apparatus having a vertical cross-section is formed so that the inner portion and the outer portion is symmetrical with respect to the center portion of the electrolyte diffuser.
9. The method of claim 8,
The inner portion of the electrolyte diffuser is a substrate plating apparatus that is selectively adjusted in height in the thickness section of the outer portion of the electrolyte diffuser.

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